Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: In a laminated ceramic electronic component, a side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces.

Abstract: A multilayer ceramic capacitor includes a body in which a plurality of dielectric layers are stacked, first and second external electrodes disposed on one surface of the body and spaced apart from each other, a plurality of first and second internal electrodes opposing each other, the dielectric layers being interposed therebetween, a first conductive via connecting the plurality of first internal electrodes to the first external electrode, a second conductive via connecting the plurality of second internal electrodes to the second external electrode, and a shielding layer covering at least a portion of an external surface of the body.

Abstract: A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.

Abstract: Some embodiments include an integrated structure having a semiconductor base and an insulative frame over the semiconductor base. The insulative frame has vertically-spaced sheets of first insulative material, and pillars of second insulative material between the vertically-spaced sheets. The first and second insulative materials are different from one another. Conductive plates are between the vertically-spaced sheets and are directly against the insulative pillars. Some embodiments include capacitors, and some embodiments include methods of forming capacitors.

Abstract: A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode.

Abstract: In a multilayer capacitor, a multilayer capacitor main body includes first and second main surfaces, first and second side surfaces, and first and second end surfaces, the first and second main surfaces extending in a length direction and a width direction, the first and second side surfaces extending in the length direction and a thickness direction, and the first and second end surfaces extending in the width direction and the thickness direction. The second main surface is depressed in a portion extending from opposite ends of the second main surface toward a center of the second main surface in the length direction.

Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.

Abstract: High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor.

Abstract: A monolithic ceramic capacitor includes a plurality of first and second inner electrodes in a ceramic body. A direction in which the first and second inner electrodes are stacked is a stacking direction, a direction perpendicular or substantially perpendicular to the stacking direction in the ceramic body is a length direction, and a direction perpendicular or substantially perpendicular to the stacking direction and the first direction is a width direction. The ceramic body includes an effective portion, a first outer layer portion, a second outer layer portion, a first side portion, and a second side portion. A ratio A/B is about 0.04 or less when a dimension of each of the first side portion and the second side portion in the width direction is A and a dimension of the effective portion in the stacking direction is B.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 has a first metal layer 14 having many holes 14a, and a second metal layer 15 having many holes 15a, with a clearance CL provided in between in the length direction, on the other height-direction side face of the capacitor body; the first metal layer 14 is partially covered by a third part 12c of a first external electrode 12, while the remainder is exposed; and the second metal layer 15 is partially covered by a third part 13c of a second external electrode 13, while the remainder is exposed. The multilayer ceramic capacitor can have excellent heat dissipation property.

Abstract: A capacitor includes a dielectric structure formed of a sintered dielectric, and a first electrode and a second electrode each formed of a conductor. The dielectric structure includes a wall. The first electrode and the second electrode are insulated from each other by the wall. The wall has a height which is a dimension in a first direction, and a thickness which is a dimension in a second direction orthogonal to the first direction, the height being greater than the thickness. The wall has a non-straight shape when seen in the first direction.

Abstract: A capacitor array structure which includes N capacitor units is provided. Each capacitor unit includes a first metal layer, a second metal layer, and a third metal layer to form an upper electrode and a lower electrode. The second metal layer is disposed between the first metal layer and the third metal layer, and includes a second patterned metal portion of the lower electrode and a first patterned metal portion of the upper electrode. disposed above. The second patterned metal portion of the lower electrode has an opening, and a side of the first patterned metal portion of the upper electrode is exposed in the opening, such that the side of the first patterned metal portion of the upper electrode is adjacent to the lower electrode of another capacitor unit.

Abstract: Methods and systems to improve a multilayer ceramic capacitor using additive manufacturing are disclosed. Conductive layer ends of a multilayer ceramic capacitor may be modified to comprise a round shape, which may increase structural stability of the capacitor's layers. Other configurations may be possible, such as bulbous or wavy shaped conductive layer ends. The layers may comprise one or more pillars made from dielectric material, e.g., barium titanate, disposed through a portion of a conductive layer. The dielectric material may be the same material used in the insulator layers of the capacitor. Each pillar may comprise a plurality of spot connections surrounding its perimeter. The embedded pillars may be used to prevent delamination of the layers and to increase mechanical strength. Additionally, an algorithm of a computing device may determine an optimal shape, size, and/or configuration of the capacitor based on one or more predetermined specifications or properties.

Abstract: A multilayer thin-film capacitor includes a first multilayer body and a second multilayer body spaced apart from each other in a vertical direction by a split layer. The second multilayer body is disposed on a lower surface of the first multilayer body, the first multilayer body constitutes a top capacitor, and the second body constitutes a bottom capacitor. First, second, and third external terminals may be disposed on an upper surface of the first multilayer body and be connected to internal electrode layers of the first and second multilayer bodies.

Abstract: An electrical component is disclosed, wherein the electrical component comprises: a body; a conductive element disposed in the body; a first metal layer, disposed on the body and electrically connected to a terminal of the conductive element; a conductive and adhesive layer, overlaying on the first metal layer; and a second metal layer, overlaying on the first metal layer and the conductive and adhesive layer, wherein a first conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer and the conductive and adhesive layer, and a second conductive path is formed from the terminal of the conductive element to the second metal layer via the first metal layer without passing through the conductive and adhesive layer.

Abstract: The invention relates to a contact arrangement (30) for a multi-layer circuit board (1a), said circuit board (1a) having at least one inner wire (2) which is contacted via at least one cutout (10). According to the invention, at least two cutouts (10) are arranged on different sides of the at least one inner wire (2), the center axes (2) of the at least two cutouts (10) having a predefined distance (as) to a target center line (2.4) of the at least one inner wire (2). The at least two cutouts (10) expose the at least one inner wire (2) in at least two contact zones (2.1) for the purpose of contact, said contact zones being arranged on different sides of the wire (2).

Abstract: An electronic component includes a multilayer body, first to fourth outer electrodes, a pair of first insulating coating portions, and a pair of second insulating coating portions. The pair of first insulating coating portions is in at least one of a state in which inner end portions are in contact with the third outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode. The pair of second insulating coating portions is in at least one of a state in which inner end portions are in contact with the fourth outer electrode and a state in which outer end portions are in contact with the first outer electrode and the second outer electrode.

Abstract: A multi-layer electronic device is disclosed that comprises a ceramic layer, a first electrode layer, and a second electrode layer. The first electrode layer contains a first tab portion extending to the first lateral edge of the ceramic layer, the first electrode layer further defining a first cut-out region. The second electrode layer contains a second tab portion extending to the first lateral edge of the ceramic layer, the second electrode layer further defining a second cut-out region. The first tab portion of the first electrode layer is offset from the second tab portion of the second electrode layer in the longitudinal direction so that a first gap region is formed within which the first tab portion does not overlap the second tab portion. Further, the first cut-out region at least partially overlaps the second cut-out region.

Abstract: A capacitor includes a body, first and second external electrodes, and first and second auxiliary external electrodes. The body includes first and second internal electrodes each having first and second lead portions exposed to one surface of the body. The first and second external electrodes are disposed on the one surface of the body and electrically connected to the first and second internal electrodes, respectively. The first and second auxiliary external electrodes are electrically connected to the first and second external electrodes, respectively, and cover portions of surfaces of the body connected to the one surface of the body.

Abstract: To provide a thin touch panel, a touch panel with high visibility, a lightweight touch panel, or a touch panel with low power consumption. A pair of conductive layers is included in a capacitive touch sensor. The two conductive layers have a mesh shape including a plurality of openings. Furthermore, the conductive layers are provided to overlap with a region between two display elements in a plan view. Furthermore, the conductive layers included in the touch sensor are provided between two substrates included in the touch panel, and a conductive layer capable of supplying a constant potential is provided between a circuit which drives a display element and the pair of conductive layers.

Abstract: An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.

Abstract: A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.

Abstract: In an embodiment, a multilayer ceramic capacitor 10 is such that at least lead parts 14a of several first internal electrode layers 14 close to width-direction outer surfaces f3a, f4a of tapered part 11a are curved inward and the area of an exposed part of each curved lead part 14a is greater than the area of an exposed part of a lead part 14a free from curvature, while at least the lead parts 15a of several second internal electrode layers 15 close to width-direction outer surfaces f3a, f4a of the tapered part 11a are curved inward and the area of an exposed part of each curved lead part 15a is greater than the area of an exposed part of a lead part 15a free from curvature. The multilayer ceramic capacitor can mitigate separation of the first and second external electrodes from the capacitor body when mounted on a circuit board.

Abstract: A multilayer capacitor include dielectric layers stacked in a direction perpendicular to a mounting surface of a capacitor body, and internal electrodes and an equivalent series inductance (ESL) control pattern formed on upper and lower portions of the dielectric layers, respectively. The internal electrodes have an area larger than that of the ESL control pattern, and the ESL control pattern is exposed to a mounting surface of a capacitor body.

Abstract: A multilayer capacitor includes a dielectric main body having opposite first and second sides, a terminal electrode assembly and spaced apart first, second and third inner electrodes, all of which are disposed in the main body. The second inner electrode is disposed between the first and third inner electrodes. The terminal electrode assembly has a first terminal electrode unit disposed on the first side and connected to the first inner electrode, a second terminal electrode unit disposed on the second side and connected to the second inner electrode, and a third terminal electrode unit disposed on the first side and connected to the third inner electrode. The first, second and third terminal electrode units are insulated from each other.

Abstract: In a multilayer ceramic capacitor, outer electrodes include base electrode layers including a conductive metal and a glass component on a ceramic multilayer body, conductive resin layers including a thermosetting resin and a metal component on the base electrode layers such that exposed portions of the base electrode layers are exposed at least at one corner on one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof, and plating layers on the conductive resin layers and the exposed portions of the base electrode layers. The exposed portions of the base electrode layers are in direct contact with the plating layers at least at one corner on the one end surface side of the ceramic multilayer body and at least at one corner on the other end surface side thereof.

Abstract: A multilayer ceramic capacitor includes: a pair of external electrodes; a first internal electrode that is coupled to one of the pair of external electrodes; a dielectric layer that is stacked on the first internal electrode and contains BaTiO3 and Ni; and a second internal electrode that is stacked on the dielectric layer, contains Ni, and is coupled to another one of the pair of external electrodes, wherein Ni concentrations obtained by analyzing five regions with a transmission electron microscope are within a range from 0.015 to 0.045, the five regions being obtained by dividing a region from a location 50 nm away from the first internal electrode of the dielectric layer to a location 50 nm away from the second internal electrode of the dielectric layer in a stacking direction between the first internal electrode and the second internal electrode equally into five.

Abstract: A multilayer ceramic capacitor includes a ceramic body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween. The first internal electrode includes a first electrode plate and a first lead portion exposed to an external surface of the ceramic body and the second internal electrode includes a second electrode plate and a second lead portion exposed to an external surface of the ceramic body. The relationship Mb>Mt may be satisfied, where Mb is a length of the first and second lead portions extending from the first and second electrode plates to a mounting surface of the ceramic body to which the first and second lead portions are exposed and Mt is a length from the first and second electrode plates to a surface of the ceramic body opposing the mounting surface.

Abstract: Methods and systems for improved matching for on-chip capacitors may comprise in a semiconductor die comprising an on-chip capacitor with one or more metal layers: electrically coupling a first set of metal fingers, electrically coupling a second set of metal fingers that are interdigitated with the first set of metal fingers, wherein the first set of metal fingers and the second set of metal fingers are arranged symmetrically in the semiconductor die, and configuring the on-chip capacitor in a plurality of symmetric sections, wherein a boundary between each of the plurality of sections is configured in a zig-zag pattern. The first set of metal fingers and the second set of metal fingers may be arranged with radial symmetry. A first set of metal fingers in a first metal layer may be electrically coupled to a set of metal fingers in a second metal layer.

Abstract: Electromechanical devices described herein may employ tunneling phenomena to function as low-voltage switches. Opposing electrodes may be separated by an elastically deformable layer which, in some cases, may be made up of a non-electrically conductive material. In some embodiments, the elastically deformable layer is substantially free of electrically conductive material. When a sufficient actuation voltage and/or force is applied, the electrodes are brought toward one another and, accordingly, the elastically deformable layer is compressed. Though, the elastically deformable layer prevents the electrodes from making direct contact with one another. Rather, when the electrodes are close enough to one another, a tunneling current arises therebetween. The elastically deformable layer may exhibit spring-like behavior such that, upon release of the actuation voltage and/or force, the separation distance between electrodes is restored.

Abstract: A capacitor component includes a body including a plurality of dielectric layers having a layered structure, and first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers of the plurality of dielectric layers interposed therebetween, a first external electrode formed on a first surface and a second surface of the body opposing each other, and connected to the first internal electrodes, and a second external electrode formed on at least one of a third surface and a fourth surface of the body connecting the first surface to the second surface and opposing each other, and connected to the second internal electrodes. The capacitor component is divided into a plurality of capacitor units each including a portion of the first internal electrodes and a portion of the second internal electrodes, and the plurality of capacitor units include a first capacitor unit and a second capacitor unit.

Abstract: A laminated capacitor includes a multilayer body and first and second outer electrodes on a portion of a surface of the multilayer body. Relationships GT1>GL>GW, GT2>GL>GW, SL>SW, and (SL/SW)>(ML/MW) are satisfied, where a thickness of a first outer layer portion is GT1, a thickness of a second outer layer portion is GT2, a width of a side portion is GW, each length of end portions is GL, a length of the multilayer body is SL, a width of the multilayer body is SW, a length of a main portion is ML, and a width of the main portion is MW.

Abstract: A multilayer ceramic capacitor includes: a ceramic body having dielectric layers laminated in a thickness direction, the dielectric layers having a greater width than a length; an active layer in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body opposite to each other in a length direction with the dielectric layer interposed therebetween; upper cover layer; lower cover layers being thicker than the upper cover layer; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower cover layer is denoted by B, half of thickness of the active layer is denoted by C, and thickness of the upper cover layer is denoted by D, 1.042?(B+C)/A?1.537 is satisfied.

Abstract: A multilayer capacitor includes a multilayer body with sides each about 0.3 mm or smaller when viewed from a stacking direction of the multilayer body, and first and second outer electrodes disposed on a surface of the multilayer body. An outermost one of the conductive layers is bent to be convex in the stacking direction and includes penetrating portions extending in the stacking direction. In a cross section perpendicular or substantially perpendicular to a lengthwise direction of the multilayer body, assuming the bent conductive layer is equally divided into four regions named region A, region B, region C, and region D arranged in the order named in a widthwise direction of the multilayer body, a sum of minimum diameters of the penetrating portions is larger in the region A than in the region B and larger in the region D than in the region C.

Abstract: A multilayer ceramic electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; with external electrodes disposed on the capacitor body and electrically connected to the internal electrodes, wherein the capacitor body includes an active region in which internal electrodes having different polarities from each other overlap each other to form capacitance, and a margin part defined as region except for the active region. A concentration of an additive element in the margin part is higher than the concentration of the additive element in the active region, and the margin part has a concentration gradient of the additive element from a surface of the capacitor body toward the active region.

Abstract: A ceramic capacitor includes first and second first internal electrodes respectively including first and second extended portions that respectively include a plurality of ceramic columns penetrating the first and the second extended portions, respectively, in a thickness direction. The first extended portion includes a first high ceramic-column density portion in which ceramic columns are provided at intervals of about 20 ?m or less along the length direction of the extended portion. The second extended portion includes a second high ceramic-column density portion in which ceramic columns are provided at intervals of about 20 ?m or less along the length direction of the extended portion.

Abstract: An external electrode included in a laminated ceramic electronic component is formed on a ceramic body by baking a conductive paste including a glass component. The ceramic body with the conductive paste applied thereto is subjected to heat treatment under the conditions where the top temperature is 800° C. or higher, and the electromotive force at the top temperature is 600 to 900 mV. In this heat treatment, the glass component in the conductive paste penetrates into grain boundaries between ceramic grains of the ceramic body, and a crystalline substance containing elements constituting the glass component is generated which has dissolving resistance against plating solutions.

Abstract: Provided is a high voltage multilayer ceramic capacitor and a manufacturing method thereof. The high voltage multilayer ceramic capacitor includes a multilayer ceramic sintering body; a plurality of first inner electrode layer; a plurality of second inner electrode layers; a plurality of first arc shield pattern layers respectively formed inside the multilayer ceramic sintering body to be arranged on a plane the same as those of the plurality of first inner electrode layers and spaced apart from the first inner electrode layers to surround the first inner electrode layers; and a plurality of second arc shield pattern layers respectively formed inside the multilayer ceramic sintering body to be arranged on a plane the same as those of the plurality of second inner electrode layers and spaced apart from the second inner electrode layers to surround the second inner electrode layers.

Abstract: A manufacturing method for a multilayer capacitor includes alternately laminating dielectric layers and conductor layers including less than 50 included in a first arrangement and a second arrangement different from the first arrangement when viewed from a lamination direction to form a laminate in which at least one pair of the conductor layers adjacent to each other with the dielectric layer interposed therebetween are included in the first or second arrangement, pressing the laminate to stretch the conductor layers in a direction perpendicular or substantially perpendicular to the lamination direction, pressing the laminate to bend the conductor layers in the lamination direction, and forming first and second outer electrodes on laminate surfaces such that the first outer electrode is connected to the conductor layers included in the first arrangement and the second outer electrode is connected to the conductor layers included in the second arrangement.

Abstract: An LED tube light includes a light tube and an end cap attached over an end of light tube. The end cap includes an insulating tubular part, sleeved over the end of the light tube. A magnetic object is disposed between an inner circumferential surface of the insulating tubular part and an outer circumferential surface of the end of light tube. A hot melt adhesive is also disposed between the inner circumferential surface of the insulating tubular part and an outer circumferential surface of the end of light tube. The insulating tubular part may have protruding portions formed on an inner circumferential surface of the insulating tubular part to be extending inwardly thereof, and disposed between an outer circumferential surface of the magnetic object and the inner circumferential surface of the insulating tubular part, thereby forming a gap therebetween.

Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.

Abstract: A multilayer ceramic electronic component includes: a main body; and a first external electrode disposed on a first surface of the main body and a second external electrode disposed on a second surface of the main body. The first external electrodes include a first base electrode forming an edge portion of the first surface of the main body and a first terminal electrode disposed on a portion of the first base electrode. The second external electrodes include a second base electrode forming an edge portion of the second surface of the main body and a second terminal electrode disposed on a portion of the second base electrode.

Abstract: A capacitor having first and second electrodes and a scaffold dielectric. The scaffold dielectric comprises an insulating material with a plurality of longitudinal channels extending across the dielectric and filled with a liquid comprising cations and anions. The plurality of longitudinal channels are substantially parallel and the liquid within the longitudinal channels generally has an ionic strength of at least 0.1. Capacitance results from the migrations of positive and negative ions in the confined liquid in response to an applied electric field. A method of supplying power to a load using the capacitor and a method of making the capacitor is additionally disclosed.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers; and a plurality of internal electrodes disposed within the ceramic body, having the dielectric layer interposed therebetween, wherein, on a cross section of the ceramic body in a width-thickness direction thereof, when a distance between an uppermost internal electrode and a lowermost internal electrode measured at centers thereof in a width direction thereof is defined as a and a distance between the uppermost internal electrode and the lowermost internal electrode measured at edges thereof in the width direction thereof is defined as b, 0.953?a/b?0.996 is satisfied.

Abstract: LED tube light including light tube and end cap, in which end cap includes an insulating tubular part and a thermal conductive ring, thermal conductive ring fixedly arranged on outer circumferential surface of insulating tubular part, end cap sleeved over an end of light tube, and thermal conductive ring adhesively bonded to light tube is disclosed herein. Insulating tubular part has first and second tubular parts that are connected along axial direction of light tube, outer diameter of second tubular part is less than outer diameter of first tubular part, and thermal conductive ring is sleeved over second tubular part, in which outer surface of thermal conductive ring and outer circumferential surface of first tubular part are substantially flush with each other. End of second tubular part has notches, spatially arranged along circumferential direction thereof. Thermal conductive ring can be tubular metal ring, and insulating tubular part can be plastic.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other, a plurality of internal electrodes having the dielectric layer interposed therebetween, electrode layers formed on the first and second end surfaces of the ceramic body and electrically connected to the plurality of internal electrodes, and an impact absorption layer formed on the electrode layer so that an edge thereof is exposed.

Abstract: Disclosed herein is a multilayer ceramic capacitor including: a ceramic body in which internal electrodes and dielectric layers are alternately stacked; a pair of external electrodes covering both end portions of the ceramic body; and a moisture resistant protective film formed on surfaces of the dielectric layers between the pair of external electrodes and having a hydrophobic functional group.

Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, base electrode layers disposed on the ceramic body and including main portions connected to the internal electrodes and extension portions extending from the main portions, and resin electrode layers disposed on the base electrode layers while leaving end portions of the extension portions exposed. A width of the extension portion is narrower than a width of the outer surface of the ceramic body on which the extension portion is disposed, measured in a direction parallel to a width direction of the extension portion.

Abstract: A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity.