Abstract: An information handling center includes an information handling system (IHS) rack configured to receive cooled fluid from a pressurized plenum. The IHS rack includes at least one ventilator that is operable to cause cooled fluid to be drawn from the pressurized plenum into the IHS rack. A cooling fluid supply unit is coupled to the pressurized plenum and operable to cool a fluid passing through the cooling fluid supply unit and direct that cooled fluid into the pressurized plenum. A fluid flow control is located in the cooling fluid supply unit and coupled to a pressure sensor that is operable to determine a pressure in the pressurized plenum. The fluid flow control is operable to adjust the flow rate of the fluid passing through the cooling fluid supply unit based on the pressure determined by the pressure sensor.

Abstract: An electrical apparatus having a cooling system includes a first cover to cover a first part of the electrical apparatus to be cooled and a second cover substantially enclosing the first cover to define a surrounding space. A base plate on which the first cover is mounted defines an environmentally-sealed enclosure that houses the first part of electrical apparatus. A first circulation device causes air to circulate in the environmentally-sealed enclosure and a second circulation device causes a cooling fluid to circulate around the surrounding space. A heat transfer structure is positioned on each side of the first cover. A third cover is mounted to an opposite side of the base plate from the first cover to define a second enclosure that houses a second part of the electrical apparatus to be cooled. A heat exchange structure is positioned within the second enclosure. The second circulation device is arranged to drive cooling fluid both through the heat exchange structure and through the surrounding space.

Abstract: A server chassis includes a base defining an opening, a rotating plate, a sliding plate, and first and second elastic members. The base includes a middle plate opposite to the opening and defines a space communicating with the opening. The rotating plate defines a plurality of first air holes. The sliding plate defines a plurality of second air holes. The rotating plate is rotated toward the middle plate when the functional module is inserted into the space, the sliding plate abuts against the middle plate and slides toward the opening, and the second air holes align with the first air holes. The second elastic member restores the rotating plate to obstruct the opening when the functional module is drawn out, and the first elastic member restores the sliding plate to make the second air holes be staggered with the first air holes.

Abstract: In a disk array apparatus, by taking note of a first sound of a specific frequency which is a noise element of original sounds generated from a fan, a second sound whose phase is inverted to that of the first sound is generated by a structure of a cooling air flow path passing through the fan, and the second sound is synthesized with the first sound on the cooling air flow path, thereby reducing the noise. For example, an exhaust duct is located on a fan unit in an upper part of the apparatus, two flow paths extending to an exhaust port are formed in an internal structure of the exhaust duct, and the two flow paths are designed so that the difference in the flow path length therebetween becomes equivalent to half wavelength of the specific frequency.

Abstract: A connection assembly has a midplane, first midplane connectors and second midplane connectors. The midplane is divided into an airflow section and a connector section by a dividing line. The midplane defines a first side and a second side which faces away from the first side. The airflow section provides airflow passageways connecting spaces on both sides of the midplane. The connector section provides (i) first mounting locations which are confined to the connector section on the first side and (ii) second mounting locations which are confined to the connector section on the second side. The first midplane connectors are arranged to connect to first circuit board modules, and are mounted over the first mounting locations on the first side. The set of second midplane connectors are arranged to connect to second circuit board modules, and are mounted over the second mounting locations on the second side.

Abstract: Apparatus and methods for thermal conditioning equipment. In a preferred embodiment, an equipment enclosure comprises a body, a wall, a fluid port, and a fixture. The body defines an outer plenum and an inner chamber in the latter of which the fixture retains the equipment. The wall, which is between the outer plenum and the inner chamber, isolates the thermally conditioned first fluid from a second fluid in the inner chamber. Since the wall is thermally conductive it allows heat to be transferred between the outer plenum and the inner chamber. The fluid port is in communication with the outer plenum to allow the thermally conditioned first fluid to flow into the outer plenum. Baffle plates are also provided to distribute flow of the second fluid to the equipment.

Abstract: With the storage control device of the present invention, it is possible to mount a larger number of storage devices and to cool them effectively. A plurality of sub-storage units are provided within one storage unit. Each sub-storage unit includes a plurality of hard disk drives, a plurality of enclosures, and a plurality of power supply devices. A cover is divided into a front cover which covers over the front side of a case, and a rear cover which covers over the rear side of the case. Shield portions are provided on the upper sides of the hard disk drives and the enclosures. By these shield portions contacting the adjacent modules (other disk drives and other enclosures), it is possible to reduce the negative influence upon cooling air draft passages within the case, even when a cover has been removed.

Abstract: A disk array apparatus includes a plurality of disk drives arranged in at least one disk drive line in a direction of an airflow, at least one shield plate, a housing containing the disk drives and the at least one shield plate therein, and flow passages arranged between an upper surface of the disk drives and an inner wall of the housing for enabling the airflow to pass through. The at least one shield plate is arranged between at least two of the disk drives of the at least one disk drive line for controlling the airflow on a downstream side of the flow passages.

Abstract: An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers.

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.

Abstract: A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releasably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and at least one adjustable filler panel assembly. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. Each adjustable filler panel assembly selectively blocks a portion of the air inlet opening in order to prohibit air exhausted into the duct from flowing back into the enclosure.

Abstract: In a portable electronic apparatus, a second keyboard to be manipulated with a right hand is joined to a first keyboard unit including a first keyboard to be manipulated with a left hand so that the second keyboard can be turned down. A display unit having a built-in liquid crystal display is joined to the first keyboard unit so that the display unit can be tuned down. When the display unit is turned down, the display unit engages with the second keyboard unit that is turned down. When all the parts of the electronic apparatus are closed, the electronic apparatus serves as a CD player of a CD jacket size. When the display unit is opened, the electronic apparatus has not only the capability of a DVD player but also the capability of a simple personal computer. When all the parts are left open, the electronic apparatus serves as a personal computer having a full keyboard.

Abstract: In general, in one aspect, the disclosure describes a laptop computer that can allow for enhanced cooling of a passively cooled notebook while maintaining the desired waterproof and dust resistance of the design. This is achieved by creating a separate cooling channel where air can flow through to provide cooling to an electronics enclosure connected thereto. The cooling channel may utilize membranes (e.g., hydrophobic membranes) to protect again water and dust penetration. In some cases, two fans are used in opposite directions in order to automatically clean the membranes from dust accumulation.

Abstract: A system for restricting mixing of air in a data center includes a plurality of racks, each of the racks having a front face and a back face. The system includes an enclosure for collecting air released from the back faces of the plurality of racks, the enclosure configured to substantially contain the air in an area between the first row and the second row and having a roof panel coupled to the first row of racks and the second row of racks configured to span a distance between the first row of racks and the second row of racks. The enclosure is configured to maintain a first air pressure inside of the enclosure that is substantially equal to a second air pressure outside the enclosure.

Abstract: An external AC power adapter. The adapter includes a housing which, in one embodiment, defines an air inlet compartment, an air outlet compartment and a partially sealed electronics compartment containing electrical components for converting an AC input to a DC output. A blower generates an airflow within the electronics compartment for cooling the electrical components in the electronics compartment. Barriers are located in the air inlet compartment and the air outlet compartment to prevent liquid from entering the electronics compartment.

Abstract: The disclosed embodiments include a plurality of plenums for distributing cooling air throughout the switch. The switch is divided into separate cooling domains. Each PCB receives a separate supply of cooling air, so that no PCB is located upstream or downstream from another PCB. The present embodiments thus eliminate the problem of stack rise, which can decrease switch performance.

Abstract: An electronic device. The electronic device comprises a heat source, a housing having an inlet and an outlet, a fan disposed in the housing and selectively rotating at a first speed and a second speed higher than the first speed to generate air flow in the housing to cool the heat source, and a plurality of louvers disposed on the housing, having adjustable angles and selectively positioned at a first angle and a second angle. When the louvers are positioned at the first angle, the fan rotates at the first speed, and when the louvers are at the second angle, the fan rotates at the second speed.

Abstract: A fan enclosure for a system including one more fans and a system enclosure includes a first pivot removably attached to the system enclosure, a safety compliant fan grill attached to the first pivot rotatably between a natural closed position and a forced open position, and a cam disposed on the safety compliant fan grill. The safety compliant fan grill covers the one or more fans in the natural closed position. The cam is configured to force the safety compliant fan grill into the forced open position when a top cover of the system enclosure is placed in a closed position.

Abstract: A computer enclosure includes a chassis, an airflow-guiding device, and a mounting mechanism. The chassis includes a mounting bracket. The mounting bracket defines a receiving slot therein. The airflow-guiding device is mounted to the chassis adjacent to the mounting bracket. The mounting mechanism is installed on the airflow-guiding device. The mounting mechanism includes a hook received in the receiving slot and configured to mount the airflow-guiding device to the chassis. The mounting mechanism is configured to slide on the airflow-guiding device to disengage the hook from the receiving slot.

Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.

Abstract: A method and incorporated assembly is provided for cooling of an electronic device or component. The assembly comprises a thermal duct having a fixed duct portion and a removable duct portion. The portions each have complementary interlocking components to secure them to one another. Also a first attachment block is provided. The first attachment block has complementary interlocking portions with the fixed and removable duct portions such that the block can be secured at least partially to each of the fixed duct portion and the removable duct portion. A second attachment block is also provided that has a complementary interlocking portion with the removable duct portion. This second attachment block can be secured to one or more electronic devices requiring cooling.

Abstract: Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.

Abstract: An airflow arresting apparatus is provided configured to reside above an electronics rack within a data center. The apparatus includes an airflow arrester and a track mechanism. The airflow arrester includes a collapsible panel sized and configured to reside above the electronics rack, and when operatively positioned above the electronics rack, to extend vertically above the electronics rack and at least partially block airflow from passing over the electronics rack between the air outlet and air inlet sides of the rack. The track mechanism is sized and configured to reside above the electronics rack, and the airflow arrester is slidably engaged with the track mechanism. Positioning of the airflow arrester at a desired location above the electronics rack is facilitated by the airflow arrester slidably engaging the track mechanism.

Abstract: An airflow conducting apparatus is used for dissipating heat from at least one memory module received in a corresponding socket on a motherboard. The airflow conducting apparatus includes an airduct and a valve piece. The airduct is positioned over the socket and configured to guide air to flow therethrough. The valve piece is attached to an inside of the airduct. The valve piece includes a plurality of parallel elastic flaps. Each flap has at least one configuration that deflects air flowing through the airduct.

Abstract: An electronic system includes a chassis defining a substantially plane-shaped cavity. The chassis is arranged to contain an air stream (e.g., provided by a cooling subsystem) which flows from an air intake side of the chassis to an air exhaust side of the chassis through the substantially plane-shaped cavity. The air intake side of the chassis is opposite the air exhaust side of the chassis. The electronic system further includes a jacket circuit board disposed within the plane-shaped cavity, and a set of pluggable electronic modules. The jacket circuit board is oriented within the plane-shaped cavity to receive cooling from the air stream. Each pluggable electronic module is arranged to (i) electronically connect to the jacket circuit board through a front of the chassis and (ii) define a supplemental ventilation port through which air passes to augment the air stream.

Abstract: A combined-natural-and-forced-convection heat sink system including a plurality of fins protruding from a first surface of a conductive material, a plurality of air channels formed between the first surface and an opposing second surface of the conductive material and at least one fan. The plurality of fins forms a natural-convection heat sink. The plurality of air channels forms a forced-convection heat sink. The natural-convection heat sink and the forced-convection heat sink form a combined-natural-and-forced-convection heat sink. Each air channel has an input end opening on an input surface of the conductive material and each air channel has an output end opening on an output surface of the conductive material. The at least one fan is configured to generate an air flow through the air channels when at least one of the fans is operating.

Abstract: A computer enclosure includes a chassis, an airflow-guiding device, and a mounting mechanism. The chassis includes a mounting bracket. The mounting bracket defines a receiving slot therein. The airflow-guiding device is mounted to the chassis adjacent to the mounting bracket. The mounting mechanism is installed on the airflow-guiding device. The mounting mechanism includes a hook received in the receiving slot and configured to mount the airflow-guiding device to the chassis. The mounting mechanism is configured to slide on the airflow-guiding device to disengage the hook from the receiving slot.

Abstract: A noise-reducing attachment apparatus for a heat exchanger door is provided for facilitating attenuation of noise emanating from an electronics rack. The apparatus includes a frame structure configured to coupled to the heat exchanger door. The door includes in air opening and air-to-liquid heat exchanger, and air passing through the air opening also passes across the heat exchanger. The air opening facilitates passage of external air through the electronics rack. The frame structure defines in part an airflow channel through the apparatus, wherein air passing through the air opening also passes through the airflow channel when the apparatus is operatively coupled to the door. An acoustically absorptive material, which is coupled to the frame structure and at least partially defines the airflow opening through the apparatus, is selected and positioned to attenuate noise emanating from the electronics rack when the apparatus is coupled to the heat exchanger door.

Abstract: A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably securied to the second side of the fan.

Abstract: A system, method, and computer program product are provided for circulating external air about a chipset. Included is a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory. Further provided is an airflow subsystem coupled to the circuit board for circulating external air about the chipset.

Abstract: A storage apparatus has a cabinet stored with an array of memory mediums, a power supply unit housed at the bottom of the cabinet, a fan provided immediately under the top surface of the cabinet and immediately above the memory mediums, and a partition member provided insides the cabinet and configured to partition a first cooling path from mixing with a second cooling path inside the cabinet. The first cooling path of first external air for cooling the memory mediums starts at an inlet on a side surface of the cabinet and ends at the top surface of the cabinet to discharge the first external air out of the cabinet form the top surface. The second cooling path of second external air for cooling the power supply unit ends at the top surface of the cabinet and discharges the second external air out of the cabinet at the top surface.

Abstract: A heat radiating unit provided in an electronic apparatus includes: a fan for blowing air; and a heat radiating member in which heat radiation fins for transmitting heat to passing air are arranged and which has an endothermic section that contacts a top surface of a first heat-producing component on a circuit substrate so as to absorb heat from the first heat-producing component. The heat radiating unit further includes a supporting member provided with a heat-radiating-member biasing section that biases the heat radiating member toward the circuit substrate. The supporting member is also provided with an endothermic arm that extends toward and contacts a top surface of a second heat-producing component so as to absorb heat from the second heat-producing component. The top surfaces of the first and second heat-producing components are different in height.

Abstract: A heat dissipation device to be mounted on a heat-generating component of a graphics card includes a base in contact with the heat-generating component, a heat dissipating member placed on the base, a fan mounted on the base adjacent to an end of the base, and a covering body. The fan is located closely to the heat dissipating member and generates airflow to the heat dissipating member. The dissipating member has a cellular structure integrally formed therein. The covering body includes a top wall in contact with a top of the dissipating member and a sidewall extending downwardly from an edge of the top wall and surrounding the dissipating member and the fan. The cellular structure comprises a plurality of elongated passages extending from the fan to another end of the base away from the fan.

Abstract: A memory module includes a circuit board and a heat sink. The circuit board is disposed with multiple chip packages separated from each other by a spacing. The heat sink is attached to the chip packages and opened with multiple holes corresponding to the spacings. Thereby, a thermal air flow chamber is formed for an airflow to enter the spacings and exchange heat with the chip packages.

Abstract: Multi-stage air movers for cooling computers and other systems are described herein. In one embodiment, a computer system includes a computer cabinet holding a plurality of computer modules. The computer cabinet includes an air inlet and an air outlet. The computer system further includes a multi-stage air mover configured to move a flow of cooling air from the air inlet, past the plurality of computer modules, and out the computer cabinet via the air outlet.

Abstract: An inverter apparatus includes heating components housed in an inverter main body and cooling fans for cooling the heating components. The inverter apparatus includes a fan unit case in which the cooling fans are housed as one integral unit, a housing space formed on an outer side of a ceiling surface of the inverter main body, and a fan cover that fixes the fan unit case. The fan unit case is slid to be housed in the housing space. The inverter apparatus makes it easier to replace cooling fans, reduce the number of components, enhance cooling efficiency, and secure high reliability.

Abstract: Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

Abstract: The invention provides a temperature control device for a disk drive unit, the temperature control device includes a housing for connection to a carrier for a disk drive unit; an air flow generator arranged in the housing for providing a flow of air to a disk drive unit in a connected carrier; and, an air flow control device arranged at the side of the air flow generator and selectively configurable to control the air flow path whereby the temperature of air flowing to the disk drive unit can be controlled.

Abstract: An apparatus for guiding air through electronic components is disclosed. The apparatus has an intake, a transition portion, and a focused egress. The transition portion is connected to the intake and defines a channel. The channel has a generally ‘u’ shaped cross-section and a first edge and a second edge configured to be positioned substantially opposing a surface. The focused egress is connected to the transition portion.

Abstract: Provided is a disk array device or an electronic device having an enhanced cooling performance with lower noises. The disk array device has doors in the front side and in the rear side of the device, each of the doors is formed with outside openings which are louver-like or bend-like, the louver- or bend-like openings in the doors being directed in directions which are opposite to each other between the door on the suction side and the door on the exhaust side.

Abstract: Method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet.

Abstract: An air circulation and ventilation unit is provided including a housing configured to fit at least partially over the ceiling of an equipment cabinet including fitting over at least one vent in the ceiling of the cabinet, so that the interior of the housing is in communication with the interior of the cabinet, the housing includes a housing vent moveable between an open position in which air may flow between the outside of the housing and the inside of the housing and a closed position in which little or no air can flow between the outside of the housing and the inside of the housing, and a controller to control the position of the housing vent.

Abstract: A docking plenum for a rack is disclosed. The docking plenum includes a pair of sides that are coupled to first and second panels at the top of the docking plenum. The panels at the top of the docking plenum are separated from one another by an aperture. The docking plenum includes a front opening and a rear opening between the two sides. Each of the front opening and the rear opening are sized to receive a rack. The placement of a first rack in the front opening and a second rack in the rear opening creates a heated air cavity that is formed by the racks, the floor of the docking plenum, and the panels at the top of the docking plenum. When the racks are placed in the opening, and when one or more fans in the computer systems are activated, the fans draw air from outside the plenum across the interior of the computer systems. Heated air exits the computer systems and enters the heated air cavity. The heated air exits the heated air cavity through the aperture in the top of the docking plenum.

Abstract: An apparatus with some embodiments is described having a protrusion to provide air flow distribution to a computing device. In some embodiments, the apparatus may include a housing with one or more openings on each of the external surfaces of the housing, an air mover, and a protrusion to channel airflow to an inlet while restricting airflow from an outlet from being circulated back into the inlet. Furthermore, in some embodiments, the apparatus may be implemented on a computer system that includes one or more electronic components can generate thermal energy. Other embodiments are described.

Abstract: An air baffle with an integrated expansion card attachment is disposed in a computer for receiving an expansion card having a handle attached thereto. The air baffle includes a first wall including a first guide and a second guide projecting from a side surface of the first wall. The first guide a second guide form a transverse space therebetween. The air baffle includes a second wall parallel to the first wall disposed a distance from the first wall approximately equal to a width of the expansion card. The second wall includes a snap retainer having a projected portion thereof. The transverse space formed between the first and second guides of the first wall has a size approximately equal to a thickness of the expansion card such that a first end of the expansion card is firmly held by the first guide and the second guide when the expansion card is inserted into the transverse space.

Abstract: An information handling system's thermal management is selectively altered by coupling a thermal barrier to the bottom surface of the information handling system chassis so that an air channel insulates against the passage of thermal energy from the bottom surface. A vent opening in a side of the thermal barrier allows airflow through the air channel to a vent opening of the information handling system. The airflow through the air channel cools the base of the thermal barrier so that an end user will experience reduced thermal energy if the information handling system rests on the end user, such as in the end user's lap.

Abstract: A computer server includes a printed circuit board and a fan. The printed circuit board includes electronic components and a handling device mounted thereon. The fan is arranged to blow air across the electronic components mounted on the printed circuit board. The handling device is disposed in a path of airflow of the fan. The handling device comprises an airflow opening.

Abstract: A heat dissipation module includes a first heat dissipation apparatus, a second heat dissipation apparatus, at least one first flapper and at least one second flapper. The first heat dissipation apparatus has a first airflow passage, and the second heat dissipation apparatus has a second airflow passage. The first flappers and the second flappers are separately disposed within the first airflow passage and the second airflow passage. The first flappers and the second flappers are moved to an open position due to force generated by air flowing through the first airflow passage and the second airflow passage, and are moved to a closed position after the force is removed.