Abstract: A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

Abstract: The present invention is a set of layered probes that make electrical contact to a device under test. The layered probes are disposed within openings of at least one guide plate. The guide plate surrounds the probes via the openings. The layered probes have a base end, an opposing tip end and a shaft connecting the base end to the tip end. The base end can have a positioning device that extends away from the base end.

Abstract: A probe card installed in a probe device includes a supporting plate capable of supporting a contact body and a circuit board installed above a top surface of the supporting plate. A connection member is installed at a top surface of the circuit board and the supporting plate and the connection member are connected to each other by a connection body. Load control members are installed at a top surface of the connection member and capable of maintaining a contact load between the contact body and an object to be inspected at a constant level. Elastic members are installed at a peripheral portion of the connection member and capable of fixing a horizontal position of the supporting plate. An intermediate member is installed between the circuit board and the supporting plate and configured to elastically and electrically connect the circuit board and the supporting plate.

Abstract: A contact probe includes: a first and second plungers, one of the first and second plungers being connected to an object to be inspected, the other being connected to an inspecting board; and a spring urging the first and second plungers so as to be separated from each other. The first plunger includes a distal end side columnar part and a flange part. The flange part includes a first portion that has a first length from a center point, which is, greater than a radius of the distal end side columnar part, in a first direction perpendicular to an axial direction, and includes a second portion that has a second length from the center point, which is smaller than the radius of the distal end side columnar part, in a second direction perpendicular to the axial direction and different from the first direction.

Abstract: An interconnect assembly includes a bond pad and an interconnect structure configured to electrically couple an electronic structure to the bond pad. The interconnect structure physically contacts areas of the bond pad that are located outside of a probe contact area that may have been damaged during testing. Insulating material covers the probe contact area and defines openings spaced apart from the probe contact area. The interconnect structure extends through the openings to contact the bond pad.

Abstract: Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card.

Abstract: A contact inspection device including contacts that contact with a test object for inspection, each contact having a base end portion, a needle tip portion having a needle tip that contacts with the test object, and an elastically deformable portion located between the base end portion and the needle tip portion, with the base end portion and the needle tip portion having axes which coincide with each other. The elastically deformable portion is deformable under a compressive force applied in the axial direction of the needle tip portion while the needle tip is pressed against the test object and converts the compressive force into a tilting motion of the needle tip portion about the needle tip through deformation. The needle tip portion is displaceable in a direction in which the needle tip portion is pivotally tilted while the needle tip is pressed against the test object.

Abstract: An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S1, the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S1 satisfies S1>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X3, the crushed area S2 of the terminal is set to satisfy a relationship of S2<S1?X3.

Abstract: A probe comprises: a membrane having a bump which contacts an input/output terminal of an IC device built into a semiconductor wafer under test; a pitch conversion board having a bottom surface on which a first terminal is provided and a top surface on which a second terminal connected to the first terminal is provided; a circuit board which is electrically connected to a test head and has a third terminal; a first anisotropic conductive rubber member having a first conductor part which electrically connects the bump of the membrane and the first terminal of the pitch conversion board; and a second anisotropic conductive rubber member having a second conductor part which electrically connects the second terminal of the pitch conversion board and the third terminal of the circuit board, and the second conductor parts are provided on the whole of the second anisotropic conductive rubber member.

Abstract: A test contact may include a first portion having an open-ended rounded shape. The first portion may define an opening therethrough. The test contact may include a second portion having a curved structure. The first portion and the second portion may be formed integrally, and the second portion may be configured to contact a portion of a device lead.

Abstract: A connection device for connecting charge-coupled device (CCD) modules to test apparatuses to test the CCD modules includes a connection unit and a test unit. The connection unit includes a plurality of connection pins. The unit under test is electrically connected to the connection unit and the test apparatuses. When the connection pins are in contact with the CCD modules, the CCD modules are electrically connected to the test apparatuses through the connection unit and the test unit, such that the test apparatus receives electric signals generated by the CCD modules to enable quality testing of the CCD modules.

Abstract: Terminals of a device under test are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact partially or completely laterally surrounds the force contact, so that it need not have its own resiliency. The sense contact has a forked end with prongs that extend to opposite sides of the force contact. Alternatively, the sense contact surrounds the force contact and slides laterally to match a lateral translation component of a lateral cross-section of the force contact during longitudinal compression of the force contact. Alternatively, the sense contact includes rods that have ends on opposite sides of the force contact, and extend parallel.

Abstract: A contact probe comprises conductively coupled plungers and a coil spring. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. The spring is attached to the plungers in a manner that prevents rotation of the spring's ends. A desired magnitude of torsional bias is generated by twisting the spring a predetermined angle prior to attachment of the spring to the plungers. An additional torsional bias is generated by the tendency of the spring to twist when the spring is axially displaced. The resultant torsional bias rotatably biases the coupling means of the plungers against each other, generating contact forces for a direct conductive coupling between the plungers. The plungers are self-latching or are retentively attached to the spring using the torsional bias of the spring. Plungers with hermaphroditic coupling means can be fabricated from a sheet metal or a profiled stock by stamping or machining.

Abstract: An inspection method for inspecting electric characteristics of devices formed on a target object using an apparatus including a vertical drive mechanism for lifting and lowering a movable mounting table and a control unit for controlling the vertical drive mechanism. The vertical drive mechanism includes an elevation shaft connected to the mounting table and a servo motor for driving the elevation shaft to lift and lower the mounting table. The control unit has a servo driver including a position control part for controlling a position of the motor, a torque control part for controlling a torque of the motor as a probe card is expanded or contracted by a change in temperature and a switching part for switching the position control part and the torque control part. The method includes heating or cooling the target object, controlling a position of the motor, and controlling a torque of the motor.

Abstract: There is provided a method and a device for accurately detecting the contact of a mechanical probe with a contact object. The contact detecting device comprises a mechanical probe movable for being in contact with a contacted object, a charged particle beam source which generates a charged particle beam applied to the contacted object, a detector for detecting secondary particles or reflected particles from the contacted object, a calculating device which calculates, from a detection signal from the detector, a feature quantity of a shadow of the mechanical probe projected on the contacted object, and a control device which controls the operation of the mechanical probe. The calculating device calculates, as the feature quantity of the shadow of the mechanical probe, a shadow depth S(x, y), and obtains an evaluation value J(z), showing a distance between the contacted object and the mechanical probe, based on the shadow depth S(x, y).

Abstract: Provided are an apparatus and a method of testing a semiconductor device. A horizontal maintaining unit provided inside a test head applies load to a probe card in a direction perpendicular to the probe card to hold the probe card in a horizontal state. Probe needles of the probe card are uniformly placed on a central region of pads of the semiconductor device, thereby providing an apparatus and a method of testing a semiconductor device capable of improving productivity and reducing a yield loss of a test process.

Abstract: A wiring board and a probe card using the wiring board which respond to a demand for improving electrical reliability.

Abstract: A spring contact pin includes a depressible probe member having a tapered configuration that prevents contact between the projecting end of the probe member and the end of the spring barrel throughout the compression and release cycle of the probe. The tapered configuration of the depressible probe member improves the mechanical performance, reliability, and high-speed signal performance of the contact pin.

Abstract: A method of measuring slider resistance of different types of row bar with a common tester comprises judging the type of the row bar, if the row bar is femto-type row bar, supplying a first voltage to the front pins, and supplying a second voltage that is unequal to the first voltage to the back pins, thereby obtaining resistances of the sliders; if the row bar is shunting-type row bar, supplying a third voltage to the front pins which contact the test pads, and supplying a fourth voltage that is unequal to the third voltage to the front pin that contacts the common test pad, thereby obtaining resistances of the sliders. The present invention can measure two different types of row bar with a same common tester, which can reduce the downtime of machine and the manpower, and prevent the probe card from being damaged without a frequent disassembly and switch.

Abstract: Independent assemblies are compliantly mounted to a force transfer mechanism to optically align and thermally couple a device under test (DUT) to a test apparatus. A first assembly includes an optical connector. The first assembly has an alignment feature and a first compliant interface. A second assembly includes a thermal control member and force transfer members coupled to a structure. A passage permits a portion of the arm of the first assembly to extend through the structure. The force transfer members provide respective seats for an additional compliant interface. The alignment feature engages a corresponding feature to align the optical connector with the DUT before the compliant interfaces compress under an external force. Compliant mounting of the assemblies accommodates manufacturing tolerances in the DUT so that contact forces on the DUT are relatively consistent and thereby enable consistent optical and thermal coupling between the test apparatus and the DUT.

Abstract: A probe card is provided that is capable of accurately ensuring the flatness and the parallelism with respect to a predetermined reference surface. A point (Q) of application of force applied from a leaf spring (17) that presses a portion near an edge portion of a surface of a probe head (15) from which a plurality of probes projects over an entire circumference in a direction of a substrate to the probe head (15) is positioned inside of an outer edge of the probe head (15), and a point (P) of application of force applied from the retainer (16) that presses a portion near an edge portion of a space transformer (14) over an entire circumference in the direction of the substrate to the space transformer (14) is positioned inside of an outer edge of the space transformer (14).

Abstract: A testing mechanism for testing magnetically operated microelectromechanical system (MEMS) switches at a wafer level stage of manufacture includes an electromagnetic fixture configured to be received in a standard probe ring. The electromagnetic fixture is rotatable, relative to the probe ring, to permit adjustment of orientation of a generated magnetic field relative to the MEMS devices of a subject wafer. The testing mechanism also includes a probe card with probes positioned to contact test pads on the subject wafer. During operation, the probe card is positioned over the wafer to be tested, with the test probes in electrical contact with respective contact pads of the wafer, and the electromagnetic fixture is positioned above the probe card. An electrical potential is applied across the switches on the subject wafer, and the electromagnetic fixture is energized at selected levels of power and duration.

Abstract: Terminals (2, 502) of a device under test (DUT) are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact (770) partially or completely laterally surrounds the force contact (700). In order to increase the contact surface, the force contact, in a spring pin (700) configuration contacts the device under test terminal at that portion of the lead which is curved or angled, rather than orthogonal to the pin.

Abstract: Disclosed is a probe which stably transmits a test signal. The probe electrically connects a semiconductor device and a tester for testing the semiconductor device. The probe may include an upper plunger which is configured to be electrically connected to the semiconductor device; a lower plunger which is configured to be electrically connected to the tester; an elastic member which is disposed between the upper plunger and the lower plunger, and elastically biases the upper and lower plungers to have them spaced from each other; a conductive member which is disposed in an inside or outside of the elastic member and electrically connects the upper plunger and the lower plunger; and a barrel which accommodates therein the upper plunger, the lower plunger, the elastic member and the conductive member.

Abstract: A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement range and the second spring has a positive stiffness over the predefined displacement range. The first spring and second spring can be coupled so that the negative stiffness and positive stiffness substantially cancel to produce a net stiffness of the tip relative to the base over the predefined displacement range.

Abstract: An SCR module tester facilitates rapid testing of SCR modules by a series of tests that are tailored to detect faults without applying full power to the modules. The SCR tester includes a quick clamp connector that is able to securely and easily clamp SCR modules for both the F/A-18 A/D GCU and F/A-18-E/F GCU facilitating the rapid testing of SCR modules.

Abstract: A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly including a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body, the main body having a probe support ridge associated therewith and the removable probe having an alignment ridge associated therewith, the alignment ridge and the probe support ridge lying in a same plane when the mating protrusion is inserted into the socket.

Abstract: A tester includes a main body and a removable probe. The main body includes a main body probe and a front panel including selectable options for selecting a tester function. The removable probe may be coupled to the main body via a cord. The removable probe is fixable to the main body via a latch assembly. The latch assembly includes a socket disposed on one of the removable probe or the main body and a mating protrusion disposed at the other of the removable probe or the main body.

Abstract: A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.

Abstract: A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

Abstract: A method of correcting a position of a prober, the method including obtaining a first image of a pad, the pad having a predetermined reference contact position, contacting the prober to the pad after obtaining the first image of the pad, obtaining a second image of the pad after contacting the prober to the pad, determining an actual contact position of an actual contact mark on the pad, the actual contact mark being produced by the contacting of the prober to the pad, comparing the second image to the first image to obtain an offset data, the offset data relating the actual contact position to the reference contact position, and correcting the position of the prober by aligning the actual contact position with the reference contact position based on the offset data.

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance.

Abstract: An apparatus for controlling the Z axis position of a wafer prober includes a first sensor unit including a plurality of pressure sensors distributed and installed between a Z axis support plate, for supporting a Z axis transferring unit and a Z axis base. Actuators are distributed and installed between the Z axis support plate and the Z axis base, and lift up or lower the Z axis support plate. A driving unit drives the actuators. A control module controls the driving unit to drive the actuators in response to pieces of sensed data. The control module drives the actuators when a difference between the pieces of sensed data is greater than a preset difference limit value, thus enabling the chuck plate to be maintained in a horizontal state.

Abstract: A testing device suitable for a testing apparatus with light inspection of a display panel is provided, in which the testing device includes a main part and two contact parts. The testing device is fixed to the testing apparatus with light inspection by the main part. Two contact parts are respectively extended from two ends of the main part along a first direction, and each of the contact parts has a plurality of tips. The tips of each contact part have different heights. Besides, a testing apparatus is also provided. Therefore, the abovementioned testing device and the testing apparatus are able to drastically extend the user lifetime, improve the inspection accuracy and save cost.

Abstract: Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin.

Abstract: A flicker noise test system includes a guarded signal path and an unguarded signal path selectively connectable to respective terminals of a device under test. The selected signal path is connectable a terminal without disconnecting cables or changing probes.

Abstract: A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.

Abstract: A probe for testing electrical properties of test samples includes a body having a probe arm defining proximal and distal ends, the probe arm extending from the body at the proximal end of the probe arm, whereby a first axis is defined by the proximal and the distal ends. The probe arm defines a geometry allowing flexible movement of the probe arm along the first axis and along a second axis perpendicular to the first axis, and along a third axis orthogonal to a plane defined by the first axis and the second axis.

Abstract: A connection device for connecting charge-coupled device (CCD) modules to test apparatuses to test the CCD modules includes a connection unit and a test unit. The connection unit includes a plurality of connection pins. The unit under test is electrically connected to the connection unit and the test apparatuses. When the connection pins are in contact with the CCD modules, the CCD modules are electrically connected to the test apparatuses through the connection unit and the test unit, such that the test apparatus receives electric signals generated by the CCD modules to enable quality testing of the CCD modules.

Abstract: An SCR module tester facilitates rapid testing of SCR modules by a series of tests that are tailored to detect faults without applying full power to the modules. The SCR tester includes a quick clamp connector that is able to securely and easily clamp SCR modules for both the F/A-18 A/D GCU and F/A-18-E/F GCU facilitating the rapid testing of SCR modules.

Abstract: Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.

Abstract: A contact probe includes: a first and second plungers, one of the first and second plungers being connected to an object to be inspected, the other being connected to an inspecting board; and a spring urging the first and second plungers so as to be separated from each other. The first plunger includes a distal end side columnar part and a flange part. The flange part includes a first portion that has a first length from a center point, which is, greater than a radius of the distal end side columnar part, in a first direction perpendicular to an axial direction, and includes a second portion that has a second length from the center point, which is smaller than the radius of the distal end side columnar part, in a second direction perpendicular to the axial direction and different from the first direction.

Abstract: An electrical testing apparatus for testing an electrical test sample. The apparatus includes a conductor substrate (12) which is electrically connected via a contact spacing converter (7) to a test head (2). The conductor substrate is mechanically connected to a first stiffening device (26) and is thereby stiffened. At least one spacer (30) which penetrates the conductor substrate (12) is mechanically connected to the contact spacing converter (7) and is held on the first stiffening device (26) via at least one tilt adjusting arrangement (34).

Abstract: A fixing apparatus for fixing a probe card to a holder includes a screw fixed to the holder and binding the probe card onto the holder in a vertical direction, a first bearing member intervening between a head of the screw and the probe card and allowing expansion and contraction of the probe card with respect to the screw in a horizontal direction, and a second bearing member intervening between the probe card and the holder and allowing expansion and contraction of the probe card with respect to the holder in the horizontal direction.

Abstract: Minute probes are created to correspond to the alignment of the input/output terminals of a device under test. A probe manufacturing method of manufacturing a probe, includes: forming a contact section on a probe main body; and shaping at least one of the contact section and the probe main body by cutting by means of a cutting tool. The contact section is formed on a substrate that is to become the probe main body, and the probe manufacturing method further includes: after shaping at least one of the contact section and the substrate that is to become the probe main body, removing the portion of the substrate excluding the probe main body thereby forming a probe.

Abstract: A probe having a conductive body and a contacting tip that is terminated by one or more blunt skates for engaging a conductive pad of a device under test (DUT) for performing electrical testing. The contacting tip has a certain width and the blunt skate is narrower than the tip width. The skate is aligned along a scrub direction and also has a certain curvature along the scrub direction such that it may undergo both a scrub motion and a self-cleaning rotation upon application of a contact force between the skate and the conductive pad. While the scrub motion clears oxide from the pad to establish electrical contact, the rotation removes debris from the skate and thus preserves a low contact resistance between the skate and the pad. The use of probes with one or more blunt skates and methods of using such self-cleaning probes are especially advantageous when testing DUTs with low-K conductive pads or other mechanically fragile pads that tend to be damaged by large contact force concentration.

Abstract: An electrical testing device has a first probe that electrically contacts with an inspection device, a second probe that is electrically connected to the first probe and electrically contacts with an external terminal of a test object, a cylinder that houses the first probe and second probe, and into which and out of which a fluid flows between the first probe and second probe, and a fluid pressure regulator that controls the fluid pressure in the cylinder. The fluid pressure in the cylinder controls the contact force between the first probe and the inspection device and the contact force between the second probe and the external terminal.

Abstract: An electronic component pressing device includes a first pressing member for pressing a predetermined first region of the electronic component to be tested; a second pressing member for pressing a predetermined second region other than the first region of the electronic component to be tested; a gimbal mechanism for adhering the first pressing member to the first region when the first pressing member presses the first region of the electronic component to be tested; first pressing load applying means for applying a pressing load on the gimbal mechanism; and second pressing load applying means for applying a pressing load on the second pressing member.

Abstract: A testing device suitable for a testing apparatus with light inspection of a display panel is provided, in which the testing device includes a main part and two contact parts. The testing device is fixed to the testing apparatus with light inspection by the main part. Two contact parts are respectively extended from two ends of the main part along a first direction, and each of the contact parts has a plurality of tips. The tips of each contact part have different heights. Besides, a testing apparatus is also provided. Therefore, the abovementioned testing device and the testing apparatus are able to drastically extend the user lifetime, improve the inspection accuracy and save cost.

Abstract: Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.