Including A Particular Probing Technique (e.g., Four Point Probe) Patents (Class 324/715)
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Patent number: 7019544Abstract: A differential electrical test probe tip for sensing a plurality of electric signals and generating a differential signal including an elongate common substrate having a two signal test points at one end and a differential amplifier at the second end. Two transmission lines are on the common substrate, each connecting a respective signal test point a signal input of the differential amplifier. The characteristic impedances of the two transmission lines are substantially equal. In one preferred embodiment, the common substrate is a flexible substrate. In one preferred embodiment an over-mold, which may have gaps therein, at least partially encloses the common substrate, the first transmission line, and the second transmission line.Type: GrantFiled: November 22, 2004Date of Patent: March 28, 2006Assignee: LeCroy CorporationInventors: Lawrence W. Jacobs, Julie A. Campbell
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Patent number: 7010849Abstract: A pin having a voltage probe pin-head is provided. The pin includes a pin-head having a substantially flat surface at one end and a pin-head tip at an opposing end, the substantially flat surface is configured to attach to a resistor, and the pin-head tip contacts an electrical test point. The pin also has a neck-like portion that extends between a shaft and the pin-head, wherein the neck-like portion is shorter than the shaft and has a diameter that is smaller than a diameter of a cross-section of the shaft.Type: GrantFiled: April 18, 2002Date of Patent: March 14, 2006Assignee: Agilent Technologies, Inc.Inventor: David Nelson Kimbley
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Patent number: 7005842Abstract: A probe cartridge assembly and a multi-probe assembly (10) including a mounting plate having a plurality of the probe cartridge assemblies mounted on the mounting plate. The probe cartridge assembly generally includes a mounting member, a probe insulator (30), a probe (40), a ferrule (50), a lead insulator (60), a retaining member (70), and a wire having an electrical lead. The electrical lead is positioned within a cavity in the ferrule, and an inclined surface of the ferrule is contacted to an inclined surface of the probe within an area defined by the probe insulator and the lead insulator. The probe insulator and the lead insulator are held within an area defined by the mounting member and the retaining member. The retaining member and the mounting member are adjustably mated to each other in order to provide a clamping force to ensure proper electrical interconnection between the electric lead, the ferrule, and the probe.Type: GrantFiled: December 20, 2001Date of Patent: February 28, 2006Assignee: Tokyo Electron LimitedInventors: Steven T. Fink, Thomas H. Windhorn
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Patent number: 6943571Abstract: A system and method for measuring a resistance or a resistance per square, Rsq, of a material having a surface using a multi-point probe including four or more collinear contact points placed in the interior of the sample, the method including: making a first measurement using a first set of probe electrodes for inducing a current and a second set of probe electrodes for measuring the voltage difference when the current is induced; making a second measurement using a set of probe electrodes different from the first set for inducing a current and a set of probe electrodes different from the second set for measuring the voltage difference when the current is induced; and using a known relationship among the currents induced, the voltages measured, the nominal probe positions and the resistance per square to determine the resistance per square such that measurement errors resulting from positioning of the probes are reduced.Type: GrantFiled: March 18, 2003Date of Patent: September 13, 2005Assignee: International Business Machines CorporationInventor: Daniel Worledge
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Patent number: 6944552Abstract: One embodiment of the invention is a method for analyzing power in a component comprising determining a plurality of current densities, wherein each current density is associated with one portion of a plurality of portions of the component, determining a plurality of wire densities, wherein each wire density is associated with one region of a plurality of regions of the component, and comparing the plurality of current densities and the plurality of wire densities.Type: GrantFiled: June 25, 2003Date of Patent: September 13, 2005Assignee: Hewlett-Packard Development Company, L.P.Inventors: Erin Francom, Gregory D. Rogers
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Patent number: 6919730Abstract: Carbon nanotubes are formed on projections on a substrate. A metal, such as nickel is deposited on the substrate with optional platforms, and heated to form the projections. Carbon nanotubes are formed from the projections by heating in an ethylene, methane or CO atmosphere. A heat sensor is also formed proximate the carbon nanotubes. When exposed to IR radiation, the heat sensor detects changes in temperature representative of the IR radiation. In a gas sensor, a thermally isolated area, such as a pixel is formed on a substrate with an integrated heater. A pair of conductors each have a portion adjacent a portion of the other conductor with projections formed on the adjacent portions of the conductors. Multiple carbon nanotubes are formed between the conductors from one projection to another. IV characteristics of the nanotubes are measured between the conductors in the presence of a gas to be detected.Type: GrantFiled: March 18, 2002Date of Patent: July 19, 2005Assignee: Honeywell International, Inc.Inventors: Barrett E. Cole, David J. Zook
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Patent number: 6917208Abstract: A method for determining resistances at a plurality of interconnected resistors in an integrated circuit and a resistor configuration in which the resistors are interconnected to form a ring structure. Two measurement pads are in each case provided at the nodes between two resistors. The measurement pads can be used for feeding in current and for measuring voltage according to the known four-point measurement method. The effect of the ring structure is that fewer measurement pads are required, in contrast to the customary series circuit of resistors. By way of example, in the case of a ring structure with four resistors, two measurement pads are advantageously saved. The consequently reduced chip area required for the ring structure is advantageous particularly in the case of test circuits, which can be arranged for example in the narrow sawing frame between two chips.Type: GrantFiled: April 4, 2003Date of Patent: July 12, 2005Assignee: Infineon Technologies AGInventors: Jürgen Lindolf, Sibina Sukman
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Patent number: 6894513Abstract: The present application describes a method and an apparatus for characterizing a conductive plane using multipoint measurement. In an embodiment of the present invention, a known current is injected in the conductive plane using multipoint probes and voltage is measured using multipoint probes. The electrical characteristics of the plane can be determined using the values of the known current, measured voltage and the distance between the probes. In an embodiment of the present invention, the conductive plane is integrated in a semiconductor package of an integrated circuit and the value of the known current is determined based on the actual current that can be provided by the integrated circuit during normal operation.Type: GrantFiled: January 27, 2003Date of Patent: May 17, 2005Assignee: Sun Microsystems, Inc.Inventors: Bidyut Sen, Sreemala Pannala
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Patent number: 6856126Abstract: A voltage probe includes a first signal lead configured to receive a first signal from a device under test, a first probe-tip network that is coupled to the first signal lead and that has a frequency response that includes a first transmission zero, a first compensation network that is coupled to the first probe-tip network and that has a frequency response that includes a first transmission pole, a second signal lead configured to receive a second signal from the device under test, a second probe-tip network that is coupled to the second signal lead and that has a frequency response that includes a second transmission zero, a second compensation network that is coupled to the second probe-tip network and that has a frequency response that includes a second transmission pole, and a differential amplifier circuit that is coupled to the first compensation network and to the second compensation network, and that is configured to provide a third signal that is responsive to the first signal and to the second signType: GrantFiled: January 21, 2003Date of Patent: February 15, 2005Assignee: Agilent Technologies, Inc.Inventors: Michael T. McTigue, Kenneth Rush, Bob Kimura, Michael J. Lujan
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Patent number: 6822463Abstract: An active differential test probe with a transmission line input structure. The test probe includes a differential amplifier, a plurality of transmission line signal conductors that are coupled between the differential amplifier and test points where electrical signals can be sampled, and a plurality of transmission line ground conductors that are coupled to the differential amplifier and floating at their opposite end.Type: GrantFiled: September 30, 2002Date of Patent: November 23, 2004Assignee: LeCroy CorporationInventor: Lawrence W. Jacobs
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Publication number: 20040222805Abstract: An electrode, in the form of a spike, for insertion into a sample, has a large-area jacket adapted for applying an excitation current to the sample and a small-area tip electrically decoupled from the jacket, at which a potential measurement is made.Type: ApplicationFiled: August 22, 2003Publication date: November 11, 2004Applicant: FORSCHUNGSZENTRUM JULICH GmbHInventors: Axel Tillmann, Andreas Kemna, Egon Zimmermann, Walter Glaas, Arre Verweerd
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Patent number: 6815229Abstract: A system and method for analyzing sheet resistivity of a layer on a wafer employing electrical methods and for controlling rapid thermal annealing (RTA) of the layer is provided. The system includes components for performing RTA on the layer and components for analyzing the sheet resistivity of one or more portions of the layer upon which RTA was performed. The system further includes a feedback generator adapted to accept sheet resistivity data and to produce feedback information that can be used to control the RTA components. The system further includes a data store that can be employed in machine learning and/or to facilitate generating feedback information that can be employed to control RTA and a monitoring application that can be employed to schedule maintenance on the various components in the system.Type: GrantFiled: March 12, 2001Date of Patent: November 9, 2004Assignee: Advanced Micro Devices, Inc.Inventors: Arvind Halliyal, Ramkumar Subramanian, Bhanwar Singh
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Patent number: 6798222Abstract: A migration measuring method based on an alternating current impedance method, including steps: direct current with fine alternating current superposed is applied across electrodes (1), (2) to measure the impedance there between; and a surface static capacity (c) is calculated from the measured value of impedance in order to measure migration in accordance with the variation of the calculated surface static capacity.Type: GrantFiled: July 30, 2002Date of Patent: September 28, 2004Assignee: Espec CorporationInventors: Hirokazu Tanaka, Sachio Yoshihara, Takashi Shirakashi, Hiroaki Hiramatsu, Kazuhiro Kumekawa, Fumitaka Ueta
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Publication number: 20040183556Abstract: Provided is a fabrication method of a semiconductor integrated circuit device which comprises forming a pushing mechanism by forming, over the upper surface of a thin film probe, a reinforcing material having a linear expansion coefficient (thermal expansion coefficient) almost equal to that of a wafer to be tested; forming a groove in the reinforcing material above a contact terminal, placing an elastomer in the groove so that a predetermined amount exceeds the groove, and disposing a pusher and another elastomer to sandwich the pusher between the elastomers. The present invention makes it possible to improve the throughput of wafer-level electrical testing of a semiconductor integrated circuit.Type: ApplicationFiled: January 29, 2004Publication date: September 23, 2004Inventors: Yuji Wada, Susumu Kasukabe, Takehiko Hasebe, Yasunori Narizuka, Akira Yabushita, Terutaka Mori, Akio Hasebe, Yasuhiro Motoyama, Teruo Shoji, Masakazu Sueyoshi
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Patent number: 6763263Abstract: An electrical property imaging system includes an array of sensors placed around an object to measure the surface charges thereon as a sinusoidal voltage is applied thereacross. The resulting distribution of charges inside the object are calculated using a stored charge correlation matrix. Electrical property images are produced from the internal charge distribution image.Type: GrantFiled: July 26, 2001Date of Patent: July 13, 2004Assignee: WiSys Technology FoundationInventors: Christopher William Gregory, William D. Gregory
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Patent number: 6747205Abstract: The invention relates to a device for assisting in the measurement of the earth resistance comprising a ground rod with a wire coiled up on a reel or the like, and electrical connecting means for connecting the wire to the ground rod. To provide such a device which is practical to handle, simple, small, and capable of being produced at low costs, it is provided for the reel or the like to be rotatably mounted on the ground rod. A further improvement results in that the ground rod comprises an offset portion in whose region the reel or the like is rotatably mounted. Preferably, the electrical connecting means between ground rod and wire comprise sliding rings on the rotation axis, the reel or the like. For an rapid exchangeability of the reel, the latter may be mounted on the ground rod by a snap connection.Type: GrantFiled: March 7, 2002Date of Patent: June 8, 2004Assignee: Lem Norma GmbHInventor: Jurgen Gobelhaider
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Publication number: 20040093716Abstract: A substrate, preferably constructed of a ductile material and a tool having the desired shape of the resulting device for contacting contact pads on a test device is brought into contact with the substrate. The tool is preferably constructed of a material that is harder than the substrate so that a depression can be readily made therein. A dielectric (insulative) layer, that is preferably patterned, is supported by the substrate. A conductive material is located within the depressions and then preferably lapped to remove excess from the top surface of the dielectric layer and to provide a flat overall surface. A trace is patterned on the dielectric layer and the conductive material. A polyimide layer is then preferably patterned over the entire surface. The substrate is then removed by any suitable process.Type: ApplicationFiled: November 10, 2003Publication date: May 20, 2004Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith, Timothy Lesher, Martin Koxxy
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Patent number: 6737875Abstract: A device and method for measuring an impedance between first and second nodes in an electrical circuit without removing components includes at least one current source to provide first and second currents or current signals of known values. First and second probes contact the respective first and second nodes to apply the first and second currents. A third common probe contacts the circuit at a common node that experiences the same current flow as between the first and second nodes. At least one voltage meter measures voltages corresponding to the first and second currents. A processor calculates the impedance based on the known values of the currents, and the measured values of the voltages.Type: GrantFiled: December 17, 2001Date of Patent: May 18, 2004Assignee: Damerco, Inc.Inventors: Larry J. Davis, Kenneth M. Cox
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Patent number: 6724200Abstract: Disclosed is an improved bioelectrical impedance gauge which is so designed that the high-frequency current flowing between two selected points in a living body may be detected in the vicinity of either selected point, and that the voltage appearing between two points selected in the current passage in which the high-frequency current flows may be applied to a high-impedance buffer circuit proximate to the two points selected in the current passage.Type: GrantFiled: March 4, 2002Date of Patent: April 20, 2004Assignee: Tanita CorporationInventor: Yoshinori Fukuda
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Publication number: 20040008043Abstract: A measurement system is provided that includes a probe device having an integrated amplifier. The integrated amplifier may be a transimpedence amplifier that amplifies input current to an output voltage.Type: ApplicationFiled: July 9, 2002Publication date: January 15, 2004Inventors: Thomas P. Thomas, Douglas N. Stunkard, Miriam R. Reshotko, Brandon C. Barnett, Ian A. Young
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Patent number: 6677767Abstract: A contact-type displacement sensor for detecting a displacement of an object to be detected based on a change in a resistance value includes a resistor having a surface to be slid, a slider which slides on the surface to be slid in a predetermined direction in accordance with a displacement of the object to be detected, and an irregular pattern formed on the surface to be slid and including convex portions and concave portions continuously formed along a direction crossing or perpendicular to a sliding direction of the slider.Type: GrantFiled: March 22, 2002Date of Patent: January 13, 2004Inventors: Masahiro Kimura, Kiyohiro Fukaya, Kouji Akashi, Keiji Yasuda
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Patent number: 6671631Abstract: Systems and methods for analyzing a viscoelastic property of a combinatorial library of materials including a plurality of full bridge devices operable for measuring a temperature-modulated elongation property of each of a plurality of combinatorial materials, wherein each of the plurality of full bridge devices comprises a plurality of strain gauges operable for measuring a temperature-modulated elongation property of each of the plurality of combinatorial materials, and wherein each of the plurality of combinatorial materials is disposed on a surface of the plurality of full bridge devices. The systems and methods also including an algorithm disposed within a computer, the algorithm operable for equating the temperature-modulated elongation property of the combinatorial materials with a thermal property of the combinatorial materials.Type: GrantFiled: January 4, 2002Date of Patent: December 30, 2003Assignee: General Electric CompanyInventors: Radislav Alexandrovich Potyrailo, William Guy Morris, Ronald Eugene Shaffer
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Publication number: 20030227292Abstract: A multi-probe assembly includes a chuck assembly configured to receive a back or front surface of a semiconductor wafer. A multi-probe holder has a plurality of probes each having an elastically deformable conductive tip movable into contact with a front surface of a dielectric or a front surface of a semiconducting material. A means applies an electrical stimulus to each tip, measures a response to the electrical stimulus, and determines at least one electrical property of the dielectric and/or the semiconducting material. A method for measuring at least one electrical property applies a probe (or plurality of probes) having an elastically deformable conductive tip to a scribe line(s). An electrical stimulus is applied to the probe or one of the probes with the remaining probes grounded. A response to the electrical stimulus is measured and at least one electrical property of the semiconductor wafer is determined from the response.Type: ApplicationFiled: April 11, 2002Publication date: December 11, 2003Applicant: Solid State Measurements, Inc.Inventor: William H. Howland
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Publication number: 20030222665Abstract: A resistive pin for use in a voltage probe includes a pin-head that is configured to contact a test point in a device under test, and a resistor that is attached to the pinhead. Other systems are also provided for establishing electrical connections between testing instruments and devices under test.Type: ApplicationFiled: May 29, 2002Publication date: December 4, 2003Inventor: David J. Dascher
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Patent number: 6650128Abstract: A fault detection circuit in a boiler-water level system includes a dual-frequency signal generator which develops two AC components with no associated DC component. The two frequencies are mixed and sent through an impedance matching circuit to match the impedance of the signal generating portion of the system with the impedance of the boiler water under measurement. The impedance-matched signal is then directed to two legs, one leg directed through one of a plurality of electrode probes and then to a first filter circuit, and the other leg is directed a second set of filters. In combination, the filters pass either the higher or the lower of the two frequencies to determine an open or short condition in the level sensing circuitry, as well as a steam vs. water condition.Type: GrantFiled: February 19, 2002Date of Patent: November 18, 2003Assignee: Tyco Flow ControlInventor: Gary G. Sanders
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Patent number: 6651014Abstract: An apparatus for the automated measurement and recording of the electrical resistivity of a semiconductor boule or ingot using the method of four probes has a four point boule support grid is provided adjacent to the home position of a four tip probe which is equipped with three axis linear mobility, rotational capability, and computer control, to provide automated mapping and testing of an “as grown” or ground semiconductor boule with cropped ends, for obtaining and recording resistivity data.Type: GrantFiled: May 3, 2002Date of Patent: November 18, 2003Assignee: G.T. Equipment Technologies, IncInventors: Mohan Chandra, David M. Darling, L. Dolan Roman, Carl P. Chartier, Glen Alan Burgess
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Publication number: 20030197517Abstract: A pin having a voltage probe pin-head is provided. The pin includes a pin-head having a substantially flat surface at one end and a pin-head tip at an opposing end, the substantially flat surface is configured to attach to a resistor, and the pin-head tip contacts an electrical test point. The pin also has a neck-like portion that extends between a shaft and the pin-head, wherein the neck-like portion is shorter than the shaft and has a diameter that is smaller than a diameter of a cross-section of the shaft.Type: ApplicationFiled: April 18, 2002Publication date: October 23, 2003Inventor: David Nelson Kimbley
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Patent number: 6636050Abstract: A four-terminal measuring device, which uses nanotube terminals and measures low resistance values and low impedance values of extremely small objects under test with good precision, including two current terminals which cause a constant current to flow from a constant-current power supply to an object under test and two voltage terminals which measure the voltage across both ends of the object under test; and in this four-terminal measuring device, a nanotube terminal is formed by fastening the base end portion of a nanotube to a holder so that the tip end portion of the nanotube protrudes from the holder, and such a nanotube terminal is connected to desired terminals among the four terminals.Type: GrantFiled: July 13, 2001Date of Patent: October 21, 2003Assignees: Daiken Chemical Co., Ltd.Inventors: Yoshikazu Nakayama, Akio Harada, Takashi Okawa, Toshikazu Nosaka
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Patent number: 6636054Abstract: A low capacitance probe contact has electrically conductive contacts having fingers with opposing interior flat surfaces forming a slit there between. The fingers extend in a first direction with a mounting member extending in the opposite direction having a flat surface that is parallel to the flat surfaces of the fingers. The first and second electrically conductive contacts are secured to respective first and second electrically conductive contact pads formed on a substrate with the flat surfaces of the mounting members being positioned on the contact pads. The substrate and the electrically conductive contacts are captured within a housing having first and second members. One member has a base and extending sidewalls forming a recess that receives the substrate and the electrically conductive contacts and the other member has a periphery coextensive with the first member to capture the substrate and the electrically conductive contacts therein.Type: GrantFiled: November 16, 2001Date of Patent: October 21, 2003Assignee: Tektronix, Inc.Inventors: J. Steve Lyford, Mike A. Vilhauer
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Publication number: 20030189436Abstract: A method for determining resistances at a plurality of interconnected resistors in an integrated circuit and a resistor configuration in which the resistors are interconnected to form a ring structure. Two measurement pads are in each case provided at the nodes between two resistors. The measurement pads can be used for feeding in current and for measuring voltage according to the known four-point measurement method. The effect of the ring structure is that fewer measurement pads are required, in contrast to the customary series circuit of resistors. By way of example, in the case of a ring structure with four resistors, two measurement pads are advantageously saved. The consequently reduced chip area required for the ring structure is advantageous particularly in the case of test circuits, which can be arranged for example in the narrow sawing frame between two chips.Type: ApplicationFiled: April 4, 2003Publication date: October 9, 2003Inventors: Jurgen Lindolf, Sibina Sukman
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Publication number: 20030173985Abstract: Carbon nanotubes are formed on projections on a substrate. A metal, such as nickel is deposited on the substrate with optional platforms, and heated to form the projections. Carbon nanotubes are formed from the projections by heating in an ethylene, methane or CO atmosphere. A heat sensor is also formed proximate the carbon nanotubes. When exposed to IR radiation, the heat sensor detects changes in temperature representative of the IR radiation. In a gas sensor, a thermally isolated area, such as a pixel is formed on a substrate with an integrated heater. A pair of conductors each have a portion adjacent a portion of the other conductor with projections formed on the adjacent portions of the conductors. Multiple carbon nanotubes are formed between the conductors from one projection to another. IV characteristics of the nanotubes are measured between the conductors in the presence of a gas to be detected.Type: ApplicationFiled: March 18, 2002Publication date: September 18, 2003Applicant: Honeywell International Inc.Inventors: Barrett E. Cole, J. David Zook
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Publication number: 20030155938Abstract: A fault detection circuit in a boiler-water level system includes a dual-frequency signal generator which develops two AC components with no associated DC component. The two frequencies are mixed and sent through an impedance matching circuit to match the impedance of the signal generating portion of the system with the impedance of the boiler water under measurement. The impedance-matched signal is then directed to two legs, one leg directed through one of a plurality of electrode probes and then to a first filter circuit, and the other leg is directed a second set of filters. In combination, the filters pass either the higher or the lower of the two frequencies to determine an open or short condition in the level sensing circuitry, as well as a steam vs. water condition.Type: ApplicationFiled: February 19, 2002Publication date: August 21, 2003Inventor: Gary G. Sanders
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Publication number: 20030151418Abstract: A circuit tester comprises a reference voltage source, an indicator with first and second response states, an indicator driver connected to the reference voltage source, an oscillator and a probe. The oscillator's output and the probe are both connected to the indicator driver's input. The indicator driver drives the indicator in the first response state when the voltage at the input is lower than the reference voltage, and in the second response state when the voltage at the input is higher than the reference voltage. The oscillator causes the indicator driver to cycle the indicator between the first and second response states when the probe is not connected to a circuit under test.Type: ApplicationFiled: February 8, 2002Publication date: August 14, 2003Inventor: Roger Joseph Leger
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Publication number: 20030132766Abstract: The present invention relates to a device that includes a low-ohmic test. The device includes a metallization copper pad such as metal-six, a metal first film such as Ni that is disposed above the metallization copper pad, and a metal second film such as Au that is disposed above the metal first film. The present invention also relates to a wire-bonding process, and to a method of pulling a first wire bond and making a second wire bond.Type: ApplicationFiled: January 16, 2002Publication date: July 17, 2003Applicant: Intel CorporationInventors: Krishna Seshan, Kuljeet Singh
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Patent number: 6578264Abstract: A method for constructing a membrane probe that includes providing a substrate, and creating a depression within the substrate. Conductive material is located within the depression and a conductive trace is connected to the conductive material. A membrane is applied to support the conductive material and the substrate is removed from the conductive material.Type: GrantFiled: April 11, 2000Date of Patent: June 17, 2003Assignee: Cascade Microtech, Inc.Inventors: Reed Gleason, Michael A. Bayne, Kenneth Smith
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Publication number: 20030094960Abstract: A low capacitance probe contact has electrically conductive contacts having fingers with opposing interior flat surfaces forming a slit there between. The fingers extend in a first direction with a mounting member extending in the opposite direction having a flat surface that is parallel to the flat surfaces of the fingers. The first and second electrically conductive contacts are secured to respective first and second electrically conductive contact pads formed on a substrate with the flat surfaces of the mounting members being positioned on the contact pads. The substrate and the electrically conductive contacts are captured within a housing having first and second members. One member has a base and extending sidewalls forming a recess that receives the substrate and the electrically conductive contacts and the other member has a periphery coextensive with the first member to capture the substrate and the electrically conductive contacts therein.Type: ApplicationFiled: November 16, 2001Publication date: May 22, 2003Inventors: J. Steve Lyford, Mike A. Vilhauer
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Patent number: 6552553Abstract: A bioelectrical impedance measuring apparatus is provided, which includes a measurement board and two pairs of electrodes arranged on the measurement board. A bioelectrical impedance of a subject is detected bringing both foot soles of the subject into contact with the electrodes. Each of the two pairs of electrodes extends approximately radially from the center of the measurement board.Type: GrantFiled: August 31, 2001Date of Patent: April 22, 2003Assignee: Tanita CorporationInventors: Tamaki Shoji, Fumie Shibata
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Patent number: 6552529Abstract: A method and a structure for assembling a circuit board whereby high temperature attach devices can be electrically tested prior to the joining of permanent low temperature attach devices. A test interposer, with low temperature attach known good reference devices, is placed in electrical contact with the circuit board containing high temperature attach devices. The test interposer/circuit board assembly can be used to identify any defective high temperature attach devices which can be replaced prior to joining the permanent low temperature attach devices on the circuit board. This partial interim test, when only the high temperature attach devices are mounted on the circuit board, eliminates the need to remove known good low temperature attach devices from the circuit board during the high temperature attach device rework process.Type: GrantFiled: December 17, 2001Date of Patent: April 22, 2003Assignee: International Business Machines CorporationInventors: Benjamin V. Fasano, Mark G. Courtney
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Patent number: 6507201Abstract: A measuring system has at least four electrodes and an electric current measuring resistance placed in a material under measurement in a desired manner. A power supply supplies an alternating current between two of the electrodes through the resistance. A current measuring unit measures an electric current flowing through the resistance. A voltage measuring unit measures an electric potential difference between electrodes other than the electrodes supplied with the alternating current. A computing unit obtains a conductivity on the basis of the measured electric current and electric potential difference, together with a coefficient determined by the manner in which the electrodes are placed, and performs conversion based on calibration data to obtain the amount of a specific substance mixed in the material under measurement.Type: GrantFiled: July 10, 2001Date of Patent: January 14, 2003Assignee: National Research Institute for Earth Science and Disaster PreventionInventor: Masaki Tominaga
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Patent number: 6456097Abstract: A method for measuring the impedance of electrical distribution equipment includes: applying a voltage at a first selected frequency to electrical distribution equipment, waiting a delay time for transient effects to settle, measuring current through the electrical distribution equipment, and selecting additional frequencies to repeat the steps of applying, waiting, and measuring.Type: GrantFiled: December 29, 1999Date of Patent: September 24, 2002Assignee: General Electric CompanyInventor: Peter E. Sutherland
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Patent number: 6417679Abstract: The invention relates to a conductivity sensor with a substantially circular cylindrical casing of synthetic material and with metal measuring electrodes in its planar substantially circular front wall, of which at least two voltage electrodes and at least two current electrodes form poles, wherein at least two substantially circular voltage electrodes are encompassed by at least two plane-form current electrodes extending substantially in a semicircle or by at least four substantially circular current electrodes disposed in two semicircles.Type: GrantFiled: September 27, 2000Date of Patent: July 9, 2002Assignee: PharmaSerV Marburg GmbH & Co. KGInventor: Jörg Lenz
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Patent number: 6417677Abstract: In an antistatic apparatus for a photomask including a conductive optical shield layer, at least two conductive pins are inserted into the photomask, so that the conductive pins are in contact with the conductive optical shield layer. Then, the photomask is set in a cassette of an electron beam exposure apparatus. Then, the conductive pins are electrically connected to the cassette by conductive plates. Thus, electrons charged at the conductive optical shield layer by electron beams are effectively discharged from the conductive pins to the cassette.Type: GrantFiled: June 26, 2000Date of Patent: July 9, 2002Assignee: NEC CorporationInventor: Hiroshi Yamazaki
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Publication number: 20020084790Abstract: A four-terminal measuring device, which uses nanotube terminals and measures low resistance values and low impedance values of extremely small objects of measurement with good precision, comprising two current terminals which cause a constant current to flow from a constant-current power supply to an object of measurement and two voltage terminals which measure the voltage across both ends of the object of measurement; and in this four-terminal measuring device, a nanotube terminal is formed by fastening the base end portion of a nanotube to a holder so that the tip end portion of the nanotube protrudes from the holder, and such a nanotube terminal is connected to desired terminals among the four terminals.Type: ApplicationFiled: July 13, 2001Publication date: July 4, 2002Inventors: Yoshikazu Nakayama, Akio Harada, Takashi Okawa, Toshikazu Nosaka
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Publication number: 20020075016Abstract: A probe card for testing an electrical element such as a semiconductor wafer or a printed wiring board includes a substrate with circuitry thereon, an encapsulant layer overlying the substrate and a multiplicity of leads extending upwardly from the substrate through the encapsulant layer to terminals, the terminals projecting above the encapsulant layer. The probe card can be engaged with the electronic element so that the tips of the leads bear on the contact pads of the electronic element, and so that the leads and encapsulant layer deform to accommodate irregularities in the electronic element or probe card. The card can be made by providing the substrate, a sacrificial layer and leads extending between the sacrificial layer and substrate, moving the substrate and sacrificial layer away from one another to deform the leads and injecting a curable material around the leads to form the encapsulant layer.Type: ApplicationFiled: October 24, 2001Publication date: June 20, 2002Inventor: Joseph Fjelstad
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Patent number: 6400163Abstract: In a circuit arrangement for monitoring an electronic switch provided for controlling a load and current flown through the load during turn-on intervals for driving the load, the switch has a substantially linear resistance behavior during parts of its turn-on state and the operating point of the switch is located in this part of the turn-on state during the load control. The circuit arrangement comprises a modulation signal generator for generating a modulation signal for modulating the load current flowing through the electronic switch. A first voltage measuring device measures the first voltage drop across the electronic switch caused by the modulation signal. A second voltage measuring device measures the voltage drop across the electronic switch caused by the load current, and an evaluation unit determines the load current from the modulation signal and the first and second voltage drops.Type: GrantFiled: September 8, 2000Date of Patent: June 4, 2002Inventors: Rolf Melcher, Siegfried Seliger
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Publication number: 20020060576Abstract: A measuring system has at least four electrodes and an electric current measuring resistance placed in a material under measurement in a desired manner. A power supply supplies an alternating current between two of the electrodes through the resistance. A current measuring unit measures an electric current flowing through the resistance. A voltage measuring unit measures an electric potential difference between electrodes other than the electrodes supplied with the alternating current. A computing unit obtains a conductivity on the basis of the measured electric current and electric potential difference, together with a coefficient determined by the manner in which the electrodes are placed, and performs conversion based on calibration data to obtain the amount of a specific substance mixed in the material under measurement. An electrode rod has a distal end member formed from a cylindrical member, one end of which is formed into a conical shape.Type: ApplicationFiled: July 10, 2001Publication date: May 23, 2002Applicant: National Research Institure for Earth Science and Disaster PreventionInventor: Masaki Tominaga
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Patent number: 6387625Abstract: An electrode for detecting interactions between members of a binding pair, which electrode has been modified by formation of a non-conductive self-assembled monolayer, and a method of detecting biomolecules, such as nucleic acids or other targets, including receptors, ligands, antigens or antibodies, utilizing such an electrode. When contacted with a target nucleic acid, an oligonucleotide probe coupled to the self-assembled monolayer reacts with the target nucleic acid form a hybridized nucleic acid on the modified electrode surface. The hybridized nucleic acid is reacted with a transition metal complex capable of oxidizing a preselected base in the hybridized nucleic acid in an oxidation-reduction reaction, the oxidation-reduction reaction is detected, and the presence or absence of the nucleic acid is determined from the detected oxidation-reduction reaction.Type: GrantFiled: June 19, 2000Date of Patent: May 14, 2002Assignees: The University of North Carolina at Chapel Hill, Xanthon, Inc.Inventors: Allen E. Eckhardt, Jill C. Mikulecky, Mary E. Napier, Robert S. Thomas, H. Holden Thorp
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Publication number: 20020027439Abstract: A bioelectrical impedance measuring apparatus of the present invention includes a measurement board and two pairs of electrodes arranged on the measurement board. In the bioelectrical impedance measuring apparatus, a bioelectrical impedance of a subject is detected with bringing both foot soles of the subject into contact with the electrodes. The bioelectrical impedance measuring apparatus is characterized in that each of the two pairs of electrodes is arranged to extend approximately radially from the center of the measurement board.Type: ApplicationFiled: August 31, 2001Publication date: March 7, 2002Applicant: TANITA CORPORATIONInventors: Tamaki Shoji, Fumie Shibata
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Patent number: 6331778Abstract: Methods are provided for detecting and locating leaks in liners used as barriers in the construction of landfills, surface impoundments, water reservoirs, tanks, and the like. Electrodes are placed in the ground around the periphery of the facility, in the leak detection zone located between two liners if present, and/or within the containment facility. Electrical resistivity data is collected using these electrodes. This data is used to map the electrical resistivity distribution beneath the containment liner or between two liners in a double-lined facility. In an alternative embodiment, an electrode placed within the lined facility is driven to an electrical potential with respect to another electrode placed at a distance from the lined facility (mise-a-la-masse). Voltage differences are then measured between various combinations of additional electrodes placed in the soil on the periphery of the facility, the leak detection zone, or within the facility.Type: GrantFiled: August 25, 1997Date of Patent: December 18, 2001Assignee: Leak Location Services, Inc.Inventors: William D. Daily, Daren L. Laine, Edwin F. Laine
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Patent number: 6323661Abstract: To determine electrical resistance of an ohmic contact between a flexible printed circuit and a metallized layer upon a substrate of piezoelectric material, the printed circuit is provided with two exposed metal pads, in close proximity to each other, and two electrical leads from each pad to locations on the printed circuit that are accessible for probing with a four-lead resistance meter. For measurement of contact resistance in process development and process capability studies, many sets of such pads, of a variety of sizes, may be combined into a single printed circuit. For in-process monitoring of transducer manufacturing, a small number of contact resistance measurement pads may be designed into production printed circuits.Type: GrantFiled: May 1, 2000Date of Patent: November 27, 2001Assignee: General Electric CompanyInventors: Douglas Glenn Wildes, George Charles Sogoian