Abstract: A heating structure and a wafer test device are provided. The heating structure includes: a heating base, provided with a heating element inside the heating base; a mounting component, disposed above the heat base and including a plurality of mounting stations arranged at intervals; and a plurality of insulating thermo-conductive blocks. Each of the plurality of insulating thermo-conductive blocks is disposed at one corresponding mounting station of the plurality of mounting stations and protrudes from the mounting component for contacting a clamp of the wafer test device.

Abstract: Placing a first side of an active thermal interposer device of a thermal management head against a device under test (DUT). Disposing a cold plate against a second side of the active thermal interposer. The DUT includes a die and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to the cold plate, and individually controlling heating of each zone of the plurality of zones.

Abstract: A sensor test apparatus capable of efficiently testing a sensor is provided. A sensor test apparatus 30 which tests the pressure sensor 90 includes an application unit 40 including an application device 42 including a socket 445 to which the sensor 90 is electronically connected, a pressure chamber 43 which applies pressure to the sensor 90, and a heat sink 443,462 which applies a thermal stress to the sensor 90, the test unit 35 which tests the sensor 90 via the socket 445, and the conveying robot 33 which conveys the sensor 90 into and out of the application unit 40.

Abstract: A method for testing a semiconductor chip that has a pn junction constituting a parasitic diode therein includes: causing probe terminals to be in contact with front surface electrodes of the semiconductor chip; obtaining a temperature of the semiconductor chip by measuring electrical characteristics of the parasitic diode through at least one of the front surface electrodes and a back surface electrode and by referring to prescribed temperature characteristics of the parasitic diode; if the obtained temperature is not within a prescribed tolerance from the predetermined target temperature, heating up the semiconductor chip by applying voltage between one or more of the front surface electrodes and the back surface electrode; and once the obtained temperature increases and reaches the predetermined target temperature within the prescribed tolerance, testing electrical characteristics of the semiconductor chip through the front surface electrodes and the back surface electrode.

Abstract: A testing system includes a load board that includes a first circuit board, a first external connector attached to the first circuit board, and a thermal module configured to hold a system-on-wafer structure including a connector and a socket, a connector structure including a second circuit board, wherein the second circuit board is electrically connected to the first external connector, and a second external connector configured to connect to the connector of the system-on-wafer structure, and a test structure configured to connect to the socket of the system-on-wafer structure, the test structure including a third circuit board and pins, wherein adjacent pairs of pins of the test structure are electrically coupled through the third circuit board to form a continuous conductive path extending alternately between the system-on-wafer structure and the adjacent pairs of pins of the test structure.

Abstract: An apparatus (10) for checking a component (30) is disclosed. The apparatus (10) comprises a sample holder (20) with a module (28) for receiving at least one component (30), at least one magnetic field generator (60a, 60b, 60c) for generating a magnetic field around the module (28), an inlet (40) for feeding a tempered medium into the module (25), and an outlet (45) for discharging a tempered medium from the module (28).

Abstract: An environment control apparatus includes an apparatus body, a processing device, and a plurality of temperature adjusting devices. The apparatus body includes a plurality of accommodating chambers each having one of the temperature adjusting devices. Each of the temperature adjusting devices has a heater and a cooler. When a chip testing device carrying a plurality of chips is arranged in one of the accommodating chambers, the chip testing device is supplied with electricity, and the heater and the cooler of the corresponding temperature adjusting device are controlled to operate, the chip testing device performs a testing process on the chips disposed thereon.

Abstract: [Problem] To provide an artery visualization device capable of very appropriately visualizing a to-be-punctured artery and an artery imaging device used for the artery visualization device.

Abstract: A temperature-controlled module for electronic devices and a testing apparatus provided with the same mainly include a temperature-controlled tray, an upper board and a dry-air supply device. The temperature-controlled tray includes holding cavities for accommodating electronic devices and a fluid chamber for cooling fluid. The upper board is furnished with through holes, while the upper board and the temperature-controlled tray are spaced by a predetermined distance. The dry-air supply device provides dry air to a space between the temperature-controlled tray and the upper board. Thereupon, by having cooling fluid to flow inside the temperature-controlled tray, the temperature-controlled tray can be kept in a lower predetermined temperature so as to rapidly cool down the electronic device. In addition, by providing the upper board and the dry-air supply device to allow dry air to flow through the surface of the electronic device, then the water-condensation phenomenon and air leakage can avoided.

Abstract: A semiconductor die includes a last metallization layer above a semiconductor substrate, a bond pad above the last metallization layer, a passivation layer covering part of the bond pad and having an opening that defines a contact area of the bond pad, an insulating region separating the bond pad from the last metallization layer at least in an area corresponding to the contact area of the bond pad, and an electrically conductive interconnection structure that extends from the bond pad to the upper metallization layer outside the contact area of the bond pad. Corresponding methods of manufacture are also provided.

Abstract: A testkey structure including the following components is provided. A fin structure is disposed on a substrate and stretches along a first direction. A first gate structure and a second gate structure are disposed on the fin structure and stretch along a second direction. A first common source region is disposed in the fin structure between the first gate structure and the second gate structure. A first drain region is disposed in the fin structure at a side of the first gate structure opposite to the first common source region. A second drain region disposed in the fin structure at a side of the second gate structure opposite to the first common source region. A testkey structure is symmetrical along a horizontal line crossing the first common source region. The present invention further provides a method of measuring device defect or connection defect by using the same.

Abstract: A chip heater and heating air arrangement includes a circuit module including a circuit board, chip unit mounted on the circuit board and locating member mounted around the chip unit, heating aid including flat heat-transfer base panel, locating structure mounted in the flat heat-transfer base panel and attached to the chip unit and mounting structure outwardly extended from the flat heat-transfer base panel and fastened to the locating member, heater fastened to the locating structure of the heating aid, and heat dissipating mechanism including a heat-transfer holder plate attached to the heater. If the temperature of the chip unit goes below 0° C., the heater is turned on to generate heat and enabling generated heat to be transferred through the heating aid to heat the chip unit to the normal operating temperature level, enabling the computer device that uses the chip heater and heating air arrangement to work under cold environment.

Abstract: A climate chamber for measuring electronic circuits, having a housing that includes an interior space and an opening. The interior space is at least thermally insulated from the surroundings by the housing. Two movable jaws each have an end face. An interior space in a region of an opening is distanced from the surroundings according to the thickness of the jaws, and the jaws each comprise a thermal insulation layer, and each jaw has a front side facing the surroundings and a back side facing the interior space. The two jaws are spaced apart by a clear width being formed between the two end faces, so that the circuits disposed on a carrier can be introduced into the climate chamber and in a second state, the opening for the protection of the interior space is sealed against ambient conditions.

Abstract: A testing apparatus for testing a circuit board is disclosed, which includes an upper plate, a lower plate, and an adaptor circuit board. A plurality of positioning units is received in the lower plate. Each positioning unit has a plurality of length-variable test probes secured therein. Each test probe has a shell and upper and lower probe ends at opposite ends of the shell. In test, the circuit board is put on the lower plate and the upper plate is lowered to push the circuit board and the lower plate toward the adaptor circuit board. The upper ends of the test probes engage with electrical connectors of the circuit board and the lower ends thereof engage with the adaptor circuit board whereby test of the circuit board can be automatically performed by the testing apparatus.

Abstract: A wafer inspection interface 18 includes a probe card 20 having multiple probes 25 at a surface of the probe card 20 facing a wafer W, the probes 25 being arranged to correspond to electrodes of multiple semiconductor devices formed on the wafer W; a pogo frame 40 that is in contact with a surface of the probe card 20 opposite to the surface of the probe card 20 facing the wafer W and supports the probe card 20; and a sheath heater 44 provided in the pogo frame 40. The sheath heater 44 is provided along respective sides of through holes 43 formed in the pogo frame 40 in a grid pattern.

Abstract: The present invention relates to an electronic load module and to a method and a system therefor. The method comprises receiving control data (301) from a connectable power controller via a data bus connector (202), and controlling (302) an active load (203) based on the received control data to sink a defined current from a connectable device under test via a first input (204). The method further comprises controlling (303) the activate load (203) based on the received control data by means of a digital control circuit (201) and the connectable power controller to generate and maintain an ambient temperature of the device under test.

Abstract: A touch testing system for a capacitive touch device and a method thereof are provided. The system includes a test fixture, at least one magnetization component, at least one magnetic induction component and a driving unit. The fixture is disposed on the touch device and has at least one chute on a position corresponding to the touching area. The magnetization component is disposed on the fixture and enabled by a driving signal to produce a magnetic force. The magnetic induction component is slidably disposed in the chute and inducts the magnetic force to slide along the chute, such that the sensing unit produces a touch testing information. The driving unit is coupled to the magnetization component and the sensing unit, provides the driving signal to enable the magnetization component and receives the touch testing information to feed back a testing result on the capacitive touch device accordingly.

Abstract: An apparatus controls a temperature of a device by circulating a fluid through a heat sink in thermal contact with the device. The apparatus includes an adjustable cold input, which inputs a cold portion of the fluid having a first temperature, and an adjustable hot input, which inputs a hot portion of the fluid having a second temperature higher than the first temperature. The apparatus further includes a chamber, connected to the cold input and hot input, in which the cold and hot portions of the fluid mix in a combined fluid portion that impinges on the heat sink. The combined fluid portion has a combined temperature that directly affects a temperature of the heat sink. The cold input and hot input are adjusted to dynamically control the combined temperature, enabling the heat sink temperature to compensate for changes in the device temperature, substantially maintaining a set point temperature of the device.

Abstract: A thin heating device is provided. The thin heating device includes a first circuit board, a second circuit board, an elastic connector and a heating element. The first and second circuit boards are face-to-face arranged. The elastic connector connects the first and second circuit boards to apply a return force to hold an under-tested device. The heating element is mounted on the first or the second circuit board to heat the under-tested device.

Abstract: A system including a first circuit and a second circuit. The first circuit includes analog components configured to receive an input signal and provide an output signal based on the input signal. The second circuit is configured to measure characteristics of the output signal to test the first circuit. At least one of the output signal and another output signal is fed back to provide the input signal and generate an oscillation in the output signal.

Abstract: A current sensor is disclosed. The current sensor includes a leadframe having a die paddle, a portion of the die paddle being configured as a resistive element through which current can flow, and an integrated circuit (IC) die attached and thermally coupled to the die paddle. The IC die includes a current sensing module configured to measure a voltage drop across the resistive element and convert the voltage drop measurement to a current measurement signal and a temperature compensation module electrically coupled to the current sensing module. The temperature compensation module is configured to adjust the current measurement signal to compensate for temperature-dependent changes in the resistive element. The temperature compensation module includes a temperature-sensitive element, with a portion of the temperature-sensitive element located directly over a portion of the resistive element.

Abstract: An apparatus for testing an electrical property of a semiconductor device includes a substrate support unit, a tester head above the substrate support unit, the tester head including a base, a probe card connected to the base of the tester head, and a temperature control unit within the base of the tester head, the temperature control unit being configured to control temperature of the probe card by heat transfer with the probe card.

Abstract: Method and apparatus for self-regulated burn-in of an integrated circuit (IC) is described. One embodiment of a method of burn-in for the IC includes: configuring programmable resources of the IC device based on a burn-in pattern to implement a load controller, the load controller having a plurality of heat core circuits. The load controller is initialized with a number of enabled heat core circuits of the plurality of heat core circuits. A junction temperature is measured in the IC device after a measurement period has elapsed. The junction temperature is compared with a set-point temperature. The number of the enabled heat core circuits is increased if the junction temperature is less than the set-point temperature, or the number of the enabled heat core circuits is decreased if the junction temperature is greater than the set-point temperature.

Abstract: A burn-in system (10) includes an enclosure (12) defining a burn-in chamber (14). The enclosure (12) is configured to be mounted on a burn-in board (34) over a burn-in socket (36). A heating element (16) is configured to generate heat within the burn-in chamber (14) and a temperature sensor (18) is configured to sense a temperature within the burn-in chamber (14). An opening (24) is formed in the enclosure (12) for receiving a fluid (26). A controller (20) is configured to control the heating element (16) and fluid flow into the enclosure (12) in response to the temperature sensed by the temperature sensor (18).

Abstract: A heater for heating packaged die for burn-in and heat testing is described. The heater may be a ceramic-type heater with a metal filament. The heater may be incorporated into the integrated circuit package as an additional ceramic layer of the package, or may be an external heater placed in contact with the package to heat the die. Many different types of integrated circuit packages may be accommodated. The method provides increased energy efficiency for heating the die while reducing temperature stresses on testing equipment. The method allows the use of multiple heaters to heat die to different temperatures. Faulty die may be heated to weaken die attach material to facilitate removal of the die. The heater filament or a separate temperature thermistor located in the package may be used to accurately measure die temperature.

Abstract: A method of controlling a temperature of a test slot in a disk drive testing system includes regulating temperature changes of a subject test slot based on one or more operating conditions of one or more other test slots neighboring the subject test slot.