Abstract: A test fixture (120) is disclosed for electrically testing a device under test (130) by forming a plurality of temporary mechanical and electrical connections between terminals (131) on the device under test (130) and contact pads (161) on the load board (160). The test fixture (120) has a replaceable membrane (150) that includes vias (151), with each via (151) being associated with a terminal (131) on the device under test (130) and a contact pad (161) on the load board (160). In some cases, each via (151) has an electrically conducting wall for conducting current between the terminal (131) and the contact pad (161). In some cases, each via (151) includes a spring (152) that provides a mechanical resisting force to the terminal (131) when the device under test (130) is engaged with the test fixture (120).

Abstract: A probe connector includes a barrel, a plunger, an elastic element, at least one first magnet, and at least one second magnet. The barrel defines an enclosure surrounding a chamber. An opening is formed at one end of the barrel. The elastic element is arranged in the chamber of the barrel. The plunger has a basic portion received in the chamber and against one end of the elastic element, and a contact portion extending out of the chamber through the opening. The first magnet is disposed on the enclosure of the barrel. The second magnet is disposed on the basic portion of the plunger. When the plunger is pressed inward, the plunger is leant towards one side with the basic portion against the enclosure because of the second magnet approaching the first magnet to produce a magnetic force interaction therebetween.

Abstract: A testing module is provided including a driving assembly, a positioning assembly and a testing head mechanism. The positioning assembly positions the driving assembly and the testing head mechanism therein. The positioning assembly includes a positioning member. The positioning member includes a base seat. The base seat defines a receiving cavity. The testing head mechanism includes a cushioning mechanism accommodated in the receiving cavity and driven by the driving assembly to move relative to the positioning assembly.

Abstract: A contactor 20 includes an FPC 30 on which a contact 31 brought into contact with/separated from an electrode 12 formed on a test target 10 and a board wire 32 having flexibility and conductivity are formed, an elastic member 40 that overlaps with the FPC 30 at the contact 31 and urges the contact 31 in a pressing direction, and a main body member 50 to which the elastic member 40 is fixed at a predetermined fixed position in a state projecting to the outside and to which the FPC 30 is electrically connected from the outside. As mentioned above, by forming the board wires 32 and the elastic member 40 by separate materials, respectively, a combination of an urging force of the contact 31 and conductivity can be made freely more favorable. Also, the board wires 32 and the elastic member 40 do not slide inside the main body member 50, and generation of a noise can be further suppressed.

Abstract: In order for a conduction path to have a reduced number of sliding portions for conduction, without increase in inductance nor resistance, thereby permitting an enhanced accuracy of inspection, a pair of plungers (3, 4) biased in opposite directions by a coil spring (2), to be electrically connected to a wiring plate (10), have electrical connections in which, in a tubular portion (15) as a tight wound spiral portion (15a) fixed on one plunger (4) to allow linear flow of electrical signal, the other plunger (3) is brought into slidable contact.

Abstract: Several embodiments of integrated circuit probe card assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor wafer. Several embodiments of probe card assemblies, which provide tight signal pad pitch compliance and/or enable high levels of parallel testing in commercial wafer probing equipment, are disclosed. In some preferred embodiments, the probe card assembly structures include separable standard components, which reduce assembly manufacturing cost and manufacturing time. These structures and assemblies enable high speed testing in wafer form. The probes also have built in mechanical protection for both the integrated circuits and the MEMS or thin film fabricated spring tips and probe layout structures on substrates.

Abstract: A probe includes a contact member brought into contact with an object to be tested. Contact particles having conductivity are uniformly distributed in the contact member. A part of the contact particles protrude from a surface of the contact member on the side of the object to be tested. A conductive member having elasticity is placed on a surface of the contact member on the opposite side to the object to be tested. The probe further includes an insulating sheet including a through hole and the contact member is so positioned as to penetrate the through hole. An upper part of the contact member is formed of a conductor which does not include the contact particles. An additional conductor is placed on a surface of the conductor on the side opposite to the object to be tested.

Abstract: A vertically folded probe is provided that can provide improved scrub performance in cases where the probe height is limited. More specifically, such a probe includes a base and a tip, and an arm extending from the base to the tip as a single continuous member. The probe arm is vertically folded, such that it includes three or more vertical arm portions. The vertical arm portions have substantial vertical overlap, and are laterally displaced from each other. When such a probe is vertically brought down onto a device under test, the probe deforms. During probe deformation, at least two of the vertical arm portions come into contact with each other. Such contact between the arm portions can advantageously increase the lateral scrub motion at the probe tip, and can also advantageously reduce the probe inductance.

Abstract: Described herein are embodiments of an electrical terminal test point that can be temporarily attached to an electrical terminal (e.g., terminal block) in order to provide an interface between the test leads/jumpers of a test device and the electrical contact points of the electrical terminal. In one aspect, embodiments of the electrical terminal test point provide a shield for the electrical contact points of the electrical terminal (whether or not being used for testing) from inadvertent contact and prevents test leads/jumpers of test device from accidentally falling off or being knocked off of their contact points. Electrical terminal test point can be installed and removed without affecting the electrical connections made by electrical terminal (e.g., without removing terminal screws of electrical terminal).