Abstract: An open architecture for a wafer automatic testing system of one embodiment includes a wafer auto prober including a lifter and a fixture frame; a pogo-pin interface module mounted on the fixture frame; and at least one instrument chassis mounted on the fixture frame and above the pogo-pin interface module. The at least one instrument chassis is electrically connected to the pogo-pin interface module.

Abstract: There is provided an inspection apparatus, including: a housing having an upper surface on which an interface part for electrical connection with a probe card is provided; a first frame configured to be movable to a connection position where the first frame covers an upper portion of the interface part and to a retraction position where the first frame is retracted from the upper portion of the interface part; and a second frame configured to support a test head, arranged inside the first frame, and held by the first frame so as to be switchable between a fixed state in which the second frame is fixed to the first frame and a movable state in which the second frame is movable at least in a direction parallel to the interface part at the connection position.

Abstract: A tool for crimping a cable connector (6) comprises a first, U-shaped arm (3) which defines a seat in which the connector (6) may be accommodated in the working position; a second, compression arm (1) suitable for exerting a compression force on the connector (6), comprising a compression profile (5) at one end thereof, which, in turn, comprises a number of rotation pins which project laterally outwards from the compression profile (5) and are suitable for penetrating into corresponding holes in a branch of the first arm (3), to keep the second, compression arm (1) joined to the first arm (3).

Abstract: Probes suitable for use with densely packed fine-pitch 2-D contact arrays are provided by use of an electrically insulating guide plate in connection with vertical probes, where the vertical probes have probe flexures that are either vertically folded sections, or coils having a horizontal axis. Preferably, the probes are configured such that the probe flexures are inside the guide plate holes, and the parts of the probes extending past the guide plate are relatively rigid. This configuration alleviates problems associate with probe shorting, because the probe flexures are enclosed by the guide plate holes, and are therefore unable to come into contact with flexures from other probes during probing.

Abstract: A contactor is brought into contact with and separated from an electrode formed on a test target, and includes an elastic member that overlaps with a conductive member having a contact and which urges the contact in a pressing direction. The elastic member is fixed at a predetermined fixed position in a state projecting to the outside of a main body member and the conductive member is electrically connected from the outside of a housing of the main body member of the contactor.

Abstract: Provided is a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, including: a probe card to be connected to respective contacts of the plurality of the devices under test on a connection surface to be overlapped on the semiconductor wafer, the probe card being provided with a plurality of corresponding contacts on a rear surface of the connection surface; and a test head that tests the plurality of devices under test on the semiconductor wafer by sequentially connecting to each part of the plurality of contacts of the probe card.

Abstract: A testing apparatus for electronic components comprises a mounting block and a plurality of contact strips arranged on the mounting block. The contact strips are configured such that electrical leads of an electronic component are operative to press against and bend the contact strips in a biasing direction to ensure good contact between the electrical leads and the contact strips during testing of the electronic component. Further, a preload block located on the mounting block is operative to contact and apply a pre-stress force onto the contact strips in the biasing direction prior to contact between the electrical leads and the contact strips.

Abstract: A deflection measurement probe includes a body portion having a cavity defined by the body portion, a first positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface, and a second positional measurement sensor disposed in the cavity of the body portion, the first positional measurement sensor including a sensor tip extending from the body portion operative to contact a measurement surface.

Abstract: There is provided an operation control structure for a continuity test device for performing lock of a connector and actuation of a continuity test part timely, low cost, easily, and surely including a connector attachment part 3, a continuity test part 4 having a probe pin 12, a first cylinder 16 for locking a connector 10 in the connector attachment part, a second cylinder 15 for moving the continuity test part to the connector attachment part, wherein plugs 30 and 54 of the first cylinder and the second cylinder respectively are supplied with the same pressured air, a speed control valve 26 being provided within a plug 30 of the second cylinder 15, a fine hole 28 thinner than a hole 56 in a plug 54 of the first cylinder being provided in the speed control valve, and wherein the continuity test part is actuated by the second cylinder through the fine hole following lock of the connector by the first cylinder.

Abstract: A probe card includes a probe unit having multiple through holes arranged therein, multiple probe needles respectively press-fitted to the multiple through holes, a printed board having convex portions which presses down the probe needles located in predetermined positions, and a unit holder which supports the probe unit and the printed board.

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance.

Abstract: Recesses are formed on one surface of a substrate. A conductive film covers an inner surface of each of the recesses. This conductive film contacts a bump of a semiconductor device to be inspected and is electrically connected to the bump. It is therefore possible to prevent damages of the bump to be caused by contact of a probe pin.

Abstract: A testing system module for testing printed circuit board (PCB) includes at least one robot having a pogo pin for moving to a testing point of the PCB; a pressure detecting unit for detecting a current pressure value on the printed circuit board; and a control system for keeping the pogo pin to contact with the PCB with constant pressure.

Abstract: A testing module is provided including a driving assembly, a positioning assembly and a testing head mechanism. The positioning assembly positions the driving assembly and the testing head mechanism therein. The positioning assembly includes a positioning member. The positioning member includes a base seat. The base seat defines a receiving cavity. The testing head mechanism includes a cushioning mechanism accommodated in the receiving cavity and driven by the driving assembly to move relative to the positioning assembly.

Abstract: A contactor 20 includes an FPC 30 on which a contact 31 brought into contact with/separated from an electrode 12 formed on a test target 10 and a board wire 32 having flexibility and conductivity are formed, an elastic member 40 that overlaps with the FPC 30 at the contact 31 and urges the contact 31 in a pressing direction, and a main body member 50 to which the elastic member 40 is fixed at a predetermined fixed position in a state projecting to the outside and to which the FPC 30 is electrically connected from the outside. As mentioned above, by forming the board wires 32 and the elastic member 40 by separate materials, respectively, a combination of an urging force of the contact 31 and conductivity can be made freely more favorable. Also, the board wires 32 and the elastic member 40 do not slide inside the main body member 50, and generation of a noise can be further suppressed.

Abstract: In order for a conduction path to have a reduced number of sliding portions for conduction, without increase in inductance nor resistance, thereby permitting an enhanced accuracy of inspection, a pair of plungers (3, 4) biased in opposite directions by a coil spring (2), to be electrically connected to a wiring plate (10), have electrical connections in which, in a tubular portion (15) as a tight wound spiral portion (15a) fixed on one plunger (4) to allow linear flow of electrical signal, the other plunger (3) is brought into slidable contact.

Abstract: A vertically folded probe is provided that can provide improved scrub performance in cases where the probe height is limited. More specifically, such a probe includes a base and a tip, and an arm extending from the base to the tip as a single continuous member. The probe arm is vertically folded, such that it includes three or more vertical arm portions. The vertical arm portions have substantial vertical overlap, and are laterally displaced from each other. When such a probe is vertically brought down onto a device under test, the probe deforms. During probe deformation, at least two of the vertical arm portions come into contact with each other. Such contact between the arm portions can advantageously increase the lateral scrub motion at the probe tip, and can also advantageously reduce the probe inductance.

Abstract: An inspection apparatus includes an electrical connection member which is configured to remove flux attached to a part to be inspected of an object to be inspected, a base member which is provided with the electrical connection member, a driving member which is configured to move the base member relative to the object to be inspected, a control member which is configured to control an operation of the driving member, and an inspection start-up member which is configured to send an operation start signal to the control member, when the operation start signal is sent from the inspection start-up member to the control member, the base member is moved by the driving member, and the electrical connection member is brought into contact with the part to be inspected of the object to be inspected a predetermined number of times, by a control of the control member.