Abstract: Embodiments herein relate to a test probe. The test probe may have a first plurality of beams and a second plurality of beams. An intermediate substrate may be positioned between the first plurality of beams and the second plurality of beams. In embodiments, both the first and second plurality of beams may be angled. Other embodiments may be described or claimed.

Abstract: A display substrate having a bonding area for bonding with a circuit structure. The display substrate includes a plurality of first electrodes and a plurality of second electrodes in the bonding area, a respective one of the plurality of first electrodes being bound to a respective one of the plurality of second electrodes thereby forming a respective pair of a plurality of bound electrode pairs in the bonding area; a barrier layer including a plurality of barriers respectively between adjacent pairs of the plurality of bound electrode pairs; and an anisotropic conductive film for bonding the respective one of the plurality of first electrodes and the respective one of the plurality of second electrodes together.

Abstract: Various implementations of automatic test equipment are disclosed having a number of innovative features. In one implementation, the equipment includes a test head having a probe card support apparatus that provides stiffening support and/or planarization to the device under test (DUT) area of a probe card. In another implementation, the test head can include a planar surface and the wafer prober can include a corresponding planar surface. The planar surfaces can be brought into contact with each other to planarize the DUT area of the probe card and the wafer chuck in the wafer prober relative to each other.

Abstract: This inspection jig is provided with: an inspection-side support member having a counter plate (51) provided with a facing surface (F) disposed to face the substrate; and an electrode-side support member (6) having supporting plates (61-63) disposed to face an electrode plate (9) located on the side opposite to the facing surface (F) of the counter plate (51) A probe supporting hole (23), into and by which the rear end portion of the probe (Pr) is inserted and supported, is provided in the supporting plates (61-63), and the probe supporting hole (23) is provided with a restricting surface which is formed along a supporting line (V) inclined at a certain angle (?) with respect to a reference line (Z), and which restricts the rear end portion of the probe (Pr) from moving in the direction perpendicular to the inclined direction of the supporting line (V).

Abstract: A probe assembly is provided, which is applied to an electrical testing device. The probe assembly includes a probe body, which includes a testing end configured to contact with a to-be-tested device and a connection end opposite to the testing end; an elastic connection structure configured to be deformed when the probe body is subjected to a pressure; and a fixing base. The connection end is fixedly connected to the fixing base via the elastic connection structure. A testing device is further provided.

Abstract: A testing head for testing the working of a device under test comprises a plurality of contact probes, each contact probe having a rod-like body of a predetermined length that extends between a first end and a second end and being housed in respective guide holes made in at least one plate-like lower guide and one plate-like upper guide that are parallel to each other and spaced apart by a bending zone. Suitably, at least one of the lower guide and upper guide is equipped with at least one recessed portion formed at a plurality of those guide holes and realizing lowered portions thereof adapted to reduce a thickness of the plurality of those guide holes.

Abstract: In an embodiment, a method includes: stacking a plurality of first dies to form a device stack; revealing testing pads of a topmost die of the device stack; testing the device stack using the testing pads of the topmost die; and after testing the device stack, forming bonding pads in the topmost die, the bonding pads being different from the testing pads.

Abstract: A substrate supporting and transferring apparatus and associated methods, the apparatus including a shuttle configured to move in a x-direction and a y-direction, the y-direction being perpendicular to the x-direction; a lower wedge block on the shuttle, the lower wedge block including a lower surface that is parallel with an upper surface of the shuttle and an upper surface that is inclined with respect to the lower surface of the lower wedge block; an upper wedge block on the lower wedge block, the upper wedge block including a lower surface that is parallel with the upper surface of the lower wedge block and an upper surface that is parallel with the upper surface of the shuttle; and a chuck on the upper wedge block, the chuck being configured to support a substrate.

Abstract: A rectangular probe of a probe card device includes a metallic pin and a metallic reinforcing body. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment extending from the first connecting segment in a direction away from the middle segment, and a second contacting segment extending from the second connecting segment in a direction away from the middle segment. The metallic reinforcing body is integrally formed on the middle segment. The Young's modulus of the metallic reinforcing body is larger than that of the metallic pin. The electric conductivity of the metallic pin is larger than that of the metallic reinforcing body. An outside diameter jointly formed by the metallic reinforcing body and the middle segment is larger than an outside diameter of the second connecting segment.

Abstract: A system, method, and computer program product are provided for automatically generating a wafer image to design coordinate mapping. In use, a design of a wafer is received by a computer processor. In addition, an image of a wafer fabricated from the design is received by the computer processor. Further, a coordinate mapping between the design and the image is automatically generated by the computer processor.

Abstract: Improvement in yield of a semiconductor device is obtained. In addition, increase in service life of a socket terminal is obtained. A projecting portion PJ1 and a projecting portion PJ2 are provided in an end portion PU of a socket terminal STE1. Thus, it is possible to enable contact between a lead and the socket terminal STE in which a large current is caused to flow, at two points by a contact using the projecting portion PJ1 and by a contact using the projecting portion PJ2, for example. As a result, the current flowing from the socket terminal STE1 to the lead flows by being dispersed into a path flowing in the projecting portion PJ1 and a path flowing in the projecting portion PJ2. Accordingly, it is possible to suppress increase of temperature of a contact portion between the socket terminal STE1 and the lead even in a case where the large current is caused to flow between the socket terminal STE1 and the lead.

Abstract: Improvement in yield of a semiconductor device is obtained. In addition, increase in service life of a socket terminal is obtained. A projecting portion PJ1 and a projecting portion PJ2 are provided in an end portion PU of a socket terminal STE1. Thus, it is possible to enable contact between a lead and the socket terminal STE in which a large current is caused to flow, at two points by a contact using the projecting portion PJ1 and by a contact using the projecting portion PJ2, for example. As a result, the current flowing from the socket terminal STE1 to the lead flows by being dispersed into a path flowing in the projecting portion PJ1 and a path flowing in the projecting portion PJ2. Accordingly, it is possible to suppress increase of temperature of a contact portion between the socket terminal STE1 and the lead even in a case where the large current is caused to flow between the socket terminal STE1 and the lead.

Abstract: A temperature-forcing system and method for controlling the temperature of an electronic device under test comprises a temperature-forcing head, including a face positionable in thermal contact with the device, and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser, a flow control device for inducing a pressure drop in the refrigerant, and a conduit circuit through which the refrigerant is flowable. The subsystem cooperates with the evaporator so as to define at least one closed loop through which a corresponding bi-phase refrigerant is circulatable, so that, during circulation, the refrigerant is maintained in a liquid phase between the compressor and the flow control device and in a gaseous phase while flowing through the evaporator. The temperature of the device is therefore switchable by the head at a rapid rate of 50 to 150 degrees Celsius per minute.

Abstract: Multiple planes within the sample are exposed from a single perspective for contact by an electrical probe. The sample can be milled at a non-orthogonal angle to expose different layers as sloped surfaces. The sloped edges of multiple, parallel conductor planes provide access to the multiple levels from above. The planes can be accessed, for example, for contacting with an electrical probe for applying or sensing a voltage. The level of an exposed layer to be contacted can be identified, for example, by counting down the exposed layers from the sample surface, since the non-orthogonal mill makes all layers visible from above. Alternatively, the sample can be milled orthogonally to the surface, and then tilted and/or rotated to provide access to multiple levels of the device. The milling is preferably performed away from the region of interest, to provide electrical access to the region while minimizing damage to the region.

Abstract: A temperature-forcing system, for controlling the temperature of an electronic device under test, comprising— a temperature-forcing head, including a face configured to be put in thermal contact with the device and an evaporator, in direct or indirect thermal contact with the face; and a refrigerant circulation subsystem, including a compressor, a condenser and a metering device; wherein the subsystem is configured to circulate a bi-phase refrigerant, in closed loop fashion, through the evaporator so that, during circulation, the refrigerant is maintained at high pressure between the compressor and the metering device and at low pressure while flowing through the evaporator. More specifically, in the disclosed system the refrigerant, while flowing through the evaporator at a low pressure, is operative to dissipate heat therefrom by evaporation and the evaporator or any part thereof is formed as a heat exchanger.

Abstract: A printed circuit board assembly includes a printed circuit board, a connector mounted on the printed circuit board and including at least one terminal electrically connected to an external device, and at least one electronic component mounted on the printed circuit board and electrically connected to the at least one terminal of the connector. The connector includes at least one test point electrically connected to the terminal and configured to make contact with a test probe.

Abstract: In one embodiment, a method of fabricating an electrostatic clamp includes forming an insulator body, forming an electrode on the insulator body, and depositing a layer stack on the electrode, the layer stack comprising an aluminum oxide layer that is deposited using atomic layer deposition (ALD).

Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.

Abstract: Embodiments include a testing arrangement for testing a first package, the testing arrangement comprising a frame having a top section and a bottom section, wherein the bottom section of the frame comprises a pickup section, and wherein the pickup section has a first air pathway; a second package mounted on a top surface of the bottom section of the frame such that a second air pathway is defined between (i) the second package and (ii) the top surface of the bottom section of the frame; and a vacuum path defined by (i) the first air pathway and (ii) the second air pathway, wherein during testing of the first package, a vacuum in the vacuum path is generated such that the pickup section of the bottom section of the frame holds the first package.

Abstract: Embodiments of the present invention generally relate to a method for cleaning a processing chamber during substrate processing. During a first substrate processing step, a plasma is formed from a gas mixture of argon, helium, and hydrogen in the processing chamber. In a second substrate processing step, an argon plasma is formed in the processing chamber.

Abstract: A stretchable electronic device is disclosed. In one aspect, the device has a stretchable interconnection electrically connecting two electronic components. The stretchable interconnection includes an electrically conductive channel having a predetermined first geometry by which the channel is stretchable up to a given elastic limit and a first flexible supporting layer provided for supporting the electrically conductive channel and having a predetermined second geometry by which the first supporting layer is stretchable. The predetermined second geometry has a predetermined deviation from the predetermined first geometry chosen for restricting stretchability of the electrically conductive channel below its elastic limit.

Abstract: A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.

Abstract: A contact probe electrically connects the tester side and an electrode pad of a circuit to be tested. This contact probe has a mounting portion on a base end portion mounted on a probe card, a contact portion on a distal end portion brought into contact with the electrode pad, and an arm portion between them elastically supporting the contact portion. The contact portion is provided on a lower end portion of a base portion integrally mounted on a distal end portion of the arm portion. The arm portion has a one-side arm piece supporting the base portion and allowing vertical movement of the base portion and the other-side arm piece supporting the base portion and adjusting an inclination angle of the base portion to reduce a scrub amount of the contact portion. The probe card uses the above-described contact probe.

Abstract: An electrical apparatus, comprises a restricted breathing enclosure having an interior cavity, and a temperature regulator having at least an interior sensing portion within the interior cavity, the temperature regulator including a processor responsive to the interior sensing portion to send control signals to a heat transfer portion of the temperature regulator.

Abstract: A zero insertion force (ZIF) connector can include a connector housing defining an opening and an interior space for receiving a mating member, multiple LIGA springs positioned within the interior space and configured to apply pressure to the mating member while in a first position, and a locking component to cause the LIGA springs to move to a second position responsive to a user pressing the locking component. The LIGA springs do not apply pressure to the mating member while in the second position.

Abstract: A probe apparatus 10 that maintains a contact state between each of probes 15 of a probe card 17 and each of corresponding electrodes of semiconductor devices formed on a wafer W by maintaining a decompressed state of a sealed space S between the wafer W and the probe card 17 includes an ejector 23 configured to decompress the sealed space S. Further, the ejector 23 includes a suction port 29; a decompression chamber 31 communicating with the suction port 29; an exhaust port 34 communicating with the decompression chamber 31; and a nozzle 32 through which air is discharged toward the decompression chamber 31 at a high velocity. Furthermore, the nozzle 32 is configured to directly confront the exhaust port 34, and the suction port 29 communicates with the sealed space S.

Abstract: A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly including a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body, the main body having a probe support ridge associated therewith and the removable probe having an alignment ridge associated therewith, the alignment ridge and the probe support ridge lying in a same plane when the mating protrusion is inserted into the socket.

Abstract: Disclosed are a test probe and a machining method of a test probe, the test probe including a plunger end part contacting a tested contact point, the plunger end part including a plurality of tips protruding toward the tested contact point, and at least one of the plurality of tips is a higher tip and at least another one of the plurality of tips is a lower tip that is lower than the higher tip.

Abstract: A test apparatus for testing a semiconductor device includes a circuit board having a contact pattern on one side and an opening therethrough, and a probe card supporting a probe needle array. The probe needle array is insertable into the opening of the circuit board and is configured to probe a device under test. The probe needle array is in electrical contact with the contact pattern of the circuit board, to allow signals through the probe card and circuit board to a test equipment. A holder supports the probe card and other probe cards. The holder has multiple sides, each of which is supportable of a probe card having a probe needle array. The holder is rotatable to manipulate and position the probe needle arrays of the probe cards relative to a device under test. The holder allows disconnection and replacement of the probe needle arrays from the holder.

Abstract: A connector includes a connector case and probe pins that are arranged two-dimensionally in the connector case. Each of the probe pins includes a housing, a first contact terminal disposed at one end of the housing, a second contact terminal disposed at another end of the housing, and plural bent parts formed in the housing and protruding outward from a surface of the housing. The connector case includes through holes. Each of the through holes accommodates the probe pin and includes grooves that are formed in its inner surface and correspond to the bent parts. The grooves of each through hole face substantially the same directions as the grooves of other through holes.

Abstract: The invention relates to a contacting unit for a test apparatus for testing printed circuit boards. The contacting unit comprises a full grid cassette and an adapter. The full grid cassette is provided with a plurality of spring contact pins arranged in the grid of contact points of a basic grid of a test apparatus. The adapter is provided with test needles for electrically connecting each of the spring contact pins of the full grid cassette to a circuit board test point of a printed circuit board to be tested, the spring contact pins being secured in the full grid cassette against falling out on the side remote from the adapter and the test needles being secured in the adapter on the side remote from the full grid cassette. The adapter and the full grid cassette are releasably joined to each other. In this way, both the spring contact pins and the test needles are secured against falling out of the contacting unit in the assembled state of the adapter and the full grid cassette.

Abstract: A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.

Abstract: A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring.

Abstract: According to one embodiment, an apparatus of measuring a semiconductor device includes a first sense terminal, a first force terminal, a second sense terminal, and a plurality of second force terminals. The first sense terminal is configured to be electrically connected to a first electrode provided on a first surface of a semiconductor device. The first force terminal is configured to be electrically connected to the first electrode of the semiconductor device. The second sense terminal is configured to be electrically connected to a second electrode provided on a second surface of the semiconductor device. The second surface is opposite to the first surface. The plurality of second force terminals is disposed in a circumference of the second sense terminal, and is configured to be electrically connected to the second electrode of the semiconductor device.

Abstract: Methods and apparatus for providing measurements in p-n junctions and taking into account the lateral current for improved accuracy are disclosed. The lateral current may be controlled, allowing the spreading of the current to be reduced or substantially eliminated. Alternatively or additionally, the lateral current may be measured, allowing a more accurate normal current to be calculated by compensating for the measured spreading. In addition, the techniques utilized for controlling the lateral current and the techniques utilized for measuring the lateral current may also be implemented jointly.

Abstract: A probe module for testing an electronic device comprises at least two contacts, each contact including a first end portion extending in a first direction along a first line, a second end portion extending linearly in a second direction opposite from the first direction and along a second line, and a third curved portion extending between the first end portion and the second end portion. The first line is spaced apart from and in parallel with the second line, and the at least two contacts are spaced apart from each other in a direction perpendicular to the first line and the second line. Methods for making such a probe module are also taught.

Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.

Abstract: A connector includes multiple probes and a first insulator part and a second insulator part joined to cover the probes. Each of the probes has a monolithic structure of a single bent metal plate. Each of the probes includes an end part configured to come into contact with an electrode terminal; a spring part having a meandering shape and connected to the end part; a housing part bent to enclose the spring part; and a bent part provided between the spring part and the housing part. The end parts of the probes are at least partially projecting outward from first openings provided in the first insulator part, and the bent parts of the probes are at least partially projecting outward from second openings provided in the second insulator part.

Abstract: Manufacturing of magnetometer units (20?) employs a test socket (41) having a substantially rigid body (43) with a cavity (42) therein holding an untested unit (20) in a predetermined position (48) proximate electrical connection (50) thereto, wherein one or more magnetic field sources (281, 332, 333, 334, 335, 336) fixed in the body (43) provide known magnetic fields at the position (48) so that the response of each unit (20) is measured and compared to stored expected values. Based thereon, each unit (20) can be calibrated or trimmed by feeding corrective electrical signals back to the unit (20) through the test socket (41) until the actual and expected responses match or the unit (200) is discarded as uncorrectable. In a preferred embodiment, the magnetic field sources (281, 332, 333, 334, 335, 336) are substantially orthogonal coil pairs (332, 333, 334) arranged so that their centerlines (332-1, 333-1, 334-1) coincide at a common point (46) within the predetermined position (48).

Abstract: At least two needles (11, 12) are inserted from the surface of an outer covering film (200) such that the needles reach metal foils (252, 262) in the outer covering film (200), and the electrical connection state with an object inside of a structure covered with the outer covering film (200) is inspected. The electrical connection state is more reliably inspected.

Abstract: A semiconductor die with an array of contacts, where at least two contacts in adjacent positions have the same data signal during testing operations with a test probe. The adjacent contacts of the cluster allow the use of a larger test probe tip and/or greater tolerance on test probe tip alignment during testing operations.

Abstract: A method for testing a semiconductor device is disclosed. The method comprises positioning a probe card comprising a plurality of probes above the semiconductor device and moving the probe card in a vertical direction towards the semiconductor device. The plurality of probes are moving in a vertical direction towards a plurality of electrical structures of the semiconductor device until each probe of the plurality of probes has made mechanical contact with a corresponding electrical structure of the plurality of electrical structures with a minimum quantity of force. The each probe of the plurality of probes absorbs a portion of vertical overdrive after contacting their corresponding electrical structures. The probe card absorbs any remaining vertical overdrive. The vertical overdrive is a continuing vertical movement of the plurality of probes after a first probe of the plurality of probes mechanically contacts a first corresponding electrical structure.

Abstract: In one embodiment, a method for testing a plurality of singulated semiconductor die involves 1) placing each of the singulated semiconductor die on a surface of a die carrier, 2) mating an array of electrical contactors with the plurality of singulated semiconductor die, and then 3) performing electrical tests on the plurality of singulated semiconductor die, via the array of electrical contactors.

Abstract: A test prod for high-frequency measurement having a contact-side end for electrically contacting planar structures and a cable-side end, for connecting to a cable, wherein between the contact-side end and the cable-side end a coplanar conductor structure having at least two conductors is arranged, wherein on the coplanar conductor structure a dielectric is arranged over a predetermined section between the cable-side end and the contact-side end, wherein the test prod is between the dielectric and the contact-side end such that the conductors of the coplanar conductor structure are arranged freely in space and relative to the dielectric in a suspending manner, wherein on one side of the test prod facing towards the planar structure a shielding element is arranged extending into the area of the coplanar conductor structure.

Abstract: A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability.

Abstract: The wafer probe station includes: a plurality of the pressure sensors; a tilt correction unit which is constructed with a plurality of actuators, a plurality of displacement sensors which are disposed at positions adjacent to the corresponding actuators and a microcomputer; and a control unit which allows the wafer to be come in contact with the probe card by lifting up a Z-axis stage by a predetermined overdriving amount, extracts the pressure values of the installation positions from the pressure sensors, calculates driving amounts of the actuators of the tilt correction unit by using the pressure values so that a uniform load is applied to the chuck, calculates X and Y directional displacement values w occurring according to a change in a tilt of the chuck, lifts down the Z-axis stage, and after that, corrects an eccentric load of the chuck by driving the actuators of the tilt correction unit according to the driving amounts, and controls movement of the XY-axis stage by using the X and Y directional displ

Abstract: An assistive fine positioning support device for positioning and/or holding a test probe tip (the test probe tip being distanced from the probing head). The support device includes at least one positionable support member having a first support end and a second support end. A tip adapter at the first support end is for connecting the test probe tip to the at least one positionable support member, the tip adapter being in direct contact with the test probe tip. The second support end having means for holding and securing to a surface supporting an electrical component to be probed.

Abstract: A test circuit that senses a misaligned probe during a test includes a first power control section that senses voltage levels of a plurality of sensing lines and controls power supplied to a lower circuit section provided below a part of a pad group, and a second power control section that selectively provides an internal voltage in response to a sensing result of the first power control section.

Abstract: Translators coupleable to opposing surfaces of microelectronic substrates for testing, and associated systems and methods are disclosed. An arrangement in accordance with one embodiment includes a microelectronic substrate having a first major surface, a second major face facing opposite from the first major surface, and electrically conductive through-substrate vias extending through the substrate and electrically accessible from both the first and second surfaces.

Abstract: Nano spike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a translator having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer-side sites are carried by the translator at the wafer side of the translator. The nanospikes can be attached to nanospike sites on a wafer side of a translator. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, the nanospikes can be formed by sputtering over a metal carrier with a photoresist mask. In particular embodiments, the nanospikes have generally conical cross-section.