Abstract: A display unit is disclosed. A display apparatus includes a panel unit displaying images, a circuit unit provided a rear surface of the panel unit, a chamber surrounding the circuit unit, the chamber forming a predetermined space and at least one ventilation fan ventilating air inside the chamber along a circulation path passing beyond the circuit unit. According to a display apparatus according to the present invention, parts which are mounted in the display apparatus may be protected from external moisture or dust. Furthermore, heat radiation may be performed efficiently in the display apparatus according to the present invention even if environments of heat exchanging with an outside may not be formed enough in a structure of the display apparatus.

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: A Line Replaceable Unit (LRU) support system incorporates a unitary tray having a rear boss and an integral Air Cooling System (ACS) plenum and an ACS conduit through the rear boss communicating with the plenum. A tray support and alignment element provides a flange with tray attachment studs extending from a front surface, wall attachment studs extending from a rear surface, and an ACS aperture. The wall attachment studs are received in spaced holes in a mounting structure and the tray attachment studs are received in bores in the rear boss of the tray. Insertion of the tray attachment studs aligns the ACS conduit in the rear boss and the ACS aperture in the flange. A backing plate engages the wall attachment studs to secure the tray support and alignment element to the mounting structure. The backing plate includes an ACS spud aligned with the ACS aperture.

Abstract: A cooling unit, which is configured to contain and cool air between two rows of equipment racks defining a hot aisle, includes a housing configured to be secured mounted on the two rows of equipment racks such that the housing spans the hot aisle, a heat exchanger supported by the housing and coupled to and in fluid communication with a coolant supply and a coolant return, and an air movement assembly supported by the housing and configured to move air over the heat exchanger. Other embodiments of the cooling unit and methods of cooling are further disclosed.

Abstract: An electric power supply cut-off circuit comprises an IC which outputs a normal operation signal when the IC is operated normally, a switch which makes connection or disconnection between the IC and a power source, and a switching control circuit which continuously outputs a connection instruction signal during a period in which the normal operation signal is inputted from the IC, wherein the switch connects the IC and the power source when the connection instruction signal is inputted, and the switch cuts off the connection between the IC and the power source when the connection instruction signal is not inputted. Accordingly, it is possible to reliably avoid any excessive increase in the temperature of the IC and the ignition of the IC.

Abstract: In accordance with at least some embodiments, a computer system include a chassis and a main airflow channel within the chassis. The computer system also includes multiple processors and multiple memory banks positioned in the main airflow channel. The computer system also includes a removable airflow guide assembly installed in the main airflow channel, wherein the removable airflow guide assembly divides the main airflow channel into a processor-side airflow channel and a memory-side airflow channel.

Abstract: To cool a blade type server disposed in an air-conditioned room, the following arrangements are made. The first is at least one shell having a ventilation passage disposed in the air-conditioned room. The second is, the following are disposed in a ventilation passage: racks, in which blade type servers each composed of a case with slim boards housed therein are stacked; cooling coils each having a coolant passage and a cooling fin and cooling a passing air; and at least one fan unit having axial-flow fans placed therein and producing air currents in one direction. The third is the fan unit forces a cooling air to flow in one direction in the ventilation passage thereby to cool the servers in the racks. The cooling coils and racks are disposed alternately so that warmed cooling air after passing through the rack is cooled by the cooling coil and then cools the next rack.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: A cooling duct for cooling heat generating elements inside a casing with outside air includes an intake vent through which outside air taken in from outside the casing is drawn, a guiding unit configured to guide the outside air drawn through the intake vent to a first target element being a heat generating element to be cooled, a discharge vent through which the outside air guided by the guiding unit is discharged to the first target element, and a branch pipe provided in the guiding unit and configured to guide part of the outside air flowing in the guiding unit to a second target element being another heat generating element to be cooled.

Abstract: An acoustically absorptive apparatus is provided which includes an acoustically absorptive panel and an attachment mechanism. The acoustically absorptive panel is configured to reside along a side of an electronics rack, and includes a multilayer structure to attenuate noise. The attachment mechanism slidably mounts the acoustically absorptive panel to the electronics rack and facilitates sliding of the panel relative to the rack between retracted and extended positions. In the refracted position, the panel is disposed along the side of the rack, and in the extended position, the panel extends beyond a front or back edge of the electronics rack to facilitate attenuating noise emanating from the rack or an aisle alongside a row of multiple racks. In addition, the acoustically absorptive panel hingedly couples along a vertical edge to the attachment mechanism such that the panel is also rotatable outward away from the side of the electronics rack.

Abstract: A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.

Abstract: An exemplary computer system includes a casing, and plural brackets, hard disk drives, cooling fans and system fans received in the casing. The casing defines plural through holes and ventilating holes at two opposite sides thereof, respectively. The brackets are evenly distributed in the casing side by side along a direction perpendicular to each of the two opposite sides of the casing. Each bracket includes two parallel boards each defining plural apertures. The hard disk drives each are sandwiched between the two parallel boards of one bracket. The hard disk drives and the apertures are alternating. The cooling fans are disposed between the brackets. The system fans are received in the casing, and located between the brackets and the ventilating holes. The cooling fans and systems are aligned in series.

Abstract: Systems and methods for reducing problems and disadvantages associated with traditional approaches to cooling information handling resources are provided. A method for cooling information handling resources, may include conveying a flowing fluid proximate to one or more information handling resources such that the flowing fluid is thermally coupled to the one or more information handling resources and heat generated by the one or more information handling resources is transferred to the flowing fluid. The method may also include conveying the flowing fluid to a cooling unit such that heat is transferred from the flowing fluid.

Abstract: A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.

Abstract: According to one embodiment, an equipment enclosure includes a plurality of equipment elements, each element having one or more heat generating sources. A heat exchanger is mounted towards the top of the equipment enclosure. The heat exchanger is thermally coupled to at least some of the heat generating sources. The enclosure includes an exhaust vent through which air heated by the heat exchanger may be evacuated, and an inlet vent through which air from outside the equipment enclosure may be drawn into the equipment enclosure to cool the heat exchanger by stack effect ventilation.

Abstract: An embedded computer chassis may include a midplane having a first side and second side substantially opposite each other, where the midplane is suitably adapted to receive at least one computer card in each of the first side and the second side. Embedded computer chassis may further include a cooling region suitably adapted to cool the at least one computer card, where at least a portion of the cooling region is suitably adapted to receive a first fan tray and a second fan tray, where the first fan tray is suitably adapted to couple to the first side of the midplane, and where the second fan tray is suitably adapted to couple to the second side of the midplane. The first fan tray and the second fan tray are substantially redundant for removing the heat generated by the at least one computer card.

Abstract: A fan module for dissipating heat from a computer server includes a mounting bracket and a fan mounted on the mounting bracket. The mounting bracket is mounted to an outside of the computer server. The mounting bracket is hollow and forms an air passage in an interior of the mounting bracket. The air passage is communicated with an interior of the computer server. An airflow generated by the fan flows into the interior of the computer server through the air passage to take heat away from the interior of the computer server.

Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.

Abstract: Apparatuses, methods, and systems directed to efficient cooling of data centers. Some embodiments of the invention allow encapsulation of cold rows through an enclosure and allow server fans to draw cold air from the cold row encapsulation structure to cool servers installed on the server racks. In other particular embodiments, the systems disclosed can be used to mix outside cool air into the cold row encapsulation structure to cool the servers. In some embodiments, the present invention involves using multiple cold row encapsulation structures to cool the servers installed on the racks.

Abstract: An electronic equipment enclosure comprises a frame structure formed from a plurality of support posts and at least partially enclosed by a plurality of panels. The panels include at least side, top and back panels defining an enclosure having a top, a bottom and a rear thereof. The top panel includes an opening there through that is rectangular in shape. The equipment enclosure further comprises an exhaust air duct extending upward from the top panel of the enclosure. The exhaust air duct is rectangular in cross-section and is disposed in surrounding relation to, and in fluid communication with, the top panel opening. The exhaust air duct is adapted to segregate hot air being exhausted from the enclosure from cool air entering the enclosure, thereby improving thermal management of the enclosure.

Abstract: A cooling system includes a plurality of fans and a fan bracket accommodating the fans. Each fan comprises a fan intake and a fan outlet. The fan bracket defines a plurality of air inlets and a plurality of air outlets therein. The fan bracket is provided with a fan guard in each air outlet and a plurality of noise-reducing holes in the fan guard. The air inlets of the fan bracket communicate with the fan intakes and the air outlets of the fan bracket communicate with the fan outlets, respectively. Airflow generated by the fans through the fan outlets comprises a portion exiting through the noise-reducing holes.

Abstract: A housing for holding electronic plug-in assemblies having a component installation space open toward the front side of the housing for the plug-in assemblies and a fan space arranged above the component installation space with a cover plate and a lateral air outlet. The fan space contains at least one axial fan with an air outlet on the top side of the fan. The axial fan is arranged in the fan space such that air is drawn out from the component installation space. An air-guiding plate that runs in the direction of the air outlet of the fan space is positioned between the top side of the fan and the cover plate of the fan space.

Abstract: An electronic device includes a chassis. The chassis has a bottom wall and a rear wall, substantially perpendicular to the bottom wall. A motherboard is disposed on the bottom wall, and a riser card is perpendicularly connected to the motherboard. An expansion card is substantially parallel to the motherboard and coupled to the riser card. The expansion card has a first end and a second end, and the first end is secured to the rear wall. An airflow duct is located on the bottom wall of the chassis. A supporting bar protrudes from the airflow duct. A securing member is pivotably mounted to the airflow duct. The securing member includes a pressing plate. The second end of the expansion card is clamped between the pressing plate and the supporting bar of the airflow duct.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: An exemplary embodiment of the present invention provides a computer system. The system includes an enclosure configured to house a plurality of electronic devices. The system also includes a fan coupled to the enclosure and configured to provide a flow of cooling air through the enclosure to cool the electronic devices. The system also includes a first airflow path configured to allow the cooling air to exit the enclosure and attenuate noise generated in the enclosure. The system also includes an auxiliary outlet configured to provide a second airflow path if the first airflow path is obstructed.

Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

Abstract: An electronics assembly (48) is disclosed that utilizes a filter (24) within a plenum (50). The filter (24) may be electrically isolated from at least certain portions of the electronics assembly (48) by an electrical insulator (64). The electronics assembly (48) furthermore alleviates the need for a separate filter tray, and in this regard it may be such that only a first filter end (80) and a second filter end (82) of the filter (24) are supported within the electronics assembly (48).

Abstract: A storage device testing system that includes at least one rack, test slots housed by each rack, and at least one air mover in pneumatic communication with the test slots. Each test slot includes a test slot housing having an entrance and an exit, with the entrance configured to receive a storage device. The at least one air mover is configured to move air exterior to the racks into the entrance of each test slot housing, over the received storage device, and out of the exit of each test slot housing.

Abstract: A cooling device for dissipating heat for an electronic device includes a shell to absorb heat generating from a heat generating element in the electronic device, and a number of fins. The shell bounds a heat exchanging space and defines an air intake and an air outlet. The number of fins extends into the heat exchanging space. The shell guides air outside the shell to enter into the shell through the air intake and to exit from the shell through the air outlet after exchanging heat in the heat exchanging space.

Abstract: An interior cooling structure according to the present invention includes a frame in which a plurality of circuit board modules are stacked, with electronic components mounted on the plurality of circuit board modules by being classified by function; an external housing which covers the frame together with the plurality of circuit board modules; a plurality of cooling devices which reduce temperature rises in the external housing caused by heat produced by the plurality of circuit board modules; and a heat generating region a partitioned in such away as to enclose a circuit board module which has the highest total power consumption out of the plurality of circuit board modules, wherein the plurality of cooling devices are arranged in such away as to reduce temperature rises in the heat generating region by displaying capacity higher than capacity of each of the cooling devices.

Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.

Abstract: A docking plenum for a rack is disclosed. The docking plenum includes a pair of sides that are coupled to first and second panels at the top of the docking plenum. The panels at the top of the docking plenum are separated from one another by an aperture. The docking plenum includes a front opening and a rear opening between the two sides. Each of the front opening and the rear opening are sized to receive a rack. The placement of a first rack in the front opening and a second rack in the rear opening creates a heated air cavity that is formed by the racks, the floor of the docking plenum, and the panels at the top of the docking plenum. When the racks are placed in the opening, and when one or more fans in the computer systems are activated, the fans draw air from outside the plenum across the interior of the computer systems. Heated air exits the computer systems and enters the heated air cavity. The heated air exits the heated air cavity through the aperture in the top of the docking plenum.

Abstract: In a storage device accommodating a plurality of memory devices in a general-purpose chassis provided from both surface sides thereof, a cooling device is provided on the front of the memory devices. This cooling device is allowed to freely move to leave available the area in front of the memory devices, thereby enabling maintenance and replacement of the memory devices from the both surface sides of the chassis. With such a storage device of a type using a general-purpose chassis, and inserting therein a plurality of memory devices from the both surface sides thereof, even if a cooling device is located on the front of the chassis, the memory devices can be subjected to maintenance and replacement.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: An electronic device includes a housing, a plurality of heat-dissipating fins, and a heat-dissipating fan. The housing defines a receiving space, and an opening communicating the receiving space with the outside environment. The housing includes a power socket disposed in the receiving space. The heat-dissipating fins are disposed in the receiving space. The heat-dissipating fan includes a power plug portion corresponding to the power socket. The heat-dissipating fan is mountable in the receiving space through the opening so as to provide air flow across the heat-dissipating fins. The power plug portion is inserted into the power socket upon insertion of the heat-dissipating fan into the receiving space. The heat-dissipating fan is removable from the housing through the opening for cleaning of the heat-dissipating fan and the heat-dissipating fins.

Abstract: According to one embodiment, a heat removal system for a computer room includes a heat pipe having two ends. One of the ends is thermally coupled to one or more of a number of components forming a portion of a computing system. The other end is thermally coupled to a heat dissipation mechanism. The heat pipe is operable to move heat from the components of the computing system to the heat dissipation mechanism.

Abstract: An electronic equipment cabinet configured to support electronic equipment is provided and may include a shelf positioned in the cabinet separating the cabinet into a first zone and a second zone. The first and second zones may be in fluid communication with a cool air source. In some examples, the first zone may receive cool air directly from a cool air source and the second zone may receive cool air from a duct in fluid communication with the cool air source. In another example, both the first and second zones may receive cool air from the cool air source through a duct. In yet other examples, the cabinet may include a baffle between the cool air source and one of the first zones and the second zones to selectively control a quantity of cool air provided to the one of the first and second zones.

Abstract: The invention relates to a system unit of a computer. The system unit has a plug-in card populated with components and a fan which supplies an air flow to an air ducting body arranged in the system unit. The air flow is provided for cooling the plug-in card which is arranged in the system unit essentially parallel to the air ducting body. Cooling of the plug-in card is improved in that the air ducting body has a central conduit and a first and a second side conduit. The side conduits are provided with a plurality of openings which are arranged in a row and aligned essentially parallel to heat sinks arranged on the plug-in card. The central conduit has a constriction for the admission of air.

Abstract: An air volume control module for use with a vehicular air conditioning apparatus includes a circuit board including a control circuit for controlling the rotational speed of the blower of the vehicular air conditioning apparatus, a heat sink connected to the circuit board and including a fin for radiating heat generated by the circuit board, and a base housing surrounding the circuit board, the heat sink being inserted in the base housing with the fin projecting from the base housing. The base housing is mounted on the heat sink only by a locking finger. Either one of the base housing and the fin of the heat sink has a protective projection having a heightwise dimension greater than that of the locking finger.

Abstract: Airflow intake systems for use with computer cabinet air conditioning systems are disclosed herein. In one embodiment, a computer system includes a plurality of computer modules and an associated air mover positioned in an interior portion of a computer cabinet. The computer cabinet includes an opening that provides access to the interior portion. In this embodiment, a door or other panel is positioned in front of the opening and is at least partially offset from the opening to define a gap between the panel and the cabinet. Operation of the air mover draws cooling air into the cabinet through the gap, and then drives the cooling air through the cabinet to cool the computer modules.

Abstract: A cooling system may include a fan which may be placed near the center of the system board. The fan may include bottom inlet and may draw air through an opening in the bottom skin of the computer system and may generate a positive pressure within the computer system. Exhaust vents may be positioned at the periphery.

Abstract: A cooling unit includes: a heat absorbing section which absorbs heat from a heat-producing element; a heat radiating section which defines a ventilation area and radiates the heat into air passing through the ventilation area; and a fan having a blowing opening and blowing air toward the ventilation area from the blowing opening. The blowing opening and the ventilation area are different in size and/or position in a direction intersecting a flow of the air. The cooling unit further includes a filter installed between the blowing opening and the ventilation area to remove foreign substances in the air blown to the ventilation area. The filter has a wall guiding the air to the ventilation area from the blowing opening by connecting the blowing opening and the ventilation area at a part of a portion that is a difference in size and/or position between the blowing opening and the ventilation area.

Abstract: The present invention pertains to a computer chassis with improved airflow to reduce the occurrence of trapped air pockets and increase heat transfer from components within the chassis. The computer chassis includes a plurality of chambers, wherein each of the chambers is separated by a partition. The partitions are operable to reduce the occurrence of trapped air pockets and increase heat transfer from components of the chassis by causing air to flow through each of the chambers. The computer chassis further includes at least two air vents, wherein each of the chambers is coupled to at least one of the at least two air vents through which air enters the chamber, and wherein each of the chambers is coupled to at least one of the at least two air vents through which air exits the chamber.

Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: A disk array device comprises: a hard disk drive module including a disk for recording information thereon and having one side that has a length substantially equal to the diameter of the disk; a battery nodule; an operation module; a fan module having at least one cooling fan; a controller module having a controller; a power supply module provided for supplying power to the modules; a circuit board to which the above-mentioned modules are connected via electrical connectors; and a substantially box-shaped chassis in which the modules and the circuit board are housed. A front surface and a rear surface of the chassis are opened in a rectangular shape. A length of one side of the opened front surface of the chassis is substantially the same length as the one side of the hard disk drive module.

Abstract: A computer includes a casing; the computer further comprises a motherboard, a hard disk drive mounting structure and a hard disk drive accommodated in the casing. The motherboard is mounted on a fixing plate of the casing. The hard disk drive mounting structure is located above the motherboard, and includes a heat dissipation apparatus including a heat sink, a mounting frame, and a supporting bracket connected between the mounting frame and a base of the heat sink. A bottom end of the supporting bracket is fixed to the base of the heat sink. A top end of the supporting bracket is fixed to one end of the mounting frame to support the mounting frame, which has another end fixed to a side plate of the casing. The hard disk drive is mounted on the mounting frame.

Abstract: A blind (10) for a projector includes a bracket (20) mounted to the projector, and a folded fin (30) fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins (32) and a plurality of upper and lower tabs (34, 36) interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.

Abstract: A cooling device includes a chassis that partitions a first space, a second space, and a third space sandwiched between the first space and the second space, a printed circuit board accommodated in the chassis that extends from the first space to the second space while traversing the third space, a fan occupying the third space outside a predetermined space that produces an air flow from the first space toward the second space by rotation of a rotor blade, wherein the predetermined space is ensured between the printed circuit board and the fan in the third space and an air duct member that occupies the predetermined space to form a flow passage of the air flow from an intake port to an exhaust port on the printed circuit board, wherein the intake port is opened to the second space and the exhaust port is opened to the first space.

Abstract: According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board.