Pressure Patents (Class 361/283.1)
  • Patent number: 9524416
    Abstract: There is provided a fingerprint sensing device comprising: a sensing chip comprising an array of sensing elements, the sensing elements being configured to be connected to readout circuitry for detecting a capacitive coupling between each of the sensing elements and a finger placed on a sensing surface of the sensing device; a cover layer arranged vertically above the sensing elements to cover at least a portions of the sensing elements, wherein an outer surface of the cover layer form the sensing surface of the sensing device; wherein the cover layer comprises a three-dimensional pattern configured to reduce the amount of reflected light within a predetermined sub-range of the visible range. There is also provided a method for manufacturing a fingerprint sensing device.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: December 20, 2016
    Assignee: FINGERPRINT CARDS AB
    Inventor: Sonja Rommel
  • Patent number: 9408555
    Abstract: Apparatus and methods for a MEMS-fabricated variable capacitor. In one embodiment the capacitor is a comb drive comprising a plurality of plates interdigitated with a corresponding blades. As the plates move relative to the blades, the capacitance of the sensor changes. The capacitor is sufficiently sensitive to measure respiratory pressure in an animal.
    Type: Grant
    Filed: June 30, 2011
    Date of Patent: August 9, 2016
    Assignees: Indiana University Research and Technology Corporation, Purdue Research Foundation
    Inventors: A. George Akingba, Jason V. Clark
  • Patent number: 9330856
    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.
    Type: Grant
    Filed: December 23, 2010
    Date of Patent: May 3, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Russell T. Herrin, Jeffrey C. Maling, Anthony K. Stamper
  • Patent number: 9290369
    Abstract: Disclosed is a lifting column for lifting a load, such as a vehicle, which includes a frame with a movable carrier and a drive which acts on the carrier; control means for control of the drive; a carrying part attached to the carrier for carrying the load; weight measuring means attached to the carrying part for measuring the weight of the load; and communication means for communicating a measurement signal of the weight measuring means indicative of the weight of the load to the control means.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: March 22, 2016
    Assignee: Stertll B.V.
    Inventor: Jurjen Jan De Jong
  • Patent number: 9128114
    Abstract: The invention relates to a capacitive sensor device 100. The capacitive sensor device (100) comprises a substrate (401), a first electrode (101) coupled to the substrate (401, a second electrode (102) coupled to the substrate (401) and a movable element (103). The movable element (103) is capacitively coupled to the first electrode (101), the moveable element (103) and the first electrode (101) representing a first capacitor (104). The movable element (103) is capacitively coupled to the second electrode (102), the moveable element (103) and the second electrode (102) representing a second capacitor (105). The movable element (103) is movable between the first electrode (101) and the second electrode (102) in such a manner, that an electrical impedance between the first electrode (101) and the second electrode (102) is changeable due to a change of a position of the movable element (103). The movable element (103) is decoupled from the substrate (401), in particular to a signal line.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: September 8, 2015
    Assignee: NXP, B.V.
    Inventor: Geert Langereis
  • Patent number: 9112058
    Abstract: Input devices are provided. In accordance with an example embodiment, an input device includes an interface layer that flexes in response to pressure, a plurality of sense electrodes, a dielectric between the sense electrodes and the interface layer, and interconnecting circuitry. The dielectric compresses or expands in response to movement of the interface layer, and exhibits dielectric characteristics that vary based upon a state of compression of the dielectric. The interconnecting circuitry is coupled to the sense electrodes and provides an output indicative of both the position of each sense electrode and an electric characteristic at each sense electrode that provides an indication of pressure applied to the dielectric adjacent the respective sense electrodes.
    Type: Grant
    Filed: September 9, 2011
    Date of Patent: August 18, 2015
    Assignee: The Board of Trustees of the Leland Stanford Junior University
    Inventors: Zhenan Bao, Benjamin Chee-Keong Tee, Stefan Christian Bernhardt Mannsfeld, Justin P. Opatkiewicz
  • Patent number: 9097639
    Abstract: A resonant sensor assembly includes a dielectric substrate having a sensing region. The sensor assembly further comprises a plurality of tuning elements operatively coupled to the sensing region, where the sensing region is coupled to the plurality of tuning elements to define a plurality of resonant circuits.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: August 4, 2015
    Assignee: General Electric Company
    Inventors: Radislav Alexandrovich Potyrailo, Yongjae Lee, Victoria Eugenia Cotero, Jon Albert Dieringer
  • Patent number: 9077060
    Abstract: A modally driven oscillating element periodically contacts one of more electrical contacts, thereby acting as a switch, otherwise known as a resonant switch, or “resoswitch”, with very high Q's, typically above 10000 in air, and higher in vacuum. Due to periodic constrained contacting of the contacts, the bandwidth of the switch is greatly improved. One or more oscillating elements may be vibrationally interconnected with conductive or nonconductive coupling elements, whereby increased bandwidths of such an overall switching system may be achieved. Using the resoswitch, power amplifiers and converters more closely approaching ideal may be implemented. Integrated circuit fabrication techniques may construct the resoswitch with other integrated CMOS elements for highly compact switching devices. Through introduction of specific geometries within the oscillating elements, displacement gains may be made where modal deflections are greatly increased, thereby reducing device drive voltages to 2.5 V or lower.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: July 7, 2015
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Clark Tu-Cuong Nguyen, Yang Lin, Wei-Chang Li, Bongsang Kim
  • Patent number: 9013857
    Abstract: Embodiments of a method include forming a metal-insulator-metal (MIM) capacitor including a first electrode and a second electrode and an insulator layer between the first and second electrodes, the MIM capacitor also including a reactive layer; and altering the reactive layer to change a capacitive value of the MIM capacitor.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: April 21, 2015
    Assignee: International Business Machines Corporation
    Inventors: Daniel C. Edelstein, Anthony K. Stamper
  • Patent number: 8935961
    Abstract: A sensor assembly includes a rectangular-shaped pressure sensor element and an electronic circuitry coupled to receive a signal from the pressure sensor element. An open-ended fluid-tight passageway of the sensor assembly conveys fluid from a portal opening of the sensor assembly to a surface of the rectangular-shaped pressure sensor element. The sensor assembly further includes a closed-ended fluid-tight passageway, at least a portion of which is fabricated from metal. The closed-ended fluid tight passageway extends from at least from the portal opening of the sensor assembly to the electronic circuitry on at least a portion of a path adjacent to the rectangular-shaped ceramic pressure sensor element. The sensor assembly includes a temperature sensor element disposed in an end of the closed-ended fluid-tight passageway. Conductive links disposed in the closed-ended fluid tight passageway electrically couple the temperature sensor element to the electronic circuitry.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: January 20, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Nicholas G. Papadeas, Jeffrey Peter Silveria, Omar Rashid Ghani, Jared E. Girroir, Albert Ferdinand Zwijze, Paulus Thomas Johannes Gennissen, Edward Norberg
  • Patent number: 8704538
    Abstract: A sensor assembly includes a housing assembly, an electrode arrangement and a diaphragm having a fixed portion secured to the housing assembly and an active portion movable relative to the electrode arrangement in response to a differential pressure applied to opposite sides of the diaphragm. The fixed portion of the diaphragm is secured at one or more locations relative to at least a portion of the housing assembly; and at least one groove is formed in the fixed portion of the diaphragm between the locations at which the diaphragm is fixed relative to the housing assembly and the active portion so as to relieve any stress on the active portion of the diaphragm. A method of making the sensor assembly is also disclosed.
    Type: Grant
    Filed: July 1, 2010
    Date of Patent: April 22, 2014
    Assignee: MKS Instruments, Inc.
    Inventor: Chrisy Grudzien
  • Patent number: 8659868
    Abstract: Disclosed herein is a variable capacitor and its driving method, the variable capacitor including, a movable first electrode; and a second electrode formed with an insulating film, fixed in place, and its insulating film contacting the first electrode that is moved.
    Type: Grant
    Filed: May 27, 2011
    Date of Patent: February 25, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Chang Wook Kim, Dong Chan Park, Ju Young Song, Sang Hun Lee, Sung Bae Cho, Hyun Ho Yang, Jun Bo Yoon, Dong Hun Choi, Chang Hun Han
  • Patent number: 8638541
    Abstract: An input device includes a movable electrode and a capacitance detection electrode provided on the upper and lower sides of the resin film substrate, respectively. The movable electrode includes a moving section, and an immobile section. The moving section includes a protrusion. The end of the protrusion comes in contact with the upper side of the resin film substrate in an initial state, or is bonded to the upper side of the resin film substrate. The protrusion has a curved shape so that the side surface of the protrusion is depressed relative to a straight line that connects the end and the base of the protrusion having an approximately trapezoidal cross-sectional shape, or at least one step is formed on the side surface of the protrusion, and the width of the protrusion increases stepwise from the end to the base of the protrusion.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: January 28, 2014
    Assignee: Oga, Inc.
    Inventor: Masanori Mizushima
  • Patent number: 8511168
    Abstract: A capacitive differential pressure sensor is described which has a simple configuration, and which provides reliable measuring results even in corrosive measuring environments. The sensor element for capacitively measuring differential pressure includes a sensor diaphragm which is implemented in a layered configuration on a semiconductor substrate and spans a cavern. A pressure connection opens into the cavern. The sensor element also includes a measuring capacitor which has a movable electrode on the sensor diaphragm, and a stationary counter electrode which is situated on the base of the cavern, opposite from the movable electrode. According to the sensor, the cavern is filled with a dielectric fluid.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: August 20, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Sven Zinober, Remigius Has
  • Patent number: 8471346
    Abstract: A semiconductor device includes a substrate including a cavity and a first material layer over at least a portion of sidewalls of the cavity. The semiconductor device includes an oxide layer over the substrate and at least a portion of the sidewalls of the cavity such that the oxide layer lifts off a top portion of the first material layer toward a center of the cavity.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: June 25, 2013
    Assignee: Infineon Technologies AG
    Inventors: Thoralf Kautzsch, Markus Rochel
  • Patent number: 8471573
    Abstract: A dynamic quantity sensor includes a first substrate, a fixed part arranged in the first substrate, a spiral shaped movable electrode arranged separated from the first substrate, one end of the spiral shaped movable electrode being supported by the fixed part, a fixed electrode positioned on the periphery of the movable electrode and arranged in a detection direction of a dynamic quantity, and a first terminal electrically connected to the fixed part and a second terminal electrically connected to the fixed electrode.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: June 25, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Masaaki Asano, Tsukasa Yonekawa
  • Patent number: 8464589
    Abstract: A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.
    Type: Grant
    Filed: October 14, 2010
    Date of Patent: June 18, 2013
    Assignee: Solid State System Co., Ltd.
    Inventors: Chien-Hsing Lee, Tsung-Min Hsieh, Li-Chi Tsao, Jhyy-Cheng Liou
  • Publication number: 20130100575
    Abstract: The invention provides an electric circuit device including a conductive element configured to provide an electrical input to an electrical component, the resistivity of the conductive element being variable based at least on the extent of deformation thereof, and a deformable body coupled directly or indirectly to, or integral with, the conductive element such that deformation of the body causes the conductive element to deform, thereby varying the resistance thereof and altering the input to the electrical component. Said devices may be used singularly or in combination as logic elements within electrical circuits, providing drive and/or control functionality. Particular embodiments provide improved electrostatic generators.
    Type: Application
    Filed: February 18, 2011
    Publication date: April 25, 2013
    Applicant: AUCKLAND UNISERVICES LIMITED
    Inventors: Benjamin Marc O'Brien, Iain Alexander Anderson, Thomas Gregory McKay, Emilio Patricio Calius
  • Patent number: 8385045
    Abstract: A variable capacitor and a control method thereof capable of responding to applications of electronic apparatuses including various electronic devices and communication mobile devices. The variable capacitor includes a pair of electrodes formed so as to sandwich a ferroelectric material layer, in which polarization processing higher than a coercive field in hysteresis characteristics of polarization has been performed to the ferroelectric material layer, and the capacitance can be varied in accordance with a control voltage applied to the electrodes.
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: February 26, 2013
    Assignee: Sony Corporation
    Inventors: Kazutaka Habu, Masayoshi Kanno, Toshiaki Yokota, Makoto Watanabe
  • Patent number: 8358047
    Abstract: In accordance with the invention, there are micro-electromechanical devices and methods of fabricating them. An exemplary micro-electromechanical device can include a first dielectric layer; a buried conductive trace disposed over the first dielectric layer, such that the buried conductor trace is electrically connected to an outside power source; a second dielectric layer disposed over the buried conductive trace; at least one conductive electrode disposed over the second dielectric layer and electrically connected to the buried conductive trace; and at least one conductive membrane including membrane anchors disposed over the second dielectric layer, such that the at least one conductive membrane is electrically isolated from the at least one conductive electrode and the buried conductor trace, wherein the at least one conductive electrode is electrically connected to the power source through the buried conductive trace.
    Type: Grant
    Filed: September 29, 2008
    Date of Patent: January 22, 2013
    Assignee: Xerox Corporation
    Inventors: Peter M. Gulvin, Peter J. Nystrom
  • Patent number: 8339764
    Abstract: A MEMS device comprises first and second opposing electrodes (42,46), wherein the second electrode (46) is electrically movable to vary the electrode spacing between facing first sides of the first and second electrodes. A first gas chamber (50) is provided between the electrodes, at a first pressure, and a second gas chamber (52) is provided on the second, opposite, side of the second electrode at a second pressure which is higher than the first pressure. This arrangement provides rapid switching and with damping of oscillations so that settling times are reduced.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: December 25, 2012
    Assignee: NXP B.V.
    Inventors: Peter G. Steeneken, Hilco Suy, Martijn Goossens
  • Patent number: 8325460
    Abstract: Disclosed are a humidity sensor and a fabricating method thereof. The humidity sensor includes a substrate, an anodic aluminum oxide layer formed on the substrate and having a plurality of holes, and electrodes formed on the anodic aluminum oxide layer, in order to improve sensitivity and accuracy of the humidity sensor. Further, the fabricating method of a humidity sensor includes preparing an aluminum substrate, forming an anodic aluminum oxide layer by oxidizing the aluminum substrate, and forming electrodes on the anodic aluminum oxide layer.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: December 4, 2012
    Assignee: Postech Academy-Industry Foundation
    Inventors: Hyun-Chul Park, Hye-Jin Kim, Woon-Bong Hwang, Young-Deuk Kim, Kun-Hong Lee
  • Patent number: 8300383
    Abstract: A variable capacitor includes: a dielectric sheet disposed on a substrate and covering an electrode pattern on the substrate; a resilient conductive supporting seat mounted on the dielectric sheet for supporting an insulating operating cap on a central portion thereof; a conductive cover body covering the conductive supporting seat and permitting the operating cap to extend outward; and a biasing member for biasing the central portion of the conductive supporting seat to move away from the substrate. The cover body is connected electrically to the conductive supporting seat and a conductive contact on the substrate. When the operating cap is depressed, the operating cap forces a contact portion of the conductive supporting seat to deform such that a surface area of the deformed contact portion that contacts the dielectric sheet is increased, thereby changing the capacitance between the conductive supporting seat and the electrode pattern.
    Type: Grant
    Filed: February 25, 2011
    Date of Patent: October 30, 2012
    Inventor: Jung-Shih Tsai
  • Patent number: 8238073
    Abstract: In a method for forming an in-molded capacitive sensing device a plastic film is provided, the plastic film comprising a first side and a second side. A capacitive sensor pattern is disposed on at least a portion of the second side, the capacitive sensor pattern including a region for facilitating electrical contact. A resin layer is printed over a portion of the capacitive sensor pattern such that access to the region for facilitating electrical contact is maintained. A plastic layer is injection molded onto a portion of the resin layer such that the capacitive sensor pattern becomes in-molded between the plastic film and the plastic layer while access to the region for facilitating electrical contact is maintained.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: August 7, 2012
    Assignee: Synaptics, Inc.
    Inventors: Tony Tong, David Dwight Kellogg
  • Patent number: 8149567
    Abstract: The capacitor module includes a capacitor, in which a screw hole is arranged on an outer bottom wall surface of a capacitor case housing a capacitor element, and a heat dissipater, on which a plurality of capacitor cases are fixated by screwing fixation screws in the screw holes of the capacitors. As a result, for example, the capacitor can be fixated with reliability and durability secured even under a condition where very strong vibration is continuously applied, for example, when the capacitor module is mounted on construction machinery. Further, because, an adherence of the outer bottom wall surface of the capacitor case on a fixation surface of the heat dissipater is strengthened by screwing the fixation screw in the screw hole, the capacitor can be cooled down by transferring heat produced by the capacitor to the heat dissipater as needed.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: April 3, 2012
    Assignee: Komatsu Ltd.
    Inventors: Yoshitaka Niigaki, Hikosaburou Hiraki, Satoru Nishimuru
  • Patent number: 8143906
    Abstract: Methods for making and systems employing pressure and temperature sensors are described. Embodiments include a capacitive element including a first conductor plate and a second conductor plate. Each plate includes a conductor layer formed on a substrate. In a pressure sensor embodiment, seal is positioned at or near the edges of the conductor plates, and a gas retained in a gap defined between the plates. In a temperature sensor embodiment, the gap defined between the plates is in fluid communication with the external environment.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: March 27, 2012
    Assignee: Chevron U.S.A. Inc.
    Inventor: Don M. Coates
  • Patent number: 8113058
    Abstract: To render possible a high-quality, yet cost-effective provision suitable for mass production of a piezoelectric pressure transducer (1) with at least one piezoelectric measuring element (3, 3?, 3?) arranged on a housing base part (2), which measuring element is connected on the opposite side to a diaphragm (4), the measuring element (3, 3?, 3?) is fixed on an electrode sheet (5, 5?, 5?, 5??) or directly on the base part 2 or the diaphragm 4, wherein the electrode sheet (5, 5?, 5?, 5??) wraps conductively and positively as well as in a manner fixing the layers around a contact pin (7) insulated with respect to the base part (2) and projecting outwards.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: February 14, 2012
    Assignee: Piezocryst Advanced Sensorics GmbH
    Inventors: Martin Baumgartner, Christian Reiter, Friedrich Anton Holzinger, Alexander Schricker
  • Patent number: 8104353
    Abstract: A pressure sensor includes a platform and an elastic measuring membrane, which is joined with a surface of the platform to form a measuring chamber sealed closed at the edge, wherein the platform and/or the measuring membrane comprise ceramic, glass or a single crystal material, the measuring membrane has at least a first electrode, which faces the surface of the platform, the surface of the platform has at least a second electrode, which faces that of the measuring membrane. The capacitance between the first electrode and the second electrode is a measure for the pressure to be measured; wherein additionally at least one of the first and second electrodes comprises a conductive layer, which contains metal and glass, and wherein the metal comprises at least two noble metal elements.
    Type: Grant
    Filed: June 4, 2008
    Date of Patent: January 31, 2012
    Assignee: Endress + Hauser GmbH + Co. KG
    Inventors: Ulfert Drewes, Frank Hegner, Andreas Rossberg, Elke Schmidt, Sabine Stolle, Christel Kretschmar, Melanie Hentsche
  • Patent number: 8102638
    Abstract: A capacitive switch for microelectromechanical systems (MEMS) comprises a topmost metal plate which extends across a bridge structure formed by a polymer layer. The polymer layer comprises poly-monochoro-para-xylene (parylene-C). The space below the polymer layer contains the second plate on a substrate. Using parylene as the primary bridge material makes the bridge of the MEMS device very flexible and requires a relatively low actuation voltage to pull the bridge down and lower power is required to control the MEMS device.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: January 24, 2012
    Assignee: The University Court of the University of Edinburgh
    Inventors: Tughrul Arslan, Anthony J. Walton, Nakul R. Haridas
  • Patent number: 8079269
    Abstract: A pressure sensor comprises a first pressure chamber containing fill fluid at a first pressure, a second pressure chamber containing fill fluid at a second pressure, a porous dielectric diaphragm having first and second major surfaces exposed to the first and second pressure chambers, and first and second electrodes positioned with respect to the first and second major surfaces. A method for sensing pressure is also disclosed, comprising applying first and second pressures to fill fluid in first and second pressure chambers of a pressure sensor having a porous dielectric diaphragm, and producing an output representative of a pressure differential between the pressures, as a function of surface charges on first and second major surfaces of the porous dielectric diaphragm.
    Type: Grant
    Filed: May 16, 2007
    Date of Patent: December 20, 2011
    Assignee: Rosemount Inc.
    Inventor: Swapan Chakraborty
  • Patent number: 8072081
    Abstract: A microelectromechanical system package includes a chip carrier, a first microelectromechanical system chip, a silicon cover, a layer of metal, a plurality of first bonding wires and a sealant. The first microelectromechanical system chip is positioned on the chip carrier and has an active surface, and an active area on the active surface. The layer of metal is formed on the upper surface of the cover. The first bonding wires electrically connect the active surface of the first microelectromechanical system chip to the chip carrier. The sealant is formed on the chip carrier to encapsulate the first microelectromechanical system chip and the first bonding wires.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: December 6, 2011
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventor: Meng Jen Wang
  • Patent number: 8009406
    Abstract: A capacitance arrangement comprising at least one parallel-plate capacitor comprising a first electrode means, a dielectric layer and a second electrode means partly overlapping each other. A misalignment limit is given. Said first electrode means comprises a first and a second electrode arranged symmetrically with respect to a longitudinal axis, said first and second electrodes have a respective first edge, which face each other, are linear and parallel such that a gap is defined there between. Said second electrode means comprises a third electrode with a first section and a second section disposed on opposite sides of said gap interconnected by means of an intermediate section, which is delimited by a function depending on a first parameter and a second parameter. One of said two parameters is adapted to be selected hence allowing calculation of the other parameter to determine the shape and size of the second electrode means.
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: August 30, 2011
    Assignee: Telefonaktiebolaget L M Ericsson (publ)
    Inventors: Spartak Gevorgyan, Anatoli Deleniv, Per Thomas Lewin
  • Patent number: 7936553
    Abstract: An embodiment of the present invention provides a device, comprising a multilayered tunable dielectric capacitor, wherein said multilayers of tunable dielectric are adapted to be DC biased to reduce the dielectric constant; and wherein the DC bias is arranged so that the number of layers of tunable dielectric biased positively is equal to the number of layers of tunable dielectric biased negatively.
    Type: Grant
    Filed: March 22, 2007
    Date of Patent: May 3, 2011
    Assignee: Paratek Microwave, Inc.
    Inventors: James Oakes, James Martin, Andrey Kozyrev, Alexandr Prudan
  • Patent number: 7911761
    Abstract: The present invention provides compliant/stretchable electroactive materials and devices made from those materials which exhibit fault-tolerant properties, i.e., self-healing/clearing properties. The present invention also provides systems, which incorporate the subject materials and/or devices, as well as methods of fabricating the subject materials and devices.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: March 22, 2011
    Assignee: Bayer MaterialScience AG
    Inventors: Silmon James Biggs, Matthew Kurt Senesky
  • Patent number: 7854170
    Abstract: A capacitance sensing circuit for a membrane pressure sensor is provided. The sensing circuit has a controller, two switches in signal communication with the controller, a charge amplifier and a charge injector. The charge amplifier is connected to the switches via a sensor capacitor Cs and a reference capacitor Cr. The sensor and reference capacitors are arranged in parallel with one another and a parasitic capacitance Cp to ground. The charge injector and amplifier are arranged in parallel connection between the capacitors and the controller. The controller is configured to determine a charge imbalance indicative of a pressure difference between membranes of the pressure sensor.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: December 21, 2010
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, Samuel George Mallinson
  • Patent number: 7796371
    Abstract: A micro fluidic device and method for capacitive sensing. The device includes a fluid channel including an inlet at a first end and an outlet at a second end, a cavity region coupled to the fluid channel, and a polymer based membrane coupled between the fluid channel and the cavity region. Additionally, the device includes a first capacitor electrode coupled to the membrane, a second capacitor electrode coupled to the cavity region and physically separated from the first capacitor electrode by at least the cavity region, and an electrical power source coupled between the first capacitor electrode and the second capacitor electrode and causing an electric field at least within the cavity region. The polymer based membrane includes a polymer.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: September 14, 2010
    Assignee: California Institute of Technology
    Inventors: Jun Xie, Jason Shih, Yu-Chong Tai
  • Patent number: 7788981
    Abstract: The present invention discloses a pressure measurement device comprising: a substrate that includes at least one pressure sensing module and at least one fluid-conductive channel, wherein each channel has a first aperture and a second aperture. The substrate is flexible such that the pressure measurement device is conformably adjustable onto an object's surface. The first aperture is located on the substrate such that when the substrate is suitably adjusted onto the object's surface, the first aperture is open to the exterior of the object's surface. The pressure sensors module is operatively connected to at least one of the second apertures, such that the at least one pressure sensing module is generally being subjected to the pressure being present at the first aperture.
    Type: Grant
    Filed: March 14, 2008
    Date of Patent: September 7, 2010
    Assignee: CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Developpement
    Inventors: Noa Schmid, Helmut Knapp, Janko Auerswald, Christian Andreas Bosshard, Mark Fretz, Anne-Claire Pliska
  • Patent number: 7743662
    Abstract: A pressure transducer has an H-shaped header having a front and a back section. The front and back sections are of equal diameter and are circular. Each front and back section has a depression with a diaphragm covering the depression. Each diaphragm is of equal size and the depressions communicate one with the other via a central channel in the central arm of the H. A pressure sensor communicates with the channel, where the pressure sensor responds to a first pressure applied to the first diaphragm and a second pressure applied to the second diaphragm. The pressure sensor produces an output equal to the difference in pressure. The differential pressure inducer having both diaphragms of the same size and still enabling leads from the sensor to be brought out.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: June 29, 2010
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Anthony D. Kurtz
  • Patent number: 7721412
    Abstract: A process for the manufacture of small sensors with reproducible surfaces, including electrochemical sensors. One process includes forming channels in the surface of a substrate and disposing a conductive material in the channels to form an electrode. The conductive material can also be formed on the substrate by other impact and non-impact methods. In a preferred embodiment, the method includes cutting the substrate to form a sensor having a connector portion and a transcutaneous portion, the two portions having edges that define one continuous straight line.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: May 25, 2010
    Assignee: Abbott Diabetes Care Inc.
    Inventors: James Say, Michael F. Tomasco, Adam Heller, Yoram Gal, Behrad Aria, Ephraim Heller, Phillip John Plante, Mark S. Vreeke
  • Patent number: 7616425
    Abstract: A heat-sensitive apparatus includes a substrate with a top surface, one or more bars being rotatably joined to the surface and having bimorph portions, and a plate rotatably joined to the surface and substantially rigidly joined to the one or more bars. Each bimorph portion bends in response to being heated. The one or more bars and the plate are configured to cause the plate to move farther away from the top surface in response to the one or more bimorph portions being heated.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: November 10, 2009
    Assignee: Alcatel-Lucent USA Inc.
    Inventors: Vladimir Anatolyevich Aksyuk, Maria Elina Simon, Richart Elliott Slusher
  • Patent number: 7586749
    Abstract: A protecting casing for a transducer has an outer casing, an inner casing, a circuit board and a connector. The inner casing is detachably mounted in the outer casing and has a mounting hole and a cap detachably mounted on the inner casing to cover the mounting hole in a watertight manner. The circuit board is detachably mounted in the inner casing and has a surface, a circuit formed on the surface and a plug with terminals extends out of the inner casing. The connector is detachably mounted to the outer casing and is electrically connected between the circuit board and an external functional accessory component. Within such an arrangement to facilitate maintenance, assembly of the transducer, and effectively avoid intrusion of water, foreign object and the like.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: September 8, 2009
    Assignee: Finetek Co., Ltd.
    Inventor: Dick Wu
  • Publication number: 20090201269
    Abstract: As for a “system on panel” in which a control circuit and a driver circuit as well as a display device are integrally formed over a substrate such as a glass substrate, more sophistication is expected by fabricating an input unit over the same substrate. Input of a semiconductor device is generally performed by pushing or touching a button like input unit with fingers or the like. In that case, glass is often used for a counter substrate; however, it is difficult to form a button from glass and to provide it directly on the substrate due to the nature of the material. It is an object of the present invention to provide a semiconductor device at a lower price, in which the input operation can be performed without employing an external input unit. A variable capacitor is formed from a pair of electrodes and a dielectric interposed between the electrodes over a substrate, and an external input is detected by changing capacitance of the variable capacitor by a physical or electrical force.
    Type: Application
    Filed: April 21, 2009
    Publication date: August 13, 2009
    Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    Inventors: Kiyoshi KATO, Toshihiko SAITO
  • Publication number: 20090195959
    Abstract: A portable electronic device includes a housing, a display device exposed by the housing, an input device for receiving user-input, a plurality of sensors on the housing for detecting touches on the portable electronic device, and functional components housed in the housing. The functional components include a memory device and a processor operably connected to the sensors, the display device the input device, and the memory device.
    Type: Application
    Filed: January 31, 2008
    Publication date: August 6, 2009
    Applicant: RESEARCH IN MOTION LIMITED
    Inventors: Norman M. LADOUCEUR, Steven H. FYKE
  • Patent number: 7568395
    Abstract: The present invention relates to a pressure sensor. The pressure sensor includes a substrate assembly. The substrate assembly defines sealed channels and includes a conductive layer. A conductive membrane extends from the substrate assembly and is spaced from the conductive layer to form a sealed reference chamber. A cap defines apertures. The cap extends from the substrate assembly to cover the membrane and thereby form an apertured chamber.
    Type: Grant
    Filed: July 29, 2007
    Date of Patent: August 4, 2009
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, Samuel George Mallinson
  • Patent number: 7546772
    Abstract: A pressure sensor includes a housing portion with a fluid inlet and a polymer element within the housing portion. The polymer element may be coated with piezoresistive material to form a first resistor and may have associated electrodes. The polymer element includes a first resistance value that changes to a second resistive value in a response to a predetermined condition. The pressure sensor may also include a second polymer element that includes a first resistance value that changes to a second resistive value in a response to a predetermined condition.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: June 16, 2009
    Assignee: Honeywell international Inc.
    Inventors: Eugen I Cabuz, Cleopatra Cabuz, Tzu-Yu Wang
  • Patent number: 7533573
    Abstract: A pressure sensor for sensing a fluid pressure comprising: a first chamber including a first conductive membrane, wherein a fluid is sealed within the first chamber at a reference pressure such that the first conductive membrane deflects from pressure differences between the reference and the fluid pressure; a second chamber including a second conductive membrane sealed from the fluid pressure, wherein the second membrane deflects in response to a change in temperature which the pressure sensor is exposed thereto; and a circuit in electrical communication with the first and second conductive membrane, the circuit being configured to obtain a first and second signal from the first and second conductive membranes respectively, the first and second signals being indicative of the deflection of the first and second conductive membranes, wherein the circuit adjusts the first signal by the second signal to generate an output signal indicative of the fluid pressure.
    Type: Grant
    Filed: February 14, 2008
    Date of Patent: May 19, 2009
    Assignee: Silverbrook Research Pty Ltd
    Inventors: Kia Silverbrook, Samuel George Mallinson
  • Patent number: 7530276
    Abstract: This invention aims to realize reduction in size without impairing measurement accuracy or connection reliability in a semiconductor pressure sensor in which a glass substrate is adhered to a rear-surface side of a pressure-sensitive chip in which piezoresistive pressure-sensitive gauges have been formed on a front surface of a diaphragm formed of a silicon single crystal to form a space between a rear surface of the diaphragm and the glass substrate, for measuring a pressure applied to the front surface of the diaphragm with reference to a pressure of the first space as a standard pressure. In order to achieve this object, the semiconductor pressure sensor includes resinous projections formed on pressure-sensitive gauge electrodes disposed on a front surface of the pressure-sensitive chip or on wiring from the pressure-sensitive gauge electrodes and bumps formed so as to partially or entirely cover the resinous projections.
    Type: Grant
    Filed: August 22, 2007
    Date of Patent: May 12, 2009
    Assignee: Fujikura Ltd.
    Inventors: Masakazu Sato, Tatsuya Ito, Hideto Noguchi
  • Patent number: 7530275
    Abstract: The invention refers to a pressure sensor comprising a membrane which separates a measuring device receiving the deformation of the membrane caused by pressure from the pressurised pressure space. The pressure sensor is formed by a basic body. The pressure sensor is set in a wall defining the pressure space. The membrane is orientated essentially parallel to the surface normal line of this opening.
    Type: Grant
    Filed: June 23, 2006
    Date of Patent: May 12, 2009
    Assignee: KMW Kaufbeurer Mikrosysteme Wiedemann GmbH
    Inventors: Wolfgang Wiedemann, Rainer Wunderlich
  • Patent number: 7516667
    Abstract: A differential pressure sensor includes a case, a first and a second pressure sensing element, a first and a second pressure introduction passage, and a differential pressure determining element. The first and second pressure sensing elements work to respectively sense a first and a second pressure. The first and second pressure introduction passages are provided to respectively introduce the first and second pressures to the first and second pressure sensing elements. The differential pressure determining element works to determine a differential pressure as the difference between the first and second pressures sensed by the first and second sensing elements. The first and second pressure sensing elements have the same shape and size and are symmetrically arranged in the case with respect to a reference. The first and second pressure introduction passages also have the same shape and size and are symmetrically positioned in the case with respect to the reference.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: April 14, 2009
    Assignee: DENSO CORPORATION
    Inventor: Masato Ueno
  • Patent number: RE41521
    Abstract: The present invention provides a variable capacity condenser having fewer components. A variable capacity condenser according to the present invention comprises a dielectric substance, two electrodes, and a flexible electrode. The dielectric substance has two end faces. The two electrodes are disposed on one end face of the dielectric substance. The flexible electrode faces the other end face of the dielectric substance. The flexible electrode is pressible by a pressing member to vary a distance between at least a portion of the flexible electrode and the other end face of the dielectric substance.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: August 17, 2010
    Assignee: Wacom Co., Ltd.
    Inventors: Yasuyuki Fukushima, Hiroyuki Fujitsuka