Abstract: A probe structure is provided, including two probe heads for electrically contacting with the two objects, respectively, an elastic buffer portion forming a hollow space therein, a conductive portion being disposed within the hollow space and thereby being surrounded by the elastic buffer portion, and having two ends respectively electrically being connected to the two probe heads. When the two probe heads do not contact with the two objects electrically, the conductive portion is linearly extended between the two probe heads.

Abstract: A vertical spring contact is constructed of a single piece of electrical conductor, having a central spine that acts as a spring and does not bulge horizontally during compression. This contact is also provided with a pair of arms extending downwards from a top member, flanking both sides of the central spine without being in contact with the central spine. The lower tips of the arms are bent inwards. The central spine structurally connects the top member to a bottom member. The bottom member is provided with recesses that are adapted to loosely receive the lower tips of the arms. In this way, when the contact is compressed, the lower tips of the arms are pressed into the recesses, thus establishing more contact points for a current to pass through.

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

Abstract: A stabilizer bar with rubber bush includes a stabilizer bar (2), and at least one rubber bush (6) adhesively fixed to at least a portion of the stabilizer bar. The stabilizer bar (2) and the rubber bush (6) are adhesively fixed to each other with an adhesive agent layer (3). The adhesive agent layer (3) includes a primer agent layer (4) formed on a surface of the stabilizer bar (2) and having a dry film thickness of 3 ?m or more and 13 ?m or less; and a first top coat agent layer (5) formed on the primer agent layer (4) and having a dry film thickness of 5 ?m or more and less than 13 ?m.

Abstract: A force biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a split plunger member comprised of an upper split plunger part separated from a lower split plunger part separated by a diagonal cut reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the upper split plunger part and the second end of the internal cavity. A force biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first split plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity and a second split plunger member reciprocally mounted in the internal cavity proximate the upper end of the internal cavity.

Abstract: A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the plunger member and the second end of the internal cavity. At least one rectangular cavity formed in the plunger member with a movable cylindrical bearing in the cavity that applies a slight transverse force to the plunger member ensuring good electrical contact between the plunger and the wall of the barrel member. A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end.

Abstract: The present invention relates to a spring contact, which is integrally formed by blanking and bending a metal plate member, the spring contact comprising: an upper head portion 32 having an upper tip 31 protruding upward; a spring portion (36) formed by a strip cylindrically bent, the strip extending in a zigzag pattern from an upper connection portion 35 extending downward from the upper head portion 32; a lower head portion 39 extending downward from a lower connection 37 extending from the lower end of the spring portion 36; and a lower tip 40 being provided on the lower end of the lower head portion 39. The present invention is advantageously suitable for manufacturing a fine-pitch spring contact and can improve productivity and reduce manufacturing costs.

Abstract: The elongated body of an electrically conductive contact probe can be disposed in a guide hole and can include a patterned region for engaging and riding on a contact region of an inner sidewall of the guide hole as the elongated body moves in the guide hole in response to a force on a tip of the probe. As the patterned region rides the contact region, the tip moves in a lateral pattern that is a function of the surface(s) of the patterned region.

Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.

Abstract: Embodiments contained in the disclosure provide a method and apparatus for testing an electronic device. An electronic device is installed in a test socket guide. A pusher tip applies a load to the guided coaxial spring probes and forces contact with pads on the device. Test and ground signals are routed through the device and test socket. The apparatus includes a socket having at least one guided coaxial spring probe pin. A socket guide shim is positioned between the receptacle for the electronic device and the socket. A socket guide aids positioning. A pusher tip is placed on the side opposite that of the guided coaxial spring probe pins. The pusher tip mates with a pusher shim and the pusher spring. A top is then placed on the assembly and acts to compress the pusher spring and engage the guided coaxial spring probe pins with the pads on the device.

Abstract: A semiconductor test apparatus includes a pogo pin that is provided on a board and is in contact with an inspected object. The pogo pin includes a barrel fixedly disposed on the board, a plunger movably coupled to the barrel, and a conduction film covering the pogo pin. The conduction film contacts a portion of the plunger to be electrically connected to the plunger while being electrically insulated from the barrel.

Abstract: A routing apparatus includes a PCB having first and second arrays of contact pads, an interposer having third, fourth and fifth arrays of contact pads, the third and fourth arrays of contact pads being disposed on opposing surfaces of the interposer, the third array of contact pads being electrically connected to the first array of contact pads. First and second integrated circuits are respectively mounted on the second and fourth arrays of contact pads. The interposer includes a first group of conductive traces insulated from one another, a first array of conductive vias extending perpendicularly to the first group of conductive traces, the first array of conductive vias including through-vias connecting the third array of contact pads to corresponding contact pads in the fourth array of contact pads.

Abstract: An apparatus comprising: a barrel having an first hole and a second hole opposite to the first hole; a first plunger disposed in the first hole and including a hook shape; a second plunger disposed in the second hole; and an elastic connection member disposed within the barrel to connect the first plunger and the second plunger.

Abstract: A gimbal assembly of a single or dual stage actuator is provided with gold at a tongue/dimple interface where a dimple of a supporting loadbeam contacts a tongue on the gimbal assembly. Using gold at the tongue/dimple interface greatly reduces the amount of wear particles formed during assembly and operation of the microactuator. The tongue may include a gold coating on the tongue at the tongue/dimple interface, or the tongue may have a hole etched in a stainless steel layer at the tongue/dimple interface to expose a gold layer disposed below the stainless steel layer. The tongue portion of the tongue/dimple interface may also be formed from a gold-coated copper pad with a polymer coating over the gold.

Abstract: The present invention intends to suppress a contact probe from interfering with a guide plate to produce shavings.

Abstract: A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity. A spring member is positioned in the internal cavity between the plunger member and the second end of the internal cavity. At least one cavity formed in the plunger member with a conductive bearing in the cavity in electrical contact with the plunger and with the wall of the barrel member. A force-biased spring probe pin assembly includes a barrel member having a barrel wall defining an elongate internal cavity with a lower end and an upper end. The assembly also includes a first plunger member reciprocally mounted in the internal cavity proximate the lower end of the internal cavity and a second plunger member reciprocally mounted in the internal cavity proximate the upper end of the internal cavity.

Abstract: A probe device includes a spring probe and a probe seat. The spring probe includes a needle and a spring sleeve sleeved onto the needle and provided with at least one spring section and at least one non-spring section. The probe seat includes a plurality of dies stacked together and at least one guiding hole through which the spring probe is inserted. An upper edge and a lower edge of the guiding hole of the probe seat are arranged corresponding in position to the non-spring section of the spring sleeve. As a result, the spring probe is prevented from getting jammed due to the contact of the spring section of the spring sleeve with the upper and lower edges of the guiding hole.

Abstract: Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

Abstract: A contactor including a bellows body, a fixed portion connected to one end of the bellows body, and a movable portion connected to the other end of the bellows body, where the bellows body, the fixed portion and the movable portion are integrally molded by electroforming, and the movable portion is configured to be depressed to compress the bellows body, so that adjacent arc portions of the bellows body are brought into contact with each other to cause a short circuit.

Abstract: There is provided a substrate inspection apparatus in which a contact between a probe and a semiconductor device is checked without using an IC tester. Further, when an abnormal state is detected in the contact check, a cause of the abnormal state can be determined. A prober includes a probe card having a plurality of probes to be contacted with respective electrode pads of the semiconductor device formed on a wafer W. The probe card includes a card-side inspection circuit configured to reproduce a circuit configuration of DRAM in which the semiconductor device cut from the wafer W is to be mounted, and a comparator configured to measure a potential of a line between the probe and the card-side inspection circuit.

Abstract: A contact spring for a testing base for high current testing of an electronic component, which is produced from a spring metal sheet of a predetermined thickness and possesses two identical opposing lateral faces, and which has a spring arm and a testing arm with a testing tip, where the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by relative movement between the testing base and the electronic component.

Abstract: A battery connector includes an insulating body, a plurality of electrical terminals and a plurality of conducting pieces. The insulating body defines a plurality of terminal grooves penetrating through a front and a rear thereof and a plurality of inserting grooves communicating with the respective terminal grooves. The electrical terminals are assembled into the terminal grooves of the insulting body. The conducting pieces are assembled into the inserting grooves of the insulating body and contact with the electrical terminals. When the battery connector electrically connects the battery and the circuit board, part of the current passes through the conducting pieces, therefore heat generated by the electrical terminals is reduced to ensure that the temperature of the battery connector is within the normal range.

Abstract: A probe device includes a spring probe having a spring sleeve with at least a spring section and a connection segment fixed to a needle and having a convex portion protruding over an outer cylinder surface of the spring section, and a probe seat having stacked dies and at least a guiding hole through which the probe is inserted. The dies includes a lower die, a supporting die above the lower die and a non-circular supporting hole at the supporting die. The distance between a supporting surface and a center of the supporting hole is greater than the radius of the outer cylinder surface and smaller than the distance between a guiding surface of the supporting hole and the center, which is greater than the maximum distance between the convex portion and a needle center, thereby preventing the probe receiving external force from exceeding deflection and bending.

Abstract: A connector alignment assembly comprises a support member having a surface from which an array of male connector pins extend outwardly, each male connector pin having a base region proximate the surface of the support member and a tip region proximate the end of each male connector pin. Guide posts extend from the surface in the direction of the array of male connector pins and compression mechanisms, one associated with each of the guide posts. The compression mechanisms are adapted to transition from the uncompressed position to a compressed position. An alignment plate has guide holes which engage with the guide posts to position the alignment plate in a spaced relationship from the surface of the support member. The alignment plate has an array of male connector pin holes which engage with the array of male connector pins.

Abstract: A moving image sensor package is provided that may be used to provide optical image stabilization (OIS) in the same form factor as non-OIS enabled image sensors utilized in portable/mobile devices. The moving image sensor package includes an image sensor attached to a MEMS actuator mounted within a cutout in a circuit board, wherein the MEMS actuator has substantially the same thickness as the circuit board.

Abstract: It is an object of the invention to provide a guide plate for a probe card with fine through holes at tight pitches and with increased strength. The guide plate 100 for a probe card includes a metal base 110; first insulation layers 120; and metal layers 130. The metal base 110 has a plurality of through holes 111 to receive probes therethrough, and inner walls of the through holes 111. The first insulation layers 120 are of tuboid shape and provided on the respective inner walls of the through holes 111 of the metal base 110. The metal layers 130 are provided on the first insulation layers 120.

Abstract: Nanospike contactors suitable for semiconductor device test, and associated systems and methods are disclosed. A representative apparatus includes a package having a wafer side positioned to face toward a device under test and an inquiry side facing away from the wafer side. A plurality of wafer side sites are carried at the wafer side of the package. The nanospikes can be attached to nanospike sites on a wafer side of the package. Because of their small size, multiple nanospikes make contact with a single pad/solderball on the semiconductor device. In some embodiments, after detecting that the device under test passes the test, the device under the test can be packaged to create a known good die in a package.

Abstract: A high bandwidth solder-less lead may be connected to an electrical device having land patterns so that signals on the device may be more easily measured through the lead. The lead includes an attachment mechanism to mount the lead on the device, a microspring housing and at least one microspring. The microspring connects one of the particular land patterns on the device to the lead where it may be easier to couple to a measurement device than to the electrical device itself. The lead may be coupled to a flexible electrical conduit to make attaching to the testing device even easier. In other versions, a uniform connector may be temporarily attached to the solder-less lead to test the device. Then the connector may be disconnected from the first lead and connected to another lead to test another area of the device.

Abstract: A system for testing a wafer includes a probe card and a wafer. The probe card includes at least one first probe site and at least one second probe site. The wafer includes a plurality of dies. The at least one first probe site is arranged for a first test, and the at least one second probe site is arranged for a second test. Each of the plurality of dies corresponds to first probe pads and second probe pads. Each of the at least one first probe site is arranged to touch the first probe pads of each of the plurality of dies. Each of the at least one second probe site is arranged to touch the second probe pads of each of the plurality of dies.

Abstract: A contactor including a bellows body, a fixed portion connected to one end of the bellows body, a movable portion connected to the other end of the bellows body, and a movable touch piece that extending from at least one side edge along the bellows body, where the movable portion is configured to be depressed to compress the bellows body and to bring a movable contact point, located at a free end of the movable touch piece, into contact with the fixed portion.

Abstract: Provided is probe member for a pogo pin used for testing a semiconductor device, at least a portion of the probe member being inserted into a cylindrical body and supported by an elastic member and an upper end of the probe member contacting a terminal of the semiconductor device.

Abstract: A probe thermometer comprises a main body, a probe, a self-tapping thread, a temperature sensing unit and a display unit. The interior of the main body has a circuit board. The probe includes a measuring end and a coupling end which couples the main body. The self-tapping thread is formed on the measuring end. The temperature sensing unit is disposed within the probe and the temperature sensing unit is electrically connected to the circuit board. The display unit is disposed on the main body. The display unit, the temperature sensing unit and the circuit board are electrically connected. Thereby, the probe thermometer of the instant disclosure is convenient and effectively reduces cost.

Abstract: A high-frequency test probe device comprising a contact section (18) which forms an inner contact (40) and an outer contact (44), which is designed to interact with a contact partner (30) that is to be contacted for testing purposes, and which is provided on an inner housing (16) at one end and can be contacted at a pickup end (20) for signal pickup at the other end. The inner housing is guided at least along some sections in an outer housing (10) and in an axially movable manner relative to same.

Abstract: An inspection apparatus includes an insulating substrate, a socket in which a body portion having a through-hole in a wall thereof is integrally formed with a connection portion secured to the insulating substrate, and a contact probe detachably secured to the socket.

Abstract: A contact probe having a plunger; a top contacting member which is provided at a tip end of the plunger and is brought into contact with an electrode of a semiconductor device; a bottom contacting member which is brought into contact with an electrode of a testing board; and an elastic member for urging the top contacting member and the bottom contacting member in opposite directions away from each other. The plunger is formed into a cylindrical shape and includes a through-hole which penetrates through the plunger in an axial direction thereof. The top contacting member includes a plurality of mountain-shaped sharp portions at a tip end thereof, and each of the sharp portions is asymmetrical with respect to a straight line that passes through a peak of the sharp portion and extends along an axial direction of the plunger, and is bent toward a center line of the plunger.

Abstract: A universal spring contact pin for use in an IC test Socket includes a depressible probe member at one end and a fixed probe member at the other end. The fixed probe member preferably has a projection length chosen to allow z-axis loading of different surface mount package types within the same test socket. It also can have a relatively large tip angle which preferably terminates at a relatively sharp termination point. Preferably, the tip angle is about 90 degrees and the radius of the termination point of the tip is about 0.001 inches (0.0254 millimeters) or less.

Abstract: An apparatus and method providing improved interconnection elements and tip structures for effecting pressure connections between terminals of electronic components is described. The tip structure of the present invention has a sharpened blade oriented on the upper surface of the tip structure such that the length of the blade is substantially parallel to the direction of horizontal movement of the tip structure as the tip structure deflects across the terminal of an electronic component. In this manner, the sharpened substantially parallel oriented blade slices cleanly through any non-conductive layer(s) on the surface of the terminal and provides a reliable electrical connection between the interconnection element and the terminal of the electrical component.

Abstract: A jig for use in a semiconductor test of the present invention includes; a base on which a probe pin and an insulating material are provided such that the probe pin is surrounded by the insulating material in plan view; and a stage arranged to face a surface of the base on which the probe pin and the insulating material are provided. The stage is capable of receiving a test object placed on a surface facing the base. When the test object is placed on the stage and the base and the stage move in a direction in which they get closer to each other, the probe pin comes into contact with an electrode formed on the test object, and the insulating material comes into contact with both the test object and the stage.

Abstract: An interactive pin array device comprising a plurality of elongated pins held in a frame and forming a set. The frame is adapted to hold the plurality of pins in a parallel position to one another in a series of columns and rows, such that the distal ends of the plurality of pins together form a flat virtual plane. Each pin of the plurality of pins includes an elongated housing member defining a linear axis therethrough, and a pin member adapted to slide linearly in either direction along the axis. Each of the housing member includes an upper electromagnet, and a lower electromagnet separated from the upper electromagnet.

Abstract: An apparatus for testing electronic devices is disclosed. The apparatus includes a plurality of probes attached to a substrate; each probe capable of elastic deformation when the probe tip comes in contact with the electronic; each probe comprising a plurality of isolated electrical vertical interconnected accesses (vias) connecting each probe tip to the substrate, such that each probe tip of the plurality is capable of conducting an electrical current from the device under test to the substrate. The plurality of probes may form a probe comb. Also disclosed is a probe comb holder that has at least one slot where the probe comb may be disposed. A method for assembling and disassembling the probe comb and probe comb holder is also disclosed which allows for geometric alignment of individual probes.

Abstract: In an inspection jig (1) for electrical inspection of printed circuit boards, an electrode section (40) has an electrode (41) disposed on a surface of an electrode plate (42), and a contact (10) includes a conductive contact needle (11), a compression coil spring (12), and an intermediate member (13) that are arranged coaxially for use. The contact needle (11) has a distal end (111), a projection (112), a larger diameter portion (113), and an intermediate portion (114), and the intermediate member (13) has a cylindrical intermediate end (131), a guide portion (132), and an electrode end (133). The electrode end (133) has a cut section at an oblique angle, is bent to have a proximal end (133a) in the vicinity of a central portion, and is held by a contact holder (30) to have an initial load. The electrode (41) is smaller in diameter than the contact (10).

Abstract: A probe for inspecting electronic components, and more particularly, to a probe for inspecting electronic components, which connects a target electronic component to an inspection apparatus to inspect defects of the target electronic component. The probe for inspecting electronic components includes: a cylinder body having a cylindrical shape; a piston body reciprocating between an inside and an outside of the cylinder body; a spring surrounding an outer circumference of the cylinder body and the piston body, and forcing a part of the piston body to resiliently move out of the cylinder body when inserted into the cylinder body; a probing unit extending from the cylinder body to be brought into contact with a target electronic component to be inspected as to flow of electric current therethrough; and a contact unit extending from the piston body to be connected to an inspection apparatus for inspecting the target electronic component.

Abstract: Disclosed is an inspection device for a glass substrate, comprising at least one probe, a holder, a stretch controller and a control circuit. The probe is installed on the stretch controller, the stretch controller is employed to stretch the probe out of the holder as an electrical signal is received; and to retract the probe backward in the holder as the electrical signal stops. The present invention promotes the inspection efficiency for the glass substrate.

Abstract: A probe for connecting an electrode terminal of an electric circuit or an electric component includes a first spring; a second spring covering the first spring; a cover covering the second spring; a first terminal that is connected to the second spring and is provided at one end of the probe; and a second terminal that is connected to the cover and is provided at another end of the probe.

Abstract: Provided is a method for performing a burn-in test on an object under test in which a plurality of electrodes are provided in positions at different heights. The method comprising steps of: preparing an object under test in which an electrode in a higher position have a higher surface roughness among the plurality of electrodes; bringing a plurality of sheet-type probes into contact with the plurality of electrodes, respectively; and supplying an electric current with the plurality of electrodes through the plurality of sheet-type probes. By implementing the method, the sheet-type probes can be kept in stable contact with the electrodes because electrodes in a higher position have a higher surface roughness Ra than electrodes in a lower position. Consequently, stable and reliable burn-in test can be performed.

Abstract: A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.

Abstract: A multifunction test instrument probe includes a housing having a hollow bore with an open end. A clamp plunger is carried in the hollow bore, with a first end including a thumb press, and a second end including an alligator clamp having a pair of jaws, with a compression spring normally biasing the thumb press away from the housing, and normally biasing the alligator clamp substantially within the hollow bore proximate the open end. A point plunger is also carried in the bore, with a first end including a thumb press, and a second end terminating in a point, with a second compression spring normally biasing the thumb press away from the housing, and biasing the point within the hollow bore proximate the open end.

Abstract: The present invention relates to a pogo pin including a probe part and an elastic part, and more particularly, to a probe-connection-type pogo pin including a cylindrical upper probe part, an elastic part, and a cylindrical lower probe part, which are made in one body, to transmit electrical signals between semiconductor wafers, LCD modules, semiconductor packages, electronic parts such as a variety of sockets, etc. Accordingly, it is possible to reduce the manufacturing process and the manufacturing cost, reduce the outside diameter of the pogo pin by making the elastic part formed to surround the cylindrical lower probe part, and reduce the loss and distortion of electrical signal by allowing the upper probe part and the lower probe part to come in surface contact with each other.

Abstract: There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board.

Abstract: Provided is probe member for a pogo pin used for testing a semiconductor device, at least a portion of the probe member being inserted into a cylindrical body and supported by an elastic member and an upper end of the probe member contacting a terminal of the semiconductor device.