Abstract: A method of measuring focus of a lithographic projection apparatus includes exposure of a photoresist covered test substrate with a plurality of verification fields. Each of the verification fields includes a plurality of verification markers, and the verification fields are exposed using a predetermined focus offset FO. After developing, an alignment offset for each of the verification markers is measured and translated into defocus data using a transposed focal curve. The method according to an embodiment of the invention may result in a focus-versus alignment shift sensitivity up to 50 times higher (typically dX,Y/dZ=20) than conventional approaches.

Abstract: A table saw includes a workpiece support surface and a laser apparatus. The workpiece support surface defines a blade opening through which a cutting blade is configured to extend. The laser apparatus is configured to emit a laser light away from the workpiece support surface.

Abstract: An alignment system for optical lithography uses cameras fixed to a movable stage and to a lithography unit to view unique microscopic non-uniformities that are inherent to the surface of a work piece, e.g., metal or ceramic microcrystalline grains, for position referencing. Stage cameras image two sites on the work piece through windows in the stage to establish original position templates. After the work piece has been repositioned, e.g., reversed topside-down, the same two sites are again viewed and template matching establishes the transformed coordinates of the work piece, e.g. by a lithography unit camera under which the stage moves to approximate site locations. Two corner cameras can serve as a coarse positioning mechanism. The alignment system is particular useful for backside alignment in printed circuit board lithography.

Abstract: The invention relates to alignment of an interferometer module for use in an exposure tool. An alignment method is provided for aligning an interferometer to the tool while outside of the too. Furthermore, the invention provides a dual interferometer module, an alignment frame use in the alignment method, and an exposure tool provided with first mounting surfaces for cooperative engagement with second mounting surfaces of an interferometer module.

Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).

Abstract: Disclosed is a system for aligning a collimator tube with an alignment ring used to hold a film or sensor aligned with the collimator tube. The disclosed alignment system includes a light source, a light detector, and a reflective surface, where, when the collimator and alignment ring are aligned, light emitted from the light source reflects off the reflective surface and is received by the light detector.

Abstract: In an embodiment, a stage system calibration method includes moving the stage relative to an encoder grid in response to a setpoint signal and measuring a position of the stage by a sensor head cooperating with the encoder grid. The position of the stage is controlled by a stage controller. A signal representative of a difference between the setpoint signal and the position of the stage as measured by the sensor head is registered. The stage system is calibrated from the registered signal representative of the difference.

Abstract: A method of determining the location of a lithographic substrate relative to an imprint template is disclosed.

Abstract: Provided is a transport method comprising judging whether there is a possibility that misalignment greater than or equal to a threshold value occurs between substrates to be layered that are held by a pair of substrate holders aligned and stacked by an aligning section, the misalignment occurring when the pair of substrate holders is transported from the aligning section to a pressure applying section; and if the judgment indicates that there is the possibility of misalignment, transporting the pair of substrate holders to a region other than the pressure applying section. Whether there is the possibility of misalignment may be judged based on acceleration of the substrate holders. Whether there is the possibility of misalignment may be judged based on acceleration of a transporting section that transports the substrate holders. Whether there is the possibility of misalignment may be judged based on relative positions of the substrate holders.

Abstract: A substrate stage for an immersion type lithographic apparatus is arranged to project a patterned radiation beam from a patterning device onto a substrate, the substrate stage being constructed to hold the substrate and including at least a sensor for sensing the patterned radiation beam, the sensor including an at least partially transmissive layer having a front side facing the incoming radiation beam and a back side opposite the front side, wherein the back side is provided with at least a sensor mark to be subjected to the radiation beam transmitted through the layer.

Abstract: A semiconductor wafer may include a dummy field configured to enable overlay measurements. The enhanced dummy field may include a plurality of encoding blocs that enable OVL measurements to be made throughout the enhanced dummy field.

Abstract: An alignment method for controlling a mirror (100) makes it possible to orient an optical compensation digital hologram (3) relative to a mirror control tool. The control tool is designed to light up, one by one, confined portions (S10) of a reflecting surface (S100) of the mirror, and the entire surface is controlled while moving a lighting and image capture assembly (20), between a series of views, over the mirror. The control tool can then be of small size, even when the mirror has a very low curvature and a large size.

Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.

Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.

Abstract: A mirror block on which moving gratings are arranged is fixed to the lower surface of a stage. Fixed gratings are placed on the upper surface of a stage platform that is opposed to the lower surface of the stage. A Y encoder that measures Y positional information of the stage is configured including the moving gratings and the fixed gratings. Similarly, an X encoder that measures X positional information of the stage is configured including the moving gratings and the fixed grating.

Abstract: A method for detecting the optimum viewing distance of three-dimensional display is provided, which includes: providing a three-dimensional display having a display screen to display at least a testing pattern thereon; providing a platform with an included angle towards the display screen at a side of the three-dimensional display, wherein the testing pattern on the display screen is suitable to be projected onto the platform; providing an image sensing element over the platform to capture the testing pattern projected on the platform for producing an image frame. The image frame includes at least a first color area and at least a second color area. The first color area partially overlaps the second color area. The non-overlapping areas of the first color area and the second color area are defined as an optimum viewing distance.

Abstract: An overlay measurement apparatus includes a stage on which a wafer comprising first and second overlay measurement keys, which are separated from each other, is placed. A nonlinear medium receives a reference beam and first and second diffracted beams respectively generated by the first and second overlay measurement keys. A detector detects a synthesized beam emitted from the nonlinear medium.

Abstract: A light source device includes: a light source section adapted to emit a light beam; a first optical element provided with a first entrance surface to which the light beam emitted from the light source section is input, and adapted to transmit the light beam; and a second optical element provided with a second entrance surface to which the light beam transmitted through the first optical element is input, and adapted to transmit the light beam, wherein the first entrance surface is tilted towards a direction rotated around a primary axis with respect to a principal ray of the light beam input to the first entrance surface, and the second entrance surface is tilted towards a direction rotated around a secondary axis substantially perpendicular to the primary axis with respect to the principal ray of the light beam input to the second entrance surface.

Abstract: A method of measuring a property of a substrate includes generating a patterned mask configured to cause a radiation beam passing through the mask to acquire the pattern, simulating radiating the substrate with a patterned radiation beam that has been patterned using the mask to obtain a simulated pattern, determining at least one location of the simulated pattern that is prone to patterning errors, and irradiating the substrate with the patterned radiation beam using a lithographic process. The method also includes measuring an accuracy of at least one property of the at least one location of the pattern on the substrate that has been determined as being prone to patterning errors, and adjusting the lithographic process according to the measuring.

Abstract: A method for correcting a position error of a lithography apparatus comprises inputting position data of exposure pattern, irradiating laser light onto a position reference mask from a position measurement laser system, calculating actual position data of the laser light irradiated onto the position reference mask, and comparing the position data of the exposure pattern with the actual position data of the laser light irradiated onto the position reference mask. With this method, circuit patterns can be accurately formed at predetermined positions on a photomask, and the circuit patterns on the photomask can be accurately formed at predetermined positions on a wafer.

Abstract: A method and apparatus for bitstream modulation of an infrared light source used by an optical sensor in a stereoscopic projection system, combined with a bitstream filter on the receiver electronics.

Abstract: A control system controls a support structure of a lithographic apparatus. A first measurement system measures the position of a substrate supported by the support structure, in a first coordinate system. A second measurement system measures the position of the support structure in a second coordinate system, the first measurement system having a presumed position in the second coordinate system. A controller controls the position of the support structure based on measurements by the second measurement system, to convert the measured position of the substrate into a converted position of the support structure in the second coordinate system, to position the support structure based on the converted position, to receive a position error signal indicative of a difference between the presumed position and an actual position of the first measurement system in the second coordinate system, and to position the support structure dependent upon the position error signal.

Abstract: An example embodiment relates to an alignment device including an optical aligner system including a plurality of aligners configured to measure a position of a workpiece having a plurality of alignment marks, and an optical member. The optical member is configured to diverge alignment beams reflected from neighboring alignment marks of the plurality of alignment marks and transmit the beams to neighboring aligners of the plurality of aligners respectively if a distance between the neighboring aligners is greater than a distance between the neighboring alignment marks.

Abstract: An exemplary alignment apparatus can align a first layer with a second layer. The first layer has a first alignment pattern. The second layer has a second alignment pattern. The alignment apparatus includes a supporting device for supporting the first layer and the second layer, a light pervious reference plate, and a viewing and adjusting mechanism. The light pervious reference plate has a first reference pattern spatially corresponding to the first alignment pattern on the first layer, and a second reference pattern spatially corresponding to the second alignment pattern on the second layer. The viewing and adjusting mechanism is adapted for assisting a human operator to align the first reference pattern with the first alignment pattern and the second reference pattern with the second alignment pattern.

Abstract: An exposure method capable of performing accurate exposure without using a large photomask. The exposure method performs exposure while relatively moving a photomask above a substrate and includes a step of performing position correction of the photomask by performing, on a front side of the photomask relatively moved in a moving direction, image recognition of a pattern prearranged on the substrate such as a line and a black matrix and by correcting deviation of the photomask with respect to the pattern, and a step of checking the position correction of the photomask by performing image recognition of a reference mark arranged on the photomask and by determining whether or not the position correction of the photomask is accurately performed in the step of performing the position correction of the photomask.

Abstract: A method for making a sample for evaluation of laser irradiation position and evaluating the sample, and an apparatus which is switchable between a first mode of modification of semiconductor and a second mode of making and evaluating the sample. Specifically, a sample is made by irradiating a semiconductor substrate for evaluation with a pulse laser beam while the semiconductor substrate is moved for evaluation at an evaluation speed higher than a modifying treatment speed, each relative positional information between pulse-irradiated regions in the sample is extracted, and stability of the each relative positional information between pulse-irradiated regions is evaluated. The evaluation speed is such a speed that separates the pulse-irradiated regions on the sample from each other in a moving direction.

Abstract: An alignment system for a lithographic apparatus has a source of alignment radiation; a detection system that has a first detector channel and a second detector channel; and a position determining unit in communication with the detection system. The position determining unit is constructed to process information from said first and second detector channels in a combination to determine a position of an alignment mark on a work piece, the combination taking into account a manufacturing process of the work piece. A lithographic apparatus has the above mentioned alignment system. Methods of alignment and manufacturing devices with a lithographic apparatus use the above alignment system and lithographic apparatus, respectively.

Abstract: An apparatus for aligning semiconductor wafers includes equipment for positioning a first surface of a first semiconductor wafer directly opposite to a first surface of a second semiconductor wafer and equipment for aligning a first structure on the first semiconductor wafer with a second structure on the first surface of the second semiconductor wafer. The aligning equipment comprises at least one movable alignment device configured to be moved during alignment and to be inserted between the first surface of the first semiconductor wafer and the first surface of the second semiconductor wafer. The positioning equipment are vibrationally and mechanically isolated from the alignment device motion.

Abstract: Methods of positioning an optical unit in an optical package are provided. According to one method, a partially assembled optical package is provided. The wavelength conversion device within the package comprises a conversion layer having a waveguide portion formed therein. The optical unit is coarse-positioned in the optical package to direct light from the laser diode to the wavelength conversion device in the form of a beam spot on an input face of the wavelength conversion device. The intensity of the frequency-converted optical signal output from the wavelength conversion device is monitored as the position of the optical unit is modified to 1D scan the beam spot along a portion of a crossing axis Y1 that crosses a planar projection of the conversion layer of the wavelength conversion device. Subsequently, the crossing axis Y1 is offset and the intensity monitoring step is repeated as the beam spot is 1D scanned along an offset crossing axis Y2.

Abstract: Even in case that a wafer is so greatly deviated that a peripheral portion of the wafer cannot be detected, position determination of the wafer can be performed without inflicting a damage on the wafer. The wafer peripheral portion, which is a target, is detected based on output images from a plurality of imaging units disposed along a peripheral portion shape of the wafer (step S210), and a wafer position deviation correcting step (step S220) or a rough correcting step (step 230) is performed according to the number of the imaging units capable of detecting the wafer peripheral portion. In case that the wafer peripheral portion cannot be detected by all the imaging units, a wafer position adjusting step (step 240) for moving the wafer is performed in a position adjusting direction acquired by a combination of the output images by each imaging unit.

Abstract: A controller measures positional information of a stage within an XY plane using three encoders which at least include one each of an X encoder and a Y encoder of an encoder system, and the stage is driven in the XY plane, based on measurement results of the positional information and positional information (p1, q1), (p2, q2), and (p3, q3) in a surface parallel to the XY plane of a head (an encoder) used for measurement of the positional information. Accordingly, it becomes possible to control the movement of the stage with good precision, while switching the head (the encoder) used for control during the movement of the stage using the encoder system which includes a plurality of heads.

Abstract: A method for alignment of a substrate, in which the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark, scanning the spot of the illumination beam along a second scan path across the mark, the second scan path being parallel to the first scan path, wherein the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure.

Abstract: A process for optically aligning a laser rangefinder that includes the steps of providing a laser rangefinder having a laser source, a photodetector lens and a photodetector, providing a fiber optic travel path, aligning the laser source to the fiber optic travel path, illuminating the photodetector with a light source, focusing the photodetector lens, coupling the fiber optic travel path to an optical light source, and aligning the fiber optic light relative to the photodetector.

Abstract: An extreme ultraviolet light system includes a steering system that steers and focuses an amplified light beam traveling along a propagation direction to a focal plane near a target location within an extreme ultraviolet light chamber, a detection system including at least one detector positioned to detect an image of a laser beam reflected from at least a portion of a target material within the chamber, a wavefront modification system in the path of the reflected laser beam and between the target location and the detection system, and a controller. The wavefront modification system is configured to modify the wavefront of the reflected laser beam as a function of a target focal plane position along the propagation direction. The controller includes logic for adjusting a location of the focal plane of the amplified light beam relative to the target material based on the detected image of the reflected laser beam.

Abstract: A lithographic apparatus, includes a support structure configured to hold a patterning device, the patterning device configured to impart a beam of radiation with a pattern in its cross-section; a substrate table configured to hold a substrate; a projection system configured to project the patterned beam onto a target portion of the substrate; a liquid supply system configured to provide liquid to a space between the projection system and the substrate table; a sensor configured to measure an exposure parameter using a measuring beam projected through the liquid; and a correction system configured to determine an offset based on a change of a physical property impacting a measurement made using the measuring beam to at least partly correct the measured exposure parameter.

Abstract: An alignment tool for use in calibrating an optical bench and/or alignment of an optical system such as a collector optical system for EUV and X-ray applications is disclosed. The optical system includes multiple nested mirrors attached to a mechanical support.

Abstract: A line of sight adjustment device (LSAD) employs a simple yet robust structure and method to adjust the line of sight (or boresight) of a telescope, clip-on night sight, night vision sight, day scope, or other optical sighting device. In one embodiment, the LSAD includes a single optical element adjusted to change the apparent viewing angle to a target viewed through the device without degrading the optical quality of the image.

Abstract: A laser alignment system for a drill press includes first and second adjustable laser assemblies mountable on the drill press. Each adjustable laser assembly includes a base firmly affixed to the drill press, a rotatable element mounted on the base and being adapted to selectively rotate relative to the base, a pivotable element mounted on the rotatable element and being adapted to selectively pivot relative to the rotatable element, and a laser mounted on the pivotable element and being adapted to move simultaneously with the pivotable element. The laser alignment system includes a pivot adjusting mechanism coupled with the pivotable element for selectively pivoting the pivotable element relative to the rotatable element, and a rotation adjusting mechanism coupled with the rotatable element for selectively rotating the rotatable element relative to the base.

Abstract: An alignment device is provided for aligning a primary mirror with a secondary mirror in an optical system having the primary mirror and the secondary mirror arranged so as to face each other along the optical axis. The alignment device has a dichroic film formed on a surface on the front side of the secondary mirror and configured to reflect light used in the optical system and to transmit alignment light, a back reflecting surface formed on the back side of the secondary mirror and configured to reflect the alignment light, and a detection system which detects a positional deviation between the primary mirror and the secondary mirror, based on the alignment light having traveled via the dichroic film, the back reflecting surface, and a reflecting surface of the primary mirror.

Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail and containing a printhead carriage housing at least one printhead therein, a first camera assembly configured to capture image data of the printhead and provide the image data to a computer, and a computer receiving the image data from the first camera assembly and configured to determine a deviation between a desired position of the printhead and an actual position of the printhead.

Abstract: A method and system comprising a Master station, a processor and one or more targets that allows a user of said system to automatically generate a 3 dimensional graphical representation of a construction site and also overlay a drawing onto the graphical representation to guide the user within a virtual space being displayed by the processor.

Abstract: The present invention provides an adjustment method for a position detection apparatus which comprises an optical system including first and second optical members whose positions can be changed, and detects a position of an object, comprising the steps of calculating a value representing an asymmetry of a detection signal of a light which enters a photoelectric conversion device via the optical system, for each of a plurality of positions of the first optical member in a direction perpendicular to an optical axis of the optical system, specifying a position of the object in the direction of the optical axis, at which the value is insensitive, for each of the plurality of positions, and adjusting a position of the second optical member in the direction perpendicular to the optical axis based on the value at the position of the object specified in the specifying step.

Abstract: A method for making a sample for evaluation of laser irradiation position and evaluating the sample, and an apparatus which is switchable between a first mode of modification of semiconductor and a second mode of making and evaluating the sample. Specifically, a sample is made by irradiating a semiconductor substrate for evaluation with a pulse laser beam while the semiconductor substrate is moved for evaluation at an evaluation speed higher than a modifying treatment speed, each relative positional information between pulse-irradiated regions in the sample is extracted, and stability of the each relative positional information between pulse-irradiated regions is evaluated. The evaluation speed is such a speed that separates the pulse-irradiated regions on the sample from each other in a moving direction.

Abstract: A position finding system and method may be used to find an alignment position of a laser device relative to an optical fiber such as an angled optical fiber. The laser device may be positioned “off-axis” relative to the optical fiber such that light from the laser device is directed at an angle to an end of the optical fiber and coupled into the optical fiber. The position finding system and method may be used to find the alignment position by searching for relative high power positions at different angular orientations of the laser device and calculating coordinates of at least one alignment position from the coordinates of the relative high power positions. The relative high power positions may be positions at which the measured power coupled into the optical fiber by the laser is maximized.

Abstract: A method for aligning a semiconductor laser to a wavelength conversion device in a wavelength converted light source includes positioning a beam spot of the semiconductor laser on an input facet of the wavelength conversion device. The beam spot is stepped in a scanning direction by a succession of steps. A wavelength control signal of the semiconductor laser is swept over an alignment signal range at the end point of individual steps of the succession of steps. The peak output power of a wavelength converted output beam emitted from the wavelength conversion device during the sweep is determined at the end point of individual steps of the succession of steps. The peak output power is compared to a threshold output power to determine if the beam spot is aligned with the waveguide of the wavelength conversion device.

Abstract: A detection method and apparatus is provided. The detection apparatus includes at least two angular mounted lasers, a surface for receiving laser lines emitted by the angular mounted lasers, a camera for detecting a laser pattern formed by the laser lines on the surface, and a processor for analyzing the laser pattern. The lasers emit orthogonal laser lines on a surface of the device. The camera detects a laser pattern on the surface of the device and the processor analyzes the laser pattern to determine whether the position of the device is in pocket based on the analysis and position algorithms.

Abstract: To inspect all portions of the substrate, the substrate table can be moved rotationally and linearly. Furthermore, the detector can be moved rotationally. This allows all portions of a surface of the substrate to be inspected from all angles in a plane parallel to the substrate. In one example, as less linear motion is needed, the apparatus occupies a smaller volume and generates smaller vibrations.

Abstract: Systems and methods are provides for measuring and correcting for a given telecentricity in a lithographic apparatus. A radiation beam is partitioned into a plurality of beams, each of which is modulated using an array of individually controllable elements and projected onto a portion of a substrate through a projection system. A set of alignment beams is transmitted simultaneously on paths similar to those traversed by the plurality of radiation beams, and a corresponding set of sensors respectively measures an angle and a position of the set of alignment beams proximate to an entrance of the projection system. An assembly of telecentricity control mirrors (TCM) adjusts appropriate ones of the plurality of radiation beams in response to the measurement to correct for any detected telecentricity errors.

Abstract: To inspect all portions of the substrate the substrate table can be moved rotationally and linearly. Furthermore the detector can be moved rotationally. This enables all portions of a surface of the substrate to be inspected from all angles in a plane parallel to the substrate. Less linear motion is needed, so the apparatus occupies a smaller volume and generates smaller vibrations.

Abstract: A photosensitive chip, including: at least one set of photosensors substantially aligned in a Y direction; and a layer of non-transmissive material including a plurality of openings. Each opening in the plurality of openings includes a respective center line and overlaps only a portion of a respective photosensor so that only the portion of the respective photosensor is photosensitive. The respective center lines for openings for each set of photosensors are not collinear in the Y direction. In an example embodiment, the plurality of openings includes at least one row of openings substantially aligned in an X direction, orthogonal to the Y direction. In an example embodiment, each opening has an equal width in an X direction, orthogonal to the Y direction.