Abstract: An invention for making productive uses of normally undesirable whiskers is provided. Embodiments of the invention include a variety of apparatuses and methods associated with forming and using whiskers as well as forming whisker compounds is disclosed. For example, whisker detection modules can be created which provide a whisker surveillance capability. The whisker detection modules can further be coupled with a whisker response system such as an alarm or insulating material dispersing system. Another aspect of the invention is providing a variety of environments or microenvironments with regard to a whisker forming structure to affect whisker creation such as maximizing whisker formation. Another example includes provision of a variety of embodiments for manufacturing compounds of whiskers of various metal and metal alloys, including structures and methods is provided. Whisker compounds produced using various embodiments of the invention can be used for various applications.

Abstract: A method of determining the orientation of a grain structure of a turbine blade or vane using an optical technique, illuminates a surface with a beam from a light source and then manipulates the relative orientation of the surface, a light beam and detector to determine the relative orientation which provides the peak reflectance of the beam from the surface to the detector. Further surfaces of the component are similarly manipulated and illuminated and the orientation of the grain structure calculated from the determined relative peak reflectance orientations of the surface, first further surface and second further surface. Determination of the grain orientation allows the value of high angle boundaries to be determined. Also disclosed is apparatus suitable for performing the method.

Abstract: In a method of detecting a defect of a substrate, a first light having a first intensity may be irradiated to a first region of the substrate through a first aperture. A defect in the first region may be detected using a first reflected light from the first region. A second light having a second intensity may be irradiated to a second region of the substrate through a second aperture. A defect in the second region may be detected using a second reflected light from the second region. Thus, the defects by the regions of the substrate may be accurately detected.

Abstract: Light that is scattered by a defect on a wafer is very weak, and a PMT and an MPPC are used as detection methods for measuring the weak light with high speed and sensitivity. The methods have a function of photoelectronically converting the weak light and multiplying an electron, but have a problem in that a signal light is lost and an S/N ratio is reduced because the quantum efficiency of the photoelectron conversion is as low as 50% or less. Direct light is amplified prior to the photoelectron conversion. The optical amplification is an amplification method in which the signal light and light of pump light are introduced into a rare-earth doped fiber, a stimulated emission is caused, and the signal light is amplified. In the present invention, the optical amplification is used. The amplification factor is changed according to various conditions.

Abstract: A method of manufacturing a particle-based image display having a plurality of imaging cells is disclosed. The method includes filling the plurality of imaging cells with a plurality of first particles, identifying a defect associated with one or more of the imaging cells, and repairing the defect within a unit corresponding to part of the plurality of imaging cells.

Abstract: A method of inspecting defects of a sample on a movable table includes a first step for, on a basis of position information of the defects which is previously detected by an other inspection system, driving the table so that the defects come into a viewing field of an optical microscope having a focus which is adjusted, a second step for re-detecting the defects to obtain a first detection result, a third step for correcting the position information of defects on a basis of position information of the re-detected defects, and a fourth step for reviewing the defects whose position information is corrected to obtain a second detection result. At the second step, re-detecting is performed using reflection light or scattered light from the sample which passes an optical filter which includes a light shielding portion and a light transmitting portion.

Abstract: An invention being applied is a defect detecting apparatus that has: an illuminating optical system with a laser light source for irradiating a sample on whose surface a pattern is formed with light; a detecting optical system with a sensor for detecting light generated from the sample illuminated by the illuminating optical system; and a signal processing unit that extracts a defect from an image based on the light detected by the detecting optical system, in which an amplification rate of the sensor is dynamically changed during a time when the light is detected by the detecting optical system.

Abstract: A defect recognition procedure in prepreg materials (1) draws a first transversal cross line (4b) at the beginning boundary (3b) of a defective area (2) in a prepreg material (1). A second transversal cross line (4e) at the end boundary (3e) of a defective area (2) is drawn as well. The cross lines (4b, 4e) form an angle (?) with respect to the prepreg material (1) motion direction (5). Each transversal cross line (4b, 4e) delimiting the beginning and the end of a defective area (2) has identification codes (Bi, Ei).

Abstract: A method for characterizing a surface comprises rotating a carrier about an axis of rotation where the carrier has a top surface adapted to hold at least one semiconductor wafer with a major surface of the wafer extending generally transverse to the axis of rotation. A surface characterization tool is moved over a plurality of positions relative to the top surface of the carrier, where a measurement location over the top surface of the carrier is changed while said top surface of the carrier is heated to a predetermined temperature. Characterization signals over the plurality of positions with the surface characterization tool are produced and contain information about the heated top surface of the carrier, or when semiconductor wafers are held on the carrier, information about the semiconductor wafer can also be obtained.

Abstract: A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The optical collection and detection system features, in the front quartersphere, a light channel assembly for collecting light reflected from the surface of the workpiece, and a front collector and wing collectors for collecting light scattered from the surface, to greatly improve the measurement capabilities of the system. The light channel assembly has a switchable edge exclusion mask and a reflected light detection system for improved detection of the reflected light.

Abstract: A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The optical collection and detection system features, in the front quartersphere, a light channel assembly for collecting light reflected from the surface of the workpiece, and a front collector and wing collectors for collecting light scattered from the surface, to greatly improve the measurement capabilities of the system. The light channel assembly has a switchable edge exclusion mask and a reflected light detection system for improved detection of the reflected light.

Abstract: A surface inspection device includes an image generator for generating a digital image achieved by imaging an inner surface of a bore which is subjected to a boring work, a line extraction processor for extracting a line along a horizontal direction set to a line extraction direction from the digital image, for determining the state of the inner surface of the bore based on the line extracted by the line extraction processor. The line extraction processor extracts lines along the line detection direction from respective digital images before and after rotation which are achieved by rotating the digital image once or over plural times every predetermined angle while the line extraction direction is fixed, and the estimating unit determines the state of the inner surface of the bore based on the lines extracted from the respective digital images before and after the rotation.

Abstract: Embodiments of mechanisms of an optical inspection system for inspecting an object are provided. The optical inspection system includes a light source emitting a coherent beam having a first width, and a beam expander increasing the first width to a second width. The optical inspection system also includes an polaroid module adjacent to the beam expander and polarizing the coherent beam. The object generates an inspection beam with an interference pattern by reflecting the polarized coherent beam. The optical inspection system further includes an image module capturing the inspection beam.

Abstract: A blade inspection apparatus inspects a plurality of blades periodically disposed on a periphery of a rotating shaft of a rotor of an engine and rotated on the rotating shaft. The blade inspection apparatus has a borescope having an insertion portion in which an observation optical system is provided, fixtures attached to one of a plurality of external access ports provided on the engine and fixing the borescope, and dedicated for each of the external access ports, and an identification information output portion for outputting identification information for identifying the external access port to which the fixtures are attached.

Abstract: A surface inspection device for a cylindrical body includes an illumination light source disposed above the cylindrical body, a beam splitter disposed above the cylindrical body so as to correspond to the illumination light source, and a surface condition recognition device disposed above the beam splitter. Illumination light emitted from the illumination light source is reflected by the beam splitter and applied coaxially to the surface of the cylindrical body, and the reflected light reflected by the surface of the cylindrical body transmits through the beam splitter to be recognized by the surface condition recognition device. The device is configured such that the illumination light from the illumination light source is applied from one end side of the cylindrical body in the axial direction toward, the other end side so as to be in parallel to the axial direction.

Abstract: Provided is a method wherein a multi-anode detector is used for the purpose of detecting scattered light from a wafer, data obtained from the detector (multi-anode) for detecting defects is used, the shape of a beam radiated to the wafer, a rotational shift between the radius direction and the beam long side, and the like are calculated, and the optical axis of the irradiation beam is adjusted. Furthermore, the method is provided with a technique which feeds back the correction quantities for rotation and amplitude to inspection signal data, on the basis of the correction data, and corrects inspection data. Since fine correction with the adjustment of an optics system and signal processing is made possible, positional accuracy of defect inspection and accuracy of defect level (defect size) are improved.

Abstract: A measuring device (40) for measuring an illumination property of an illumination system (12), which is configured for two-dimensional irradiation of a substrate (24) arranged in an illumination plane (21) with illumination radiation (20). Two differing measurement beam paths (52, 54) are formed in the measuring device, each arranged to guide the illumination radiation emitted by the illumination system onto a spatially resolving intensity detector (42) of the measuring device. A first (52) of the measurement beam paths is arranged to measure an intensity distribution in the illumination plane and the second (54) of the measurement beam paths is arranged to measure an intensity distribution in a pupil of the illumination system. The measuring device also includes an imaging optical unit (44) arranged in the first measurement beam path (52) such that the illumination radiation guided in the first measurement beam path passes through the imaging optical unit.

Abstract: A system having a beam for providing movement of a first stage and a second stage in a Y axis. The first stage receives a first substrate. A first motor provides movement for the first stage in an X axis. The second stage receives a second substrate. A second motor provides movement for the second stage in the X axis. The first stage and the second stage move together in the Y axis and independently in the X axis. A robot loads substrates onto the first stage and the second stage. A controller directs the robot to load a second substrate onto the second stage while simultaneously directing the first stage and the guide beam to scan a first substrate.

Abstract: A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect.

Abstract: A test glass changer for optically measuring layer properties in a vacuum coating system including a movable substrate holder for guiding a substrate through a stream of coating material; a mount connected to a rotary spindle and rotatable relative to the substrate holder about the rotary spindle; and a control device directing a test glass element into a ray path of an optical measuring device and into a stream of the coating material. The mount has at least two recesses offset eccentrically with respect to the spindle for one test glass element in each case. The control device can induce a rotational movement of the mount about the spindle. The centering device can exert a torque and holding moment on the mount to bring a test glass element arranged in one of the recesses into a measuring position of the measuring device. Related methods are also provided.

Abstract: A surface roughness value and a sub-surface scattering property of a material are estimated. The material is illuminated with a light beam with controlled coherence properties at multiple incident angles. Multiple speckle patterns are recorded, each speckle pattern being recorded for a respective one of the multiple incident angles. Both of a surface roughness value and a sub-surface scattering property of the material are estimated by calculations using the multiple speckle patterns and the incident angle for each such speckle pattern.

Abstract: A compact and versatile multi-spot inspection imaging system employs an objective for focusing an array of radiation beams to a surface and a second reflective or refractive objective having a large numerical aperture for collecting scattered radiation from the array of illuminated spots. The scattered radiation from each illuminated spot is focused to a corresponding optical fiber channel so that information about a scattering may be conveyed to a corresponding detector in a remote detector array for processing. For patterned surface inspection, a cross-shaped filter is rotated along with the surface to reduce the effects of diffraction by Manhattan geometry. A spatial filter in the shape of an annular aperture may also be employed to reduce scattering from patterns such as arrays on the surface. In another embodiment, different portions of the same objective may be used for focusing the illumination beams onto the surface and for collecting the scattered radiation from the illuminated spots simultaneously.

Abstract: A method includes forming a two-dimensional interrogating beam on a selected sample region of a surface; collecting light transmitted through or reflected from the sample region with an array of lenses to form a sample array of focus spots; imaging the sample array of focus spots through an imaging lens on a sensor; and comparing an image of the sample array of focus spots to a reference array of focus spots to determine a level of non-uniformity in the sample region.

Abstract: When the intensity of scattering light from a defect on a sample becomes very low according to the diameter of the defect, the dark noise from a sensor device itself accounts which a large proportion of the detected signal outputted from the sensor and thus it is difficult to detect minute defects. Furthermore, since a laser light source is pulsed into oscillation, pulse components from the laser light source are superimposed on the detected signal outputted from the sensor, and therefore it is difficult to detect defects with high accuracy.

Abstract: A fiber optic inspection microscope including an objective lens, an optical detector, an image detector, an illumination source, and first and second beamsplitters, wherein the first beamsplitter is in a first optical path between the objective lens, the image detector and the optical detector, wherein the first beamsplitter allows passage of an optical image to the image detector, wherein the first beamsplitter directs optical energy to the optical detector, wherein the second beamsplitter is in a second optical path between the illumination source and the objective lens, and wherein the second beamsplitter directs light from the illumination source to the objective lens.

Abstract: Provided herein is an apparatus, including a photon emitting means for emitting photons onto surface edges of an article, a photon detecting means for detecting photons scattered from particles on the surface edges of the article, and a mapping means for mapping a particle or a defect of the surface of the article.

Abstract: Provided herein is an apparatus, including a mapping means for generating a map of locations of surface features of an article based on photon-detector signals corresponding to photons scattered from the surface features of the article, and a surface feature manager. The surface manager is configured to locate a predetermined surface feature of the surface features of the article based, at least in part, on the map of the surface features locations, irradiate photons of a first power onto the location of the predetermined surface feature to analyze the predetermined surface feature, and irradiate photons of a second power onto the location of the predetermined surface feature to remove the predetermined surface feature.

Abstract: Provided herein are apparatuses and methods related thereto, wherein at least one apparatus includes: a photon emitting means configured to emit photons, wherein the photons are scattered from magnetic features of an article; a photon detector array configured to receive scattered photons; and a processing means configured to differentiate the magnetic features from the scattered photons.

Abstract: This invention implements reduction in the amount of background-scattered light from a semiconductor wafer surface and highly sensitive inspection, without increasing the number of detectors. A surface inspection apparatus that detects defects on the surface of an object (semiconductor wafer surface) to be inspected, by irradiating the surface of the object with a beam of light such as laser light and detecting the light reflected or scattered from the surface; wherein a widely apertured lens with an optical Fourier transform function is disposed between the object to be inspected and a detector, a filter variable in position as well in aperture diameter is provided on a Fourier transform plane, and background-scattered light from the semiconductor wafer surface is effectively blocked, whereby only a signal from a defect such as a foreign substance is detected.

Abstract: Provided are methods and apparatus for determining the crystal fraction of a casted-mono silicon wafer. A light source is directed at the wafer and the transmission or reflection is measured by a detector. An image of the wafer is generated by a processor and the crystal fraction is calculated from the generated image. The crystal fraction is correlated to the efficiency of the solar cell produced, allowing for the rejection of inferior wafers prior to processing.

Abstract: Provided are a sintered ceramic and a ceramic sphere which are inhibited from suffering surface peeling due to fatigue resulting from repetitions of loading and can attain an improvement in dimensional accuracy when subjected to surface processing and which have excellent wear resistance and durability. A ceramic-sphere inspection device is also provided with which a ceramic sphere is inspected for a flaw present in the surface layer and for snow flakes without destroying the ceramic sphere. The device is a ceramic-sphere inspection device (100) in which a ceramic sphere (S) is rotatably supported in a given position and illuminating light emitted from a light projector (110) is detected with a light receiver (120) to evaluate the state of the inner part of the surface layer, and has been configured so that the light receiver (120) does not detect the light emitted from the light projector (110) and reflected at the surface of the ceramic sphere.

Abstract: Disclosed are methods and apparatus for performing inspection or metrology of a semiconductor device. The apparatus includes a plurality of laser diode arrays that are configurable to provide an incident beam having different wavelength ranges. The apparatus also includes optics for directing the incident beam towards the sample, a detector for generating an output signal or image based on an output beam emanating from the sample in response to the incident beam, and optics for directing the output beam towards the detector. The apparatus further includes a controller for configuring the laser diode arrays to provide the incident beam at the different wavelength ranges and detecting defects or characterizing a feature of the sample based on the output signal or image.

Abstract: An inspection system for coated paper includes a traveling web of paper, a coating device for forming bands on the web by applying a coating liquid in the width direction of the web such that the bands are spaced from each other in the longitudinal direction of the web at regular intervals, a drying device for drying the web having the bands, a detection unit which is arranged downstream of the coating device for detecting at least either defect in the bands or defect in the web that is caused due to application of the coating liquid. A control device is inputted with the detection result from the detection unit and includes a determination section for determining the type of defect from the detection result. A quality control unit is inputted with the determination result from the determination section and configured to manage the determination result.

Abstract: Systems and methods for inspecting a wafer are provided. One system includes an illumination subsystem configured to illuminate the wafer; a collection subsystem configured to collect light scattered from the wafer and to preserve the polarization of the scattered light; an optical element configured to separate the scattered light collected in different segments of the collection numerical aperture of the collection subsystem, where the optical element is positioned at a Fourier plane or a conjugate of the Fourier plane of the collection subsystem; a polarizing element configured to separate the scattered light in one of the different segments into different portions of the scattered light based on polarization; and a detector configured to detect one of the different portions of the scattered light and to generate output responsive to the detected light, which is used to detect defects on the wafer.

Abstract: Detection of periodically repeating nanovoids is indicative of levels of substrate contamination and may aid in reduction of contaminants on substrates. Systems and methods for detecting nanovoids, in addition to, systems and methods for cleaning and/or maintaining cleanliness of substrates are described.

Abstract: Illumination subsystems for multi-spot wafer inspection are provided. One illumination subsystem includes a diffractive optical element configured to separate an illumination light beam into multiple light beams and a refractive lens array positioned in the path of the multiple light beams. The refractive lens array is configured to relay the laser beam waist at the diffractive optical element onto a wafer surface and to separately and simultaneously focus each of the multiple light beams to a wafer for inspection.

Abstract: A method of measuring damage of an organic layer of a thin film encapsulation includes: preparing a thin film encapsulation structure in which an inorganic layer is stacked on an organic layer, in which a light-emitting material is mixed; irradiating light to the thin film encapsulation structure so that light is emitted from the light-emitting material, the intensity of light emitted from the light emitting material decreasing over time; detecting a light emission lifetime of the light emitted from the light emitting material; and determining a degree of damage to the organic layer based on the light emission lifetime. Accordingly, a degree of the damage to the organic layer due to plasma may be easily detected, and the damage to the organic layer may be minimized based on the detected degree of the damage by improving plasma process conditions for an operation of forming an inorganic layer.

Abstract: An optical probe system for probing an electronic device includes a sample plate that can hold a target device comprising an integrated circuit, an optical objective system that can collect reflected or emitted light from the integrated circuit in the target device, and a temperature control chamber that can hold a fluid to control the temperature of the target device.

Abstract: A disk surface inspection method for detecting a circle scratch defect, separately from sporadically existing scratch defects. In the method, the sample is irradiated with light, regular reflection light reflected from the sample is detected, scattered light in the vicinity of the regular reflection light is detected separately from the regular reflection light, scattered light, scattered in a high angle direction greater than the direction of the regular reflection light is detected, and the defects on the surface of the sample are detected by processing a regular reflection light detection signal, a low-angle scattered light detection signal and a high-angle scattered light detection signal to extract defect candidates, and regarding the extracted defect candidates, a circumferential defect is extracted based on the ratio of defect candidates in a circumferential direction within a predetermined width in a radial direction from the center of the sample.

Abstract: The passivation of a nonlinear optical crystal for use in an inspection tool includes growing a nonlinear optical crystal in the presence of at least one of fluorine, a fluoride ion and a fluoride-containing compound, mechanically preparing the nonlinear optical crystal, performing an annealing process on the nonlinear optical crystal and exposing the nonlinear optical crystal to a hydrogen-containing or deuterium-containing passivating gas.

Abstract: An illumination apparatus comprising, a light source that emits a laser beam, a lens array on which the laser beam is illuminated, a plurality of element lenses having a diameter greater than or equal to the laser beam are arranged in the lens array, the lens array being rotatable around an optical axis of the laser beam, wherein the two lens arrays are arrayed in an optical axis direction of the laser beam, and the element lenses in each lens array are arranged such that a boundary between the element lenses adjacent to each other radiates from a rotation center of the lens array and a direction in which the element lens of one of the lens arrays traverses the optical axis of the laser beam is orthogonal to a direction in which the element lens of the other lens array traverses the optical axis of the laser beam.

Abstract: A surface defect inspection apparatus includes a light source that emits light to a first position on a surface of a target at an angle inclined with respect to the surface of the target, a first photodetector that detects first reflected light of the light from the light source, the first reflected light being reflected at the first position, a second photodetector that detects second reflected light of the light from the light source, the second reflected light being reflected at a second position, the second position being closer to the light source than the first position and being separated from the surface of the target by a given distance, and a determining unit that determines whether or not foreign matter is present on the surface of the target on a basis of detection results obtained from the first photodetector and the second photodetector.

Abstract: According to one embodiment, an inspection apparatus includes a first monochromatic body disposed behind an inspection target including a transparent member or a semitransparent member, relative to an observation position which deviates from a normal direction of the inspection target, a light source configured to illuminate the inspection target and disposed at such a position in front of the inspection target that an image of the light source is not reflected on the inspection target which is observed at the observation position, and a second monochromatic body disposed at such a position in front of the inspection target that an image of the second monochromatic body is reflected on the inspection target which is observed at the observation position.

Abstract: Disclosed is a visual inspection apparatus for a glass substrate of a liquid crystal display, comprising an inspection platform and at least two slide rails. The glass substrate for inspection is fixedly located on an inspection platform main body. The slide rails are installed at two adjacent sides of the main body leastwise. Length directions of the slide rails are parallel with a level of the main body. The lengths of the two adjacent slide rails are mutually perpendicular; the visual inspection apparatus further comprises a coordinate reader. The coordinate reader is slidably jointed to the slide rails and employed to cross above the level of the main body to form a locating point. An inspector reads a coordinate of the locating point to acquire a corresponding coordinate of the glass substrate. The present invention also provides an inspection method for a glass substrate of a liquid crystal display.

Abstract: A method of bright spot defect detection for a polarizer is to be performed by an inspection device and includes the steps of: a) obtaining gray values for pixels of an image of a detected region, that contains a target spot, on the polarizer; b) obtaining a gray value variation score from the gray values obtained for the detected region, the gray value variation score being indicative of gray value variation among the pixels of the image of the detected region; and c) comparing the gray value variation score obtained for the detected region with a threshold value to obtain a comparison result, and determining whether the target spot is a bright spot according to the comparison result.

Abstract: A beam deflection device including an aluminum disc containing a plurality of lasers, each laser projecting a laser beam substantially along one of the ‘X’, ‘Y’, and ‘Z’ axes of a structural beam to which the device is attached. Wiring is attached to each of the plurality of lasers to provide power and transmit data. Passageways are provided in the solid disc to route the wiring to the exterior. A suction cup on a surface of the device allows it to be attached to the beam by pressing the device against a flat surface area of the beam.

Abstract: A device for testing the quality of microstructurization of a surface (2) having a known target microstructurization quality, comprising a radiation source (1) for coherent radiation, a first detector (10) and a second detector (4) and a masking system, all of which are set up and arranged with respect to one another so that radiation emitted by the radiation source (1) onto the surface (2) produces a diffraction pattern, wherein the diffraction maximum of order n of the diffraction pattern without the masking system would impinge on the first detector (10), the masking system prevents 80% of the photons that are assigned to the diffraction maximum of order n from impinging on the first detector and the diffraction maximum of order a of the diffraction pattern impinges on the second detector (4), wherein n is selected from the group consisting of 1, 2, 3, 4, 5, 6, 7, 8, 9 and 10 and a is selected from the group consisting of 1, 2, 3, 4, 5, 6, 7, 8, 9 and 10 and a?n.

Abstract: The invention relates to a device for inspecting contact-sensitive planar materials or workpieces, e.g. wafers for the semiconductor industry, solar cells, glasses, FPD substrates, or biologically active substrates for biosensors, as well as materials having contact-sensitive curved surfaces. Said inspection device comprises a support element (1) for supporting a material (3) on the top face of the support element (1), at least one oscillator which is connected to the support element (1) and the oscillation frequency and amplitude of which are selected in such a way as to keep the material (3) hovering on the support element (1), and at least one optical sensor (4). The support element is made of a light-permeable material, and the optical sensor (4) is arranged below the support element (1).

Abstract: A method and a sensor for detecting a target gas by laser spectroscopy using a laser or a laser diode having a monochrome emission wavelength that can be modulated by varying the operating temperature or the operating current. The wavelength range of the target gas comprises a first modulation of the laser or the laser diode over a first large modulation width, in addition to at least two absorption lines of a reference gas and at least one absorption line of the target gas. The absorption lines are used to calibrate the wavelength scale of the laser or the laser diode in relation to the varied operating temperature or operating current, a second modulation of the laser or the laser diode being performed over a second small modulation width, with the at least one absorption line of the target gas, for detecting the target gas.

Abstract: Provided are novel methods and systems for setting up ranges of optical inspection parameters. These ranges may be later used for inspection of photovoltaic cells for discoloration, for example. A set of values corresponding to an inspection parameter, such as hue, saturation, and intensity, is obtained from a set-up image. The image includes multiple set-up areas, e.g., a defined group of pixels, wherein each set-up area is assigned a corresponding value in the set. A test image is then constructed from multiple test areas that are also associated with the values in the set. Each test area is assigned a color from a set of user defined colors based on the corresponding value and user defined ranges. A user interface includes both a range diagram and test image, which are used to adjust the ranges in the diagram that result in modification of the test image. Adjusting is repeated until the test image meets predetermined criteria.