Abstract: A probe card includes a flexible inorganic material layer, a metal micro structure, and a circuit board. The flexible inorganic material layer has a first surface and a second surface opposite to each other. The metal micro structure is disposed on the first surface. The circuit board is disposed on the second surface, and the circuit board is electrically connected to the metal micro structure. The test signal is adapted to be conducted to the circuit board through the flexible inorganic material layer.

Abstract: Proposed are a laminated anodic aluminum oxide structure in which a plurality of anodic aluminum oxide films are stacked, a guide plate of a probe card using the same, and a probe card having the same. More particularly, proposed are a laminated anodic aluminum oxide structure with a high degree of surface strength, a guide plate of a probe card using the same, and a probe card having the same.

Abstract: Proposed are an anodic aluminum oxide structure made of anodic aluminum oxide, a probe head having the same, and a probe card having the same. More particularly, proposed are an anodic aluminum oxide structure that has a fine size and pitch guide hole and facilitates insertion of a probe, a probe head having the same, and a probe card having the same.

Abstract: An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.

Abstract: A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.

Abstract: An inspection jig includes a support member that supports a probe. The support member includes an inspection side plate-shaped body arranged on one end portion side, and an electrode side plate-shaped body arranged on the other end portion side of the support member. A probe support hole into which one end portion of the probe is inserted and supported is formed in the inspection side plate-shaped body. A probe insertion hole into which the other end portion of the probe is inserted is formed in the electrode side plate-shaped body. The probe is supported while the one end portion of the probe abuts on an inner wall of the probe support hole in a state in which a contact portion provided at the one end portion of the probe is not in contact with an inspected portion to be inspected.

Abstract: Disclosed is a probe device of a floating structure including a probe unit having a groove formed at one end thereof into which a needle for transmitting an electrical signal is inserted, and a guide portion formed at the other end thereof and a plate unit having an inner space which is inserted with the guide portion and formed to support a part of the guide portion, wherein the guide portion is spaced apart from the inner space at a predetermined interval by an external force applied to the needle.

Abstract: A test socket according to the present disclosure is provided in a test apparatus in which a device under inspection having a terminal is connected to a tester, which generates a test signal, for testing the device under inspection, the test socket includes a nonelastic insulating housing formed of a nonelastic insulating material and provided with a plurality of housing holes formed therein to pass therethrough in a thickness direction; and an electrically-conductive part formed to have a configuration in which a plurality of electrically-conductive particles are contained in an elastic insulating material, the electrically-conductive part having a lower end portion connected to a signal electrode of the tester placed below the nonelastic insulating housing and an upper end portion disposed in the housing hole to be connected to the terminal of the device under inspection placed on the nonelastic insulating housing.

Abstract: An environment control device and a chip testing system are provided. An apparatus body of the environment control device includes a plurality of accommodating chambers. Each of the accommodating chambers has a temperature adjusting device disposed therein. Each of the accommodating adjusting devices includes a temperature adjuster, a contacting structure, a frame body, and an elastic annular enclosed member. When a chip testing device carrying a plurality of chips is disposed in one of the accommodating chambers, and the contacting structure contacts one side of the chips, the elastic annular enclosed member is abutted against the chip testing device, and the chip testing device and the contacting structure jointly define an enclosed space. The temperature adjuster can correspondingly adjust the temperature of the contacting structure so that the chip testing device can perform a predetermined testing process on the chips in a predetermined temperature environment.

Abstract: A probe card of a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane. Suitably, the testing head is arranged between the support plate and a first portion of the flexible membrane, which is connected to the support plate through a second portion thereof, the probe card further comprising a plurality of contact tips arranged on a first face of the flexible membrane at the first portion thereof, the second end portion of each contact element being apt to abut onto a second face of the flexible membrane, opposite to the first face, the number and distribution of the contact elements being different to the number and distribution of the contact tips.

Abstract: A terminal state measurement device for a coaxial cable includes: a conductive cylindrical body which comes close to a front end edge of an outer conductor terminal to bring a front end face of the conductive cylindrical body into contact with the front end edge when the outer conductor terminal is connected to a coaxial cable; a conduction measurement element displaceable with respect to the conductive cylindrical body in an axial direction, and which contacts a front end of an inner conductor terminal from the front side to displace in the axial direction in accordance with an insertion position of the inner conductor terminal; a displacement measurement device which measures a position of the front end of the inner conductor terminal; and an insulation determination unit which determines an insulation quality based on a conduction state of the conduction measurement element and the conductive cylindrical body.

Abstract: A probe card inspection wafer includes a base wafer and first and second probe card inspection chips on the base wafer and apart from each other, wherein each of the first and second probe card inspection chips located on the base wafer is divided into a probe vertical-level inspection region, a probe horizontal-position inspection region, and contact inspection regions, wherein the first and second probe card inspection chips include first pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second alternating-current (AC) probes of a probe card to be inspected, and second pad arrays located on the probe vertical-level inspection region and configured for inspecting vertical levels of first and second VSS probes of the probe card to be inspected.

Abstract: A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units disposed on the circuit board. Each electrically connecting unit includes a main body disposed on the circuit board to form an accommodating slot, a lift structure partially arranged in the accommodating slot. A portion of the lift structure having a chip receiving slot passes through an opening of the main body. The pressing device includes a temperature conditioner being controllable to increase or decrease temperature. When the lift structure is pressed by a flat structure of the temperature conditioner, the probe assemblies are connected to one side of a chip received in the chip receiving slot, and the flat contacting surface is abutted against another side of the chip for transmitting heat energy there-between.

Abstract: A probe is a probe having a substantially bar-like shape and includes a distal end portion with a substantially columnar shape adapted to be in contact with an inspection point provided on a device under test, a base end portion with a substantially columnar shape on an opposite side of the distal end portion, and a main body portion formed in a flat ribbon shape and extended to connect the distal end portion to the base end portion. The distal end portion is provided with a distal end surface inclined relative to and intersecting with an axial center of the probe.

Abstract: A probe card device and a rectangular probe are provided. The rectangular probe includes a metallic pin, an insulating film, and an insulating latch. The metallic pin includes a connecting portion, a detecting portion, and a middle segment arranged between the connecting portion and the detecting portion. The insulating film covers entirely outer surfaces of the middle segment. The insulating latch is in a ring shape and is arranged around at least part of the insulating film. A bottom of the insulating latch is arranged adjacent to the detecting portion. A length of the insulating latch is less than or equal to that of the insulating film, and a thickness of the insulating latch is larger than that of the insulating film and is at least 10 ?m.

Abstract: A semi-automatic connector for flexible circuit, comprising a lead wire (6), an upper housing (1), a lower housing (2) and an insert snap portion (4); a button hole (1.1) being opened on the upper housing (1) and a button (3) being disposed in the button hole (1.1); wherein a circuit board (5) is disposed in the lower housing (2) and the top surface of the circuit board (5) provided with elastic sheets (5.1), the circuit board (5) is connected to one end of the lead wire (6); the insert snap portion (4) is disposed above the circuit board (5) with a cavity to receive a flexible circuit pad; the insert snap portion includes two elastic arms (4.1) in parallel and a barb snap (4.1.1) is provided on a free end of each flexible arm (4.1); within the cavity, the flexible circuit pad (8) is being locked as the two barb snaps engaging with recesses (8.1) on the flexible circuit pad (8) and the bottom surface of the flexible circuit pad (8) is in close contact with the elastic sheets (5.

Abstract: A reduced pin count (RPC) device includes an electrical circuitry in a package with uniformly distributed leads, a subset of the leads being electrically disconnected form the circuitry. A contactor pin block with sockets corresponding to the uniformly distributed leads has the sockets corresponding to the leads with electrical connections filled with test pins suitable for contacting respective leads, and the sockets corresponding to the electrically disconnected leads voided of test pins. Dummy plugs are inserted into the voided sockets to block the sockets and prevent accidental insertions of test pins.

Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.

Abstract: The disclosure provides for a conductive connector device. The device is configured for communicating a control signal of an electro-optic element for a vehicular display device. The device comprises a spring assembly and a body having a connecting feature. The spring assembly comprises a spring and a conductive pin. The body forms an internal passage configured to at least partially house the spring assembly. A connecting feature is in connection with the body. The connecting feature is configured to engage an aperture of a circuit board configured to communicate a control signal to the electro-optic element. The engagement of the connecting feature to the aperture is configured to receive at least a portion of a force from the spring in a compressed arrangement.

Abstract: Apparatus for testing semiconductor devices comprising die stacks, the apparatus comprising a substrate having an array of pockets in a surface thereof arranged to correspond to conductive elements protruding from a semiconductor device to be tested. The pockets include conductive contacts with traces extending to conductive pads, which may be configured as test pads, jumper pads, edge connects or contact pads. The substrate may comprise a semiconductor wafer or wafer segment and, if the latter, multiple segments may be received in recesses in a fixture. Testing may be effected using a probe card, a bond head carrying conductive pins, or through conductors carried by the fixture.

Abstract: Electrically conductive columns of intertwined carbon nanotubes embedded in a mass of material flexible, resilient electrically insulating material can be used as electrically conductive contact probes. The columns can extend between opposing sides of the mass of material. Terminals of a wiring substrate can extend into the columns and be electrically connected to an electrical interface to a tester that controls testing of a device under test. A pair of physically interlocked structures can coupling the mass of material to the wiring substrate. The pair can include a receptacle and a protrusion.

Abstract: The present disclosure is directed to a shock-absorbent junction between the facemask and the helmet of a user, thus minimizing the likelihood of neck and cranial injury by maximizing impact energy absorption. The shock-absorbent junction including a first plate, a resilient material, and a second plate. Due to the possible geometrical symmetry of this embodiment, it is possible that the facemask be adapted in order to be attached to the first plate while the helmet would be adapted to the second plate.

Abstract: Apparatus for testing semiconductor devices comprising die stacks, the apparatus comprising a substrate having an array of pockets in a surface thereof arranged to correspond to conductive elements protruding from a semiconductor device to be tested. The pockets include conductive contacts with traces extending to conductive pads, which may be configured as test pads, jumper pads, edge connects or contact pads. The substrate may comprise a semiconductor wafer or wafer segment and, if the latter, multiple segments may be received in recesses in a fixture. Testing may be effected using a probe card, a bond head carrying conductive pins, or through conductors carried by the fixture.

Abstract: Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing.

Abstract: A testing fixture includes a base, a signal source, a workstation and a crimping mechanism. The base is provided with a sloping surface carrying the workstation and the crimping mechanism. The signal source is located on the base. The crimping mechanism applies testing signals transmitted by the signal source to the product to be tested. Additionally, the workstation performs an electrical function test on the product to be tested. The testing fixture can effectively perform an electrical function test on the product to be tested and has an integrated design of the base, the signal source, the workstation and the crimping mechanism, which facilitates management and maintenance. The base is also provided with a sloping surface carrying the workstation and the crimping mechanism to provide the testing fixture with an optimal testing angle, thereby facilitating operation and production.

Abstract: A solderless test fixture, including a conductive base, a clamp, and a connector is described. The conductive base has at least one cable groove with a cable grounding portion. A clamp is mounted on the base and associated with the cable groove. A connector is associated with the cable groove and has a solderless center terminal aligned with the cable groove and an outer shield being mechanically and electrically connected to the base.

Abstract: An integrated circuit burn-in socket with a spring-loaded contact pin built into the socket base and an electrical receptacle built into the socket lid wherein the electrical receptacle is configured to mate with the spring-loaded contact pin when the burn-in socket is closed. In one implementation, the socket lid is separate from the socket base and with a spring-loaded contact pin built into the socket base and with an electrical receptacle built into the socket lid wherein the electrical receptacle is configured to mate with the spring-loaded contact pin when the socket lid is clamped to the socket base.

Abstract: Apparatus for testing semiconductor devices comprising die stacks, the apparatus comprising a substrate having an array of pockets in a surface thereof arranged to correspond to conductive elements protruding from a semiconductor device to be tested. The pockets include conductive contacts with traces extending to conductive pads, which may be configured as test pads, jumper pads, edge connects or contact pads. The substrate may comprise a semiconductor wafer or wafer segment and, if the latter, multiple segments may be received in recesses in a fixture. Testing may be effected using a probe card, a bond head carrying conductive pins, or through conductors carried by the fixture.

Abstract: The invention provides a contact probe and a semiconductor element socket provided with the same, the contact probe capable of smooth inspection of a device while securing good conductivity. A contact probe has an upper plunger having a contact stem portion, a lower plunger having an insertion hole with which the contact stem portion is capable of coming into contact, and a coil spring connected to the upper plunger and the lower plunger in such a way as to cover the contact stem portion. The coil spring is configured by helically winding a wiring, and includes a guide portion wound tight in the axial direction of the coil spring by the wire, the guide portion located on the lower plunger side of the coil spring and also includes the upper plunger side portion than an upper end portion of the insertion hole.

Abstract: A method of fabricating a test probe includes a first conductive providing operation in which a first conductive member formed of a conductive metal material is provided, the first conductive member including a probe portion that has a probe shape and is formed in an upper portion of the first conductive member by a micro-electromechanical systems (MEMS) process, a second conductive member providing operation in which a second conductive member formed of a conductive metal material is provided, the second conductive member having an insertion portion formed in an upper portion of the second conductive member for inserting the first conductive member to be coupled to the insertion portion, an insertion operation in which the first conductive member is inserted into the insertion portion of the second conductive member, and a fixing and coupling operation in which the first conducive member is fixedly coupled to the second conductive member by deforming a part of the second conductive member.

Abstract: A contact structure unit that achieves electrical continuity between a substrate, which includes a plurality of electrodes, and a contact object includes a first-type contact-carrying member including a contact portion which makes contact with the contact object; includes a plurality of second-type contact-carrying members each of which includes a leading end portion formed at one end portion and making contact with the electrodes and each of which makes contact with the first-type contact-carrying member at the other end portion; and includes a plurality of coil springs each of which is disposed between the contact portion and the leading end portions and each of which biases the contact portion and the leading end portions.

Abstract: Terminals (2, 502) of a device under test (DUT) are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact (770) partially or completely laterally surrounds the force contact (700). In order to increase the contact surface, the force contact, in a spring pin (700) configuration contacts the device under test terminal at that portion of the lead which is curved or angled, rather than orthogonal to the pin.

Abstract: A multifunction test instrument probe includes a housing having a hollow bore with an open end. A clamp plunger is carried in the hollow bore, with a first end including a thumb press, and a second end including an alligator clamp having a pair of jaws, with a compression spring normally biasing the thumb press away from the housing, and normally biasing the alligator clamp substantially within the hollow bore proximate the open end. A point plunger is also carried in the bore, with a first end including a thumb press, and a second end terminating in a point, with a second compression spring normally biasing the thumb press away from the housing, and biasing the point within the hollow bore proximate the open end.

Abstract: A test fixture (120) is disclosed for electrically testing a device under test (130) by forming a plurality of temporary mechanical and electrical connections between terminals (131) on the device under test (130) and contact pads (161) on the load board (160). The test fixture (120) has a replaceable membrane (150) that includes vias (151), with each via (151) being associated with a terminal (131) on the device under test (130) and a contact pad (161) on the load board (160). In some cases, each via (151) has an electrically conducting wall for conducting current between the terminal (131) and the contact pad (161). In some cases, each via (151) includes a spring (152) that provides a mechanical resisting force to the terminal (131) when the device under test (130) is engaged with the test fixture (120).

Abstract: A connector includes multiple probes and a first insulator part and a second insulator part joined to cover the probes. Each of the probes has a monolithic structure of a single bent metal plate. Each of the probes includes an end part configured to come into contact with an electrode terminal; a spring part having a meandering shape and connected to the end part; a housing part bent to enclose the spring part; and a bent part provided between the spring part and the housing part. The end parts of the probes are at least partially projecting outward from first openings provided in the first insulator part, and the bent parts of the probes are at least partially projecting outward from second openings provided in the second insulator part.

Abstract: In a method for optimizing an order in which certain points on a circuit board can be tested and evaluated, a coordinate system is established in a circuit diagram of a circuit board, and at least one locating point is preset. When an operator selects a signal path routing within the circuit diagram, the method can display the testing points in the selected signal path routing on a display device. After calculating the distance between each of the testing points and each of the at least one locating point, a group of distances is obtained. By comparing the distances, the minimum distance can be determined from the group of distances. The method further optimizes the order of the testing points according to the distance between each of the testing points and the locating point that consists of the minimum distance.

Abstract: Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.

Abstract: A probe includes a contact member brought into contact with an object to be tested. Contact particles having conductivity are uniformly distributed in the contact member. A part of the contact particles protrude from a surface of the contact member on the side of the object to be tested. A conductive member having elasticity is placed on a surface of the contact member on the opposite side to the object to be tested. The probe further includes an insulating sheet including a through hole and the contact member is so positioned as to penetrate the through hole. An upper part of the contact member is formed of a conductor which does not include the contact particles. An additional conductor is placed on a surface of the conductor on the side opposite to the object to be tested.

Abstract: A contactor is brought into contact with and separated from an electrode formed on a test target, and includes an elastic member that overlaps with a conductive member having a contact and which urges the contact in a pressing direction. The elastic member is fixed at a predetermined fixed position in a state projecting to the outside of a main body member and the conductive member is electrically connected from the outside of a housing of the main body member of the contactor.

Abstract: A deflection measurement probe includes a body portion having a cavity defined by the body portion, a first positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface, and a second positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface.

Abstract: A contact probe comprises conductively coupled plungers and a coil spring. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. The spring is attached to the plungers in a manner that prevents rotation of the spring's ends. A desired magnitude of torsional bias is generated by twisting the spring a predetermined angle prior to attachment of the spring to the plungers. An additional torsional bias is generated by the tendency of the spring to twist when the spring is axially displaced. The resultant torsional bias rotatably biases the coupling means of the plungers against each other, generating contact forces for a direct conductive coupling between the plungers. The plungers are self-latching or are retentively attached to the spring using the torsional bias of the spring. Plungers with hermaphroditic coupling means can be fabricated from a sheet metal or a profiled stock by stamping or machining.

Abstract: A probe head can comprise a substrate and electrically conductive structures extending from opposite surfaces of the substrate. The probe head can be made by forming frame structures each comprising a frame to which a row of the conductive structures is coupled. The frame structures can be placed in a stack. A compressible shim or a curable adhesive can be provided between adjacent frames in the stack to control a distance between the contact ends of the conductive structures in adjacent rows of the conductive structures. The frames can include cavities that form a mold while the frames are in the stack, and the substrate can be formed by introducing a moldable material into the mold. After the moldable material hardens, the frame can be removed, leaving the conductive structures embedded in the substrate.

Abstract: Embodiments of the invention describe forming a set of probes using semiconductor regions each including a plurality of vias. A first set of probe segments may be formed from a first set of vias on a first semiconductor region. A second set of probe segments may be formed from a second set of vias on a second semiconductor region and bonded to the first set of probe segments. At least one spring comprising a dielectric material may be formed to couple the first set of probe segments, while a set of metal tips disposed on the second set of probe segments.

Abstract: A spring contact pin includes a depressible probe member having a tapered configuration that prevents contact between the projecting end of the probe member and the end of the spring barrel throughout the compression and release cycle of the probe. The tapered configuration of the depressible probe member improves the mechanical performance, reliability, and high-speed signal performance of the contact pin.

Abstract: A probe card is provided that is capable of accurately ensuring the flatness and the parallelism with respect to a predetermined reference surface. A point (Q) of application of force applied from a leaf spring (17) that presses a portion near an edge portion of a surface of a probe head (15) from which a plurality of probes projects over an entire circumference in a direction of a substrate to the probe head (15) is positioned inside of an outer edge of the probe head (15), and a point (P) of application of force applied from the retainer (16) that presses a portion near an edge portion of a space transformer (14) over an entire circumference in the direction of the substrate to the space transformer (14) is positioned inside of an outer edge of the space transformer (14).

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance.

Abstract: Disclosed is a contactor interconnect in an integrated circuit device test fixture comprises a plurality of contactor pins enabled to provide electrical contact with the contact points of an integrated circuit device, the contactor pins being mounted in the test fixture; and an electrical circuit coupled to two or more of the contactor pins of the test fixture, wherein the electrical circuit is isolated from other contactor pins of the plurality of contactor pins and wherein the electrical circuit is coupled to the two or more contactor pins by an electronically direct pathway.

Abstract: Terminals (2, 502) of a device under test (DUT) are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact (770) partially or completely laterally surrounds the force contact (700). In order to increase the contact surface, the force contact, in a spring pin (700) configuration contacts the device under test terminal at that portion of the lead which is curved or angled, rather than orthogonal to the pin.

Abstract: A method and system for testing a semiconductor package. At least some of the illustrative embodiments are methods comprising testing a semiconductor package unit (150, 420) by electrically coupling a top printed circuit board (208, 420) to a top-side of a semiconductor package unit (150, 420), the coupling using electrically conductive top-side pogo pins (201A, 420), and a pair of adjacent top-side pogo pins (201A, 420) bridged using an electrically conductive path (302, 420), electrically coupling a bottom printed circuit board (210, 430) to a bottom-side of the semiconductor package unit (150, 430), the coupling using electrically conductive bottom-side pogo pins (201B, 430), said top-side pogo pins (201A, 430) and said bottom-side pogo pins are of substantially equal height (201B, 430), and transmitting test signals from the bottom printed circuit board to the semiconductor device package by way of the bottom-side pogo pins (210, 440).

Abstract: An inspection unit includes: a metal block having a through hole; a contact probe for grounding which is coaxially arranged in through hole; and a coil spring having electrical conductivity at least on a surface thereof and provided between an inner peripheral face of the through hole and an outer peripheral face of the contact probe. The coil spring includes: a first coil part a part of which is in contact with the inner peripheral face of the through hole; and a second coil part a part of which is in contact with the outer peripheral face of the contact probe.