Abstract: A contact probe having a plunger; a top contacting member which is provided at a tip end of the plunger and is brought into contact with an electrode of a semiconductor device; a bottom contacting member which is brought into contact with an electrode of a testing board; and an elastic member for urging the top contacting member and the bottom contacting member in opposite directions away from each other. The plunger is formed into a cylindrical shape and includes a through-hole which penetrates through the plunger in an axial direction thereof. The top contacting member includes a plurality of mountain-shaped sharp portions at a tip end thereof, and each of the sharp portions is asymmetrical with respect to a straight line that passes through a peak of the sharp portion and extends along an axial direction of the plunger, and is bent toward a center line of the plunger.

Abstract: A conductivity measurement device comprises a first body, a second body, a baseplate, a extension rod and a contact pad. The extension rod is positioned inside the first body, the baseplate is positioned on one end of the extension rod, and the contact pad is positioned on the other end of the extension rod. The contact pad contacts the surface to be tested and measures the electrical conductivity thereof with no resulting damage to the surface.

Abstract: The invention provides a high-frequency vertical spring probe card structure including a plurality of probes. Each of the probes includes at least one conducting layer and at least one insulating layer. The conducting layer includes a first contact end and a second contact end used for electrically contacting an external component while the probe is compressed and includes a probe body including at least one plate portion and at least one resilient portion connected to each other. The plate portion is used for supporting deformation of the resilient portion while the resilient portion is compressed vertically. The insulating layer includes at least one plate member tightly attached to the plate portion of the conducting layer correspondingly. The probe structure of the invention is simple and can be formed as multi-layer stack structure by electroplating through Lithographie GaVanoformung Abformung (LIGA) technology.

Abstract: A cartridge, including a cartridge frame, formations on the cartridge frame for mounting the cartridge frame in a fixed position to an apparatus frame, a contactor support structure, a contactor interface on the contactor support structure, a plurality of terminals, held by the contactor support structure, for contacting contacts on a device, and a plurality of conductors, held by the contactor support structure, connecting the interface to the terminals.

Abstract: A contact assembly for receiving a spring probe unit includes an elongate contact element adapted to electrically contact the spring probe unit. The contact element includes a stop for restraining movement of the spring probe unit towards the stop in the direction of an axis along the length of the contact element, and urging means, adapted to urge the spring probe unit against the contact element for removable engagement of the spring probe unit with the contact element.

Abstract: A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip mounting area of the substrate, and a plurality of test pads disposed on top and bottom surfaces of the substrate and comprising a first group of test pads configured on the top and bottom surfaces of the substrate and having a first height above the respective top and bottom surface of the substrate, and a second group of test pads disposed on the lower surface of the substrate and having a second height greater than the first, wherein each one of the second group of test pads includes a solder ball attached thereto.

Abstract: The present invention relates to a probe device for testing a semiconductor chip, and has the aim of providing a probe device for testing with higher test reliability through an improved structure that enables test current to flow safely, the probe device including a barrel open at the top and bottom thereof and a probe projection formed on a top end to contact a connection terminal of a semiconductor chip, an upper plunger having a lower portion housed in an upper portion of the barrel, and a lower plunger having an upper portion housed in a lower portion of the barrel, wherein a metal ball contained in cylindrical silicon to form a conductive silicon portion that exhibits conductivity and housed inside the band electrically connects the upper plunger and the lower plunger and resiliently supports the downward pressure transferred to the upper plunger during the testing of a semiconductor chip, such that the conductive silicon portion containing the metal ball for exhibiting conductivity and inserted in the

Abstract: An inspection unit includes: a metal block having a through hole; a contact probe for grounding which is coaxially arranged in through hole; and a coil spring having electrical conductivity at least on a surface thereof and provided between an inner peripheral face of the through hole and an outer peripheral face of the contact probe. The coil spring includes: a first coil part a part of which is in contact with the inner peripheral face of the through hole; and a second coil part a part of which is in contact with the outer peripheral face of the contact probe.

Abstract: A composite spring contact structure includes a structural component and a conduction component distinct from each other and having differing mechanical and electrical characteristics. The structural component can include a group of carbon nanotubes. A mechanical characteristic of the composite spring contact structure can be dominated by a mechanical characteristic of the structural component, and an electrical characteristic of the composite spring contact structure can be dominated by an electrical characteristic of the conduction component. Composite spring contact structures can be used in probe cards and other electronic devices. Various ways of making contact structures are also disclosed.

Abstract: Embodiments of microspring arrays and methods for fabricating and using same are provided herein. In some embodiments, a microspring array may include at least two lithographically formed resilient contact elements, each resilient contact element having a beam and a tip for contacting a device to be tested, wherein the beams extend in substantially the same direction relative to a first end of the beams, and wherein the ends of the at least two beams are separated by a distance defining a central region and wherein the respective tips of the at least two beams extend away from the beams in a non-zero, non-perpendicular direction into the central region.

Abstract: A spring wire rod includes a wire core that is made of a conductive material having an electrical resistivity of equal to or lower than 5.00×10?8 ?•m, and a coating member 3 that is made of a spring material having a longitudinal elastic modulus of equal to or higher than 1.00×104 kgf/mm2 and coats an outer circumference of the core. A coating thickness d of the coating member is smaller than a minimum value r of a distance between the center of gravity of a transverse cross section of the core and the outer edge of the transverse cross section.

Abstract: A test probe is configured to provide conductive contact with a surface on application of the probe to the surface. The probe includes a probe body having a proximal and distal end, a probe tip located at the distal end of the probe body, the probe being configured such that, when the probe tip is applied to the surface, the probe tip is moved to rotate about its axis, whereby the shaft tip can rotatably remove oxidation and/or contamination debris from between the shaft tip and the surface.

Abstract: A method of testing a semiconductor device includes a conductive foreign matter test step of measuring the resistance value between the first and second conductive patterns to determine whether conductive foreign matter is present between the first and second conductive patterns, a first open circuit test step of measuring the resistance value between two points on the first conductive pattern to determine whether there is an open circuit in the first conductive pattern, and a second open circuit test step of measuring the resistance value between two points on the second conductive pattern to determine whether there is an open circuit in the second conductive pattern. The measurement of the resistance value in each of the test steps is accomplished by pressing probes vertically against the first conductive pattern or the second conductive pattern or both.

Abstract: The probe pin includes a plunger formed of a sheet metal, and a coil spring unit formed of a metal wire and configured to hold the plunger thereon. In a developed state, the plunger includes first and second portions each of which has an upper contact strip, a wide portion, and a lower contact strip, and which are connected to each other via the wide portions formed in the first and second portions. The plunger is formed in a united manner by folding together the first and second portions along a boundary of the wide portions formed therein to thereby bring at least the wide portions into tight contact with each other.

Abstract: A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.

Abstract: A contact probe has a tubular plunger which is not made by press working and rounding so that quality control of gold plating or the like is not necessary or not difficult. The tubular plunger is made of a metal tube with a tip that has a reduced outside diameter and notches spaced from the tip. The tip is bent inside the tube and an outer surface of the metal tube, from a bent part to a bottom side, with a small diameter defining a convex part having a larger diameter. The small diameter part of the metal tube is cut off at the end of the small diameter.

Abstract: A probe connector includes a barrel, a plunger, an elastic element, at least one first magnet, and at least one second magnet. The barrel defines an enclosure surrounding a chamber. An opening is formed at one end of the barrel. The elastic element is arranged in the chamber of the barrel. The plunger has a basic portion received in the chamber and against one end of the elastic element, and a contact portion extending out of the chamber through the opening. The first magnet is disposed on the enclosure of the barrel. The second magnet is disposed on the basic portion of the plunger. When the plunger is pressed inward, the plunger is leant towards one side with the basic portion against the enclosure because of the second magnet approaching the first magnet to produce a magnetic force interaction therebetween.

Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.

Abstract: A testing module is provided including a driving assembly, a positioning assembly and a testing head mechanism. The positioning assembly positions the driving assembly and the testing head mechanism therein. The positioning assembly includes a positioning member. The positioning member includes a base seat. The base seat defines a receiving cavity. The testing head mechanism includes a cushioning mechanism accommodated in the receiving cavity and driven by the driving assembly to move relative to the positioning assembly.

Abstract: A terminal end for a flat test probe having tapered cam surfaces providing a lead-in angle on the tail of the terminal end which extend to a sharp rear angle to engage detents or projections within a receptacle. The tapered cam surfaces and shape rear angles allow the probe to be inserted into the receptacle with minimal force to retain the flat test probe within the receptacle.

Abstract: A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement range and the second spring has a positive stiffness over the predefined displacement range. The first spring and second spring can be coupled so that the negative stiffness and positive stiffness substantially cancel to produce a net stiffness of the tip relative to the base over the predefined displacement range.

Abstract: A conductive contact unit includes a conductive contact holder, a conductive contact, and an aligning unit. The conductive contact holder includes a first guiding grooves and a second guiding groove opposite to the first guiding groove, each slidably engaging one edge of the conductive contact. The conductive contact has a plate-like shape, and includes a first contacting element and a second contacting element that are brought into contact with different circuitries, a resilient element that is expandable and contractible in a longitudinal direction between the first contacting element and the second contacting element, a first connecting element that connects the resilient element and the first contacting element, and a second connecting element that connects the resilient element and the second contacting element. The aligning unit aligns the conductive contacts.

Abstract: A conductive contact holder includes a holder substrate and a holding member. The holder substrate is made of a conductive material and has an opening for holding a conductive contact for inputting and outputting a signal to and from a circuit structure. The holding member is formed by filling the opening with an insulating material, smoothing the surface of the insulating material, and forming a hole through the insulating material for inserting the conductive contact.

Abstract: A contact type electrical connector includes a first plunger in contact with one member; a second plunger in contact with another member and electrically connected to the first plunger, whereby the two members are electrically connected through the first plunger; a cylindrical support member for slidably and elastically supporting the first and second plungers with a connection portion of the first plunger and a connection portion of the second plunger overlapping and electrically connected; and a compression coil spring surrounding the outer peripheries of the first and second plungers with the connection portions thereof supported by the cylindrical support member and brought into contact with a spring receiving portion of each of the plungers so as to urge the plungers apart. The cylindrical support member, which may be formed as a coil spring, serves to improve electrical connection between the plungers.

Abstract: Described herein are embodiments of an electrical terminal test point that can be temporarily attached to an electrical terminal (e.g., terminal block) in order to provide an interface between the test leads/jumpers of a test device and the electrical contact points of the electrical terminal. In one aspect, embodiments of the electrical terminal test point provide a shield for the electrical contact points of the electrical terminal (whether or not being used for testing) from inadvertent contact and prevents test leads/jumpers of test device from accidentally falling off or being knocked off of their contact points. Electrical terminal test point can be installed and removed without affecting the electrical connections made by electrical terminal (e.g., without removing terminal screws of electrical terminal).

Abstract: A universal spring contact pin for use in an IC test Socket includes a depressible probe member at one end and a fixed probe member at the other end. The fixed probe member preferably has a projection length chosen to allow z-axis loading of different surface mount package types within the same test socket. It also can have a relatively large tip angle which preferably terminates at a relatively sharp termination point. Preferably, the tip angle is about 90 degrees and the radius of the termination point of the tip is about 0.001 inches (0.0254 millimeters) or less. The large tip angle on the contact pin's fixed probe member provides the pin with a robust probe end that operates reliably over a large number of test cycles, is better adapted for effective use with different surface mount chip packages, and better supports a sharp tip radius. A sharp tip radius will, in turn, provide for better penetration of oxide coatings and/or foreign material on the leads of the chip packages.

Abstract: A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a sheet-metal plate which is bent multiple times, the sheet-metal plate having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together.

Abstract: A socketless integrated circuit (IC) contact connector is provided with an electrically conductive support post. An electrically conductive spring has a first end connected to the post, and a second end. An electrically conductive first wire has a first end connected to the spring second end, and a second end. An electrically conductive loop with a loop neck is connected to the first wire second end. Typically, the loop is formed in the first wire second end. The spring and loop work in cooperation to engage an IC contact.