Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.

Abstract: A mirror block on which moving gratings are arranged is fixed to the lower surface of a stage. Fixed gratings are placed on the upper surface of a stage platform that is opposed to the lower surface of the stage. A Y encoder that measures Y positional information of the stage is configured including the moving gratings and the fixed gratings. Similarly, an X encoder that measures X positional information of the stage is configured including the moving gratings and the fixed grating.

Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.

Abstract: A method for detecting the optimum viewing distance of three-dimensional display is provided, which includes: providing a three-dimensional display having a display screen to display at least a testing pattern thereon; providing a platform with an included angle towards the display screen at a side of the three-dimensional display, wherein the testing pattern on the display screen is suitable to be projected onto the platform; providing an image sensing element over the platform to capture the testing pattern projected on the platform for producing an image frame. The image frame includes at least a first color area and at least a second color area. The first color area partially overlaps the second color area. The non-overlapping areas of the first color area and the second color area are defined as an optimum viewing distance.

Abstract: An overlay measurement apparatus includes a stage on which a wafer comprising first and second overlay measurement keys, which are separated from each other, is placed. A nonlinear medium receives a reference beam and first and second diffracted beams respectively generated by the first and second overlay measurement keys. A detector detects a synthesized beam emitted from the nonlinear medium.

Abstract: A light source device includes: a light source section adapted to emit a light beam; a first optical element provided with a first entrance surface to which the light beam emitted from the light source section is input, and adapted to transmit the light beam; and a second optical element provided with a second entrance surface to which the light beam transmitted through the first optical element is input, and adapted to transmit the light beam, wherein the first entrance surface is tilted towards a direction rotated around a primary axis with respect to a principal ray of the light beam input to the first entrance surface, and the second entrance surface is tilted towards a direction rotated around a secondary axis substantially perpendicular to the primary axis with respect to the principal ray of the light beam input to the second entrance surface.

Abstract: A method of measuring a property of a substrate includes generating a patterned mask configured to cause a radiation beam passing through the mask to acquire the pattern, simulating radiating the substrate with a patterned radiation beam that has been patterned using the mask to obtain a simulated pattern, determining at least one location of the simulated pattern that is prone to patterning errors, and irradiating the substrate with the patterned radiation beam using a lithographic process. The method also includes measuring an accuracy of at least one property of the at least one location of the pattern on the substrate that has been determined as being prone to patterning errors, and adjusting the lithographic process according to the measuring.

Abstract: A method for correcting a position error of a lithography apparatus comprises inputting position data of exposure pattern, irradiating laser light onto a position reference mask from a position measurement laser system, calculating actual position data of the laser light irradiated onto the position reference mask, and comparing the position data of the exposure pattern with the actual position data of the laser light irradiated onto the position reference mask. With this method, circuit patterns can be accurately formed at predetermined positions on a photomask, and the circuit patterns on the photomask can be accurately formed at predetermined positions on a wafer.

Abstract: A method and apparatus for bitstream modulation of an infrared light source used by an optical sensor in a stereoscopic projection system, combined with a bitstream filter on the receiver electronics.

Abstract: A control system controls a support structure of a lithographic apparatus. A first measurement system measures the position of a substrate supported by the support structure, in a first coordinate system. A second measurement system measures the position of the support structure in a second coordinate system, the first measurement system having a presumed position in the second coordinate system. A controller controls the position of the support structure based on measurements by the second measurement system, to convert the measured position of the substrate into a converted position of the support structure in the second coordinate system, to position the support structure based on the converted position, to receive a position error signal indicative of a difference between the presumed position and an actual position of the first measurement system in the second coordinate system, and to position the support structure dependent upon the position error signal.

Abstract: An example embodiment relates to an alignment device including an optical aligner system including a plurality of aligners configured to measure a position of a workpiece having a plurality of alignment marks, and an optical member. The optical member is configured to diverge alignment beams reflected from neighboring alignment marks of the plurality of alignment marks and transmit the beams to neighboring aligners of the plurality of aligners respectively if a distance between the neighboring aligners is greater than a distance between the neighboring alignment marks.

Abstract: An exemplary alignment apparatus can align a first layer with a second layer. The first layer has a first alignment pattern. The second layer has a second alignment pattern. The alignment apparatus includes a supporting device for supporting the first layer and the second layer, a light pervious reference plate, and a viewing and adjusting mechanism. The light pervious reference plate has a first reference pattern spatially corresponding to the first alignment pattern on the first layer, and a second reference pattern spatially corresponding to the second alignment pattern on the second layer. The viewing and adjusting mechanism is adapted for assisting a human operator to align the first reference pattern with the first alignment pattern and the second reference pattern with the second alignment pattern.

Abstract: An exposure method capable of performing accurate exposure without using a large photomask. The exposure method performs exposure while relatively moving a photomask above a substrate and includes a step of performing position correction of the photomask by performing, on a front side of the photomask relatively moved in a moving direction, image recognition of a pattern prearranged on the substrate such as a line and a black matrix and by correcting deviation of the photomask with respect to the pattern, and a step of checking the position correction of the photomask by performing image recognition of a reference mark arranged on the photomask and by determining whether or not the position correction of the photomask is accurately performed in the step of performing the position correction of the photomask.

Abstract: A method for making a sample for evaluation of laser irradiation position and evaluating the sample, and an apparatus which is switchable between a first mode of modification of semiconductor and a second mode of making and evaluating the sample. Specifically, a sample is made by irradiating a semiconductor substrate for evaluation with a pulse laser beam while the semiconductor substrate is moved for evaluation at an evaluation speed higher than a modifying treatment speed, each relative positional information between pulse-irradiated regions in the sample is extracted, and stability of the each relative positional information between pulse-irradiated regions is evaluated. The evaluation speed is such a speed that separates the pulse-irradiated regions on the sample from each other in a moving direction.

Abstract: Methods of positioning an optical unit in an optical package are provided. According to one method, a partially assembled optical package is provided. The wavelength conversion device within the package comprises a conversion layer having a waveguide portion formed therein. The optical unit is coarse-positioned in the optical package to direct light from the laser diode to the wavelength conversion device in the form of a beam spot on an input face of the wavelength conversion device. The intensity of the frequency-converted optical signal output from the wavelength conversion device is monitored as the position of the optical unit is modified to 1D scan the beam spot along a portion of a crossing axis Y1 that crosses a planar projection of the conversion layer of the wavelength conversion device. Subsequently, the crossing axis Y1 is offset and the intensity monitoring step is repeated as the beam spot is 1D scanned along an offset crossing axis Y2.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: An apparatus for aligning semiconductor wafers includes equipment for positioning a first surface of a first semiconductor wafer directly opposite to a first surface of a second semiconductor wafer and equipment for aligning a first structure on the first semiconductor wafer with a second structure on the first surface of the second semiconductor wafer. The aligning equipment comprises at least one movable alignment device configured to be moved during alignment and to be inserted between the first surface of the first semiconductor wafer and the first surface of the second semiconductor wafer. The positioning equipment are vibrationally and mechanically isolated from the alignment device motion.

Abstract: A controller measures positional information of a stage within an XY plane using three encoders which at least include one each of an X encoder and a Y encoder of an encoder system, and the stage is driven in the XY plane, based on measurement results of the positional information and positional information (p1, q1), (p2, q2), and (p3, q3) in a surface parallel to the XY plane of a head (an encoder) used for measurement of the positional information. Accordingly, it becomes possible to control the movement of the stage with good precision, while switching the head (the encoder) used for control during the movement of the stage using the encoder system which includes a plurality of heads.

Abstract: Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.

Abstract: A method for alignment of a substrate, in which the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark, scanning the spot of the illumination beam along a second scan path across the mark, the second scan path being parallel to the first scan path, wherein the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure.

Abstract: A process for optically aligning a laser rangefinder that includes the steps of providing a laser rangefinder having a laser source, a photodetector lens and a photodetector, providing a fiber optic travel path, aligning the laser source to the fiber optic travel path, illuminating the photodetector with a light source, focusing the photodetector lens, coupling the fiber optic travel path to an optical light source, and aligning the fiber optic light relative to the photodetector.

Abstract: An extreme ultraviolet light system includes a steering system that steers and focuses an amplified light beam traveling along a propagation direction to a focal plane near a target location within an extreme ultraviolet light chamber, a detection system including at least one detector positioned to detect an image of a laser beam reflected from at least a portion of a target material within the chamber, a wavefront modification system in the path of the reflected laser beam and between the target location and the detection system, and a controller. The wavefront modification system is configured to modify the wavefront of the reflected laser beam as a function of a target focal plane position along the propagation direction. The controller includes logic for adjusting a location of the focal plane of the amplified light beam relative to the target material based on the detected image of the reflected laser beam.

Abstract: A lithographic apparatus, includes a support structure configured to hold a patterning device, the patterning device configured to impart a beam of radiation with a pattern in its cross-section; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam onto a target portion of the substrate; a liquid supply system configured to provide liquid to a space between the projection system and the substrate table; a sensor configured to measure an exposure parameter using a measuring beam projected through the liquid; and a correction system configured to determine an offset based on a change of a physical property impacting a measurement made using the measuring beam to at least partly correct the measured exposure parameter.

Abstract: A line of sight adjustment device (LSAD) employs a simple yet robust structure and method to adjust the line of sight (or boresight) of a telescope, clip-on night sight, night vision sight, day scope, or other optical sighting device. In one embodiment, the LSAD includes a single optical element adjusted to change the apparent viewing angle to a target viewed through the device without degrading the optical quality of the image.

Abstract: An alignment tool for use in calibrating an optical bench and/or alignment of an optical system such as a collector optical system for EUV and X-ray applications is disclosed. The optical system includes multiple nested mirrors attached to a mechanical support.

Abstract: A laser alignment system for a drill press includes first and second adjustable laser assemblies mountable on the drill press. Each adjustable laser assembly includes a base firmly affixed to the drill press, a rotatable element mounted on the base and being adapted to selectively rotate relative to the base, a pivotable element mounted on the rotatable element and being adapted to selectively pivot relative to the rotatable element, and a laser mounted on the pivotable element and being adapted to move simultaneously with the pivotable element. The laser alignment system includes a pivot adjusting mechanism coupled with the pivotable element for selectively pivoting the pivotable element relative to the rotatable element, and a rotation adjusting mechanism coupled with the rotatable element for selectively rotating the rotatable element relative to the base.

Abstract: An alignment device is provided for aligning a primary mirror with a secondary mirror in an optical system having the primary mirror and the secondary mirror arranged so as to face each other along the optical axis. The alignment device has a dichroic film formed on a surface on the front side of the secondary mirror and configured to reflect light used in the optical system and to transmit alignment light, a back reflecting surface formed on the back side of the secondary mirror and configured to reflect the alignment light, and a detection system which detects a positional deviation between the primary mirror and the secondary mirror, based on the alignment light having traveled via the dichroic film, the back reflecting surface, and a reflecting surface of the primary mirror.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail and containing a printhead carriage housing at least one printhead therein, a first camera assembly configured to capture image data of the printhead and provide the image data to a computer, and a computer receiving the image data from the first camera assembly and configured to determine a deviation between a desired position of the printhead and an actual position of the printhead.

Abstract: A method and system comprising a Master station, a processor and one or more targets that allows a user of said system to automatically generate a 3 dimensional graphical representation of a construction site and also overlay a drawing onto the graphical representation to guide the user within a virtual space being displayed by the processor.

Abstract: The present invention provides an adjustment method for a position detection apparatus which comprises an optical system including first and second optical members whose positions can be changed, and detects a position of an object, comprising the steps of calculating a value representing an asymmetry of a detection signal of a light which enters a photoelectric conversion device via the optical system, for each of a plurality of positions of the first optical member in a direction perpendicular to an optical axis of the optical system, specifying a position of the object in the direction of the optical axis, at which the value is insensitive, for each of the plurality of positions, and adjusting a position of the second optical member in the direction perpendicular to the optical axis based on the value at the position of the object specified in the specifying step.

Abstract: A position finding system and method may be used to find an alignment position of a laser device relative to an optical fiber such as an angled optical fiber. The laser device may be positioned “off-axis” relative to the optical fiber such that light from the laser device is directed at an angle to an end of the optical fiber and coupled into the optical fiber. The position finding system and method may be used to find the alignment position by searching for relative high power positions at different angular orientations of the laser device and calculating coordinates of at least one alignment position from the coordinates of the relative high power positions. The relative high power positions may be positions at which the measured power coupled into the optical fiber by the laser is maximized.

Abstract: A method for making a sample for evaluation of laser irradiation position and evaluating the sample, and an apparatus which is switchable between a first mode of modification of semiconductor and a second mode of making and evaluating the sample. Specifically, a sample is made by irradiating a semiconductor substrate for evaluation with a pulse laser beam while the semiconductor substrate is moved for evaluation at an evaluation speed higher than a modifying treatment speed, each relative positional information between pulse-irradiated regions in the sample is extracted, and stability of the each relative positional information between pulse-irradiated regions is evaluated. The evaluation speed is such a speed that separates the pulse-irradiated regions on the sample from each other in a moving direction.

Abstract: A method for aligning a semiconductor laser to a wavelength conversion device in a wavelength converted light source includes positioning a beam spot of the semiconductor laser on an input facet of the wavelength conversion device. The beam spot is stepped in a scanning direction by a succession of steps. A wavelength control signal of the semiconductor laser is swept over an alignment signal range at the end point of individual steps of the succession of steps. The peak output power of a wavelength converted output beam emitted from the wavelength conversion device during the sweep is determined at the end point of individual steps of the succession of steps. The peak output power is compared to a threshold output power to determine if the beam spot is aligned with the waveguide of the wavelength conversion device.

Abstract: A detection method and apparatus is provided. The detection apparatus includes at least two angular mounted lasers, a surface for receiving laser lines emitted by the angular mounted lasers, a camera for detecting a laser pattern formed by the laser lines on the surface, and a processor for analyzing the laser pattern. The lasers emit orthogonal laser lines on a surface of the device. The camera detects a laser pattern on the surface of the device and the processor analyzes the laser pattern to determine whether the position of the device is in pocket based on the analysis and position algorithms.

Abstract: Systems and methods are provides for measuring and correcting for a given telecentricity in a lithographic apparatus. A radiation beam is partitioned into a plurality of beams, each of which is modulated using an array of individually controllable elements and projected onto a portion of a substrate through a projection system. A set of alignment beams is transmitted simultaneously on paths similar to those traversed by the plurality of radiation beams, and a corresponding set of sensors respectively measures an angle and a position of the set of alignment beams proximate to an entrance of the projection system. An assembly of telecentricity control mirrors (TCM) adjusts appropriate ones of the plurality of radiation beams in response to the measurement to correct for any detected telecentricity errors.

Abstract: To inspect all portions of the substrate the substrate table can be moved rotationally and linearly. Furthermore the detector can be moved rotationally. This enables all portions of a surface of the substrate to be inspected from all angles in a plane parallel to the substrate. Less linear motion is needed, so the apparatus occupies a smaller volume and generates smaller vibrations.

Abstract: To inspect all portions of the substrate, the substrate table can be moved rotationally and linearly. Furthermore, the detector can be moved rotationally. This allows all portions of a surface of the substrate to be inspected from all angles in a plane parallel to the substrate. In one example, as less linear motion is needed, the apparatus occupies a smaller volume and generates smaller vibrations.

Abstract: A photosensitive chip, including: at least one set of photosensors substantially aligned in a Y direction; and a layer of non-transmissive material including a plurality of openings. Each opening in the plurality of openings includes a respective center line and overlaps only a portion of a respective photosensor so that only the portion of the respective photosensor is photosensitive. The respective center lines for openings for each set of photosensors are not collinear in the Y direction. In an example embodiment, the plurality of openings includes at least one row of openings substantially aligned in an X direction, orthogonal to the Y direction. In an example embodiment, each opening has an equal width in an X direction, orthogonal to the Y direction.

Abstract: A system which automatically reduces change in effective angle and plane of incidence of a reflected focused beam of electromagnetic radiation entering a detector, via use of a detector with dimensions less than is the spatial spread of a reflected focused beam at a location distal to the location on said sample from which it is caused to reflect, preferably after passing through a collimating lens. The basis of operation is that the portion of a reflected focused beam intercepted by the detector changes with change in sample position and/or orientation.

Abstract: An alignment device with one or two optoelectronic transmitting and/or receiving units and an evaluation unit. At least one optoelectronic transmitting and/or receiving unit contains an inclinometer. Furthermore, the transmitting and/or receiving unit is connected to a vibration sensor which can be the inclinometer. Both the result of the alignment process and also the result of the vibration measurement are communicated to the user as an easily understandable characteristic on a display of the evaluation unit. For vibration measurement at a non-rotating part of a machine, an accelerometer/inclinometer sensor may be used for measuring acceleration forces resulting from machine vibrations to be measured and for measuring gravity and an electronic evaluation unit determining the orientation of the sensor with regard to gravity from a stationary component of the sensor output and determining sensor orientation from evaluation of non-stationary components of sensor output.

Abstract: A sample investigation system (ES) in functional combination with an alignment system (AS), and methodology of enabling calibration and very fast, (eg. seconds), sample height, angle-of-incidence and plane-of-incidence adjustments, with application in mapping ellipsometer or the like systems.

Abstract: The X, Y and Rz positions of a mask stage are measured using two optical encoder-reading heads measuring displacements of respective grid gratings mounted on the mask stage. The grid gratings are preferably provided on cut-away portions of the mask table so as to be coplanar with the pattern on the mask itself. Measurements of the table position in the other degrees of freedom can be measured with capacitive or optical height sensors.

Abstract: A Pre-Aligned Metrology System comprising a number of Pre-Aligned Metrology Assemblies and Pre-Aligned Metrology Modules for measuring a target on a wafer. The Pre-Aligned Metrology Assemblies and Pre-Aligned Metrology Modules can reduce the maintenance down time and decrease the cost of ownership (COO).

Abstract: A method and apparatus for a pipe alignment tool have been described. A laser is inserted into the end of a pipe and projects a laser beam indicative of the longitudinal axis of the pipe.

Abstract: An imprint lithography apparatus is disclosed, the apparatus including a substrate table arranged to support a substrate having a first surface to be imprinted and a second surface, facing the substrate table, comprising a substrate alignment mark, a template holder arranged to hold a template to imprint the first surface of the substrate, and an alignment system arranged to align the template to a substrate alignment mark provided on the substrate, wherein the substrate table further comprises a substrate table optical system to allow the substrate alignment mark to be viewed by the alignment system.

Abstract: The present teachings provide for systems, and components thereof, for detecting and/or analyzing light. These systems can include, among others, optical reference standards utilizing luminophores, such as nanocrystals, for calibrating, validating, and/or monitoring light-detection systems, before, during, and/or after sample analysis.

Abstract: An alignment system for optical lithography uses cameras fixed to a movable stage and to a lithography unit to view unique microscopic non-uniformities that are inherent to the surface of a work piece, e.g., metal or ceramic microcrystalline grains, for position referencing. Stage cameras image two sites on the work piece through windows in the stage to establish original position templates. After the work piece has been repositioned, e.g., reversed topside-down, the same two sites are again viewed and template matching establishes the transformed coordinates of the work piece, e.g. by a lithography unit camera under which the stage moves to approximate site locations. Two corner cameras can serve as a coarse positioning mechanism. The alignment system is particular useful for backside alignment in printed circuit board lithography.

Abstract: Disclosed is a method and apparatus which are arranged to detect magnitude of correlation between (i) an explanatory variable corresponding to operation data related to an operation made by an exposure apparatus for exposing a substrate, and (ii) a response variable corresponding to inspection data related to a result of inspection made to the substrate after the same is exposed, the magnitude of correlation between the explanatory variable and the response variable being detected with respect to each of different combinations of operation data pieces, and also arranged to specify, on the basis of detected correlation magnitudes and with respect to one of the different combinations of operation data pieces, a category of the operation data and the correlation between the explanatory variable and the response variable.

Abstract: A process for optically aligning a laser rangefinder that includes the steps of providing a laser rangefinder having a laser source, a photodetector lens and a photodetector, providing a fiber optic travel path, aligning the laser source to the fiber optic travel path, illuminating the photodetector with a light source, focusing the photodetector lens, coupling the fiber optic travel path to an optical light source, and aligning the fiber optic light relative to the photodetector.

Abstract: A method of aligning a die when the die is held with a circuit pattern on a first side of the die facing away from an infrared light source, wherein infrared light from the infrared light source is projected onto a second side of the die opposite to the first side such that the infrared light passes through a body of the die. From the second side of the die, an image of the infrared light reflected from the circuit pattern is detected and captured. Thereafter, an alignment of the die from the captured image of the die is determined.