Abstract: An exemplary server center includes a server, a heat dissipating system, and temperature controlling device. The heat dissipating system includes an exhaust fan, and an airflow tunnel connecting the exhaust fan with the server. The temperature controlling device includes a temperature sensor electrically connected to the server, and an airflow valve mounted on the airflow tunnel The temperature sensor is configured for detecting a temperature of the server and controlling the airflow valve to permit the airflow enter the airflow tunnel or not, according to the temperature obtained from the server.

Abstract: A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.

Abstract: A computer system has a chassis, a plurality of interconnected panels mounted on the chassis in a manner defining an interior space at least partially encompassed by the panels, a circuit assembly, an electrically-powered fan within the interior space, and an energy conversion device mounted within the interior space. One or more of the panels has an airflow opening therein. The circuit assembly is mounted on the chassis within the interior space and includes a heat generating system component. The heat generating system component includes a surface from which energy in the infrared (IR) electromagnetic spectrum is emitted during operation thereof. The energy conversion device is configured for converting the emitted infrared energy to electrical energy and is electrically connected to the electrically-powered fan for providing the electrical energy thereto.

Abstract: A server includes a server enclosure having an accommodating room with a front area and a rear area and a top plate defining a first intake hole communicating with the accommodating room, a first component module and a second component module respectively at the front and rear areas, a first fan module and a second fan module in the accommodating room. The first fan module is for forcing air to flow from the front area to the rear area. The second fan module includes an air-guiding housing and a fan inside the air-guiding housing. The air-guiding housing has a second intake hole aligned with the first intake hole, and an exhaust hole opening toward the rear area. The fan draws air outside the server enclosure through the first and second intake holes, and blows the air toward the rear area through the exhaust hole.

Abstract: An entertainment system includes a video system mounted within an automobile headrest, the headrest including a headrest body in which the video system is mounted. A cooling system is integrated with the headrest for maintaining the video system at a desirable temperature.

Abstract: A fan module for dissipating heat from a computer server includes a mounting bracket and a fan mounted on the mounting bracket. The mounting bracket is mounted to an outside of the computer server. The mounting bracket is hollow and forms an air passage in an interior of the mounting bracket. The air passage is communicated with an interior of the computer server. An airflow generated by the fan flows into the interior of the computer server through the air passage to take heat away from the interior of the computer server.

Abstract: An electronic device includes: a first housing that includes an inlet and an outlet on one end; a second housing; and a linkage section that links the second housing to the first housing such that the second housing can be opened and closed. The device is configured such that the second housing divides at least a part of a space between the inlet and the outlet while the second housing is in the open position relative to the first housing. While the second housing is opened relative to the first housing, the second housing divides the space between the inlet and the outlet, thereby preventing the exhausted warm air from being drawn into the electronic device.

Abstract: An electronic equipment includes an air flow control unit that controls an air flow generated by an air blow. The electronic equipment includes an expanding unit that is disposed behind the air flow control unit, includes an additional electronic circuit for an electronic circuit mounted on a main board, which are cooling targets of the air blow, and expands a function of the electronic circuit of the main board. The expanding unit has a hollow structure casing and includes the additional electronic circuit in an inside of the hollow structure casing. The air flow control unit has an opening part to allow the air flow to pass through and a blocking part to block the air flow, and supplies most of the air flow into the inside of the hollow structure casing of the expanding unit by the opening part and the blocking part, the blocking part including a vent.

Abstract: An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers.

Abstract: A cooling unit (80) comprising at least one cooling coil, at least one fan (86) for circulating air through said at least one cooling coil, and a housing containing said at least one cooling coil and fan, wherein said housing is sized to fit within an IT server rack and is arranged for attachment to said rack. This allows a cooling unit to be fitted to an IT rack conforming to EIA 310 D specifications. Such racks, in particular the 19? configuration, are commonly found in datacentres and computer rooms and therefore the provision of a cooling unit which can be inserted into such a rack allows an existing datacentre to quickly be adapted to take advantage of the latest in computer room cooling methodology. The cooling unit (80) can be mounted in a semi-recessed configuration with the at least one fan projecting beyond the rack boundary to reduce power consumption.

Abstract: A thermal management system is provided. The system can include an electronic device enclosure having a first surface and a second surface. At least a portion of the perimeter of the first surface can be disposed proximate the second surface to provide a chamber between the first and second surfaces. At least one first aperture in fluid communication with the chamber can be disposed on the second surface, while at least one second aperture in fluid communication with the chamber can be disposed on the first surface. A fluid mover, having a fluid inlet and a fluid discharge, can be disposed proximate the second aperture. Fluid from the chamber can provide an inflow to the fluid inlet and an outflow from the fluid discharge can be directed to the exterior of the electronic enclosure.

Abstract: A video/audio computer display processor comprising a chassis, a video processor, a graphics card, and a ventilation duct. The chassis has first, second and third fans mounted therein and the video processor has a processor heatsink mounted thereon, wherein the processor heatsink has fins extending therefrom. The first fan is mounted on the processor heatsink and the second fan is positioned to direct an airflow parallel to and along the fins of the processor heatsink. The graphics card has a graphics card heatsink mounted thereon, and the graphics card heatsink has fins extending therefrom. The ventilation duct extends along a side of the chassis and has an opening therein adjacent the graphics card heatsink. The third fan is positioned to direct airflow through the ventilation duct, out through the opening and parallel to and along the fins of the graphics card heatsink.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Abstract: A heat dissipating apparatus includes a first fan and a second fan. A clipping portion with a block is located on the first fan. A receiving hole is defined in the second fan, and two first retaining panels and a second retaining panel extend from the second fan. The two first retaining panels are substantially parallel to each other and perpendicular to the second retaining panel. The clipping portion is located between the two retaining panels and abuts the first retaining panel, and the block is engaged in the receiving hole.

Abstract: A motherboard for an electronic device includes a main circuit board, an interface, and a sub-circuit. The main circuit board holds a plurality of heat generating element, and the sub-circuit board is electrically connected to the main circuit board through the interface. The sub-circuit board includes a connecting board and a holding board for holding heat generating elements. An end of the connecting board is electrically connected to the main circuit board through the interface, and another end of the connecting board is electrically connected to the holding board. The holding board and the main circuit board are located at opposite ends of the connecting board, and the holding board is spaced with the main circuit board in parallel.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.

Abstract: A cooling fan housing assembly for assembling to a heat sink includes a boosting portion and a connecting portion extended from the boosting portion. The connecting portion includes a first part and a second part for covering on and fixing to the heat sink. The second part of the connecting portion is provided with at least one hooking section for firmly hooking to the heat sink, so that a cooling fan supported on the cooling fan housing assembly can be quickly assembled to the heat sink without the risk of producing vibration during the operation of the cooling fan. Therefore, the cooling fan housing assembly not only reduces assembling labor and time and manufacturing cost, but also enables stable operation of the cooling fan.

Abstract: An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.

Abstract: A cooling device for rack mount equipment comprises an extensible side duct, open on its inner and rear-facing sides which redirects warm exhaust air exiting vents in the side of a chassis towards the rear of an enclosure holding the chassis. An apparatus incorporating the cooling device may be installed in a rack with the extensible side duct in a retracted position. The extensible side duct may extend under the influence of air pressure, forming a plenum in fluid communication with the interior of a chassis on which it is mounted such that warm air exiting the chassis is collected in the plenum formed by the extensible side duct and directed out towards the rear of the chassis. Use of the apparatus permits conventional front-to-back cooling airflow patterns to be maintained even with chassis having side exhaust vents.

Abstract: An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, includes a heat exchange assembly disposed within an outlet door cover of the computer rack, having one or more perforations. One or more air moving device(s) are also disposed on the outlet door and activated by an activator when the door is opened such that the devices when activated force hot air into the heat exchanger. Cool air is then exhausted through a planar containment plate having a plurality of edges. The plate is secured to top of the outlet door along one of its edges.

Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.

Abstract: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

Abstract: An exemplary server system includes a server cabinet defining a space therein; a number of racks arranged in the space, a number of servers mounted in the racks, and a heat dissipation apparatus arranged under the racks. A channel is defined between the racks. Each of the servers includes a drawing fan. The heat dissipation apparatus includes a fan module and two heat exchangers respectively arranged at opposite sides of the fan module. The fan module is aligned with the channel for generating upward a flow of cooling air upward to the channel. During operation of the server system, the cooling air is drawn across the servers by the drawing fans to evacuate heat from the servers and becomes heated air, and the heated air flows down to the heat exchangers where the heat is dissipated from the heated air such that the heated air become the cooling air again.

Abstract: A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.

Abstract: A heat dissipation apparatus includes a computer case having a base plate, a motherboard positioned on the base plate, and a heat sink. The motherboard includes a first heat source positioned thereon. The heat sink is positioned on the first heat source and thermally contacts with the first heat source. The motherboard includes a second heat source located on a first side of the heat sink. An angle between the second heat source and a motherboard plane is greater than 0 degrees and less than 90 degrees. Airflow from outside of the computer case is able to flow through a top surface and a bottom surface of the second heat source to dissipate heat for the first and second heat sources.

Abstract: A computer includes an enclosure, and a mainframe module enclosed in the enclosure. The mainframe module includes a base board defining a motherboard, a plurality of drive devices, a heat sink device and a fan thereon. The heat sink device includes a heat sink having a plurality of fins and a heat pipe. The base board is divided into a first part and a second part. The motherboard is located in the first part, and the drive devices are located in the second part. The fan is located between the first and second parts. The heat pipe transmits heat from a heat source on the motherboard to the plurality of fins. The fan blows air to the plurality of fins to cool the heat source on the motherboard.

Abstract: A storage device transporter includes a transporter body having first and second body portions. The first body portion is configured to be engaged by automated machinery for manipulation of the storage device transporter. The second body portion is configured to receive and support a storage device. The first body portion is configured to receive and direct an air flow over one or more surfaces of a storage device supported in the second body portion.

Abstract: An air duct defines a first air vent and a second air vent at opposite ends thereof, respectively. The air duct includes a duct body and a movable plate. The duct body defines a through opening in a side thereof. The through hole intercommunicates an interior and an exterior of the air duct. The movable plate is mounted on the side of the duct body adjacent to the through opening. By moving the movable plate, the through opening can be changed between an open state and a closed state freely. An electronic device incorporating the air duct is also provided.

Abstract: A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vented out of the housing through the top wall by the fan.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An air duct includes a top panel and a blocking member rotatable secured to the top panel. A through hole is defined in the top panel, and a pair of clipping portions are located an edge of the through hole. The blocking member includes an operating portion and a blocking portion connected to the operating portion. The operating portion is located on an outside of the top panel, and the blocking portion is located on an inside of the top panel. The operating portion of the blocking member is passed through a bottom surface of the top panel through the through hole, extends to a top surface of the top panel, and engaged with the pair of clipping portions.

Abstract: A display device includes a substrate having light emitting elements for display on a front surface; a substrate supporting body having an opening in the center and positioned on the back surface side of the substrate to support a peripheral region of the substrate; a case body positioned on the back surface side of the substrate supporting body and covering a part of the center opening; a fan unit arranged in the case body; a wind path plate arranged between the fan unit and the back surface of the substrate and forming a wind path to pass airflow generated by driving the fan unit only on the back surface side of the substrate; and a power supply arranged in the case body and on the back surface of the wind path plate; and wherein the airflow impinges the wind path plate through the fan, thereafter passes through the wind path and is discharged to the outside from the back side of the wind path plate.

Abstract: A cooling system includes a system air intake, a system air outlet, a fan, and a noise-reducing outlet. The fan includes a fan intake, and a fan outlet. The fan drives airflow, from the system air intake through the fan intake, the fan outlet, and the system air outlet. The noise-reducing outlet is located adjacent to the fan outlet. When the airflow exits through the fan outlet, a portion of the airflow exits through the noise-reducing outlet.

Abstract: A computer system includes a chassis and an airflow guiding duct. The chassis includes a chassis bottom wall, a chassis front wall and a chassis rear wall. The chassis front wall defines a first ventilation hole, and the chassis rear wall defines a second ventilation hole. A motherboard is secured to the chassis bottom wall between the chassis front wall and the chassis rear wall. A memory card is secured to the motherboard. The airflow guiding duct is secured in the chassis and includes an entrance portion. The entrance portion covers a portion of the memory card, so as to guide airflow. Airflow flows in the chassis via the first ventilation hole, over the memory card, and then out of the chassis via the second ventilation hole.

Abstract: An apparatus has a plurality of printed board units each including a printed board, a frame to have the printed board arranged therein, a first rail to be arranged at a first lower end of an inner wall of the frame having the printed board located thereon in a lower opening of the frame, and a second rail to be arranged at a second lower end opposed to the first lower end in the opening; a housing including a rail holding unit to movably hold the first rail of a first printed board unit and the second rail of a second printed board unit adjacent to the first printed board unit among the plurality of printed board units; and a cooling fan to be arranged on an upper side or underside of the housing to send air into the frame.

Abstract: A fan box is provided with, in addition to an intake port in the front face, a second intake port at a wall surface position upstream of a fan. An Input/output unit disposed above or below the fan box comprises an exhaust notch that is aligned with the second intake port of the fan box, as well as an intake notch that is provided further to the rear than the exhaust notch. The intake notch is in communication with an air duct that opens in the front face of the processor and that leads to a unit box. The fan discharges through an exhaust port cooling wind that has flowed into the first intake port via an operation unit, as well as cooling wind that has flowed into the second intake port via the Input/output unit.

Abstract: Embodiments of the disclosed technology comprise a method of dissipating heat from within a case of a computer, and a computer case designed therefor, which functions by placing add-on cards into the computer housing or case. In this manner, convection aids in cooling off the interior of the computer as the add-on cards, which generate significant amounts of heat in some computer systems, are placed at the top. As it is unsightly to have add-on cards and their corresponding cables, and the like, exiting from the top of a computer case, in embodiments of the disclosed technology, an air channel is created between the top of the case, comprising portals for add-on cards, and a top panel. A fan may be used to aid in pushing air out of the top channel.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: An electronic device includes a chassis, a motherboard, an airflow duct, and an expansion card. The chassis includes a bottom wall, a rear wall, and a sidewall. A motherboard is disposed on the bottom wall, and a riser card perpendicularly connected to the motherboard. An expansion card is parallel to the motherboard and inserted in the riser card. The expansion card has a first end and a second end. The first end is secured to the rear wall of the chassis. An airflow duct is located on the bottom wall of the chassis. The airflow duct includes a mounting wall parallel to the chassis rear wall. The first end of the expansion card is secured to the rear wall, and the second end of the expansion card is mounted to the mounting wall of the airflow duct.

Abstract: An electronic apparatus includes a housing, first and second circuit boards disposed in the housing in such a way that the first and second circuit boards are stacked on each other, and a pump block disposed between the first and second circuit boards, the pump block abutting a first electronic part mounted on the first circuit board and a second electronic part mounted on the second circuit board, the pump block sucking air outside the housing and discharging the air out of the housing.

Abstract: An electronic equipment cabinet is provided, which includes an enclosure defining an interior space. A support is disposed with the interior space and is configured to receive electronic equipment. The bottom portion defines a base plenum configured for at least one heat exchanger, which is in fluid communication with a low temperature fluid supply and a high temperature fluid return. A closed loop gas flow distribution pathway includes a first plenum communicating with the base plenum and configured to direct a low temperature gas to the support, and a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the base plenum. A temperature sensor is disposed with the enclosure to sense the temperature of the high temperature gas flow within the enclosure.

Abstract: A display apparatus having a front substrate that is a display panel, a rear substrate disposed at a predetermined distance apart from the front substrate and facing the front substrate, the rear substrate comprising a back light unit, and a cooling device to remove heat generated by the rear substrate. The cooling device includes an actuator disposed between the front substrate and the rear substrate, the actuator to generate an ion wind using a voltage, a transparent electrode installed to face the actuator and which is grounded, a plurality of supports to support ends of the actuator, and a high-voltage power source to apply a voltage to the actuator.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow one or more fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves fanless servers installed on the server racks and introduces fan units to draw cooling air from the cold row encapsulation structure through the fanless servers on the racks.

Abstract: A server heat dissipating system includes two server assemblies, an airflow producing device configured to produce airflow, and a main airflow guiding pipe. Each server assembly includes a server cabinet configured to receive a first server and an airflow guiding device. The airflow guiding device is configured to guide airflow to the first server to dissipate heat generated by the first server. The main airflow guiding pipe is connected to the two airflow guiding devices to guide airflow from the airflow producing device to the airflow guiding devices.

Abstract: Aspects of the invention include a method and apparatus for cooling a hard drive in a hard drive array. In one example, the cooling device has similar dimensions as a hard drive on a server. Within the cooling device is a fan. The positioning of the fan provides both impingement and indirect airflow on a hard drive. The cooling device may also have power and data connections identical to those of the hard drive. These connections allow the cooling device to be connected and controlled by a control unit. The control unit may operate to monitor and control the temperature of the hard drive by controlling the power and speed of the fan. In another example, the cooling device is operable to cool DIMMs on a circuit board.

Abstract: An electronic apparatus comprises a case configured to house an electronic circuit unit and includes an air intake, through which external air is taken into the case, and an exhausting opening, from which the air is ejected, an circulator provided in the case and configured to take the external air into the case through the air intake and supply the air to the electronic circuit unit, an evaporation unit provided in the case and configured to cool the air by thermal exchange between the air and a working medium and guide the air to the exhausting opening, the working medium being vaporized as a result of the thermal exchange, and a condenser provided out of the case and configured to liquidize the working medium and supply the working medium to the evaporation unit.

Abstract: A waste heat recycling device includes an air-duct, a fan and a retaining mechanism. The air-duct is connected to a heat air. The fan communicates with the air-duct. The retaining mechanism clasps the air-duct and retains the fan. The retaining mechanism includes a clip and a support ring. An edge of the air-duct is sandwiched between the clip and the support ring.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a partition, a first cooling fan, and a second cooling fan. The partition partitions an inside of the housing into a first chamber and a second chamber. The first chamber communicates with a first inlet, a third inlet, and a first outlet. The second chamber communicates with a second inlet and a second outlet. The first cooling fan locates above the third inlet in the first chamber, and includes a first intake configured to draw air in the first chamber, and a second intake configured to draw air outside the housing through the third inlet, the first cooling fan being configured to discharge the air to a heat sink. The second cooling fan locates in the second chamber and is configured to draw air in the second chamber, and to discharge the air to the second outlet.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.