Fluid Pressure Patents (Class 324/754.15)
  • Patent number: 11029336
    Abstract: A probe card for a testing apparatus of electronic devices comprises a testing head, which houses a plurality of contact elements extending along a longitudinal axis (H-H) between a first end portion and a second end portion, a support plate, onto which the first end portion is adapted to abut, and a flexible membrane which comprises a first face and a second and opposite face.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: June 8, 2021
    Assignee: TECHNOPROBE S.P.A.
    Inventors: Riccardo Vettori, Stefano Felici
  • Patent number: 9910089
    Abstract: An inspection unit in which a probe card is united with a connection body via a vacuum chamber. It prevents flatness of tips of probes provided on the probe card from worsening when the probe card is united with a connection body by suction force (negative pressure) of the vacuum chamber. The inspection unit includes a probe card with probes on a first surface and a connection body united with a second surface of the probe card via a first vacuum chamber. The first chamber is formed with a plurality of chambers.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: March 6, 2018
    Assignee: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Kenichi Washio, Norie Yamaguchi
  • Patent number: 9277660
    Abstract: This application relates to methods and apparatus for pneumatically separating adhesively joined components. A pneumatic release mechanism can be positioned between the adhesively joined components. The pneumatic release mechanism can be positioned adjacent to or within an adhesive joint so that when it is filled with air the pneumatic release mechanism can exert a force on the joined components sufficient to sever the adhesive bond. In some embodiments, the joined components can be housing components. In other embodiments, the joined components can be a battery cell and a housing component.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: March 1, 2016
    Assignee: Apple Inc.
    Inventors: Daniel L. McBroom, Michael D. McBroom, Matthew P. Casebolt
  • Patent number: 8994390
    Abstract: A probe apparatus has probe wires with a contact pattern on one side. The contact pattern is for contacting a respective contact pattern on another test equipment or component, such as a circuit board. The probe wires have tips that probe a device desired for testing. Signals are transmitted through the probe wires from the probe card, for example, through a circuit board to other diagnostic equipment. The contact of the probe card with the circuit board allows signals to be transferred through the probe wires to the other diagnostic equipment. On another side of the probe card is a connector structure. The connector structure includes a retainer that can allow the probe card to be replaced from a test system, such as allowing it to be connected and disconnected from a holder.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: March 31, 2015
    Assignee: Celadon Systems, Inc.
    Inventors: Bryan J. Root, William A. Funk, John L. Dunklee
  • Publication number: 20140055156
    Abstract: Provided are a method and system for using fluid to position a device in a socket for testing. The device is positioned within a socket and a body is coupled to the socket. Fluid is delivered to a chamber defined in part by the body, a first surface of the device to provide pressure onto the device to move the device within the socket.
    Type: Application
    Filed: August 27, 2012
    Publication date: February 27, 2014
    Inventors: John C. JOHNSON, Charles FULTON, Philip R. MARTIN, Kent M. CARRIE
  • Patent number: 8659312
    Abstract: A probe card has a thin film substrate having projection electrodes on a first surface facing the semiconductor wafer and at a position facing the pad electrodes, a non-contact electrode, and first electrodes provided a second surface opposite to the first surface; and a wiring substrate having second electrodes disposed at a side opposite to the semiconductor wafer in the thin film substrate and at a position facing the first electrodes. The wiring substrate and the thin film substrate form a first sealed space and the thin film substrate and the semiconductor wafer form a second sealed space. By reducing the pressure in the first and the second sealed space, the first and the second electrodes are brought into close contact with each other and the pad electrodes and the projection electrodes are brought into close contact with each other, and the pressure of each of the first and second sealed space can be independently adjusted.
    Type: Grant
    Filed: July 19, 2010
    Date of Patent: February 25, 2014
    Assignee: Panasonic Corporation
    Inventors: Yoshirou Nakata, Naomi Miyake
  • Patent number: 8350584
    Abstract: An apparatus for supporting a device, comprising a base assembly, a plurality of carrier columns extending from the base unit, and a plurality of vertical support plates, each vertically movable along a respective carrier column and including a pivotal device mounting bracket. A pneumatic unit including a piston rod is associated with each vertical support plate such that vertical motion of the piston rod controls vertical motion of the respective vertical support plate.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: January 8, 2013
    Assignee: inTEST Corporation
    Inventors: Charles P. Nappen, Christopher L. West, Steven J. Crowell
  • Patent number: 8183878
    Abstract: An electrical testing device has a first probe that electrically contacts with an inspection device, a second probe that is electrically connected to the first probe and electrically contacts with an external terminal of a test object, a cylinder that houses the first probe and second probe, and into which and out of which a fluid flows between the first probe and second probe, and a fluid pressure regulator that controls the fluid pressure in the cylinder. The fluid pressure in the cylinder controls the contact force between the first probe and the inspection device and the contact force between the second probe and the external terminal.
    Type: Grant
    Filed: January 22, 2010
    Date of Patent: May 22, 2012
    Assignee: Renesas Electronics Corporation
    Inventor: Kentarou Sekino
  • Patent number: 7990166
    Abstract: A testing module is provided including a driving assembly, a positioning assembly and a testing head mechanism. The positioning assembly positions the driving assembly and the testing head mechanism therein. The positioning assembly includes a positioning member. The positioning member includes a base seat. The base seat defines a receiving cavity. The testing head mechanism includes a cushioning mechanism accommodated in the receiving cavity and driven by the driving assembly to move relative to the positioning assembly.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: August 2, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: San-Ping Qiu, Gao-Xiong Li, Ren-Zhong Wei