Abstract: Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g. probe structures for making contact between two electronic components for example in semiconductor wafer and chip and electronic component test applications). Some embodiments of the invention provide structures that include a core and shell on at least one layer where the layer including the shell is formed from at least one core material and at least one shell material wherein the shell material is different from a shell material or a single structural material on at least one of an immediately preceding layer or an immediately succeeding layer and wherein the core material is different from any core material on at least one of an immediately preceding layer or an immediately succeeding layer.

Abstract: A contact probe includes a first plunger, a second plunger, a coil spring, and a pipe; the first plunger includes a first slide portion that slides along the inner periphery of the pipe; the second plunger includes a second slide portion that slides along the inner periphery of the pipe; and the coil spring includes: a first attachment portion that is attached to the first plunger and tightly wound; a second attachment portion that is attached to the second plunger and tightly wound; a coarsely wound portion; a first contact portion including one end connected to the first attachment portion and another end connected to the coarsely wound portion and contacting the pipe; and a second contact portion including one end connected to the coarsely wound portion and another end connected to the second attachment portion and contacting to the pipe.

Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.

Abstract: Techniques regarding qubit chip assemblies are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a qubit chip positioned on an interposer chip. The apparatus can also comprise an electrical connector in direct contact with the interposer chip. The electrical connector can establish an electrical communication between a wire and a contact pad of the interposer chip that is coupled to the qubit chip.

Abstract: An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Abstract: An example contact head includes coaxial contacts configured for transmission of radio frequency (RF) signals or digital signals between a test system and a device under test (DUT). Each of the coaxial contacts is configured to target a specific impedance. Each of the coaxial contacts includes a coaxial structure having an open-curve shape. The coaxial structure includes a spring material that bends in response to applied force and that returns to the open-curve shape absent the applied force. The coaxial structure includes a center conductor terminating in a contact pin and a return conductor separated by a dielectric from the center conductor. At least part of the center conductor and the return conductor include an electrically-conductive material. Flexible contacts on the coaxial contact include the electrically-conductive material.

Abstract: The embodiments of the present disclosure provide a contact probe and a socket for testing an electrical component. The contact probe includes: a tubular structure in which a receiving cavity is formed, and a contact part for contacting with a terminal of a first electrical component is provided at a first end of the tubular structure; a spring arranged in the receiving cavity; a plunger connected with the tubular structure in a slidable manner, wherein a first end of the plunger is provided with a spring positioning part, which abuts against the spring and is an eccentric structure arranged offset from a central axis of the plunger, a second end of the plunger projects from a second end of the tubular structure.

Abstract: An apparatus for probing a device-under-test (DUT) includes a fixture disposed over the DUT, a circuitry film disposed along a contour of the fixture, a first signal connector, and a plurality of probing tips disposed on the circuitry film and extending toward the device-under-test. The circuitry film includes a first portion attached to a top sidewall of the fixture, and the first signal connector is disposed on and electrically connected to the first portion of the circuitry film. The first signal connector is electrically coupled to the probing tips through the circuitry film. A method for probing a DUT is also provided.

Abstract: A contact pin includes: a first plunger including a first contact portion provided at an upper end, and a hollow body portion provided below the first contact portion; a second plunger including: a second contact portion provided at a lower end; a first taper portion that is provided above the second contact portion and enlarges in diameter toward the second contact portion; a small diameter portion provided above the first taper portion; and a large diameter portion that is provided above the small diameter portion and is inserted into the body portion to abut on an inner wall surface of the body portion; and a spring for energizing the first and second contact portions to be separated from each other. The first taper portion is capable of abutting on a lower end of the body portion in a case where the first and second contact portions approach each other.

Abstract: An apparatus has at least substrate having at least two conductive paths, a least two connectors positioned in a first plane, and a movable stage connected to one of the at least one substrate to move the one substrate perpendicular to the first plane form an electrically conductive path between two of the at least two connectors.

Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.

Abstract: A hybrid optical-electrical automated testing equipment (ATE) system can implement a workpress assembly that can interface with a device under test (DUT) and a load board that holds the DUT during testing, analysis, and calibration. A test hand can actuate to position the DUT on a socket and align one or more alignment features. The workpress assembly can include two optical interfaces that are optically coupled such that light can be provided to a side of the DUT that is facing away from the load board, thereby enabling the ATE system to perform simultaneous optical and electrical testing of the DUT.

Abstract: Disclosed is a spring probe, which comprises a needle tube, a needle with a tail end clamped in the needle tube and capable of moving axially along the needle tube, and a spring arranged between the front end of the needle and the inner bottom of the needle tube and applying thrust to the needle. The open end of the needle tube is circumferentially provided with a plurality of elastic sheets with elasticity. The inner sides of the elastic sheets are provided with first flanges for preventing the needle from separating from the needle tube. The first flanges are pressed against the outer wall of the needle under the action of the elastic force of the elastic sheets. The outer wall of the tail end of the needle head is provided with a second flange which can abut against the first flanges under the action of the spring.

Abstract: A connector with a tolerance module includes a socket and a plug adapted to the socket, wherein the socket includes a first housing, the plug includes a tolerance module and a third housing, the tolerance module includes a second housing, the second housing includes second contact members, the second housing is movably arranged on the third housing in a direction perpendicular to the axial direction of the connector, and the second contact members are floatingly assembled in the second housing to enable displacement in the direction perpendicular to the axial direction of the connector. The second housing only generates translational motion without displacement when the connector is inserted. The tolerance of the plug and the socket is realized by the floating assembly of the second contact members in the second housing.

Abstract: A test head assembly for a semiconductor device has a carrier, a pin seat and a test wire assembly. The carrier is formed in an L shape and has a lateral board, a perpendicular board and a opening formed through the perpendicular board. The pin seat is mounted in the corresponding opening. The test wire assembly has a test head, a plurality of connectors and a plurality of test wires. The test head is mounted on an outer sidewall of the lateral board and connected to the pin seat through the test wires and the connectors. Therefore, the pin seat is mounted on the perpendicular board of the L-shaped uprightly and the test head is mounted on the lateral board. The pin seat and the test head are not parallel to each other, and a lateral size of the test head assembly is reduced to increase the space usage.

Abstract: The disclosed invention relates to a method of manufacturing a housing-integrated board mating connector, the method including: preparing a housing of an electrical device, the housing having a housing insertion hole formed therein and a part or the entirety of the housing being made of a conductive metal material; inserting a cylindrical ground gasket into the housing insertion hole; preparing a dielectric part and signal terminal part assembly in which a dielectric part surrounds a signal terminal part; and inserting the dielectric part and signal terminal part assembly into an inner circumferential surface of the ground gasket.

Abstract: A wafer test device includes a test interconnect to interface with a microcircuit of the wafer at a first side and an interposer to interface with the test interconnect at a second side of the test interconnect, opposite the first side. The interposer connects the test interconnect, via a printed circuit board (PCB), to a test apparatus that determines and controls test patterns that are applied to the microcircuit via the test interconnect. A support structure supports the test interconnect and the interposer. The support structure includes an inner bearing to tilt the test interconnect to match a tilt of a surface of the microcircuit. An elastomer between the test interconnect and the interposer reduces deflection of the test interconnect during a process of connecting the test interconnect to the microcircuit.

Abstract: An insulating system to reduce or eliminate the possibility of arcing while the pressure within a chamber is being varied is disclosed. The system is operable at cryogenic temperatures, such that the insulating system is able to accommodate dimensional changes due to thermal contraction. The insulating system, which includes a housing having one or more bores, is disposed between the two components which are to be electrically connected. An electrical contact, which may be spring loaded, passes through the bore and is used to electrically connect the two components. The ends of the electrical contact are surrounded by an insulating extender which extends from the housing. In one embodiment, a spring-loaded piston is used as the insulating extender. This insulating extender compensates for changes in dimension due to thermal contraction and covers the portion of the electrical contact that extends beyond the outer surface of the housing.

Abstract: A testing socket includes a metal block, an assembly block, an analog ground probe pin and a digital ground probe pin. The metal block is formed with a concave portion and used to connect to an independent main ground. The assembly block is electrically isolated from the metal block, and detachably embedded in the recess, so that the metal block and the assembly block are assembled together to be a probe holder. The digital grounding probe is inserted in the metal block, electrically connected to the independent main ground through the metal block. The digital ground probe pin can be electrically connected to a device to be tested (DUT) and the independent main ground. The analog ground probe pin is inserted in the assembly block, and electrically connected to the DUT and another independent main ground.

Abstract: A testing device is disclosed including a plurality of elastic members, a plurality of elastic terminals, and a plurality of terminal boards. Each elastic member is provided with an arc-shaped elastic deformation portion, at least one elastic terminal is arranged as one set and is clamped on one elastic member with an inner arc of the elastic deformation portion. Each terminal board is provided with a recess for accommodating one of the elastic members, the recess is provided with at least one arc-shaped groove each matched with a respective elastic terminal, an outer arc of the elastic deformation portion is embedded in a respective arc-shaped groove, each arc-shaped groove has an upper end extending to an upper surface of the terminal board, and a lower end extending to a lower surface of the terminal board.

Abstract: A pogo block includes: a conductor having a first terminal connected to a terminal of a board of an inspection part, a second terminal connected to a terminal of a probe card, and an elastically expandable and contractible connection portion connecting the first terminal and the second terminal, and configured to be expandable and contractible in a direction connecting the first terminal and the second terminal; and a housing having a first holder configured to hold the first terminal, a second holder configured to hold the second terminal, and a guider into which the elastically expandable and contractible connection portion is inserted and configured to guide movements of the first holder and the second holder in the direction connecting the first terminal and the second terminal.

Abstract: The present invention relates to a probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member. An embodiment of the present invention provides a probe member including a first body portion and a second body portion that are stacked in a height direction based on the other end of a contact portion, wherein the probe member is used in a test socket in a state in which at least a portion of the probe member is inserted in a pipe having an internal space.

Abstract: Provided is a contact pin comprising: a hollow first plunger that includes a first contact portion provided on one end side in a first direction and a first enlarged portion which is enlarged in a second direction intersecting the first direction; a second plunger, the one end of which is inserted into the first plunger and that includes a second contact portion provided on the other end side in the first direction and a second enlarged portion provided in a protruding portion protruding from the first plunger so as to be enlarged in the second direction; and a spring provided between the first and second plungers so as to surround the first and second plungers, wherein the first enlarged portion forms a curve shape to bulge outward.

Abstract: When a load necessary for inspection is applied to a cylindrical body in the axial direction thereof, an end of the first bar-like main body is located closer to the other end side of the cylindrical body than one end of a support portion in a support member that supports the body portion, an end of the second bar-like main body is located closer to one end side of the cylindrical body than the other end of the support portion, the body portion is located in the entire portion where the support portion is located, and a radial distance between the outer peripheral surface of the axial central portion of at least one of the first spring portion and the second spring portion and the support member is larger than the distance between the body portion and the support portion.

Abstract: The present invention extends to methods, systems, and computer program products for testing proximity card readers. Aspects include proximity card reader test bed environments configured to test proximity card readers with a plurality of proximity cards while minimizing human involvement. A proximity card reader can be tested to determine a likelihood of the proximity card reader functioning as intended over time and to determine proximity card reader compatibility with different proximity card formats. Proximity card reader failures (e.g., crashes) and incompatibilities can be detected in the testbed environment reducing the likelihood of deploying defective and/or incompatible card readers into operation.

Abstract: A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.

Abstract: A probe member for a pogo pin, a method of manufacturing the probe member, and a pogo pin including the probe member are disclosed. The probe member for the pogo pin has a contact portion including a material having hardness greater than the hardness of a first body portion and a second body portion, and each of the first and second body portions includes a material having electrical conductivity equal to or greater than 50% IACS (International Annealed Copper Standard).

Abstract: An electronic device includes a first connection module, a second connection module, and a positioning assembly. The positioning assembly includes a guide pin, a guide post, a guide bar, and an elastic component. The guide pin is fixed on a first surface of the first connection module, and the guide post is fixed on a second surface of the second module. The electronic device includes a positioning assembly which serves to position components during the installation of the electronic device. The positioning assembly provides space for positional adjustment to the first component and the second component and the elasticity of the elastic component avoids crushing or handling damage to the first component and the second component.

Abstract: A contact probe is conductive and capable of expanding/contracting along an axial line direction. The contact probe includes: a first contact member configured to contact one contact target; a second contact member configured to contact another contact target, and to house at least a portion of the first contact member; and a spring member configured to couple the first contact member and the second contact member in a manner capable of expansion/contraction with both end parts of the spring member. The spring member is wound in a helical shape, and at least a diameter of an outer circumference in one of the end parts held by the second contact member is larger than diameters of other portions. A diameter of an inner circumference of an end part of the second contact member on a side housing the first contact member is equal to or larger than a maximum diameter of the first contact member.

Abstract: The present invention relates to an improved probe for precisely positioning a probe tip at a measurement point. For this purpose, an image capturing device such as a camera may be firmly arranged at the probe. The image capturing device may capture image data around an area of the probe tip. The captured image data may be provided to a user during positioning the probe tip at the desired measuring point.

Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Abstract: A micro-electrical-mechanical system (MEMS) actuator includes: a MEMS actuation core, and a multi-piece MEMS electrical connector assembly electrically coupled to the MEMS actuation core and configured to be electrically coupled to a printed circuit board, wherein the multi-piece MEMS electrical connector includes: a plurality of subcomponents, and a plurality of coupling assemblies configured to couple the plurality of subcomponents together.

Abstract: The present application provides a testing apparatus. The testing apparatus includes a base; a first printed circuit board, disposed above the base; a stiffener, disposed adjacent to the base, located at a center of the base and passing through the first printed circuit board; a second printed circuit board, disposed at a center of the stiffener; and a probe card, one part thereof disposed adjacent to the stiffener and the other part thereof passing through the base, the first printed circuit board, the stiffener and the second printed circuit board. The base, the stiffener and the second printed circuit board are integrated and the base carries the first circuit board.

Abstract: A semiconductor device test socket has a shielding structure formed around each contactor so as to prevent signal delay or distortion during a test process and thereby enhance the test reliability. The socket includes a vertical probe comprising a contactor which has a contact terminal to be electrically connected to an external connection terminal of a semiconductor device. The shielding structure which is formed by laminating a conductive material on the outer edge of the contactor and is electrically connected to a ground. The socket further includes an elastic layer which is filled in the space between the contactor and the shielding structure, and surrounds the contactor such that the contact terminal of the contactor is exposed; and a connection film which is formed by laminating a conductive material so as to electrically connect shielding structures of multiple vertical probes.

Abstract: Sensors, systems, and methods for monitoring environmental conditions, such as physical, electromagnetic, thermal, and/or chemical parameters within an environment, over extended periods of time with the use of one or more electromechanical sensing devices and electronic circuitry for processing an output of the sensing devices. The sensing devices each include a cantilevered structure and at least one contact configured for contact-mode operation with the cantilevered structure in response to the cantilevered structure deflecting toward or away from the contact when exposed to the parameter of interest. The cantilevered structure has at least first and second beams of dissimilar materials, at least one of which has at least one property that changes as a result of exposure to the parameter.

Abstract: A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.

Abstract: A rectangular probe includes two broad side surfaces and two narrow side surfaces each parallel to a longitudinal direction of the rectangular probe. The rectangular probe includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, a first contacting segment and a second contacting segment respectively extending from the first and second connecting segments, and a stroke structure arranged on the middle segment, the first contacting segment, or the second contacting segment. A longitudinal thru-hole of the stroke structure is formed by penetrating through the two broad side surfaces. Two transverse grooves of the stroke structure are respectively recessed in the two broad side surfaces. The two transverse grooves are configured to move in two directions away from each other so as to reduce a length of the rectangular probe.

Abstract: This application relates to magnetically actuated electrical connectors. The electrical connectors includes movable magnetic elements that move in response to an externally applied magnetic field. In some embodiments, the electrical connectors includes recessed contacts that move from a recessed position to an engaged position in response to an externally applied magnetic field associated with an electronic device to which the connector is designed to be coupled. In some embodiments, the external magnetic field has a particular polarity pattern configured to draw contacts associated with a matching polarity pattern out of the recessed position.

Abstract: Described herein are techniques for identifying a path in a workload that may be associated with a deviation. A workload may be associated with multiple measurements of a plurality of metrics generated during execution of the workload. The multiple measurements may be aggregated at multiple levels of execution. One or more measurements may be compared to one or more other measurements or estimates to determine whether there is a deviation from an expected correlation. If determined that there is a deviation, a path can be identified in the workload that may be associated with the deviation.

Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

Abstract: An interconnect structure is provided which includes: a member having a first end coupled to a test card, and a second end opposite the first end; and a contact tip at the second end of the member, the contact tip to removably attach to another interconnect structure of a device under test, where a modulus of elasticity of the member varies along a length of the member.

Abstract: An electricity storage device tester including: a voltage application unit configured to apply to a circuit a direct-current voltage; an ammeter configured to acquire a current value of the circuit; a voltage control unit configured to control an output voltage of the voltage application unit; and a determination unit configured to determine whether the electricity storage device is defective or not based on the value acquired by the ammeter. The voltage application unit includes a plurality of power source devices connected in series with each other. One of the power source devices is a specific power source device which is configured to have a variable output voltage and of which both a maximum value and a step width of the output voltage are smaller than the power source devices other than the specific power source device.

Abstract: In an overcurrent detection circuit for switches parallely connected to each other, sense detectors are respectively provided for the switches. Each of the sense detectors detects a sense voltage of the corresponding one of the switches. The sense voltage of each of the switches is based on a sense current associated with a current flowing through the corresponding one of the switches. A parameter calculator calculates, based on the sense voltages calculated by the respective sense detectors, a determination parameter that is less subject to imbalance between currents flowing through the respective switches. A determiner determines whether a value of the determination parameter is higher than an overcurrent threshold, and determines that there is an overcurrent flowing through at least one of the switches upon determining that the value of the determination parameter is higher than the overcurrent threshold.

Abstract: An electric contact including a first member portion to be in contact with a first electric component and a second member portion to be in contact with a second electric component. The first member portion is formed to be tubular by an electrically conductive material plate member a part of which is formed of wave shape portions, and the first member portion includes a first contact portion to be in contact with the first electric component and a spring portion formed by the wave shape portions. The second member portion is constructed by a rod member and includes a second contact portion to be in contact with the second electric component and an insert portion inserted into the spring portion. The first and second contact portions are urged to separate each other while the first and second member portions are contracted with against urging force of the spring portion.

Abstract: Disclosed is related generally to a contact for testing a semiconductor device and a socket device therefor. The contact of the present invention, being a spring contact configured in an integrated body by blanking and bending a metal board, includes: an elastic part composed of various strips in a fixed pattern, and sharp end parts provided on opposite ends of the elastic part, respectively. Preferably, with a filler having conductivity and elasticity being filled in space volume, the contact of the present invention has excellent durability and electrical characteristics. In addition, the test socket according to the present invention, being the rubber type adopting the above-stated contacts, provides an appropriate effect for a test of a semiconductor device having a fine pitch.

Abstract: An interface structure connecting an electronic component to a circuit board. The interface structure includes a base defining an elongated through hole with a central axis and a coil spring retained in the elongated through hole. The coil spring has a proximal portion and a distal portion extending from the elongated through hole in an uncompressed condition and being offset at an angle with respect to the central axis. As the coil spring is compressed, the coil spring creates a force having a component substantially perpendicular to the central axis.

Abstract: An apparatus includes a carrier base and one or more contact elements coupled to a portion of the carrier base. The one or more contact elements are configured to sense an electrical signal flowing through at least one electrical component in a circuitry under test. The first contact element of the one or more contact elements comprises a power sense conductor extending from a bottom surface of the first contact element toward a top surface of the first contact element and a ground conductor electrically isolated from the power sense conductor.

Abstract: An elastomer structure of a conductivity probe contains: an elastic body configured to transmit electronic currents and electronic signals. The elastic body includes a first transceiver portion formed on a first free end thereof, a second transceiver portion formed on a second free end thereof, and a resilient section surrounding between the first transceiver portion and the second transceiver portion. Preferably, at least one of the first and second transceiver portions has a plane.

Abstract: A contact probe includes a first plunger, a second plunger, and a coil spring. The coil spring is disposed outside the first plunger, and urges the first plunger and the second plunger in a direction away from each other. The first plunger and the second plunger are fitted to each other so as to be slidable with respect to each other. The first plunger includes a large diameter part, and a small diameter part provided on a proximal end side of the large diameter part. The small diameter part is fitted into the second plunger. The coil spring includes a close winding part on a side of the second plunger. Adjacent lines of the close winding parts are brought into close contact with each other and come into electrical contact with each other at least in a compressed state of the coil spring.

Abstract: A method of manufacturing a micro-electrical-mechanical system (MEMS) assembly includes mounting a micro-electrical-mechanical system (MEMS) actuator to a metal plate. An image sensor assembly is mounted to the micro-electrical-mechanical system (MEMS) actuator. The image sensor assembly is electrically coupled to the micro-electrical-mechanical system (MEMS) actuator, thus forming a micro-electrical-mechanical system (MEMS) subassembly.