Abstract: Provided is a probe member for a pogo pin, which is used for testing a semiconductor device, and at least a portion of which is inserted into a cylindrical body to be supported by an elastic member and an upper end of which contacts a terminal of the semiconductor device.

Abstract: A probe apparatus may include a plurality of probe pins attached to a probe head portion. Each of the probe pins may be independently movable relative to the probe head portion.

Abstract: A dual probing tip system uses a slot and rail system to provide variable spacing and lateral and axial compliance of the probing tips mounted on first and second support members. A movable base member is secured on a frame with the base member having a rack of linear teeth and a pair of rails angled toward the front. First and second intermediate carriers each have a slot that engages one of the angled rails. Each of the carriers has stanchions that receive a thumb wheel pinion gear mounted on a shaft. The pinion gear mates with the teeth on the base member for movement of the carriers. Each support member has an axial slot that mated with an axial slot on each one of the carriers. Each support member has a compression spring which allows axial compliance of the support members.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A semiconductor testing probe needle for connecting to a circuit board for inspection and to an inspection main board of a testing apparatus includes a conductive shaft having two ends of a connection end and an inspection end for contacting with the circuit board for inspection. A spring column includes one end electrically connected to the connection end of the conductive shaft and another end abuts the inspection main board. A conductive wire is arranged along the spring column and includes one end electrically connected to the conductive shaft and another end provided to be electrically connected to the inspection main board.

Abstract: A probe needle for connecting to a circuit board for inspection and to an inspection main board of a testing apparatus includes a conductive shaft having two ends of a connection end and an inspection end for contacting with the circuit board for inspection. An elastic conductive rod is axially connected to the conductive shaft and having two ends of a free end and a fixed end; wherein the free end is connected to the connection end of the conductive shaft and the fixed end abuts the inspection main board. The probe needle has a simplified structure facilitating the manufacturing of parts and assembly thereof.

Abstract: An inspection probe 16Ai is formed by subjecting a thin sheet material made of a copper alloy to press working. The inspection probe 16Ai includes: a device side plunger 16A having a contact point which selectively comes into contact with an electrode portion DVb of a semiconductor device DV; a board side plunger 16B having a contact point which selectively comes into contact with a contact pad of a printed wiring board 18; a spring portion 16D which biases the device side plunger 16A and the board side plunger 16B in a direction away from each other; and a cylindrical support stem 16C being disposed inside the spring portion 16D, making the spring portion 16D slidable thereon, and being configured to retain straight advancing property of the spring portion 16D.

Abstract: The probe unit includes probe groups of two or more contact probes to be in contact with one electrode of a contact target body on a side of one end in a longitudinal direction and the respective contact probes are to be in contact with separate electrodes of a board on a side of another end. The contact probe includes an end portion arranged on the side of one end, having nail portions in a tapered end shape, and brought into contact with the one electrode at the nail portions; a second contact unit arranged on the side of another end, and to be in contact with a corresponding electrode of the board; and a coil spring arranged between the end portion and the second contact unit, and biasing the end portion and the second contact unit.

Abstract: A testing device includes a test board, a number of locating pins, a pin holder, a number of metal pins, a connector holder, a connector, a number of elastic elements, and a pressure block. The test board is electrically connected with a testing circuit. The locating pins are fixed on the testing board to guide the connector holder. Bottoms of the number of metal pins are vertically fixed in the pin holder. The elastic elements are arranged between the pin holder and the connector holder for pushing the connector holder back to its original position after testing. The connector is set in the connector holder and connected with an electronic device to be tested. The pressure block is positioned above the connector holder and used to push the connector holder down to the pin holder to make the testing contacts in the connector contact the metal pins.

Abstract: A high bandwidth solder-less lead may be connected to an electrical device having land patterns so that signals on the device may be more easily measured through the lead. The lead includes an attachment mechanism to mount the lead on the device, a microspring housing and at least one microspring. The microspring connects one of the particular land patterns on the device to the lead where it may be easier to couple to a measurement device than to the electrical device itself The lead may be coupled to a flexible electrical conduit to make attaching to the testing device even easier. In other versions, a uniform connector may be temporarily attached to the solder-less lead to test the device. Then the connector may be disconnected from the first lead and connected to another lead to test another area of the device.

Abstract: A probe apparatus is provided and includes a probe layer formed with a through-hole, a conductor, electrically coupled to test equipment, disposed on and insulated from a through-hole sidewall, a probe disposed within the through-hole to be spaced from the conductor and thereby movable upon application of an external force thereto and a compliant layer connected to the probe and sufficiently compliant to allow the probe to at least temporarily contact the conductor upon the application of the external force thereto.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip and a compliant body wherein a portion of the complaint body is formed, then the contact tip is formed and then finally the rest of the compliant body is formed, wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Abstract: An exemplary embodiment of the present invention provides a vertical micro contact probe that includes a column formed by longitudinally continuously stacking a plurality of basic units and a front end formed at the front end of the column and contacting an electrode pad of a semiconductor chip. The basic unit includes a probe body alternately bending to the left and right and protrusions protruding from the probe body at the left and right sides from the center of the width direction, and contacting the adjacent probe body to support the probe body under compression.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip, a compliant body, and a bonding material that can be used in bonding the probe to a substrate and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Abstract: A testing jig of a pogo pin connector for testing a connection between at least one pogo pin and an electrical plug is disclosed. The testing jig includes a first support element, a second support element, and a platform. The first support element has a first groove and at least one opening defined therein. The second support element has a second groove corresponding to the first groove for receiving the electrical plug. The platform is disposed below the first support element, and at least one receiving hole is defined in the platform. The at least one pogo pin is disposed in the at least one receiving hole and exposed in the first groove through the at least one opening. The pogo pin is configured in various tilt angles through the platform with the opening for solving high cost of various mold developments.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods of forming probe structures include formation of a plurality of planar multi-material electrodeposited layers wherein each probe structure includes a contact tip and a compliant body, wherein the compliant body is formed from at least one material that is different from the contact tip material and wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Abstract: A probing assembly is disclosed. The probing assembly includes an interface board, a structural support element, a trace support element and a probe support element. The structural support element provides structural and mechanical support to the trace support element. The trace support element includes a body and multiple trace lines located on the body. The probe support element includes a plate having multiple guide holes in which micro probes are inserted. At least one of the micro pins is in contact with one of the trace lines within the trace support element. A set of rails are utilized to secure the probe support element, the trace support element and the structural support element to the interface board.

Abstract: A high frequency vertical spring probe is provided in the present invention. The probe includes an unclosed ring structure having a gap disposed therein to provide an elastic property for vertical deformation. At least a first contacting component and a second contacting component are disposed on the ring structure of the probe to provide electrical connection of an external component when the probe is compressed. The first contacting component is located near two terminals of the ring structure adjacent to the gap and the second contacting component is disposed vertically corresponding to the first contacting component. The probe can serve as the electrical connection between two components or can be installed in the probe card to provide chip testing with high-frequency, high-speed and good-contacting environment.

Abstract: A terminal end for a flat test probe having tapered cam surfaces providing a lead-in angle on the tail of the terminal end which extend to a sharp rear angle to engage detents or projections within a receptacle. The tapered cam surfaces and shape rear angles allow the probe to be inserted into the receptacle with minimal force to retain the flat test probe within the receptacle.

Abstract: A spiral probe includes a tapered distal end portion (2) configured to be brought into direct contact with an inspection object, a hollow, nearly cylindrical distal body (3) extending in one direction from the base of the distal end portion (2), a hollow, nearly cylindrical flexible portion (4) integral with and continuously extending in the one direction from the distal body (3) and having a spiral outer peripheral surface, and a hollow, nearly cylindrical proximal end portion (5) integral with and continuously extending in the one direction from the flexible portion (4), wherein the distal body (3), the flexible portion (4) and the proximal end portion (5) have outer peripheral surfaces aligned with each other in the one direction.

Abstract: A contact spring for a testing base for high current testing of an electronic component, which is produced from a spring metal sheet of a predetermined thickness and possesses two identical opposing lateral faces, and which has a spring arm and a testing arm with a testing tip, where the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by relative movement between the testing base and the electronic component.

Abstract: A testing arrangement is provided for testing the electrical circuits of an assembly of terminal blocks arranged in side-to-side relation, each of the terminal blocks including two mutually-insulated collinearly-arranged horizontal bus bar sections that are normally electrically connected by first and second pairs of leaf spring contacts arranged above and below the bus bar sections, respectively. During the testing operation, the testing device may be arranged either above or below the assembly, and an insulating test plug on the testing device is inserted either vertically downwardly from above, or upwardly from below, the terminal block, thereby to disengage one pair of contacts. A dummy plug is vertically inserted in the opposite direction to disengage the other pair of contacts. The remote ends of the bus bar sections are provided with clamping devices for connection with the bare ends of insulated conductors, respectively.

Abstract: A probe of the present invention includes a beam portion cantilevered by a holding portion, and a contact extending perpendicularly to and downward from a free end of the beam portion. An inner cut portion is formed on a fixed end side of the beam portion in a side portion of the contact, and an outer cut portion is formed on a free end side of the beam portion in a side portion of the contact, so that the outer cut portion and the inner cut portion are formed to bend the contact when the contact contacts an electrode of an object to be inspected at a predetermined contact pressure. According to the present invention, in inspection of electrical characteristics of the object to be inspected, suitable contact between the probe and the object to be inspected may be maintained and the durability of the probe may be improved.

Abstract: A probe is made to contact an electrode terminal in an electric circuit or an electronic part for an electric measurement of the electric circuit or the electronic part. The probe includes a terminal portion which is brought in contact with the electrode terminal at one end of the probe, a spring portion in which U-shaped unit portions are arrayed in a zigzag formation, and a housing portion which surrounds the spring portion. The probe is formed of a sheet of a metal sheet which is bent multiple times, the metal sheet having a predetermined configuration in which a portion corresponding to the terminal portion, a portion corresponding to the spring portion, and a portion corresponding to the housing portion are continuously linked together.

Abstract: The probe pin includes a plunger formed of a sheet metal, and a coil spring unit formed of a metal wire and configured to hold the plunger thereon. In a developed state, the plunger includes first and second portions each of which has an upper contact strip, a wide portion, and a lower contact strip, and which are connected to each other via the wide portions formed in the first and second portions. The plunger is formed in a united manner by folding together the first and second portions along a boundary of the wide portions formed therein to thereby bring at least the wide portions into tight contact with each other.

Abstract: A semiconductor package and testing method is disclosed. The package includes a substrate having top and bottom surfaces, a semiconductor chip mounted in a centrally located semiconductor chip mounting area of the substrate, and a plurality of test pads disposed on top and bottom surfaces of the substrate and comprising a first group of test pads configured on the top and bottom surfaces of the substrate and having a first height above the respective top and bottom surface of the substrate, and a second group of test pads disposed on the lower surface of the substrate and having a second height greater than the first, wherein each one of the second group of test pads includes a solder ball attached thereto.

Abstract: Spring assemblies and a test socket using the spring assemblies. The spring assemblies are used in a test socket electrically connecting lead terminals of a semiconductor chip to test terminals of a test device by contacting the lead terminals and the test terminals, and include: first springs in which a first steel wire having elasticity and conductivity is coiled in a spiral in one direction; and second springs in which a second steel wire having elasticity and conductivity is coiled in a spiral in an opposite direction to the direction in which the first springs are coiled, which have outer diameters narrower than inner diameters of the first springs, and are inserted into the first springs. Accordingly, electric resistances and inductances of two spring assemblies coiled in a spiral are reduced to improve electricity transmission characteristic. A height of a test socket is easily adjusted using spring assemblies having desired lengths.

Abstract: A probe used for electrical measurement includes first and second internal electrically-conductive parts; first and second terminal contact parts configured to contact first and second external electrode terminals, respectively; first and second spring parts each having a meandering pattern; a housing part configured to surround the first and second internal electrically-conductive parts. The first internal electrically-conductive part, the first terminal contact part, the first spring part, the housing part, the second spring part, the second terminal contact part, and the second internal electrically-conductive part are successively connected in a single metal plate from a first end to a second end thereof. The first and second terminal contact parts are in first and second bent portions, respectively, of the single metal plate. The first and second internal electrically-conductive parts are configured to contact each other at the time of performing the electrical measurement.

Abstract: Based upon a layout of a semiconductor wafer comprising a plurality of integrated circuits at pre-defined locations, each integrated circuit comprising a set of electrical connection pads, a probe chip contactor is established, having a unit standard cell on the probe side of the probe chip to correspond to each of the arranged integrated circuits. The unit standard cell is stepped and repeated for the probe side of the probe chip contactor, to establish a wafer scale standard cell layout. The opposite contact side of the probe chip contactor is connectable to a central structure, e.g. a Z-block or PC board, typically comprising a fixed array of vias with fixed X, Y, and Z locations. The routing of contact side of the probe chip contactor is preferably routed automatically, such as implemented on one or more computers, to provide electrical connections between the substrate through vias and the Z-block through vias.

Abstract: A test contact may include a first portion having an open-ended rounded shape. The first portion may define an opening therethrough. The test contact may include a second portion having a curved structure. The first portion and the second portion may be formed integrally, and the second portion may be configured to contact a portion of a device lead.

Abstract: A high-frequency test probe device comprising a contact section (18) which forms an inner contact (40) and an outer contact (44), which is designed to interact with a contact partner (30) that is to be contacted for testing purposes, and which is provided on an inner housing (16) at one end and can be contacted at a pickup end (20) for signal pickup at the other end. The inner housing is guided at least along some sections in an outer housing (10) and in an axially movable manner relative to same.

Abstract: A contact probe comprises conductively coupled plungers and a coil spring. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. The spring is attached to the plungers in a manner that prevents rotation of the spring's ends. A desired magnitude of torsional bias is generated by twisting the spring a predetermined angle prior to attachment of the spring to the plungers. An additional torsional bias is generated by the tendency of the spring to twist when the spring is axially displaced. The resultant torsional bias rotatably biases the coupling means of the plungers against each other, generating contact forces for a direct conductive coupling between the plungers. The plungers are self-latching or are retentively attached to the spring using the torsional bias of the spring. Plungers with hermaphroditic coupling means can be fabricated from a sheet metal or a profiled stock by stamping or machining.

Abstract: A contact probe include: a first plunger to be connected to an object to be inspected; a second plunger to be connected to a board for inspection; and a spring operable to urge the first and second plungers in directions of moving the first and second plungers apart from each other. A pillar part of one of the first and second plungers is slidably engaged with an inner periphery of a tubular part of the other of the first and second plungers. The pillar part includes an elastically deformable part which is in contact with a part of the inner periphery of the tubular part.

Abstract: Disclosed are a spring-type probe pin having upper and lower contacts, and a manufacturing method thereof. The spring-type probe pin includes: cylindrical upper and lower sleeves having upper and lower grounded portions, respectively, in which one of the sleeves moves to be guided into the other; and a shock-absorbing operation unit provided between the upper and lower sleeves and containing a pair of shock-absorbing springs having a spiral spring form, which are connected to each other in such a manner that a turn of the upper shock-absorbing spring deviates from a turn of the lower shock-absorbing spring, in which the shock-absorbing operation unit performs an elastic shock-absorbing operation up to a position where the upper and lower shock-absorbing springs overlap each other. The cylindrical upper and lower sleeves and the shock-absorbing operation unit are integrally formed by using a press forming process.

Abstract: A spring contact pin includes a depressible probe member having a tapered configuration that prevents contact between the projecting end of the probe member and the end of the spring barrel throughout the compression and release cycle of the probe. The tapered configuration of the depressible probe member improves the mechanical performance, reliability, and high-speed signal performance of the contact pin.

Abstract: A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell components such as, a head plate, a test head, a signal delivery system, and a manipulator to emulate wafer test cell dynamics during the probe card inspection and analysis process.

Abstract: A contact probe includes a conductive first plunger including, on a same axis, a distal end portion, a flange portion, a boss portion, and a base end portion, a conductive second plunger including, on the same axis, a second distal end portion and a boss portion, and a coil spring including a coarsely wound portion formed by winding at a predetermined pitch with an inner diameter equal to or larger than a diameter of the boss portion of the first plunger and a tightly wound portion formed by tightly winding with an inner diameter substantially equal to a diameter of the boss portion of the second plunger, so that the first plunger and the second plunger are connected to each other on the same axis.

Abstract: A microelectronic probe element can include a base, a tip, and a spring assembly coupled between the tip and the base. The spring assembly can include a first spring and a second spring, wherein the first spring has a negative stiffness over a predefined displacement range and the second spring has a positive stiffness over the predefined displacement range. The first spring and second spring can be coupled so that the negative stiffness and positive stiffness substantially cancel to produce a net stiffness of the tip relative to the base over the predefined displacement range.

Abstract: A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component.

Abstract: Disclosed is a manufacturing method which enables manufacturing of an ultra-fine, thin contact for current inspection jigs. After a gold or gold alloy plating layer is formed, an Ni electroformed layer is formed by electroformation on the outer periphery of the formed plating layer. After a resistant layer is formed on the outer periphery of the Ni electroformed layer, a spiral groove is formed in the resistant layer by laser exposure, and etching is carried out using the resistant layer as a masking material. The Ni electroformed layer is removed from the part of the resistant layer where the spiral groove was formed, and then the resistant layer is removed and the plating layer is removed from the part of the spiral groove section where the Ni electroformed layer was removed. The core material is then removed, leaving the plating layer inside the periphery of the Ni electroformed layer.

Abstract: Disclosed is an inspection device for a glass substrate, comprising at least one probe, a holder, a stretch controller and a control circuit. The probe is installed on the stretch controller, the stretch controller is employed to stretch the probe out of the holder as an electrical signal is received; and to retract the probe backward in the holder as the electrical signal stops. The present invention promotes the inspection efficiency for the glass substrate.

Abstract: A low inductance contact probe comprises conductively coupled plungers. The plungers have coupling means which enable them to be slidably and non-rotatably engaged. A coil spring is attached to the plungers in a manner that prevents rotation of the spring's ends. The spring provides an axial plunger bias, and a torsional bias for conductive coupling between the plungers. The torsional bias is generated by an axial displacement of the spring and by twisting the spring a predetermined angle prior to attachment to the plungers. Torsion-induced contact forces between the plungers assure a direct conductive path through the plungers. The torsional bias further enables a positive attachment of the spring to the plungers. Plungers with hermaphroditic coupling means can be fabricated from a drawn profiled stock by stamping or machining. Essential plunger coupling features can be prefabricated in a drawn profiled stock with a high degree of dimensional accuracy and reproducibility.

Abstract: In an inspection jig (1) for electrical inspection of printed circuit boards, an electrode section (40) has an electrode (41) disposed on a surface of an electrode plate (42), and a contact (10) includes a conductive contact needle (11), a compression coil spring (12), and an intermediate member (13) that are arranged coaxially for use. The contact needle (11) has a distal end (111), a projection (112), a larger diameter portion (113), and an intermediate portion (114), and the intermediate member (13) has a cylindrical intermediate end (131), a guide portion (132), and an electrode end (133). The electrode end (133) has a cut section at an oblique angle, is bent to have a proximal end (133a) in the vicinity of a central portion, and is held by a contact holder (30) to have an initial load. The electrode (41) is smaller in diameter than the contact (10).

Abstract: Disclosed is an improved probe having a spring portion which allows effective contact with a device under test without requiring a lower die portion. The probe includes a slot retention and placement portion, which provides for an improved approach for manufacturing arrangements of probes, where the slot retention and placement portions of the probe facilitate precise placement and alignment of the probes while not excessively increasing the cost or complexity of the probes and probe cards.

Abstract: An apparatus includes a metal housing, and a pogo pin penetrating through the metal housing. The pogo pin has a first end extending out of a first surface of the metal housing, and a second end extending out of a second surface of the metal housing, with the first and the second surfaces being opposite surfaces of the metal housing. A membrane is attached to the metal housing, wherein the membrane includes a metal line embedded therein. A metal pad is in physical contact with the pogo pin, wherein at least a portion of the metal pad is inside the membrane.

Abstract: The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site.

Abstract: A probe for testing electrical properties of test samples includes a body having a probe arm defining proximal and distal ends, the probe arm extending from the body at the proximal end of the probe arm, whereby a first axis is defined by the proximal and the distal ends. The probe arm defines a geometry allowing flexible movement of the probe arm along the first axis and along a second axis perpendicular to the first axis, and along a third axis orthogonal to a plane defined by the first axis and the second axis.

Abstract: Embodiments of the present invention provide a probe card in which the positional shift of the tip of a probe can be compensated for in response to a change in the temperature, and a wafer test in a wide range of temperatures can be performed. More specifically, the probe card includes a substrate, a probe composed of a first metallic material having a first thermal expansion coefficient, a base of the probe being joined to the substrate, a tip of the probe coming into contact with a connection terminal of an electronic device, and a thermal compensation member composed of a second metallic material having a second thermal expansion coefficient that is higher than the first thermal expansion coefficient, a base of the thermal compensation member being fixed to the substrate, a tip of the thermal compensation member coming into contact with the probe at an intermediate portion between the base of the probe and the tip of the probe.

Abstract: A testing jig of a pogo pin connector for testing a connection between at least one pogo pin and an electrical plug is disclosed. The testing jig includes a first support element, a second support element, and a platform. The first support element has a first groove and at least one opening defined therein. The second support element has a second groove corresponding to the first groove for receiving the electrical plug. The platform is disposed below the first support element, and at least one receiving hole is defined in the platform. The at least one pogo pin is disposed in the at least one receiving hole and exposed in the first groove through the at least one opening. The pogo pin is configured in various tilt angles through the platform with the opening for solving high cost of various mold developments.