Abstract: A system for inspecting a depth relative to a layer using a sensor with a fixed focal plane. A focus sensor senses the surface of the substrate and outputs focus data. In setup mode the controller scans a first portion of the substrate, receives the focus data and XY data, and stores correlated XYZ data for the substrate. In inspection mode the controller scans a second portion of the substrate, receives the focus data and XY data, and subtracts the stored Z data from the focus data to produce virtual data. The controller feeds the virtual data plus an offset to the motor for moving the substrate up and down during the inspection, thereby holding the focal plane at a desired Z distance.

Abstract: Provided are a defect inspecting method and a defect inspecting apparatus, wherein defect detecting sensitivity is improved and also haze measurement is performed using polarization detection, while suppressing damages to samples. The defect inspecting apparatus is provided with a light source which oscillates to a sample a laser beam having a wavelength band wherein a small energy is absorbed, and two independent detecting optical systems, i.e., a defect detecting optical system which detects defect scattered light generated by a defect, by radiating the laser beams oscillated by the light source, and a haze detecting optical system which detects roughness scattered light generated due to roughness of the wafer surface. Polarization detection is independently performed with respect to the scattered light detected by the two detecting optical systems, and based on the two different detection signals, defect determination and haze measurement are performed.

Abstract: In a method and apparatus for optically inspecting a magnetic disk, irradiating the surface of the sample with a light by rotating and moving the sample in the direction orthogonal to the center axis of the rotation, detecting the regular reflection light from the surface of the sample, detecting the scattered light in the vicinity of the regular reflection light from the surface of the sample by separating the scattered light from the regular reflection light, detecting the scattered light scattered in the direction at a higher angle with respect to the normal direction of the surface of the sample, and detecting the defects by processing the detection signal of the regular reflection light, the detection signal of the scattered light in the vicinity of the regular reflection light, and the detection signal of the scattered light in the high angle direction.

Abstract: A method of forming a standard mask for an inspection system is provided, the method comprising providing a substrate within a chamber, and providing a tetraethylorthosilicate (TEOS) precursor within the chamber. The method further includes reacting the TEOS precursor with an electron beam to form silicon oxide particles of controlled size at one or more controlled locations on the substrate, the silicon oxide particles disposed as simulated contamination defects.

Abstract: This invention relates to temperature-corrected photoluminescence spectroscopy which may be applied to semiconductors and, in particular, photovoltaic films.

Abstract: A foreign-matter inspection apparatus is implemented which allows the stable detection sensitivity to be maintained. A laser beam emitted from a laser apparatus is applied to a beam irradiation sample via an irradiation unit and a mirror. Then, the laser beam is captured into a beam-capturing camera via an image-forming lens and a beam-direction switching mirror. Based on the captured beam image, an image computational processing unit judges inclination of the laser beam, then adjusting the irradiation unit thereby to correct the inclination of the laser beam. Also, the beam is captured into the beam-capturing camera in specified number-of-times while focus of the laser beam is being changed by an arbitrary amount by the irradiation unit. Based on the captured beam, the focus of the laser beam is corrected by adjusting the irradiation unit.

Abstract: The present disclosure provides a system and method for providing an improved protective coating for a substrate that may be inspected using the unaided eye or other apparatus under available light. The protective coating is mixed with an additive comprising flakes or particles that, when applied to the substrate as part of the protective coating, allow the user to empirically determine if the surface has received an adequate protective coat. The determination of whether or not any defects exist may include comparing the observed appearance of the specialty pigment particles with a comparative standard.

Abstract: An optical collection and detection system for use in a surface inspection system for inspecting a surface of a workpiece. The surface inspection system has an incident beam projected through a back quartersphere and toward a desired location on the surface, which is a scanned spot having a known scanned spot size. The incident beam impinges on the surface to create scattered light that is collected by a collector module. The collector module includes collection optics for collecting and focusing the scattered light to form focused scattered light. A collector output slit is positioned at an output of the collector module, through which the collection optics focus the scattered light. The scattered light that is associated with the scanned spot forms an imaged spot at the collector output slit.

Abstract: A method is disclosed evaluating a silicon layer crystallized by irradiation with pulses form an excimer-laser. The crystallization produces periodic features on the crystalized layer dependent on the number of and energy density in the pulses to which the layer has been exposed. An area of the layer is illuminated with light. A detector is arranged to detect light diffracted from the illuminated area and to determine from the detected diffracted light the energy density in the pulses to which the layer has been exposed.

Abstract: A surface state inspection apparatus has a lighting device that irradiates an inspection target placed on a stage with light, an imaging device that images the inspection target, and a detection device that detects a surface defect of the inspection target by analyzing a first inspection image obtained by the imaging device. The lighting device is a surface light source that includes a light emission region having a predetermined size and, in the lighting device, portions of light emitted from positions in the light emission region differ from each other in a spectral distribution. The detection device detects a portion in which a hue is different from that of its surrounding portion in the inspection target surface as a flaw. The detection device detects a portion in which the hue is substantially equal to that of its surrounding portion while brightness is different from that of its surrounding portion as a stain.

Abstract: A method for inspecting a surface of a workpiece for asymmetric defects, by scanning an incident beam on the surface of the workpiece to impinge thereon to create reflected light extending along a light channel axis in a front quartersphere and scattered light, the incident beam and the light channel axis defining an incident plane, collecting the scattered light at a plurality of collectors disposed above the surface at defined locations such that scatter from asymmetric defects is collectable by at least one collector, detecting collector output and generating signals in response, and processing the signals associated with each collector individually to obtain information about asymmetric defects.

Abstract: One of the broader forms of the present disclosure involves a method of enhanced defect inspection. The method includes providing a substrate having defect particles and providing a fluid over the substrate and the defect particles, the fluid having a refractive index greater than air. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles.

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes combining first image data and second image data, generated using different output generated using different values for focus of an inspection system, corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer and detecting defects on the wafer using the additional image data.

Abstract: A tool for tuning the pitch of blades on a model propeller with pivoting blades, the tool comprising a mount for the model propeller and a calculation module. The mount allows the propeller to be positioned such that the axis of the propeller coincides with a fixed reference axis of the mount and to place each blade of the propeller, successively, in a measurement position. The calculation module determines the angle between a chord of a blade in the measurement position and a fixed reference plane of the tool, the fixed reference plane being orthogonal to the fixed reference axis, based on optical sightings by the calculation model on a suction face of the blade in the measurement position.

Abstract: An apparatus for optically inspecting an at least partially reflecting surface of an object includes first and second transverse carriers (12, 14) defining respective substantially circular segment-shaped cutouts (32). The transverse carriers (12, 14) are disposed at a longitudinal distance (D) from one another and the longitudinal distance (D) defines a longitudinal direction (17). A plurality of longitudinal members are configured to hold the first and second transverse carriers at the longitudinal distance (D). The longitudinal members are arranged at a defined radial distance to the circular segment-shaped cutouts. A translucent diffusing screen is held in the circular segment-shaped cutouts by the transverse carriers to form a tunnel-shaped inspection space. A multiplicity of light sources are arranged outside of the tunnel-shaped inspection space behind the diffusing screen.

Abstract: The invention relates to a device for inspecting contact-sensitive planar materials or workpieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces. Said inspection device comprises a support element (1) for supporting a material (3) on the top face of the support element (1), at least one oscillator which is connected to the support element (1) and the oscillation frequency and amplitude of which are selected in such a way as to keep the material (3) hovering on the support element (1), and at least one optical sensor (4). The support element is made of a light-permeable material, and the optical sensor (4) is arranged below the support element (1).

Abstract: A defect inspection method wherein illumination light having a substantially uniform illumination intensity distribution in a certain direction on the surface of a specimen is radiated onto the surface of the specimen; wherein multiple components of those scattered light beams from the surface of the specimen which are emitted mutually different directions are detected, thereby obtaining corresponding multiple scattered light beam detection signals; wherein the multiple scattered light beam detection signals is subjected to processing, thereby determining the presence of defects; wherein the corresponding multiple scattered light detecting signals is processed with respect to all of the spots determined to be defective by the processing, thereby determining the sizes of defects; and wherein the defect locations on the specimen and the defect sizes are displayed with respect to all of the spots determined to be defective by the processing.

Abstract: This application relates to an apparatus and method for providing patterned illumination fields for use within process control and article inspection applications. More specifically, it pertains to the use of patterned illuminators to enable visual surface inspection of polished objects such as ball bearings. The use of patterned illuminators properly disposed in relation to a polished part under inspection allows small surface imperfections such as scratches and pits to become visible against the normal surface background. The use of carefully engineered illuminators facilitates advantageous defect-site scattering from generally dark field sources. The patterned nature of the illuminators defined by this invention allows the complete surface of three-dimensional parts to be effectively highlighted using dark field illumination fields.

Abstract: When examination at a scan speed equal to or higher than the line rate of the sensor such as a TDI sensor is carried out, the line rate of the TDI sensor is asynchronous with the scan speed, and the image is blurred. Therefore, a TDI sensor cannot be used at a scan speed equal to or higher than the line rate of the TDI sensor. This problem has not been considered. To solve the problem, high-speed examination irrespective of the line rate of the TDI sensor is enabled. To control the line rate of the TDI sensor and stage scan speed asynchronously and to solve the problem of the image addition variation due to the charge accumulation of the TDI sensor, the object to be examined is irradiated with thin-line illumination, and only a given pixel line of the TDI sensor is made to receive light scattered by the object to be examined. The aspect ratio of the detection pixel size can be controlled by the speed ratio between the line rate of the TDI sensor and the stage scan speed.

Abstract: Various embodiments for substrate inspection are provided.

Abstract: Provided herein is an apparatus, including a photon emitting means for emitting photons onto a surface of an article, a photon detecting means for detecting photons scattered from features in the surface of the article; and a mapping means for mapping the features in the surface of the article, wherein the apparatus is configured to process more than one article every 100 seconds.

Abstract: An optical fiber crack detector that includes a plurality of FBG sensors positioned within one or more fibers that are operable to reflect a defined wavelength of an optical input beam. The crack detector includes a light source for generating the optical input beam that propagates down the optical fiber and interacts with the FBG sensors. A wavelength of the optical beam that is reflected by the FBG sensors is detected, and if a crack in the component damages the fiber between an FBG sensor and the detector circuit, where one or more of the reflected signals are not received, the detector knows that a crack has occurred. By strategically placing a plurality of the FBG sensors along the fiber, a crack that damages the fiber in multiple locations between multiple FBG sensors, or in multiple fibers, can provide an indication of the length of the crack.

Abstract: A method and apparatus for evaluating a soiling level of a media item, such as a banknote. The method comprises receiving an image of a media item including a plurality of pixels, each pixel having an associated intensity. Two sets of pixels are created, where each pixel in the first set has a higher intensity than each pixel in the second set. A representative intensity value from the first set and a representative intensity value from the second set are calculated. A soiling value from the ratio of the representative intensity value of the second set to the representative intensity value of the first set is calculated. The media item is captured if the soiling value fulfils a capture criterion.

Abstract: A wafer surface observing apparatus for inspecting a peripheral portion of an object has (A) a lens system and a CCD camera for taking images of the peripheral portion of the object, (B) storage for storing image data about the taken images, and (C) display for displaying the image data stored in the storage device. In particular, the present apparatus can have functions of rotating the object placed on a prealignment portion, recording images of one full outer periphery of an end portion of the object by the lens system and CCD camera into the location where the orientation flat portions or notched portions of the object are placed in position, accepting the images into the storage device, and displaying the images on a CRT.

Abstract: The invention provides an optical surface defect inspection apparatus and an optical surface defect inspection method that reduces an influence from a dead zone of a sensor array and that reduces the influence from reduction of a detected light amount in a case of extending over light receiving elements, thereby enabling a defect inspection with high sensitivity. According to the invention, a subject is irradiated with an inspection light, an image is formed on the sensor array including the light receiving elements separated by the dead zone insensitive to light scattered by a surface of the subject and arranged in a plurality of lines, outputs from two adjacent light receiving elements are added, and a defect on the surface of the subject is inspected for based on the result of the addition.

Abstract: To increase the speed of inspection, an inspection apparatus may conduct an inspection by irradiating a wafer surface with a thin light beam and acquiring an image of an irradiated region with a photodetector. However, it is not easy to have the photodetector properly form the image of the irradiated region. This problem is not solved by prior art technologies. The present invention includes an image formation optical system having an optical fiber bundle, and additionally includes a mechanism for rotating the light condensing side of the optical fiber bundle. The present invention enables the photodetector to properly form the image of light scattered from the irradiated region.

Abstract: A system and method for processing mail and other documents. A method includes scanning a document to produce a document image and analyzing the document image. The method includes determining that there is a condition of the data processing system that requires maintenance based on the analysis. The method includes notifying at least one user of the condition that requires maintenance based on the determination.

Abstract: System for inspecting defects of panel device includes a to-be-inspected device, a platform for holding the to-be-inspected device, a power unit, and a light source apparatus. The light source apparatus is controlled by the power unit to provide an inspection light to the to-be-inspected device for inspecting whether or not having defects. The light source apparatus includes a cathode structure, an anode structure, a fluorescent layer, and a low-pressure gas layer. The fluorescent layer is located between the cathode structure and the anode structure. The low-pressure gas layer is filled between the cathode structure and the anode structure, for inducing the cathode to emit electrons uniformly. The low-pressure gas layer has an electron mean free path, allowing at least enough electrons to directly hit the fluorescent layer under an operating voltage.

Abstract: A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs infrared light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.

Abstract: This invention implements reduction in the amount of background-scattered light from a semiconductor wafer surface and highly sensitive inspection, without increasing the number of detectors. A surface inspection apparatus that detects defects on the surface of an object (semiconductor wafer surface) to be inspected, by irradiating the surface of the object with a beam of light such as laser light and detecting the light reflected or scattered from the surface; wherein a widely apertured lens with an optical Fourier transform function is disposed between the object to be inspected and a detector, a filter variable in position as well in aperture diameter is provided on a Fourier transform plane, and background-scattered light from the semiconductor wafer surface is effectively blocked, whereby only a signal from a defect such as a foreign substance is detected.

Abstract: To provide a defect inspection apparatus and method adapted to easily assign threshold levels to scattered-light detectors and to appropriately acquire data detected by each scattered-light detector. The apparatus includes a stage device on which to rest a sample; a laser light irradiation device that irradiates the sample on the stage device with inspection light; scattered-light detectors, each of which detects a beam of light, scattered from the sample, and outputs an image signal; a threshold level setter formed so that an associated threshold level for judging whether defects are present is set only for an image signal selected from individual image signals of the scattered-light detectors or from image signals obtained by arithmetic processing based on the image signals, and a threshold level setting circuit that acquires the individual image signals, only if the image signal exceeds the threshold level set in the threshold level setter.

Abstract: Various apparatus and methods of testing a semiconductor chip for soft defects are disclosed. In one aspect, a method of testing a semiconductor chip that has a surface and plural circuit structures positioned beneath the surface is provided. An irradiation mask directs light or heat to a series of fractional portions of the surface to perturb portions of the plural circuit structures. The irradiation mask is adjustable such that at least one of the exposed series of fractional portions is smaller than another of the series of fractional portions. The semiconductor chip undergoes a test pattern during the irradiation to each of the fractional portions to determine if a soft defect exists in any of the series of fractional portions. Multiple paths can be tested simultaneously to inform subsequent individual CTP path tests.

Abstract: A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

Abstract: An optical component includes a substrate and a fluorine-doped thin film formed on the substrate. This fluorine-doped thin film is dense, and thus very low absorbing and insensitive to various vacuum, temperature, and humidity conditions. This dense film has a high refractive index, which remains stable irrespective of environmental conditions. The fluorine-doped thin film can advantageously ensure low scattering, low reflectance, and high transmittance. Moreover, the fluorine-doped thin film is damage resistant to incident radiation density. The fluorine-doped thin film may be a fluorine-doped silicon oxide film having a thickness of approximately 1-10 nm and a fluorine concentration of 0.1% to 5%.

Abstract: An optical collection system for use in a surface inspection system for inspecting a surface of a workpiece. The surface inspection system has an incident beam projected through a back quartersphere and toward a location on the surface of the workpiece to impinge on the surface. This forms a reflected beam that extends along a light channel axis in a front quartersphere, and forms scattered light having a haze scatter portion. The incident beam and the light channel axis form an incident plane. The optical collection system includes back collectors that are positioned in the back quartersphere for collecting the scattered light, where each of the back collectors is disposed in the back quartersphere outside the incident plane, and at a relative minimum in the Rayleigh scatter.

Abstract: In a method and apparatus for optically inspecting a magnetic disk, irradiating the surface of the sample with a light by rotating and moving the sample in the direction orthogonal to the center axis of the rotation, detecting the regular reflection light from the surface of the sample, detecting the scattered light in the vicinity of the regular reflection light from the surface of the sample by separating the scattered light from the regular reflection light, detecting the scattered light scattered in the direction at a higher angle with respect to the normal direction of the surface of the sample, and detecting the defects by processing the detection signal of the regular reflection light, the detection signal of the scattered light in the vicinity of the regular reflection light, and the detection signal of the scattered light in the high angle direction.

Abstract: Provided is a disk surface inspection device that makes it possible to extract defects repeatedly occurring at a particular position on the disk surface. The disk surface inspection device comprises conveyance means which extracts a disk from a cassette and conveys the disk, table means including a spindle which rotates the disk mounted thereon while moving the disk in a direction and a rotation angle detecting unit which detects the rotation angle of the spindle, optical detection means which irradiates the disk with light and detects reflected light from the disk, signal processing means which detects defects by processing a detection signal from the optical detection means, and output means. The signal processing means stores positional information of defects detected on the disk by use of rotation angle information on the spindle and positional information on a particular part of the disk stored in the cassette.

Abstract: In order to feed back information on the detected defect to a production process in a short period of time, there is provided a method for inspecting the surface of a sample by illuminating illumination light to the sample, detecting scattered light generated from the sample by the illumination light and processing a detection signal representing the detected scattered light in order to detect a defect on the sample. In the step of processing the detected scattered signal includes the sub-steps of making use of detection signals representing the scattered light scattered in the first elevation-angle direction and the scattered light scattered in the third elevation-angle direction in order to detect a defect on the sample, identifying the type of the detected defect, generating spectroscopic data by dispersing the scattered light scattered in the second elevation-angle direction and summing up the spectroscopic data for every defect type.

Abstract: Disclosed herein is a surface defect detecting apparatus including a stage unit having an upper surface on which a subject is disposed; at least one light source unit that is moved according to an examination condition and irradiates examination light onto a surface of the subject; an imaging unit that receives light emitted from the surface of the subject and captures an image of the surface of the subject; a controller that is connected to the at least one light source unit and the imaging unit, sets the examination condition, controls an overall operation, and detects a surface defect of the subject by using the image captured by the imaging unit; and a display unit displaying image information on the surface defect detected by the controller.

Abstract: A disk surface inspection method for detecting a circle scratch defect, separately from sporadically existing scratch defects. In the method, the sample is irradiated with light, regular reflection light reflected from the sample is detected, scattered light in the vicinity of the regular reflection light is detected separately from the regular reflection light, scattered light, scattered in a high angle direction greater than the direction of the regular reflection light is detected, and the defects on the surface of the sample are detected by processing a regular reflection light detection signal, a low-angle scattered light detection signal and a high-angle scattered light detection signal to extract defect candidates, and regarding the extracted defect candidates, a circumferential defect is extracted based on the ratio of defect candidates in a circumferential direction within a predetermined width in a radial direction from the center of the sample.

Abstract: The present invention is to provide an optical surface defect inspection apparatus or an optical surface defect inspection method that can improve a signal-to-noise ratio according to a multi-segmented cell method without performing autofocus operations, and can implement highly sensitive inspection. The present invention is an optical surface defect inspection apparatus or an optical surface defect inspection method in which an inspection beam is applied onto a test subject, an image of a scattered light from the surface of the test subject is formed on a photo-detector, and a defect on the surface of the test subject is inspected based on an output from the photo-detector. The photo-detector has an optical fiber bundle. One end thereof forms a circular light receiving surface to receive the scattered light. The other end thereof is connected to a plurality of light receiving devices.

Abstract: The present invention provides a method and apparatus for inspecting a surface of a substrate. The apparatus includes: a rotatable stage on which a substrate to be inspected is placed; an inspection optical system having an illumination light source for emitting light to a substrate placed on the stage and a detector for detecting light from the substrate which is irradiated with the light from the illumination light source; an A/D converter for amplifying and A/D converting signals output from the detector in the inspection optical system; and a defect detector for detecting defects in a surface of the substrate by processing signals output from the detector and converted by the A/D converter and classifying the defected defects. The defect detector extracts micro defects in the surface of the substrate by processing the signals output from the detector, and detects linear defects existing discretely in a linear region.

Abstract: The present invention provides an inspection apparatus having a high throughput and high sensitivity with respect to a number of various manufacturing processes and defects of interest in inspection of a specimen such as a semiconductor wafer on which a pattern is formed. The apparatus illuminates with light the specimen having the pattern formed thereon, forms an image of the specimen on an image sensor through a reflective optics, and determines the existence/nonexistence of a defect. The reflective optics has a conjugate pair of Fourier transform optics. An aberration of the reflective optics is corrected off-axis. The reflective optics has a field of view in non-straight-line slit form on the specimen surface. Also, the optics is of a reflection type, includes a conjugate pair of Fourier transform optics and has a field of view in non-straight-line slit form. An optimum wavelength band is selected according to the specimen (FIG. 1).

Abstract: An inspection system for coated paper includes a traveling web of paper, a coating device for forming bands on the web by applying a coating liquid in the width direction of the web such that the bands are spaced from each other in the longitudinal direction of the web at regular intervals, a drying device for drying the web having the bands, a detection unit which is arranged downstream of the coating device for detecting at least either defect in the bands or defect in the web that is caused due to application of the coating liquid. A control device is inputted with the detection result from the detection unit and includes a determination section for determining the type of defect from the detection result. A quality control unit is inputted with the determination result from the determination section and configured to manage the determination result.

Abstract: A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable polarization a polarizing relay assembly arranged to selectively permit the scattered light having a selected polarization orientation to pass along a detector optical axis to a light detection unit in the detection subsystem. The system also features a collector output width varying subsystem for varying the width of an output slit in response to changes in the location of the location scanned on the workpiece.

Abstract: Systems and methods for monitoring time-varying classification performance are disclosed.

Abstract: A measuring device for determining a measured variable at one end of a rod-shaped product includes an optical displacement sensor which includes a light source producing light that is scanned across an entire end face of the rod-shaped product to be examined and a light detector for detecting light that is reflected at the end face of the rod-shaped product to generate a measuring signal. A processing device is coupled to receive the measuring signal to determine a quantitative profile of the entire end face of the rod-shaped product.

Abstract: A high-speed, 3-D method and system for optically inspecting parts are provided. The system includes a part transfer subsystem including a transfer mechanism adapted to support a part at a loading station and transfer the supported part from the loading station to an inspection station at which the part has a predetermined position and orientation for inspection. The system also includes an illumination assembly to simultaneously illuminate an end surface of the part and a peripheral surface of the part. The system further includes a lens and detector assembly to form an optical image of the illuminated end surface and an optical image of the illuminated peripheral surface of the part and to detect the optical images. The system still further includes a processor to process the detected optical images to obtain an end view of the part and a 3-D panoramic view of the peripheral surface of the part.

Abstract: Apparatus for inspecting a semiconductor wafer (8) has a plurality of light sensors (2) arranged relative to a light source (1) and wafer inspection platform (4), so that images of different angle views of a surface of the wafer can be received and compared with corresponding images taken of a reference wafer to automatically detect defects based on image comparison. The light sensors (2) may receive superposed images of light (7) reflected directly from the light source (1) off the wafer surface and light (6) indirectly reflected off the wafer surface after first reflecting off a dome (3) with a diffusely reflecting inner surface (5) positioned over the platform (4).

Abstract: Various computer-implemented methods for classifying defects on a specimen are provided. One method includes assigning individual defects detected on the specimen to defect groups based on one or more characteristics of the individual defects. The method also includes displaying information about the defect groups to a user. In addition, the method includes allowing the user to assign a classification to each of the defect groups. Systems configured to classify defects on a specimen are also provided. One system includes program instructions executable on a processor for assigning individual defects detected on the specimen to defect groups based on one or more characteristics of the individual defects. The system also includes a user interface configured for displaying information about the defect groups to a user and allowing the user to assign a classification to each of the defect groups.