Abstract: A system, method and apparatus for converting writing on surface to digital signal for further processing. A specially designed object which is a very cost effective passive method, helps to identify true multiple passive writing instruments writing at the same time, and can works with most passive writing instruments including human finger, pen, stick, chopstick, laser pointer and any pen a-like objects as well as regular pens. Laser pointer light beam can be identified as a writing instrument and can function similarly as a mouse function or other functions. A reflection mirrors system makes the system flexible and adjustable to work with any existing writing area at any size and can be a true portable system. An additional light sub-system enhances the captured image at any ambient light condition. A laser sub-system helps for easier installation and setup.

Abstract: A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction mirror arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.

Abstract: A sample investigation system (ES) in functional combination with an alignment system (AS), and methodology of enabling very fast, (eg. seconds), sample height, angle-of-incidence and plane-of-incidence adjustments, with application in mapping ellipsometer or the like systems.

Abstract: A method, structure, system of aligning a substrate to a photomask. The method comprising: directing light through a clear region of the photomask in a photolithography tool, through a lens of the tool and onto a set of at least three diffraction mirror arrays on the substrate, each diffraction mirror array of the set of at least three diffraction minor arrays comprising a single row of mirrors, all mirrors in any particular diffraction mirror array spaced apart a same distance, mirrors in different diffraction mirror arrays spaced apart different distances; measuring an intensity of light diffracted from the set of at least three diffraction mirror arrays onto an array of photo detectors; and adjusting a temperature of the photomask or photomask and lens based on the measured intensity of light.

Abstract: A system and method for determining whether one or more slides are loaded properly within a cassette. Each slide includes one or more transparent regions and one or more non-transparent regions. The slides are between a light source and a sensor. The light source generates light that is directed towards the sensor through the slides. If the sensor is able to detect light from the light source, then the slides are properly loaded in the cassette. Slides are not properly loaded if the light is blocked by a non-transparent region before reaching the sensor. The sensor or a separate controller can generate a signal or data to provide an indication to a user or to processing equipment that the slides are or are not properly loaded. For example, a speaker or an indicator light can be used to provide an indication to the user. The signal or data can also be used for other functions, such as displaying a message on a screen indicating whether the slides are properly loaded.

Abstract: A method of semiconductor manufacturing including forming an overlay offset measurement target including a first feature on a first layer and a second feature on a second layer. The first feature and the second feature have a first predetermined overlay offset. The target is irradiated. The reflectivity of the irradiated target is determined. An overlay offset for the first layer and the second layer is calculated using the determined reflectivity.

Abstract: A wafer measurement/inspection instrument receives information on at least one of a processing result and an operating state of at least one of a coater/developer that performs film forming/resist processing to a wafer and an exposure apparatus that performs liquid immersion exposure to the wafer, and optimizes inspection conditions of the wafer based on the received information (steps 501 and 517). With this operation, quality inspection of the wafer can be efficiently performed, and as a consequence, it becomes possible to efficiently perform processing to the wafer.

Abstract: A detecting assembly for multi-axis machine tools having a spindle and a turntable and has a detector, a lens device and a computer. The detector is connected to the spindle and has a mounting frame and two detecting segments. The mounting frame is connected to the spindle and has a connecting rod, a bottom board and multiple mounting boards. The detecting segments are mounted on the mounting boards and each has a light source and a sensor. The lens device is mounted on the turntable, extends into the detector and has a supporting shaft and a spherical lens. The spherical lens is mounted on an upper end of the supporting shaft to align light emitted from the light sources with corresponding sensors via the spherical lens. The computer is electrically connected to the detector to receive signals of the detecting segments of the detector and has a signal processor.

Abstract: An alignment system for optical lithography uses cameras fixed to a movable stage and to a lithography unit to view unique microscopic non-uniformities that are inherent to the surface of a work piece, e.g., metal or ceramic microcrystalline grains, for position referencing. Stage cameras image two sites on the work piece through windows in the stage to establish original position templates. After the work piece has been repositioned, e.g., reversed topside-down, the same two sites are again viewed and template matching establishes the transformed coordinates of the work piece, e.g. by a lithography unit camera under which the stage moves to approximate site locations. Two corner cameras can serve as a coarse positioning mechanism. The alignment system is particular useful for backside alignment in printed circuit board lithography.

Abstract: The core adjusting process includes a procedure of searching for the position in which the photocurrent of the light-receiving element reaches its peak in each of the X-, Y-, and Z-directions. In the searching procedure, the light emitted from a multimode fiber of a MCP is gathered by a lens and is transmitted to the light-receiving element. A check is then made to determine whether, at in both directions of the search direction, there exist a first and second attenuation positions in which the photocurrent shows a predetermined attenuation relative to a peak value in a search range. If there exist the attenuation positions, a peak position is determined to be a position located within a second predetermined range from the middle point between the attenuation positions, and the relative positions of the receptacle and the CAN package are adjusted to the peak position.

Abstract: A system for achieving multi-axis angular alignment of devices includes a monolithic mount. The mount includes three sections arranged along a longitudinal axis. The first two sections are connected by two flexures that constrain the second section to rotate in relation to the first section in a first rotational degree of freedom. The second and third sections are connected by flexures that constrain the third section to rotate in relation to the second section in a second rotational degree of freedom. The first and second rotational degrees of freedom are different. Actuating screws contact bearing surfaces on the mount to actuate the rotations.

Abstract: A method of aligning a substrate includes forming a first alignment hole in the substrate, preparing a mask with a second alignment hole narrower than the first alignment hole, modifying a surface reflectance around either the first alignment hole or the second alignment hole to form a treatment region, positioning the mask below the substrate, such that the first and second alignment holes overlap, and operating a sensor unit above the first alignment hole to examine alignment of the first and second alignment holes.

Abstract: Different types of test structures are formed during semiconductor processing. One type of test structure comprises features that are aligned with one another and that are formed from different layers. Other types of test structures comprise features formed from respective layers that are not aligned with other test structure features. The different types of test structures are formed with a single mask that is used in a manner that also allows alignment marks to be formed which do not interfere with one another as subsequent layers are patterned. The different types of test structures can provide insight into performance characteristics of different types of devices as the semiconductor process proceeds.

Abstract: An apparatus for manufacturing carbon nanotubes includes an observation device, a work stage, a laser device, and a lighting device. The observation device includes an observation tube, an observation window arranged on the top of the observation tube, a first half-reflecting, pellicle mirror installed with an angle 45° in the observation tube, and a second half-reflecting, pellicle mirror installed parallel to the first half-reflecting, pellicle mirror. The work stage is disposed under and separated from the observation tube with a certain distance. The laser device is arranged perpendicular to the observation device and corresponding to the first half-reflecting, pellicle mirror. The lighting device is arranged perpendicular to the observation device and corresponding to the second half-reflecting, pellicle mirror. The observation device, the laser device and the lighting device are optically conjugated/linked with one another.

Abstract: The disclosure relates to a system and a method for light beam interrogation of an optical biosensor and for monitoring a biological event on the biosensor for use, for example, in microplate image analysis. The system and method correct pointing-errors that can be encountered, for example, in scanning label-independent-detection biosensor applications.

Abstract: Apparatus for processing substrates according to a predetermined photolithography process includes a loading station in which the substrates are loaded, a coating station in which the substrates are coated with a photoresist material, an exposing station in which the photoresist coating is exposed to light through a mask having a predetermined pattern to produce a latent image of the mask on the photoresist coating, a developing station in which the latent image is developed, an unloading station in which the substrates are unloaded and a monitoring station for monitoring the substrates with respect to predetermined parameters of said photolithography process before reaching the unloading station.

Abstract: An optical measurement apparatus comprises an optical system (100) having a receiving axis (115). The optical system (100) comprises a source (102) that generates a probe beam that is directed to a location to be measured (114). A detector (112) of the optical system receives a reflected beam from the location to be measured (114). The apparatus also comprises a processing resource that receives an output signal from the detector (112) and makes an assessment of a characteristic of the output signal in order to determine a degree of alignment of the location to be measured (114) with the receiving axis (115) of the optical system (100).

Abstract: A method for orienting a parallax barrier screen on a display screen with picture elements x(i,j) in a grid comprising rows i and columns j for the purpose of producing a display screen for three-dimensional representation. This method includes the steps of: temporary application of a positioning marker, observation of the positioning marker by means of a camera, relative orientation of the display screen, removal of the positioning marker, positioning of the parallax barrier screen in front of the picture area of the display screen display of a test picture, which comprises various views, where k=1, . . . , n and n=6 or n=7, on the picture elements x(i,j) with rows i and columns j, observation of the displayed test picture through the parallax barrier screen by the camera, orientation of the parallax barrier screen in front of the display screen.

Abstract: The invention relates to a method for orienting an optical element (e. g. a parallax barrier screen or lenticular screen) on a screen comprising pixels x(i, j) in a raster composed of lines (i) and columns (j) in order to produce a screen for three-dimensional representation. In said method, especially a test pattern is presented which consists of various views A(k), wherein k=n, and n>1. The test pattern comprises at least two first straight lines that are located in different horizontal positions in the n>1 views A(k) as well as at least two second straight lines which each extend parallel to one of the first straight lines and are located in at least the same horizontal positions in the n>1 views A(k). The method according to the invention can be carried out quickly and with high accuracy and is therefore suitable for industrial use to produce screens for three-dimensional representation.

Abstract: An imaging microoptics, which is compact and robust, includes at least one aspherical member and has a folded beam path. The imaging microoptics provides a magnification |??| of >800 by magnitude. Furthermore, a system for positioning a wafer with respect to a projection optics includes the imaging microoptics, an image sensor positionable in the image plane of the imaging microoptics, for measuring a position of an aerial image of the projection optics, and a wafer stage with an actuator and a controller for positioning the wafer in dependence of an output signal of the image sensor.

Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.

Abstract: A method and a system are provided for calibrating metrological tools used to measure features of a semiconductor device. A critical dimension (CD) ruler defines a known pitch plus a pitch offset. A photoresist layer is measured to determine a measured pitch whereupon the measured pitch is compared to the known pitch. From the comparison, appropriate calibration steps can be taken to reduce the difference between the known pitch and the measured pitch.

Abstract: A zero-order overlay target comprises a first zero-order line array fabricated on a first layer of a semiconductor structure, the first zero-order line array having a first pitch, and a second zero-order line array fabricated on a second layer of the semiconductor structure, the second zero-order line array having a second pitch. The second pitch may be different from the first pitch, and a portion of the second zero-order line array may be positioned to become optically coupled to a portion of the first zero-order line array when subject to an overlay measurement. Further, the second pitch may be variable. For example, the variable pitch may comprise a first set of features having a pitch approximately equal to the first pitch, a second set of features having a pitch different from the first pitch, and a third set of features having a pitch approximately equal to the first pitch.

Abstract: Methods and systems for evaluating and controlling a lithography process are provided. For example, a method for reducing within wafer variation of a critical metric of a lithography process may include measuring at least one property of a resist disposed upon a wafer during the lithography process. A critical metric of a lithography process may include, but may not be limited to, a critical dimension of a feature formed during the lithography process. The method may also include altering at least one parameter of a process module configured to perform a step of the lithography process to reduce within wafer variation of the critical metric. The parameter of the process module may be altered in response to at least the one measured property of the resist.

Abstract: A method and apparatus for estimating a position and an orientation of a mobile robot. The apparatus includes: a ceiling image grabber for obtaining a ceiling image of an area where the mobile device travels; a mark detector for detecting a retro-reflective artificial mark from the ceiling image, the retro-reflective artificial mark including a first mark and a second mark, each including a non-reflective portion and an infrared reflective portion; and a position & orientation estimator for estimating a position and an orientation of the mobile device using a position of the artificial mark or encoder information according to whether detection of the artificial mark is successful.

Abstract: An alignment device is provided for aligning a primary mirror with a secondary mirror in an optical system having the primary mirror and the secondary mirror arranged so as to face each other along the optical axis. The alignment device has a dichroic film formed on a surface on the front side of the secondary mirror and configured to reflect light used in the optical system and to transmit alignment light, a back reflecting surface formed on the back side of the secondary mirror and configured to reflect the alignment light, and a detection system which detects a positional deviation between the primary mirror and the secondary mirror, based on the alignment light having traveled via the dichroic film, the back reflecting surface, and a reflecting surface of the primary mirror.

Abstract: Methods and apparatuses are provided for positioning a substrate having a target that may be located on either the front-side or the backside of the substrate. The optical detector that views the target contains a signal-generating material that is substantially identical to the substrate material.

Abstract: Alignment parameters determination method with less overlay error after exposure without tremendous expending time and cost is provided. Provision is made of a fetching unit performing position measurement and statistical processing to obtain reference computation results. Another fetching unit obtains reference processing results by positioning and exposing shots at a predetermined exposure apparatus based on the reference computation results, then measuring overlay error for the shots. Another fetching unit changes at least parts of the predetermined alignment parameters and performs position measurement and statistical processing to obtain comparative computation results. A controller 650 calculates estimated overlay error when assuming positioning and exposure of shots at a predetermined exposure apparatus based on the comparative computation results using the reference computation results, comparative computation results, and reference processing results.

Abstract: A method, system and computer program product for determining an angle of incidence of a light beam illuminating a workpiece positioned on a stage are disclosed. A method for determining an angle of incidence of a light beam illuminating a workpiece positioned on a stage may include: positioning a calibration target on the stage with multiple different tilts; first determining an angle of incident of the light beam with respect to the calibration target with each tilt using a detector; mapping a response of the detector to a determined angle of incidence; and second determining the angle of incidence with respect to the workpiece based on a result of the mapping.

Abstract: A housing for a control device includes an enclosed cavity configured to secure an optical detection system, including a light source and a sensor, and a face of the enclosed cavity configured to include a window to allow light from the light source to scatter light off of a surface and configured to allow reception of the scattered light on the sensor. In this configuration the housing is structured to prevent exposure of the optical detection system to external elements such as the surface. Also disclosed is a homodyning system for use with a coherent light source optical pointing device.

Abstract: Provided are a method of fabricating a semiconductor device unconstrained by optical limit and an apparatus of fabricating the semiconductor device. The method includes: forming an etch target layer on a substrate; forming a hard mask layer on the etch target layer; forming first mask patterns on the hard mask layer; forming first spacers on sidewalls of the first mask patterns; forming hard mask patterns having an opening by using the first mask patterns and the first spacers as a mask to etch the hard mask layer; aligning second mask patterns on the hard mask patterns to fill the opening; forming second spacers on sidewalls of the second mask patterns; forming fine mask patterns by using the second mask patterns and the second spacers as a mask to etch the hard mask patterns; and forming fine patterns by using the fine mask patterns as a mask to etch the etch target layer.

Abstract: A system and method for prealigning a substrate. One embodiment provides a rotor configured to rotate a carrier around a rotation axis in response to a rotation signal. The carrier includes a main surface substantially perpendicular to the rotation axis. The substrate is disposable on the carrier. The substrate includes a main surface and a mark such that an orientation of the substrate with respect to the rotation axis is detectable. An electromagnetic radiation source is configured to illuminate the main surface of the substrate with electromagnetic radiation. An optical/electrical converter is responsive to the electromagnetic radiation reflected back from the main surface, detecting the mark of the substrate and providing a sensing signal. A controller is configured to receive the sensing signal and providing the rotation signal.

Abstract: Each target used in a method of measuring overlay using a scatterometer includes a first portion and a second portion, the first portion has features varying only in a first direction and the second portion has features only varying in a second direction. The first and second directions are orthogonal, thus eliminating cross talk between the directions, and improving the accuracy of overlay error calculations.

Abstract: The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges (37) for Z positioning of the optical component (35) as close as possible to the detector (21) and passive X and Y alignment means via holding wedges and/or holding balls (36), the X, Y and Z axes being axes perpendicular to each other.

Abstract: In repeated processes (steps 201 to 213) of lot processing, an analytical apparatus detects abnormality of overlay, that is, deterioration of overlay accuracy in step 211 and optimizes an apparatus parameter of an exposure apparatus so that the abnormality is solved (so that the overlay accuracy is improved), and then the optimization result is promptly reflected in the exposure apparatus and a measurement/inspection instrument. Since such optimization is performed without stopping the lot processing, the productivity of devices is not lowered.

Abstract: A compact multiple diameter wafer testing device with a footprint of about 33 by 34 inches features on-chuck wafer calibration and integrated cassette-chuck transfer. It includes a five axes wafer handling system, a quick exchange chuck and a fixed through beam sensor fixed. Two of the five axes are provided by an X-Y stage, a third axis is provided by a rotary stage on top of the X-Y stage, a fourth axis belongs to a rotating effector and a fifth axis is provided by motion controlled pin lifters all combined with the X-Y stage. The quick exchange chuck may be easily changed for different wafer diameters and also calibrated by the through beam sensor. The through beam sensor provides on-chuck position calibration of the chucked wafers in conjunction with the X-Y stage and rotary stage. The compact wafer testing device handles wafers between six and twelve inches diameter.

Abstract: Alignment of layers during manufacture of a multi-layer sample is controlled by applying optical measurements to a measurement site in the sample. The measurement site includes two diffractive structures located one above the other in two different layers, respectively. The optical measurements include at least two measurements with different polarization states of incident light, each measurement including illuminating the measurement site so as to illuminate one of the diffractive structures through the other. The diffraction properties of the measurement site are indicative of a lateral shift between the diffractive structures. The diffraction properties detected are analyzed for the different polarization states of the incident light to determine an existing lateral shift between the layers.

Abstract: An exposure apparatus may include: a stage configured to move a substrate; an optical unit configured to generate and project a plurality of laser beams; and a control unit configured to measure straightness of the stage by controlling the projection of the laser beams to an exposed surface of the substrate while moving the stage. A method to measure straightness of a stage in an exposure apparatus may include: placing a substrate on the stage; moving the stage and substrate; generating a plurality of laser beams; projecting the laser beams to the substrate on the stage; and measuring the straightness of the stage by projecting the laser beams to an exposed surface of the substrate.

Abstract: An alignment tool for use in calibrating an optical bench and/or alignment of an optical system such as a collector optical system for EUV and X-ray applications is disclosed. The optical system includes multiple nested mirrors attached to a mechanical support.

Abstract: A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.

Abstract: A method for correcting an exposure parameter of an immersion lithographic apparatus is provided. In the method, an exposure parameter is measured using a measuring beam projected through a liquid between the projection system and a substrate table of the immersion lithographic apparatus and offset is determined based on a change of a physical property impacting a measurement made using the measuring beam to at least partly correct the measured exposure parameter. Also, there is provided an apparatus and method to measure a height of an optical element connected to liquid between the projection system and the substrate table in the immersion lithographic apparatus.

Abstract: The present invention is directed to novel metrology marks and methods for their use. The marks comprise cross hashed overlay metrology marks formed on a substrate including a plurality of target regions. The mark including a first grating structure formed in one layer of a target region and including a second grating structure formed in another layer of the target region. The periodic features of the first and second grating structures are oriented substantially orthogonal one another to form a cross-hatched metrology target in the target region. Additionally, the patent discloses methods of employing the metrology marks to obtain overlay metrology measurements.

Abstract: The present invention discloses an overlay alignment measurement apparatus and method. The overlay target is periodic and is illuminated by coherent radiation; a Fourier transform lens optically computes the Fourier transform of the target. Analysis of the spatial frequencies at the Fourier plane yields overlay alignment information.

Abstract: A method and system to measure misalignment error between two overlying or interlaced periodic structures are proposed. The overlying or interlaced periodic structures are illuminated by incident radiation, and the diffracted radiation of the incident radiation by the overlying or interlaced periodic structures are detected to provide an output signal. The misalignment between the overlying or interlaced periodic structures may then be determined from the output signal.

Abstract: An optical apparatus includes a laser light source for emitting a beam of light, an integrator for dividing the beam of light into plural beams of light, and a light focusing optical system for focusing the beams of light passed through the integrator. The optical apparatus also includes a stage, on which the light concentrated by the light focusing optical system is irradiated and on which an object may be placed, and includes a projecting optical system for projecting the light transmitted through the object. The following conditions satisfy the following numerical formula (1). The projecting optical system has a visual field including an effective visual field, and the integrator has a division number N corresponding to a predetermined direction in a predetermined effective visual field. A ghost image is formed in the effective visual field in the predetermined direction and has contrast ?.

Abstract: A Pre-Aligned Metrology System comprising a number of Pre-Aligned Metrology Assemblies and Pre-Aligned Metrology Modules for measuring a target on a wafer. The Pre-Aligned Metrology Assemblies and Pre-Aligned Metrology Modules can reduce the maintenance down time and decrease the cost of ownership (COO).

Abstract: A semiconductor wafer may include a dummy field configured to enable overlay measurements. The enhanced dummy field may include a plurality of encoding blocs that enable OVL measurements to be made throughout the enhanced dummy field.

Abstract: A method for aligning a reticle is provided. A first patterned layer with a first alignment grid is formed. Sidewall layers are formed over the first patterned layer to perform a first shrink. The first alignment grid after shrink is etched into an etch layer to form an etched first alignment grid. The patterned layer is removed. An optical pattern of a second alignment grid aligned over the etched first alignment grid is measured. The optical pattern is used to determine whether the second alignment grid is aligned over the etched first alignment grid.

Abstract: A marker structure on a substrate for optical alignment of the substrate includes a plurality of first structural elements and a plurality of second structural elements. In use, the marker structure allows the optical alignment based upon providing at least one light beam directed on the marker structure, detecting light received from the marker structure at a sensor, and determining alignment information from the detected light, the alignment information comprising information relating a position of the substrate to the sensor.

Abstract: Embodiments are directed to laser emitter modules and methods and devices for making the modules. Some module embodiments are configured to provide hermetically sealed enclosures that are convenient and cost effective to assemble and provide for active alignment of optical elements of the module.