Abstract: An ultrasonic transducer includes a resin substrate, a support film and a piezoelectric element. The resin substrate has an opening. The support film blocks off the opening in the resin substrate. The piezoelectric element is disposed on the support film in a region that blocks off the opening in plan view from a thickness direction of the support film. The piezoelectric element includes a lamination of a lower electrode, a piezoelectric body, and an upper electrode.

Abstract: An ultrasound probe and a method for manufacturing the same are provided. More particularly, a one-dimensional or two-dimensional ultrasound probe having a multi-element-type piezoelectric material is easily manufactured by inserting a flat wire in a backing material, wherein the flat wire is used as a signal cable to supply electrical signals, enabling easy and simple arrangement of piezoelectric units as well as the signal cable.

Abstract: Embodiments reduce capacitive cross-talk between micromachined ultrasonic transducer (MUT) arrays through grounding of the substrate over which the arrays are fabricated. In embodiments, a metal-semiconductor contact is formed to a semiconductor device layer of a substrate and coupled to a ground plane common to a first electrode of the transducer elements to suppress capacitive coupling of signal lines connected to a second electrode of the transducer elements.

Abstract: A system, apparatus and method for processing substrates using acoustic energy. In one aspect, the invention can be a system for processing flat articles comprising: a support supporting a flat article; a dispenser applying liquid to a first surface of the flat article; a transducer assembly comprising: a transmitting structure having a longitudinal axis; a first set of transducers acoustically coupled to the transmitting structure in a spaced apart manner on a first side of the longitudinal axis; a second set of transducers acoustically coupled to the transmitting structure in a spaced apart manner on a second side of the longitudinal axis; the transducers of the first and second sets staggered along the longitudinal axis; and wherein when the dispenser applies liquid to the first surface of the flat article, a film of liquid is formed between the transmitting structure and the first surface of the flat article.

Abstract: The invention relates to an actuator (9) for a touch interface module (1) with haptic feedback, the interface module comprising a touch surface (3) able to detect at least one property of a user's touch, the actuator (9) comprising: a frame (11); a moveable core (13) interacting with the frame (11) and intended to be driven to move between extreme positions in order to generate the haptic feedback; and a main actuator connected to the touch surface (3) and able to generate haptic feedback depending on the detected touch and comprising electromagnetic actuating means (15, 17) for driving the moveable core (13) to move, characterized in that it furthermore comprises a controlled secondary actuator (18) cooperating with the moveable core (13).

Abstract: An ultrasonic transducer as an important part of an ultrasonic flow meter is described, with a transducer housing and with a transducer element, the transducer housing having an ultrasound window and a housing tube, the transducer element being made for sending or receiving ultrasonic waves and being either near the ultrasound window of the transducer housing or away from the ultrasound window of the transducer housing, there being a relatively soft mechanical coupling system and the mechanical coupling system having preferably at least one weakly coupled mechanical resonator. The ultrasonic transducer is improved with respect to the prevention of the transmission of housing waves by there being a second soft mechanical coupling system.

Abstract: A piezoelectric speaker includes a cover with a receiving space and a vibrating speaker unit accommodated in the receiving space. The vibrating speaker unit includes a piezoelectric oscillator including an upper surface and an lower surface, a diaphragm disposed on the upper surface of the piezoelectric oscillator, and a vibrating member kept a distance from the lower surface of the piezoelectric oscillator. The piezoelectric oscillator defines a first amplitude capable of driving the diaphragm only and a second amplitude driving both the vibrating member to vibrating with a largest amplitude and the diaphragm to generate sound. The distance is larger than the first amplitude and smaller than the second amplitude.

Abstract: An electroacoustic transducer including a first electrode formed on a substrate capable of transmitting ultrasounds, a membrane formed above the first electrode and separated therefrom by a cavity, a second electrode formed on the membrane, a first insulating layer on the second electrode, and a third electrode formed on the first insulating layer.

Abstract: A system is provided that provides a voice call service over a Circuit Switching (CS) domain to a User Equipment (UE) that was receiving a service in a Packet Switching (PS) domain. A Mobile Management Entity (MME) sends a paging message to the UE to provide a service in the CS domain. The MME sends a suspend request message requesting suspension of the service being provided to the UE in the PS domain, upon receiving a report message indicating that the UE has switched to the CS domain. A gateway suspends the service in the PS domain upon receiving the suspend request message from the MME.

Abstract: An ultrasound transducer array is formed with stealth dicing. A laser is used to form defects within the piezoelectric substrate and along the desired kerf locations. The substrate is fractured along the defects. A controlled expansion, such as using thermal expansion, may be used to establish the desired kerf width. Spacers may be used to maintain the desired kerf width. The kerfs are filled to create the ultrasound transducer array.

Abstract: An ultrasonic probe includes at least one transmission element layer for transmitting ultrasonic waves, at least one reception element layer for receiving ultrasonic waves and which is provided with an electrode on each of both surfaces opposed in a direction of a thickness thereof, and at least one matching layer for matching acoustic impedance. These layers are arranged in this order in a direction of transmitting the ultrasonic waves. The reception element layer is provided with a projecting portion projecting in a direction of elevation from upper and lower layers which sandwich the two electrodes respectively formed on both surfaces of the reception element layer, and at least one of the electrodes is formed by extending to the projecting portion.

Abstract: A process for fabricating an integrated Micro-Electro-Mechanical Systems (MEMS) filter includes bonding an insulating substrate having a first end and a second end to a base substrate, the second end of the insulating substrate cantilevered over and separated from the base substrate by a gap, forming a resonator element on the second end of the insulating substrate, forming an inductive element comprising a coil, wherein the coil is formed on the insulating substrate, and forming a capacitive element on the first side of the insulating substrate, the capacitive element comprised of two conductive plates, wherein one of the two conductive plates is formed on the insulating substrate.

Abstract: A method of fabricating a plurality of ultrasound transducer assemblies is provided. The method includes applying one or more layers of patternable material to at least a portion of a surface of a wafer comprising a number of die. The method further includes patterning the patternable material to define a plurality of openings, where each of the openings is aligned with a respective one of the die, disposing ultrasound acoustic arrays in respective ones of the openings, coupling the ultrasound acoustic arrays to the respective die to form the respective ultrasound transducer assemblies, and separating the ultrasound transducer assemblies to form individual ultrasound transducer assemblies.

Abstract: The present disclosure provides a probe for an ultrasonic diagnostic apparatus. The probe includes a backing layer, a piezoelectric layer disposed on one side of the backing layer, a matching layer disposed on one side of the piezoelectric layer, a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer, and a ground connector disposed outside the signal connector. The backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer. The probe for an ultrasonic diagnostic apparatus includes a stack of the backing layer, the piezoelectric layer and the matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement through minimization of interference from a signal connector and a ground connector.

Abstract: The present disclosure involves a method and apparatus for attaching two electrical dies by wire bonding and then encasing the assembly in a protective casting that works by arranging two dies into a fixture conducive to wire bonding. Doped epoxy may be immediately dispensed over the assembly to form a near-net-shape protective cover, or Drive Can.

Abstract: The invention relates to a resonator for the distribution and partial transformation of longitudinal vibrations and to a method for treating at least one fluid by means of a resonator according to the invention. The resonator is designed for the distribution of longitudinal vibrations and the partial transformation thereof into longitudinal vibrations that are superimposed by vibrations oriented towards the centre of gravity or approximately towards the centre of gravity of a cross-sectional surface of at least one opening of the resonator. The resonator comprises a natural number of parallel elements of at least lambda/2 or a natural multiple thereof, at least one of the lambda/2 elements comprising at least one opening suitable for transmitting the transformed vibrations to a fluid located inside the opening.

Abstract: An ultrasonic wave generating apparatus includes: a generator including an electric power supply, a controller that generates a control signal, a liquid crystal display indicator, and a transducer drive circuit; and transducer portions. The generator includes: the controller having an internal memory or a port to which an external memory is inserted, and formed of a microcomputer to control the generator and the transducer portions; thyristor portions that are arranged respectively in the front and rear ends of the transducer portions, in which two thyristors are connected in series in the respective thyristor portions; snubber circuit portions that are connected in parallel with the respective thyristor portions; at least one transducer that is connected with the controller and is included in the transducer portions; and choke coils that are connected with one end of the respective transducers in the transducer portions.

Abstract: A compact, high power, dual mode, emitting and receiving ultrasound transducer and method for applying ultrasonic energy within a living subject and for monitoring the effects it induces in tissue comprises a set of piezoelectric polymeric transducer elements and a set of piezoelectric ceramic elements, bonded together. The polymeric transducer elements have electrodes enabling their use for low power diagnostic imaging interrogation of the tissue and the ceramic transducer elements have electrodes enabling their use for high power therapy applications.

Abstract: Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.

Abstract: An ultrasonic transducer detector having a high operating frequency is provided. The ultrasonic transducer detector comprises a substrate and an ultrasonic transducer array. The substrate has a plurality of openings, and the ultrasonic transducer array is disposed on the substrate. The ultrasonic transducer array has a plurality of resonance units, and the thickness of each resonance unit is equivalent to ½ wavelength of the operating frequency of the ultrasonic transducer. Each resonance unit comprises an oscillating element and a piezoelectric element. The oscillating element has a first surface adjacent to the substrate, and the piezoelectric element is disposed on the first surface and located in the corresponding opening.

Abstract: Implementations and techniques for manufacturing flexible micro bumps operably coupled to an array of nano-piezoelectric sensors are generally disclosed. The micro bumps and coupled nano-piezoelectric device have use at least as tactile sensors. A wide variety of configurations of the micro bumps and the nano-piezoelectric device are anticipated.

Abstract: An ultrasonic transducer according to the invention includes a flexible sheet, a rigid body portion including a lower electrode made of at least a thin-film conductive material on a surface of the flexible sheet, a dividing portion which divides the rigid body portion into segments, and a plurality of transducer elements including the divided rigid body portion, has at least one transducer cell composed of one of the segments, an insulating partition portion bonded to the segment, an air gap portion surrounded by the partition portion, an upper electrode opposed to the lower electrode extending to the partition portion to sandwich the air gap portion therebetween, and an upper insulating layer formed on the upper electrode, and includes an upper protection film which continuously covers a surface portion of the transducer elements and the dividing portion.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: The present invention relates to an ultrasound transducer assembly (100) comprising ultrasound transducer elements (175, 175a) for transmitting ultrasound waves in a general transmission direction (A). Each of or each of part of the ultrasound transducer elements (175, 175a) comprises a piezoelectric layer (110, 110a) having a top surface, a bottom surface and a side surface with respect to the general transmission direction (A), as well as a bottom electrode layer (111, 111a) and a top electrode layer (112, 112a). A conductive layer (125) is applied at least partly on the side surface of at least one specific one (110a) of the piezoelectric layers, such that the conductive layer (125) is connected to the top electrode layer (112a) and the bottom electrode layer (111a) of said specific piezoelectric layer (110a).

Abstract: The elementary filter of the HBAR type includes two resonators (20, 22) of the HBAR type which are each formed by a transducer (8) and a substrate (12) which are coupled in a suitable manner by electroacoustic waves. The first resonator (20), the second resonator (22) and the coupling element (28) by way of evanescent waves include the same monobloc acoustic substrate (12) which is arranged facing and coupled to the piezoelectric transducer (8) by waves having the same longitudinal or transverse vibration mode through the same reference electrode (10).

Abstract: Provided are an acoustic matching member with a fixed density, an ultrasonic transmitter/receiver unit with a high sensitivity, and an ultrasonic flow meter device which attains stable and high-accurate flow measurement. An acoustic matching member comprises hollow elements and a binding agent. The acoustic matching member is created by removing hollow elements having higher densities, hollow elements having cracks, etc., from hollow elements before sorting-out. Since the hollow elements having higher densities, the hollow elements having cracks, etc., are removed from hollow elements before sorting-out, it becomes possible to provide an acoustic matching member having fixed characteristics without being affected by a manufacturing lot and a transportation process of the hollow elements. An ultrasonic transmitter/receiver unit created using the acoustic matching member has fixed characteristics and is able to perform high-accurate flow measurement.

Abstract: An ultrasound element includes a silicon substrate, a lower electrode layer that has a plurality of lower electrode sections, and a plurality of lower wiring sections, and is connected to a lower electrode terminal to which a drive signal and a bias signal are applied, a lower insulating layer, an upper insulating layer in which a plurality of cavities smaller than the respective lower electrode sections are formed, an upper electrode layer that has a plurality of upper electrode sections that are disposed to face the respective lower electrode sections via the respective cavities, and are smaller than the lower electrode sections and larger than the cavities, and a plurality of upper wiring sections, and is connected to an upper electrode terminal at a ground potential that detects a capacitance signal, and a protection layer.

Abstract: An impedance conversion layer useful for medical imaging ultrasonic transducers comprises a low impedance polymer layer and a high impedance metal layer. These layers are combined with corresponding thicknesses adapted to provide a function of converting from a specific high impedance to specific low impedance, wherein the polymer layer is at the high impedance side and the metal layer is at the low impedance side. The effective acoustic impedance of the polymer and metal layer combination may be adapted to configure an impedance converter in the same way as a quarter wavelength impedance converter, converting from low impedance to high impedance (metal to polymer) or from a high impedance to low impedance (polymer to metal). This structure may be used for front matching with the propagation medium and back matching with an absorber for ultrasonic transducers.

Abstract: Methods are provided for creating a metal or other electrically-conductive member extending from an air-backed cavity of a piezoelectric ultrasonic transducer (pMUT) apparatus defining such an air-backed cavity, through a substrate layer disposed adjacent to the transducer device of the pMUT device, and into electrically-conductive engagement with a first electrode of the pMUT device, such that the electrically-conductive member provides an electrically-conductive engagement between the first electrode and a conformal electrically-conductive layer deposited in the air-backed cavity of the pMUT device. Associated apparatuses are also provided.

Abstract: An ultrasonic transducer device includes a substrate on which a plurality of openings are arranged; a plurality of ultrasonic transducer elements, each of the ultrasonic transducer elements being provided to each of the openings of the plurality of openings, on a first surface of the substrate; and a member fixed to a second surface of the substrate, which is a surface on the opposite side of the first surface of the substrate. Provided to the member are a plurality of first groove sections, and a second groove section for bundling together the plurality of the first groove sections.

Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion and electrically connected to the convex portion, a resin provided between the oscillator and the printed wiring board, the resin covering at least the convex portion and a portion of the printed wiring board.

Abstract: A compact, high power, dual mode, emitting and receiving ultrasound transducer and method for applying ultrasonic energy within a living subject and for monitoring the effects it induces in tissue comprises a set of piezoelectric polymeric transducer elements and a set of piezoelectric ceramic elements, bonded together. The polymeric transducer elements have electrodes enabling their use for low power diagnostic imaging interrogation of the tissue and the ceramic transducer elements have electrodes enabling their use for high power therapy applications.

Abstract: A liquid-ejecting head includes a pressure-generating chamber communicating with a nozzle opening, and a piezoelectric element. The piezoelectric layer contains a perovskite complex oxide containing Bi, La, Fe, and Mn and is ferroelectric.

Abstract: A method is provided for forming a piezoelectric ultrasonic transducer apparatus having a first electrode deposited on a dielectric layer disposed on a primary substrate. A piezoelectric material is deposited between the first electrode and a second electrode, to form a transducer device. At least the piezoelectric material is patterned such that a portion of the first electrode extends laterally outward therefrom. The primary substrate and the dielectric layer are etched to form a first via extending to the laterally outward portion of the first electrode, and a first conductive material is deposited to substantially fill the first via and form an electrically-conductive engagement with the laterally outward portion of the first electrode. The primary substrate is etched to define a second via extending therethrough, wherein the second via is laterally spaced apart from the first via. An associated method and apparatus are also provided.

Abstract: An ultrasonic transducer for determining and/or monitoring flow of a measured medium through a measuring tube, which includes at least one piezoelectric element, at least one coupling element and at least one adapting, or matching, layer between the piezoelectric element and coupling element. The adapting, or matching, layer has a thickness smaller than a fourth of an uneven integer multiple of a wavelength of an ultrasonic signal being used.

Abstract: A method for manufacturing a surface acoustic wave element that prevents curvature of a piezoelectric substrate when forming an electrode pattern includes a first step of bonding to a first principal surface of a piezoelectric substrate a support member having a linear expansion coefficient lower than a linear expansion coefficient of the piezoelectric substrate to form a composite substrate, a second step of forming a plurality of grooves in the support member of the composite substrate from a surface that is opposite to a bonding interface between the support member and the piezoelectric substrate, a third step of forming electrode patterns including at least one IDT electrode on a second principal surface of the piezoelectric substrate of the composite substrate, and a fourth step of dividing the composite substrate on which the electrode patterns are formed to form individual surface acoustic wave elements.

Abstract: A periodic signal generator is configured to generate high frequency signals characterized by relatively low temperature coefficients of frequency (TCF). This generator may include an oscillator containing a pair of equivalent MEMs resonators therein, which are configured to support bulk acoustic wave and surface wave modes of operation at different resonance frequencies. Each resonator includes a stack of layers including a semiconductor resonator body (e.g., Si-body), a piezoelectric layer (e.g., AIN layer) on the resonator body and interdigitated drive and sense electrodes on the piezoelectric layer. The oscillator is configured to support the generation of first and second periodic signals having unequal first and second frequencies (f1, f2) from first and second resonators within the pair. These first and second periodic signals are characterized by respective first and second temperature coefficients of frequency (TCf1, TCf2), which may differ by at least about 10 ppm/° C.

Abstract: An ultrasonic transducer device component changes a transducer with another one having the same frequency or a different frequency without adjustment inside a generator main body or a change of the generator main body. The ultrasonic transducer device component includes a connection unit for use in applying ultrasonic transducer to cleaning fluid for cleaning objects, and for connection with a generator main body that generates an ultrasonic vibration signal; and a transducer connected to a connection unit. The connection unit includes an output transformer for adjusting an output of the ultrasonic vibration signal; a coil capacitor electrically connected to the output transformer; and a current detector electrically connected to the coil capacitor.

Abstract: A piezoelectric sensing device is described for measuring material thickness of targets such as pipes, tubes, and other conduits that carry fluids. The piezoelectric sensing device includes a piezoelectric element mounted to a flexible circuit with glass reinforced polyimide C-stage cover layers surrounding a pure polyimide C-stage core.

Abstract: An aspect of one embodiment, there is provided an ultrasonic transducer including a plurality of oscillators, each of the oscillator having a convex portion, a printed wiring board provided to be opposed to the convex portion, an adhesive material including at least a portion of the convex portion, the adhesive material joining the oscillator and the printed wiring board, and a resin provided between the oscillator and the printed wiring board, the resin covering the convex portion and the adhesive material.

Abstract: The purpose is to provide an ultrasonic transducer and ultrasonic probe without the complexity of the manufacturing process of a non-conductive acoustic matching layer while ensuring the conductive path. In the non-conductive acoustic matching layer comprising the first surface of the electrode side and the second surface of the opposite side of the piezoelectrics, a plurality of first grooves leading up to the mid-way point between the first surface and the second surface are arranged on each of the first surfaces of the non-conductive acoustic matching later in response to the arrangement of sound elements. Moreover, each of the second surfaces is provided with the plurality of second grooves leading up to at least the mid-way point from the second surface, intersecting the first grooves.

Abstract: Provided is a piezoelectric sound generating device capable of obtaining a stable connection state of lead-out conductors constituted of a conductive resin layer. A piezoelectric sound generating device 10, wherein lead-out conductors 18a, 18b are so flatly formed as to extend from surface electrodes 11a, 11b1 of a piezoelectric element 11 exposed to first openings 13a1, 13b1 to terminal electrodes 15a, 15b of a terminal portion 15 exposed to second openings 13a2, 13b2 on one main surface side of a diaphragm 12, respectively. As a result, the surface electrode 11a1 of the piezoelectric element 11 and the terminal electrode 15a of the terminal portion 15, and also the surface electrode 11b1 and a surface electrode 11c of the piezoelectric element 11, and the terminal electrode 15b of the terminal portion 15 are conductively connected. Hence, poor connection caused by cracks or the like is not likely to occur in the lead-out conductors.

Abstract: According to one embodiment, an ultrasonic probe includes a single crystal piezoelectric body with first and second planes facing each other and having a crystal orientation of [100], first and second electrodes on the respective first and second plane of the piezoelectric body, an acoustic matching layer on the first electrode, and a backing member under the second electrode, wherein the piezoelectric body is polarized along a first direction passing through the piezoelectric body and first and second electrodes, a fracture surface of the piezoelectric body that includes the first direction has a multilayer shape along one of the first and second electrodes, and a thickness of each layer of the multilayer shape is not less than 0.5 ?m and not more than 5 ?m.

Abstract: A piezoceramic pulse-echo acoustic transducer includes protection layers for the piezoceramic that are tuned to the piezoceramic so as to optimize pulse-echo signal response (i.e. greater output signal bandwidth and increased return signal sensitivity). The protection layers are tuned to the piezoceramic via material selection and thickness. The acoustic transducer has a backing, a piezoceramic adjacent the backing, an intermediate protection layer adjacent the piezoceramic, and a front protection layer adjacent the intermediate protection layer and opposite the piezoceramic. The front and intermediate protection layers are tuned to the piezoceramic via their acoustic impedance such that the acoustic impedance of the intermediate layer is greater than the acoustic impedance of the piezoceramic and of the front protection layer. The acoustic impedance of the front protection layer is less than the acoustic impedance of the piezoceramic.

Abstract: An ultrasonic sensor device includes a housing, a transducer, a securing unit and a circuit board. The housing has an enclosing portion formed with first and second openings. The transducer is mounted to the enclosing portion at the second opening, and includes an electrically conductive surrounding wall and a piezoelectric member. The securing unit includes a securing component that secures the transducer on the enclosing portion, and a connecting pin set including two pins each having an end connected electrically to a respective one of the surrounding wall and the piezoelectric member. The circuit board is disposed at the first opening of the enclosing portion for electrical connection with the connecting pin set.

Abstract: An ultrasonic device is configured to transmit ultrasonic waves and includes a substrate, a diaphragm, a piezoelectric member and a control unit. The substrate has an opening. The diaphragm covers the opening of the substrate. The piezoelectric member is coupled to the diaphragm, and includes a first piezoelectric part and a second piezoelectric part. The control unit controls a voltage applied to the first piezoelectric part to be a vibration voltage and controls a voltage applied to the second piezoelectric part to be a constant voltage when the ultrasonic device transmits the ultrasonic waves.

Abstract: An ultrasound transducer includes an array of PZT elements mounted on a non-recessed distal surface of a backing block. Between each element and the backing block is a conductive region formed as a portion of a metallic layer sputtered onto the distal surface. Traces on a longitudinally extending circuit board—preferably, a substantially rigid printed circuit board, which may be embedded within the block—connect the conductive region, and thus the PZT element, with any conventional external ultrasound imaging system. A substantially “T” or “inverted-L” shaped electrode is thereby formed for each element, with no need for soldering. At least one longitudinally extending metallic member mounted on a respective lateral surface of the backing block forms a heat sink and a common electrical ground. A thermally and electrically conductive layer, such as of foil, transfers heat from at least one matching layer mounted on the elements to the metallic member.

Abstract: An ultrasound transducer includes an array of acoustic elements, an integrated circuit, and an interposer. The interposer includes conductive elements that electrically connect the array of acoustic elements to the integrated circuit. An electrically conductive adhesive is engaged with the conductive elements of the interposer to electrically connect the interposer to at least one of the integrated circuit or the array of acoustic elements. The electrically conductive adhesive is anisotropically conductive.

Abstract: A positioning device includes a magnetometer configured to detect and provide heading information, a motion sensor configured to detect and provide motion information, a microcontroller coupled to the magnetometer and the motion sensor and configured to generate position data based on the heading information and the motion information, a transmitter coupled to the microcontroller and configured to wirelessly transmit a signal including the position data, and a piezoelectric power source configured to supply power to at least one of the microcontroller, the magnetometer, the motion sensor and the transmitter.

Abstract: A component having a robust, but acoustically sensitive microphone structure is provided and a simple and cost-effective method for its production. This microphone structure includes an acoustically active diaphragm, which functions as deflectable electrode of a microphone capacitor, a stationary, acoustically permeable counter element, which functions as counter electrode of the microphone capacitor, and an arrangement for detecting and analyzing the capacitance changes of the microphone capacitor. The diaphragm is realized in a diaphragm layer above the semiconductor substrate of the component and covers a sound opening in the substrate rear. The counter element is developed in a further layer above the diaphragm. This further layer generally extends across the entire component surface and compensates level differences, so that the entire component surface is largely planar according to this additional layer.