Abstract: A heat dissipation structure includes an electronic device, and a cooling device mounted to the electronic device. The electronic device includes a housing, and a heat generating element mounted in the housing. The housing defines an opening. The cooling device comprises a shell abutting against the heat generating element through the opening, a number of fins extending from the shell, a fan mounted to the shell, an air intake, and an air outlet. The air intake and the air outlet are located outside the housing.

Abstract: Information equipment includes an open/close mechanism that opens or closes exhaust ports, a cooling fan that dissipates heat in the information equipment into the air through the exhaust ports, a user state detecting part that detects a contact state in which the hand of a user is in contact with the information equipment or a closeness state in which the hand of the user is close to the information equipment, and a heat dissipation control part that controls an open/closed state of the open/close mechanism so that heat exhausted from the exhaust ports is not directed to the hand of the user that is contact with or close to the information equipment, in accordance with the contact state or the closeness state detected by the user state detecting part.

Abstract: A thermal management system includes an air duct assembly comprising a supply air duct having an air inlet opening, a return air duct having an air exit opening and a plurality of distribution air ducts configured to be in fluid communication with the air inlet opening of the supply air duct and with the air exit opening of the return air duct. A fan is disposed within the air duct assembly to direct air from the air inlet opening of the supply air duct through the supply air duct and out the air exit opening of the return air duct. The fan and supply duct are disposed to direct air over a first surface of a heat sink. A second opposing surface of the heat sink is disposed over and configured to be in thermal contact with a plurality of active circuits disposed on a first surface of a radio frequency (RF) multi-layer printing wiring board (PWB).

Abstract: A network cabinet comprising an electronic component a duct positioned therein. The electronic component has at least one exhaust vent and the duct defines first and second openings. The first opening aligns with the exhaust vent such that the duct receives exhaust therefrom and the duct extends from the first opening toward a side of the network cabinet such that the second opening faces the side of the cabinet to direct the exhaust thereto.

Abstract: The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).

Abstract: A waterproof and heat-dissipating module mounted on an electronic device includes a housing structure, a compartment structure, and a fan. A first ventilation hole, a second ventilation hole, a first drainage holes, and a second drainage holes are formed on the housing structure. The compartment structure is disposed inside the housing structure and for partitioning an inside space of the housing structure off that includes an inhaling chamber, a fan room, an accommodated space, and an exhausting chamber. The fan is disposed inside the fan room so that airflow is guided from the first ventilation hole to the second ventilation hole via the inhaling chamber, the fan room, the accommodated space, and the exhausting chamber so as to dissipate heat from circuit boards disposed inside the accommodated space away.

Abstract: A mobile, modular communications device, featuring a multiple-slot base chassis designed to support a plurality of individual user-configurable and interchangeable personality modules, capable of providing the ability to accept secure/classified user communications, including voice, data and video, the means to encrypt or secure such user communications through either internal or external encryption capabilities, the means to optimize the secure voice, data and video communications for transmission across a remote reachback communications link and the ability to provide multiple network/uplink reachback transmission alternatives, such as local area networks, satellites, cellular, ISDN or other forms of fixed or wireless communications. The invention is intended to provide a standardized, structured and modular approach to the provisioning of different technologies within the overall system and to be capable of being deployed as a man-carry or rack-embedded unit.

Abstract: Airflow bypass dampers made from a resilient material and systems including the resilient dampers. The dampers are secured in a chassis and extend into a deployed position to obstruct airflow through a component bay of a chassis in the absence of a component, such as a sever blade, within the selected bay. The airflow bypass damper bends into a retracted position in response to installing a component into the bay. It returns to its original shape and position when the component is removed. An air moving device moves air through a component installed in the chassis. A plurality of the resilient airflow bypass dampers may be secured in a plurality of bays of a chassis, each resilient damper moving independently of the others. The resilient material bends without permanent deformation. For example, the resilient material may include, without limitation, natural polymers, synthetic polymers and metals. A preferred damper has a curved cross-sectional shape.

Abstract: A method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet.

Abstract: A computer enclosure includes a chassis and an airflow-guiding device mounted to the chassis. A receiving slot is defined in the chassis. An elastic receiving portion is formed around the receiving slot. One side of the airflow-guiding device is detachably fixed on the chassis. A first resilient securing member is formed on another side of the airflow-guiding device corresponding to the receiving slot. A wedge is formed on the first securing member to slide over the receiving portion and insert into the receiving slot.

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract: A cooling unit to cool the display apparatus including a heat generating unit to generate heat and a casing to accommodate the heat generating unit, the cooling unit includes a cooling fan to generate air flow; a duct which is coupled with the casing and forms a cooling path to connect the cooling fan and the heat generating unit; an inlet portion which is provided to one side of the casing to communicate with the duct; an inlet grill which is provided in the inlet portion to guide air to be inhaled in a direction inclined to a rear surface of the casing; an outlet portion which is provided to an other side of the casing to communicate with the duct, being spaced from the inlet portion; and an outlet grill which is provided in the outlet portion to guide air to be exhaled in a direction inclined to a rear surface of the casing, wherein the exhaled direction provided by the outlet grill is different from the air-inhaling direction provided by the inlet grill.

Abstract: According to one embodiment, an electronic device includes a cooling fan which is arranged in a case, a space being present between heat radiation fins and the cooling fan, and a case-contained member contained in the case. The case includes a second member which is detachably coupled to a first member and faces the space. The case-contained member faces the space on the side opposite to the second member. When the second member is coupled to the first member, the second member and the case-contained member cooperate to form a duct which guides air exhausted from the cooling fan to the heat radiation fins.

Abstract: An information handling center includes an information handling system (IHS) rack configured to receive cooled fluid from a pressurized plenum. The IHS rack includes at least one ventilator that is operable to cause cooled fluid to be drawn from the pressurized plenum into the IHS rack. A cooling fluid supply unit is coupled to the pressurized plenum and operable to cool a fluid passing through the cooling fluid supply unit and direct that cooled fluid into the pressurized plenum. A fluid flow control is located in the cooling fluid supply unit and coupled to a pressure sensor that is operable to determine a pressure in the pressurized plenum. The fluid flow control is operable to adjust the flow rate of the fluid passing through the cooling fluid supply unit based on the pressure determined by the pressure sensor.

Abstract: A temperature isolation duct in a computer system comprising a chassis securing a circuit board and a fan system that draws air through the chassis, and a heat-generating component is mounted on the circuit board and exposed to the air flow. The hot air duct passively directs air heated by the heat-generating component from a single hot air duct inlet in direct downstream alignment with the heat-generating component to a single hot air duct outlet. A thermal sensor is secured within, or in direct alignment with, the hot air duct near the duct outlet for sensing the temperature of air flowing through the hot air duct and generating a temperature signal. A controller is in electronic communication with the thermal sensor for receiving the temperature signal and in electronic communication with the fan system for sending a fan speed control signal.

Abstract: A baffle has a slot, with the slot positioned between first and second adjacent components when the baffle is installed above the components. A pair of heatsinks are inserted into the slot, with at least one heatsink having a heat dissipating portion that remains above the slot after insertion into the slot. A spring is inserted into the slot between the pair of heatsinks.

Abstract: A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.

Abstract: An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.

Abstract: A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.

Abstract: A method, system, and apparatus are disclosed. In one embodiment method includes causing a cooling medium to flow through a hollow cable. The cable couples an external cooling station to a heat exchanging unit. The heat exchanging unit is located within a mobile computing device. The method then transfers heat from within the mobile computing device to the cooling medium at the heat exchanging unit. Then the cooling medium contained the transferred heat is expelled out of the mobile computing device.

Abstract: Some embodiments of the present invention provide a system that includes a first hard disk drive (HDD) and a second HDD. Within this system, the first HDD is coupled to the second HDD in a non-parallel configuration, which reduces rotational vibration transmitted between the first HDD and the second HDD.

Abstract: An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: A computer system includes a chassis and a fan module attached to the chassis. The fan module includes a rotor, a side panel coaxial with the rotor, and a cylindrical cover extending from the side panel for encasing the rotor. One side of the rotor is covered and protected by the side panel, while another side of the rotor is bare. The chassis includes an air vent for exposing the bare side of the rotor. An airflow-guiding part inwardly protrudes from an edge of the air vent and abuts the cylindrical cover of the fan module.

Abstract: An air backflow prevention member includes a frame assembly including a plurality of vanes and a plurality of stops. The plurality of vanes are rotatable between an open position, wherein the plurality of vanes are oriented oblique to a direction of airflow and in contact with the plurality of stops, and a closed position, wherein the plurality of vanes are oriented perpendicular to the direction of airflow.

Abstract: An electrical enclosure assembly comprises an enclosure having walls defining an interior space for housing electrical components and having a front flange surrounding a front opening. A cover is hingedly mounted to the enclosure for selectively closing the front opening. The cover comprises a front wall larger than the front opening and a rearwardly extending peripheral rim. Cooling structure is integrally formed on an interior surface of the cover proximate the peripheral rim. The cooling structure comprises a plurality of spaced apart cooling ribs each having a shoulder engaging the enclosure front flange when the cover is in a closed position to provide an air flow path between the interior space and outside of the enclosure through spaces between the cooling ribs.

Abstract: The present application relates to apparatus (100) for cooling a light valve device (103), the apparatus comprising an array of elongate members (119), the elongate members (119) each having a tip (131) for contacting the light valve device (103). The apparatus (100) is suitable for cooling a digital micro-mirror device (103). A duct (117) may be provided for directing a flow of air from a fan to the light valve device (103).

Abstract: A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably secured to the second side of the fan.

Abstract: A computer system includes a rack, a computer module and an interface-dedicated module to be mounted therein, and an intra-rack management module. The rack has a rear panel for power supply to and signal connection among modules, and the modules permit plug-in mounting onto the rear panel of the rack. The computer module has behind the computer a dedicated adapter which makes possible plug-in mounting of the computer onto the rack and coordinates signals between the computer and the rear panel.

Abstract: A computer having a housing including a passage extending from one side to an opposite side of the housing, and a plurality of air intake vents arranged in at least one wall of the passage and configured for taking in external air into the housing.

Abstract: A cooling mechanism to dissipate thermal energy generated by the heat generating components of a graphics card assembly. An apparatus includes a circuit board having at least one heat generating component affixed thereto. The apparatus also includes a fan and carrier therefor including a heat sink plate having a portion thermally coupled to the heat generating component. The heat sink plate includes a means for forming at least one slot proximate the portion. The fan is adapted to direct airflow cross the portion. The thermal energy generated by the heat generating component is transferred to the fan carrier and ultimately removed from the fan carrier by the airflow. The airflow inducts a secondary airflow drawn through the slot during operation thereby to enhance transfer of the thermal energy from the heat generating component.

Abstract: A waterproof panel comprises a front wall, a back wall, a front baffle assembly and a back baffle. A cavity is defined between the front wall and the back wall, the front baffle assembly and the back baffle are received in the cavity. The front wall defines a first hole array and a second hole array, the back wall defines a third hole array in same height with the second hole array. The front baffle assembly fixed on one side of the second hole array near the third hole array comprises a main baffle. The back baffle fixed on one side of the third hole array near the second hole array is on one side of the main baffle near the second hole array. The back wall comprises a plurality of protruding strips, which can rebound water entering through the third hole array back.

Abstract: A test slot cooling system for a storage device testing system includes a storage device transporter having first and second portions. The first portion of the storage device transporter includes an air director and the second portion of the storage device transporter is configured to receive a storage device. The test slot cooling system includes a test slot housing defining an air entrance and a transporter opening for receiving the storage device transporter. The air entrance is in pneumatic communication with the air director of the received storage device transporter. The test slot cooling system also includes an air mover in pneumatic communication with the air entrance of the test slot housing for delivering air to the air director. The air director directs air substantially simultaneously over at least top and bottom surfaces of the storage device received in the storage device transporter.

Abstract: Electrical units are effectively cooled, even if the longitudinal length of the cover member in which the electrical units to be cooled are accommodated is short, by easily guiding a flow of air during operation toward the electrical units. A second cover member which constitutes at least a part of a body cover together with a first cover member is positioned ahead of the first cover member which accommodates an electrical unit to be cooled. Inlets which let a flow of air during operation into the second cover member are disposed in the second cover member. An outlet for discharging a flow of air during operation out of the first cover member is provided in the first cover member.

Abstract: A computer assembly having a processor integrated circuit, a hard disk drive electrically connected to the processor units and a power supply assembly, powering the processor integrated circuit and hard disk drive. These components are sealed in an liquid-tight case defining fluid channels. Electrical connectors permit connection of the processor to outside devices. Finally, a fan in the liquid-tight case, adapted to drive fluid through the fluid channel, thereby facilitates the movement of heat through the computer assembly and creates a monolithic thermal structure. In one embodiment, the computer assembly is powered by a raw DC power supply input and self manages this power input source to provide consistent and reliable power to the computer assembly without burdening the raw DC power supply during transient conditions.

Abstract: A storage control apparatus comprises a vertical logic board; and a cooling mechanism for cooling the logic board. This cooling mechanism is constituted such that air taken in from the front of the storage control apparatus travels to the rear side of the storage control apparatus and then rises up, this risen air rises further while cooling the vertical logic board, and the risen air is discharged from the rear of the storage control apparatus.

Abstract: A modular server cooling unit user standard dimension modules to build a variety of components for use in cooling a server or server farm. One module may be the module in which the server(s) are mounted. Another module may be an exhaust plenum, drawing air through the server module and exhausting the air to the outside. A third module may be a cooling module through which outside air is drawn, filtered and optionally cooled, for example, using an adiabatic, or water-wash, cooler. Exhaust air may be selectively mixed with air from the cooling module to provide finer control of server temperature and humidity.

Abstract: A power supply includes a power supply casing, a fan module, a PCB module and a power-output element. The power supply casing has a first opening portion and a second opening portion. The fan module passes through the first opening portion in order to detachably combine with the power supply casing. The PCB module is disposed inside the power supply casing, and the PCB module has a PCB (Printed Circuit Board) and a plurality of electronic elements electrically disposed on the PCB. The power-output element is electrically connected to the PCB module in order to output power to supply external electronic device.

Abstract: A central air manifold for an electronic module enclosure includes a front section and a rear section. The front section includes openings adapted to communicate with electronic modules and the rear section includes openings adapted to communicate with fans. The openings of the front section can be open when electronic modules are installed in the front section and the openings in the rear section can be open when operating fans are installed in the rear section.

Abstract: Apparatus for storing data and supplying stored data comprising a main housing containing control circuitry for controlling signals to a plurality of disk drives. The main housing has a plurality of mounting mechanisms each configured to support a unit of a first type. The apparatus further comprises a plurality of cables each having a first connector for connecting to a unit of the first type for providing signals from the control circuitry. The apparatus has a first unit, of a first type, having a plurality of second connectors each connected to a disk drive and a fan providing a flow of air for cooling the disk drives and the control circuitry. The first unit is connected to a first one of the cables and mounted in a first one of the mounting mechanisms such that the first unit is mounted to slide into the main housing. The apparatus also has a second unit, of a second type, supported by a second one of the mounting mechanisms and mounted to slide into the main housing.

Abstract: A chassis having a bypass channel for air flow is disclosed. The chassis include a bypass channel that is proximate one side of the chassis. The bypass channel may be formed by the side of the chassis and a module of the computing system, such as the processor module of the computing system. A second module exists in the rear of the chassis. A physical barrier may be used to direct air from the bypass channel to the second module, which may be an I/O module. A plenum is placed on the opposite side of I/O module from the air flow. The presence of the plenum creates a negative pressure on the opposite side of the second module, causing air to cross the second module into the plenum. A fan in the rear of the chassis causes air to leave the plenum and exit the chassis.

Abstract: A circuit board including a blower thereon to cool a heat generating arrangement. The circuit board includes a board substrate; a blower disposed on the board substrate, the blower having an inlet adapted to take in coolant in a inlet direction, and an outlet adapted to blow out coolant in a first outlet direction extending at an angle with respect to the inlet direction; and a heat-generating arrangement disposed on the board substrate such that the blower is adapted to blow out coolant in the first outlet direction to cool the heat generating arrangement.

Abstract: An airflow conducting apparatus is used for dissipating heat from at least one memory module received in a corresponding socket on a motherboard. The airflow conducting apparatus includes an airduct and a valve piece. The airduct is positioned over the socket and configured to guide air to flow therethrough. The valve piece is attached to an inside of the airduct. The valve piece includes a plurality of parallel elastic flaps. Each flap has at least one configuration that deflects air flowing through the airduct.

Abstract: An air duct (10) is used for directing air in a computer enclosure (50) to flow from an interior to an exterior thereof for dissipating heat generated from an electronic device (82) in the computer enclosure. At least one cable is provided in the computer enclosure for power supply or data transmission. The air duct includes a top wall (11), a pair of side walls (13), and at least one retaining member. The side walls depend from opposite ends of the top wall. At least one retaining member is formed on at least one of the top wall and one of the side walls for retaining the at least one cable therein. The at least one retaining member and the at least one of the top wall and the side walls cooperatively form a retaining space therebetween.

Abstract: The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects.

Abstract: An electronic equipment enclosure includes a frame structure, one or more enclosure panels mounted on the frame structure, an exhaust duct, and a plurality of adjustable filler panel assemblies. The frame structure and the one or more enclosure panels together define an enclosure. The exhaust duct is substantially the same height as the enclosure and has an air inlet opening formed therein for receipt of exhaust air from equipment mounted in the enclosure. The plurality of adjustable filler panel assemblies selectively block portions of the air inlet opening in order to create a custom-fit air inlet opening for a particular piece of equipment so that exhaust air from the equipment does not flow back into the enclosure after entering the exhaust duct.

Abstract: A computer includes a chassis, a motherboard, an air guiding member, and a fan. The chassis includes a rear wall at a rear side thereof and a sidewall at a lateral side thereof. The rear wall defines a plurality of inlet holes therein, and the sidewall defines a plurality of outlet holes therein. The motherboard is received in the chassis opposite to the sidewall, a heat sink is installed on the motherboard for dissipating heat generated by a processor mounted on the motherboard. The air guiding member is received in the chassis at a front side, for guiding air drawn into the chassis through the inlet holes toward the outlet holes. The fan is used for drawing air from outside of the chassis through the inlet holes, and blowing the air out of the chassis through the outlet holes.

Abstract: A notebook computer with a tilting keyboard, which opens a vent when tilted, solves multiple problems and may further materially contribute to countering terrorism. A tilted position of the keyboard allows the vent to open when the notebook lid is open, thereby providing extra cooling capacity during periods of computer use when there is a lessened need for compactness. The vent is it least partially closed when the keyboard is in the stowed position and the lid is closed, thereby reducing the possibility of debris ingestion when air flow needs are reduced and the need for compactness is increased. A security inspection position of the keyboard enables inspection of the inside of the computer, for example as part of a security checkpoint procedure. A negative tilt can reduce wrist strain and repetitive motion injuries for some users. Some embodiments tilt the keyboard automatically in response to the lid opening, and stow the keyboard automatically in response to the lid being closed.

Abstract: A first printed wiring board extends in the vertical direction within a first duct that extends in the vertical direction. A first axial flow fan generates airflow which absorbs heat from the first printed wiring board. Second and third ducts extends in parallel with the first duct. A fourth duct extends between the second and third ducts. A second printed wiring board extends in the horizontal direction within the fourth duct. A second axial flow fan is connected to the third duct. The second axial flow fan generates airflow which absorbs heat from the second printed wiring board. The electronic apparatus can be reduced in size.