Fan Or Blower Patents (Class 361/695)
  • Patent number: 11369035
    Abstract: A data centre (10) includes one or more controllable air circulation systems (e.g. air optimiser (11)), one or more cold aisles (15) and/or one or more hot aisles (16), one or more rows of racks (14), the data centre being so arranged that in use cooling air (18) passes, under the control of the one or more controllable air circulation systems, from a cold aisle (15) through the racks (14) and/or through the racks (14) to a hot aisle (16). An access door (20), which provides access to at least one of the aisles, is movable between an open position allowing personnel access to the aisle and a closed position. The door (20) has an aperture (25) in which is provided a controllable air intake arrangement, for example comprising a vent (17) in the form of multiple vertically extending rotatable blades (28).
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: June 21, 2022
    Assignee: Bripco (UK) Limited
    Inventor: William Thornton
  • Patent number: 11369037
    Abstract: A disclosed system includes (1) at least one hardware component mounted to a drawer of a chassis, (2) a fan module capable of generating airflow to cool the hardware component, and (3) an extensible airduct coupled between the hardware component and the fan module such that, when the drawer of the chassis is opened, the extensible airduct stretches out to lengthen a distance between the hardware component and the fan module and, when the drawer of the chassis is closed, the extensible airduct contracts to shorten the distance between the hardware component and the fan module. Various other apparatuses, systems, and methods are also disclosed.
    Type: Grant
    Filed: February 4, 2021
    Date of Patent: June 21, 2022
    Assignee: Meta Platforms, Inc.
    Inventors: Chenyu Xu, Jun Shen, Madhavan Ravi
  • Patent number: 11347285
    Abstract: Systems and methods that may be implemented to provide supplemental cooling air for a portable information handling system from one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned at multiple different locations relative to a portable information handling system, such as notebook computer or laptop computer. In one example, the disclosed systems and methods may be implemented to have one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned to align with differing geometries of cooling air inlet opening locations that correspond to different portable information handling system sizes and/or designs.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: May 31, 2022
    Assignee: Dell Products L.P.
    Inventors: Mark A. Casparian, Philip J. Grossmann, Joe A. Olmsted, Francisco Santana, Charles Cameron Duncan, Frank C. Azor
  • Patent number: 11346928
    Abstract: An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: May 31, 2022
    Assignee: FUJIFILM SONOSITE, INC.
    Inventor: Rahul Gupta
  • Patent number: 11330733
    Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: May 10, 2022
    Assignee: YANDEX EUROPE AG
    Inventors: Andrey Olegovich Korolenko, Andrey Alekseevich Blokhin, Oleg Valerevich Fedorov, Igor Iurevich Znamenskii, Ivan Vladimirovich Prostov, Vladimir Viktorovich Khulagov, Aleksandr Alekseevich Konovalov, Konstantin Aleksandrovich Klubnichkin, Nikita Aleksandrovich Vedeneev
  • Patent number: 11324137
    Abstract: An air mover assembly may be configured such that during insertion of the assembly into an air mover gantry, one or more spring features integral to the gantry apply a first spring force opposite to a direction of insertion of the assembly relative to the gantry in order to maintain the assembly in an unseated position until the first spring force is overcome by an opposite force to fully seat assembly into the gantry and when the assembly is fully seated within the gantry, the one or more spring features integral to the gantry apply a second spring force to the assembly in a direction of air flow through an air mover of the assembly that biases an exhaust portion of the air mover toward a face of the gantry opposite of the one or more spring features.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: May 3, 2022
    Assignee: Dell Products L.P.
    Inventor: Jean Marie Doglio
  • Patent number: 11313383
    Abstract: A fan module frame is configured to fix a fan module in a chassis. The fan module frame includes a first frame component, a second frame component and two latches. The first frame component connects a server fan unit to the second frame component by an elastic fastener. The second frame component has a plurality of chambers, and each of the chambers is configured for the server fan unit to be placed therein. The latches are disposed on two opposite sides of the second frame component and connected to the second frame component. The second frame component fixes the fan module in the chassis through the latches. As such, the fan module is detachably fixed in the chassis and can be removed from the chassis without additional tools, and the fan module frame is compatible with various servers and models, thereby saving design costs and saving space.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: April 26, 2022
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Xiaogang Lu
  • Patent number: 11317542
    Abstract: A compute device for operation in a rack of a data center includes a substrate, a solid state drive array, a fan array, and a plurality of physical resources. The components of the compute device are arranged on the substrate to prevent or reduce shadowing of heat-producing physical resources, such as a processor, by other heat-producing physical resources relative to an airflow generated by the fan array. To do so, ruler solid state drives are used to facilitate positioning of the fan array toward a front edge of the substrate.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: April 26, 2022
    Assignee: Intel Corporation
    Inventors: Blaine Monson, Pankaj Kumar, Steven Miller
  • Patent number: 11280489
    Abstract: The disclosure provides a luminous fan including a main body, a light guide member and a light source. The main body includes a fan frame and a plurality of propellers, and the plurality of propellers are rotatably mounted on the fan frame. The light guide member includes an outer light guide ring and a plurality of inner light guide rings, the plurality of inner light guide rings are mounted on the fan frame, the plurality of inner light guide rings each have an air channel, the plurality of propellers are respectively located in the air channels, the outer light guide ring is mounted on the plurality of inner light guide rings and surrounds the plurality of inner light guide rings, and the outer light guide ring is exposed from the luminous fan. The light source is disposed between the outer light guide ring and the inner light guide ring.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: March 22, 2022
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventor: Shao-Dong Fan
  • Patent number: 11269302
    Abstract: An enclosure configured to at least partially surround a data storage library, and a system including a data storage library and enclosure(s). The enclosure includes at least one surface configured to surround the at least one library access opening and form a chamber and to permit movement of the movable panel to permit access to the interior of the data storage library, and at least one enclosure access opening in the at least one of the surface to permit access to the interior of the chamber. The enclosure is configured to resist environmental conditions from intruding into the interior of the enclosure, and is further configured to permit exterior environmental conditions from within the interior of the library to intrude into the chamber of the enclosure.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: March 8, 2022
    Assignee: International Business Machines Corporation
    Inventors: Jose G. Miranda Gavillan, Brian G. Goodman, Leonard G. Jesionowski, Michael P. McIntosh, Shawn M. Nave, Kenny Nian Gan Qiu
  • Patent number: 11266045
    Abstract: A power conversion device includes a housing, a power conversion unit, a fan, and a flexible shutter. The shutter is in a sheet shape. The shutter includes an end portion and a movable portion, the end portion being fixed to at least one of the housing and a frame body, the movable portion being movable with respect to the housing. The shutter is configured to be deformed by wind from the fan in a case where the fan is driven and to form a gap through which the wind passes between the shutter and at least one of the housing and the frame body.
    Type: Grant
    Filed: July 3, 2018
    Date of Patent: March 1, 2022
    Assignee: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
    Inventor: Yukio Kajihara
  • Patent number: 11262814
    Abstract: Apparatuses and methods include at least one push fan assembly and at least one pull fan assembly and at least one constriction channel or pathway designed to compress air pulled in by the push fan so that as the compressed air exits the at least one constriction channel or pathway, the air undergoes an expansion and cools and the push-pull fan arrangement pulls the cooled air through the housing improving the cooling of computer or electronic components housed in the housing.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: March 1, 2022
    Inventors: Scott A Strozier, Christopher D. Robinson
  • Patent number: 11259446
    Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: February 22, 2022
    Assignee: Chatsworth Products, Inc.
    Inventors: Richard Evans Lewis, II, Dennis W. Vanlith
  • Patent number: 11249522
    Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: February 15, 2022
    Assignee: Intel Corporation
    Inventors: Devdatta P. Kulkarni, Timothy G. Hanna
  • Patent number: 11252843
    Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: February 15, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Hsiao-Tsu Ni, Chun Chang, Hsin-Chieh Lin, Chia-Jung Tsai
  • Patent number: 11249523
    Abstract: An air baffle insertable between a chassis wall and a computer component such as a GPU and heat sink mounted on a GPU tray to divert air flow to the computer component is disclosed. The air baffle includes a single sheet having a bottom panel, a top panel, and a pair of parallel side walls. Each of the parallel side walls are connected to the bottom and top panels. A first end wall is joined to the side walls and the top and bottom panel. The first end wall directs air flow toward the computer component.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: February 15, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun Chang, Hsin-Chieh Lin, Chih-Hao Chang, Tzu-Fong Wang
  • Patent number: 11243584
    Abstract: A component-level cooling system for cooling components in a chassis includes a fan in a housing positioned on a circuit board. The housing has a fan inlet on a side, a first fan outlet on one end and a second fan outlet on a second end opposite the first end. The first fan outlet may direct a first airflow in a first direction to a vent on a first panel of the chassis. The second fan outlet may direct a second airflow in a second direction opposite the first direction. A duct comprises a duct inlet for receiving the second airflow, an elbow for redirecting the second airflow in a third direction to avoid the second airflow from colliding with a main airflow to reduce acoustic noise, and a duct outlet located to avoid heated air exiting the duct from re-entering the fan inlet.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: February 8, 2022
    Assignee: Dell Products L.P.
    Inventors: Tom Schnell, Qinghong He, Man Tak Ho
  • Patent number: 11239397
    Abstract: A micro light emitting diode display includes a display module and a hydrophobic layer. The display module includes a substrate, an electrode layer, and a micro light emitting diode device. The substrate has a first surface, a second surface opposite to the first surface and at least one air passage extending from the first surface to the second surface. The electrode layer is disposed on and in contact with the first surface of the substrate. The air passage has an opening on the first surface of the substrate, and the electrode layer is spaced apart from the opening. The micro light emitting diode device is disposed on the electrode layer and has a light emitting area that is less than or equal to 2500 ?m2. The hydrophobic layer at least partially covers a side of the display module.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: February 1, 2022
    Assignee: MIKRO MESA TECHNOLOGY CO., LTD.
    Inventor: Li-Yi Chen
  • Patent number: 11236754
    Abstract: Embodiments are disclosed of a fan module. The fan module includes a module housing having a module inlet and a module outlet. A fan compartment matrix is positioned within the housing to move air between the module inlet and the module outlet. The fan compartment matrix includes an M×N matrix of fan compartments, each fan compartment having an upstream side and a downstream side. A longitudinal air channel positioned between each pair of fan columns and a transverse air channel positioned between each pair of fan rows, the transverse air channel being fluidly coupled to the fan compartments between which it is positioned. A control chamber is positioned at each confluence of the at least one longitudinal air channel and the transverse air channel, the control chamber including one or more valves to control airflow between the longitudinal air channel and the transverse air channel. A fan is positioned in each fan compartment.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: February 1, 2022
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11237604
    Abstract: An adaptive airflow flapper assembly may be configured to when present in a first chassis bay adjacent to a second chassis bay unpopulated with a another information handling resource module, close to a closed position relative to the enclosure such that, due to non-overlap of the enclosure airflow openings relative to the flapper airflow openings, the adaptive airflow flapper assembly prevents airflow between the interior and the exterior of an enclosure, and when present in the first chassis bay adjacent to the second chassis bay populated with the second information handling resource module, open to an open position relative to the enclosure to allow airflow between the interior and the exterior of the enclosure.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: February 1, 2022
    Assignee: Dell Products L.P.
    Inventors: Mingming Zhang, Qingqiang Guo, Weidong Zuo, Zhiwen Jiang
  • Patent number: 11231048
    Abstract: Disclosed is a blade adjustment mechanism and an air circulator. The air circulator includes a housing defining an air outlet. The blade adjustment mechanism includes: a fixing bracket fixedly connected with the housing and defining a sliding space; at least two adjustment members, a part of each of the at least two adjustment members is accommodated in the sliding space and slidably connected with the fixing bracket, each of the at least two adjustment members defining a first adjustment slot at an end adjacent to the air outlet; at least two first wind deflectors, a part of one of the at least two first wind deflectors being configured to extend into the air outlet and being rotationally connected with the fixing bracket, a part of one of the at least two first wind deflectors facing away from the air outlet being movably accommodated in the first adjustment slot.
    Type: Grant
    Filed: December 14, 2018
    Date of Patent: January 25, 2022
    Inventor: Huanming Zhang
  • Patent number: 11229145
    Abstract: An air baffle component includes an air baffle rotationally connected to a housing of a device chassis having a module insertion port. The air baffle component also includes a level-1 elastic component. The air baffle component further includes a level-2 elastic component. The air baffle component additionally includes a connecting rod. The connecting rod includes a force-bearing rod rotationally connected to the housing of the device chassis between the air baffle and the module insertion port. The connecting rod also includes a pull rod connected to the force-bearing rode. The connecting rod further includes a baffle column on the pull rod. The level-1 elastic component provides a first elastic force for the force-bearing rod, so that the baffle column is caused to abut against a surface of the air baffle opposite to the module insertion port. The level-2 elastic component provides a second elastic force for the air baffle.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: January 18, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huan Peng, Gaoliang Xia
  • Patent number: 11215402
    Abstract: A heat dissipation module is configured to dissipate heat generated by at least one heating element of a projection device. The heat dissipation module includes at least one first heat pipe, at least one second heat pipe and a heat dissipation fin assembly. The first heat pipe includes a first section connected to the heating element and a second section. The second heat pipe includes a third section connected to the heating element and a fourth section. The length of the first heat pipe is less than that of the second heat pipe. The heat dissipation fin assembly includes a plurality of heat dissipation fins. The second section and the fourth section pass through the heat dissipation fin assembly, and the number of heat dissipation fins through which the second section passes is 70% or below of the number of heat dissipation fins through which the fourth section passes.
    Type: Grant
    Filed: May 31, 2020
    Date of Patent: January 4, 2022
    Assignee: Coretronic Corporation
    Inventors: Wen-Jui Huang, Jhih-Hao Chen, Tsung-Ching Lin
  • Patent number: 11209185
    Abstract: An air handling system includes a housing, a blower, a sensor, an air intake valve, and a controller. The housing includes an outlet to a passenger compartment, a fresh air inlet providing fresh air into the housing and a recirculated air inlet that guides air flow from the passenger compartment into the housing. The blower moves air through the housing. The air intake valve moves between a closed position blocking air flow from the fresh air inlet into the housing and an open position unblocking air flow from the fresh air inlet into the housing. The controller positions the air intake valve relative to the fresh air inlet controlling the flow of fresh air into the housing and thereby maintaining moisture density of the air flow entering the passenger compartment within a prescribed range based on humidity and temperature values from the sensor.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: December 28, 2021
    Inventors: Arch Williams, Benjamin C. Dunlap
  • Patent number: 11203436
    Abstract: A system for cooling a plurality of electrical equipment components inside a mobile platform may include at least one manifold and a plurality of flexible tubing ducts. The manifold may have an outlet, and a plurality of inlet tubing connections in fluid communication with the outlet. The outlet may be coupled to an interface of a cooling system of the platform by exhaust tubing. Each of the flexible tubing ducts may have a proximal end and a distal end. Each proximal end may be selectively connectable to the inlet tubing connections. Each distal end may have an air intake port that is alternatively positionable in two or more thermal dissipation zones of the electrical equipment components for permitting an exhaust profile inside the platform to the interface to be reconfigured based at least in part on respective positions of the electrical equipment components.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: December 21, 2021
    Assignee: The Boeing Company
    Inventors: Mary Eileen Beckman, Mark Steven Kuehn, Robert Herkimer
  • Patent number: 11206750
    Abstract: An outdoor display apparatus having a heat dissipation structure includes a first display module configured to display an image in a first direction, a second display module configured to display an image in a second direction opposite to the first direction, a housing configured to accommodate the first display module and the second display module, and having an inlet and an outlet, and a heat exchange device configured to receive heat from one of the first display module and the second display module and perform heat exchange, wherein the heat exchange device includes: a first heat exchange portion having at least one cooling passage to cool the first display module; a second heat exchange portion having at least one cooling passage to cool the second display module; and a heat exchanger configured to be selectively shared by the first heat exchange portion and the second heat exchange portion.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: December 21, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Su Lee, Sung Ki Kim, Myeong Gil Kim, Hyun Jun Jung
  • Patent number: 11202394
    Abstract: A cooling system configured to remove heat from a chimney of a server cabinet. The system includes a first heat exchanger unit in the chimney of the server cabinet. The first heat exchanger has a fluid inlet for receiving a working fluid and a fluid outlet for discharging the working fluid. The first heat exchanger also has an upstream surface receiving waste heat generated by one or more servers and a downstream surface that discharges air cooled by the first heat exchanger. The upstream surface is generally perpendicular to the downstream surface.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: December 14, 2021
    Assignee: United Sendees Automobile Association (USAA)
    Inventors: John Andrew Weems, Raymond F. Martin
  • Patent number: 11198353
    Abstract: A vehicle includes a drive unit. The driving unit includes an electric rotary machine and a power conversion device. The drive unit is connected to a cooling liquid introduction pipe for introducing a cooling liquid to the drive unit, and the drive unit is connected to a cooling liquid discharge pipe for discharging the cooling liquid from the drive unit. The cooling liquid introduction pipe is connected to a cooling liquid introduction pipe connecting portion. The cooling liquid discharge pipe is connected to a cooling liquid discharge pipe connecting portion. The cooling liquid introduction pipe connecting portion and the cooling liquid discharge pipe connecting portion are provided above a lower end portion of the drive unit to connect the cooling liquid introduction pipe and the cooling liquid discharge pipe from the vehicle width direction of the drive unit.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: December 14, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takeshi Hoshinoya, Manabu Yazaki, Heisuke Kobayashi
  • Patent number: 11195648
    Abstract: A heat sink 7A is disposed on a circuit board, an air duct is disposed on the heat sink, external cooling air is supplied by the fan attached to the sink air inlet of the heat sink and the air duct inlet of the air duct. Cooling air flowing out of the air duct outlet of the air duct comes into contact with the magnetic component mounted on the circuit board.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: December 7, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Shun Fukuchi, Masakazu Gekinozu, Takanori Shintani, Masahiro Tatsukawa, Masaki Sakuma
  • Patent number: 11178791
    Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: November 16, 2021
    Assignee: SCHNEIDER ELECTRIC USA, INC.
    Inventors: Jeffrey Scott Williams, Gary Lenn Mayes, Michael James Farrell
  • Patent number: 11147187
    Abstract: A cooling device includes at least two cooling units, each cooling unit including a plate-shaped cold plate extending in a horizontal direction, a radiator extending in a first direction perpendicular to the horizontal direction and having a plurality of plate-shaped fins which, on the cold plate, is disposed parallel to a second direction perpendicular to the first direction, and a pump which supplies a refrigerant liquid to the cold plate and the radiator, in which the pump is adjacent to the radiator and is disposed in the second direction of the radiator, and the pump of one first cooling unit of the two cooling units faces the other second cooling unit of the two cooling units in the second direction or in a third direction orthogonal to the first direction and the second direction.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: October 12, 2021
    Assignee: NIDEC CORPORATION
    Inventors: Toshihiko Tokeshi, Nobuya Nakae, Takahiro Imanishi, Akihiko Makita, Takehito Tamaoka
  • Patent number: 11134581
    Abstract: A case adapted to be selectively connected to a first interface module, a second interface module and a third interface module is provided. The case includes a substrate. The substrate includes a first connection area and a second connection area. The first connection area is adjacent to the second connection area. The first connection area includes a first post. The second connection area includes a second post and a third post. In a first state, the first interface module is disposed in the first connection area. The second interface module is disposed in the second connection area. In a second state, the third interface module is disposed in the first connection area and the second connection area. The case is adapted to be selectively connected to different types of storage units.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: September 28, 2021
    Assignee: WISTRON CORP.
    Inventors: Yu-Jian Wu, Zhi-Tao Yu, Wen Huang, Chia-Hsin Liu
  • Patent number: 11134588
    Abstract: Embodiments are disclosed of an airflow cooling solution for a battery backup unit (BBU) using a crossflow cooling module. The cooling module includes a housing with a module inlet and a module outlet positioned at a non-zero angle relative to each other. The module outlet has an area greater than the module inlet. A crossflow fan package is positioned in the cooling module housing. The crossflow fan package includes a fan housing having a fan inlet and a fan outlet; the fan inlet is fluidly coupled to the module inlet, and the fan outlet is fluidly coupled to the module outlet. One or more inlet air baffles form an inlet air channel between the module inlet and the fan inlet, and one or more outlet air baffles form a diverging outlet air channel between the fan outlet and the module outlet. The cooling module can distribute the airflow to a much wider area to the BBU module. Then a rack level crossflow air cooling configuration is proposed.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: September 28, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11129295
    Abstract: Embodiments of an enclosure assembly to enhance cooling of a hydraulic fracturing direct drive unit (DDU) during operation are included. The enclosure assembly may include an enclosure body extending at least partially around an enclosure space to house the DDU for driving a fluid pump. The enclosure assembly may include one or more heat exchanger assemblies connected to the enclosure body for cooling a process fluid associated with one or more of the DDU and the fluid pump, and which may be configured to draw air into the enclosure space from and external environment, toward one or more radiator assemblies to cool the process fluid, and along an airflow path through the enclosure space. One or more outlet fan assemblies may be operative to discharge air from the enclosure space to the external environment to maintain a desired temperature of the enclosure space.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: September 21, 2021
    Assignee: BJ Energy Solutions, LLC
    Inventors: Tony Yeung, Ricardo Rodriguez-Ramon, Guillermo Rodriguez
  • Patent number: 11122716
    Abstract: A display device includes a display panel, a bottom cover at a rear surface of the display panel, and a heat dissipation assembly. The heat dissipation assembly includes a housing between the display panel and the bottom cover, conductive lines on two lateral sides within the housing and configured to supply electricity therethrough, and a movable member having both ends thereof supported by and electrically connected to the conductive lines to thereby be movable in a longitudinal direction of the housing.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: September 14, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Jinyoung Kong, Taekjung Kwon
  • Patent number: 11116110
    Abstract: A computer server includes a plurality of layers of fixed plates each having at least one corresponding component provided thereon. An air inlet and an air outlet are provided on side panels of an outer shell of the server case. A first set of fans is provided on an inward-facing side of the air inlet, and a second set of fans is provided on an inward-facing side of the air outlet. The first set of fans and the second set of fans generate a high-pressure airflow from the air inlet to the air outlet. The computer server further comprises at least one first heat sink and a second heat sink, wherein the at least one first heat sink is connected to a heat generating component on the plurality of layers of fixed plates.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: September 7, 2021
    Assignee: BEIJING TUSEN WEILAI TECHNOLOGY CO., LTD.
    Inventor: Zhihua Ma
  • Patent number: 11109508
    Abstract: Embodiments of an enclosure assembly to enhance cooling of a hydraulic fracturing direct drive unit (DDU) during operation are included. The enclosure assembly may include an enclosure body extending at least partially around an enclosure space to house the DDU for driving a fluid pump. The enclosure assembly may include one or more heat exchanger assemblies connected to the enclosure body for cooling a process fluid associated with one or more of the DDU and the fluid pump, and which may be configured to draw air into the enclosure space from and external environment, toward one or more radiator assemblies to cool the process fluid, and along an airflow path through the enclosure space. One or more outlet fan assemblies may be operative to discharge air from the enclosure space to the external environment to maintain a desired temperature of the enclosure space.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: August 31, 2021
    Assignee: BJ Energy Solutions, LLC
    Inventors: Tony Yeung, Ricardo Rodriguez-Ramon, Guillermo Rodriguez
  • Patent number: 11106256
    Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide cooling to a heat source. In embodiments, a first set of cooling fins are thermally coupled to a heat source in a first orientation to allow first airflow to pass through in between the first set of cooling fins to dissipate heat from the heat source. A second set of cooling fins thermally coupled to the heat source in a second orientation to allow second airflow to pass through in between the second set of cooling fins to dissipate heat from the heat source. A barrier may be coupled to the second set of cooling fins to substantially divert the second airflow away from the first airflow about to pass through in between the first set of cooling fins so that pre-heated air does not flow over the first set of cooling fins.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Tao Shu, Chuansheng Liu, Na Chen, Liguang Du
  • Patent number: 11096314
    Abstract: In one embodiment, a modular electronic system includes a front panel comprising openings for receiving a plurality of modules, a removable fan tray comprising a plurality of fans for cooling one or more of the modules with airflow entering the modular electronic system at the front panel when the plurality of fans are operating, and a fan tray channel for receiving the fan tray and positioning the fans in a row generally parallel to the front panel. The channel extends from one of the openings in the front panel and is contained within a horizontal plane in the modular electronic system.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: August 17, 2021
    Assignee: CISCO TECHNOLOGY, INC.
    Inventor: Rohit Dev Gupta
  • Patent number: 11083096
    Abstract: A display device including a carrying main body, a flexible display panel and at least one fan is provided. The flexible display panel is disposed on the carrying main body and adapted to be unfolded on the carrying main body. A gap is formed between the flexible display panel and the carrying main body. The fan is disposed on the carrying main body and adapted to generate an airflow, and a flow path of the airflow is located at the gap.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: August 3, 2021
    Assignee: Au Optronics Corporation
    Inventor: Ming-Hsuan Yu
  • Patent number: 11073880
    Abstract: Modem thermal management may include a state machine monitoring a temperature associated with a modem, setting a mode in response to detection of a change in the temperature with respect to a threshold, and applying a set of one or more thermal mitigation actions associated with a current state of the state machine. The state machine may set a timer in response to detection of the change in temperature and then transition from the current state to another state in response to expiration of the timer. The monitored temperature may be a junction temperature or a skin temperature.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: July 27, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: James Francis Geekie, Henri Begin, Abha Khosla
  • Patent number: 11071235
    Abstract: Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: July 20, 2021
    Assignee: International Business Machines Corporation
    Inventors: Phillip Mann, Sandra J. Shirk/Heath, Mark Plucinski, Tyler Jandt
  • Patent number: 11069844
    Abstract: A light-emitting device and a method for manufacturing a light emitting device are disclosed. In an embodiment a light-emitting device includes a light-emitting semiconductor chip having a light-outcoupling surface and an optical element arranged on the light-outcoupling surface, wherein the light-emitting semiconductor chip is laterally surrounded by a frame element in a form-locking manner, wherein the optical element is mounted on the frame element, wherein the frame element projects beyond the light-outcoupling surface in a vertical direction such that a gas-filled gap is present at least in a partial region between the light-outcoupling surface and the optical element, and wherein the frame element has a channel connecting the gap to an atmosphere surrounding the light-emitting device.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: July 20, 2021
    Assignee: OSRAM OLED GMBH
    Inventors: Luca Haiberger, Sam Chou, Martin Brandl
  • Patent number: 11071229
    Abstract: An air shroud includes a main portion, an extension portion, and a first adjustable air baffle. The main portion is in physical communication with one or more cooling fans of an information handling system. The extension portion extends from the main portion. The first adjustable air baffle is in physical communication with the extension portion. The first adjustable air baffle is biased toward an extended position. When a first memory module is located within a first memory slot of an information handling system while the main portion is in physical communication with the one or more cooling fans, the first adjustable air baffle transitions from the extended position to a collapsed position in response to a force being exerted on the first adjustable air baffle by the first memory module.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: July 20, 2021
    Assignee: Dell Products L.P.
    Inventors: White Yi-Pai Chu, Eric Shih Huai Cho
  • Patent number: 11058290
    Abstract: An endoscope apparatus includes: a housing; a first heat generator disposed in the housing; an air feeding unit disposed in the housing and configured to cause air to pass in a vicinity of the first heat generator; a second heat generator disposed in the housing and provided in one of places above and below a flow path for the air, caused by the air feeding unit to pass in the vicinity of the first heat generator, in a height direction of the housing; and a guide plate provided on the flow path for the air, caused by the air feeding unit to pass in the vicinity of the first heat generator, and having an inclination for changing the flow path for the air after passage in the vicinity of the first heat generator to another of the places above and below in the height direction of the housing.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: July 13, 2021
    Assignee: OLYMPUS CORPORATION
    Inventors: Masaaki Watanabe, Tatsuya Nakanishi
  • Patent number: 11041500
    Abstract: A system for cooling a heat generating enclosure includes a first array of one or more fans of a first size and a second array of one or more fans of a second size, where the second array is in series to the first array. The system also includes a measuring unit configured to measure at least one process variable. The system also includes a control unit configured to control at least one of the fans in the first array or at least one of the fans in the second array based on the process variable, wherein the fans are controlled to achieve an optimization criterion.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: June 22, 2021
    Assignee: International Business Machines Corporation
    Inventors: David Barron, Rachael C. Freitas, Howard V. Mahaney, Benjamin W. Mashak, George Zacharakis-Jutz
  • Patent number: 11035371
    Abstract: A method of cooling a heat generating enclosure includes setting a speed of each fan in a first array of fans, wherein each fan in the first array of fans is a first size, is disclosed. The method further includes measuring a process variable. The method also includes calculating a cooling strategy based at least in part on the value of the process variable. The method further includes setting the speed of each fan in the first array of fans or the speed of each fan in a second array of fans, wherein the second array of fans is in series to the first array of fans and each fan in the second array of fans is a second size, and wherein the speed of each fan that is set in the first or second array is set to implement the cooling strategy.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: June 15, 2021
    Assignee: International Business Machines Corporation
    Inventors: David Barron, Rachael C. Freitas, Howard V. Mahaney, Jr., Benjamin W. Mashak, George Zacharakis-Jutz
  • Patent number: 11038293
    Abstract: Apparatuses and systems associated with power provision for packages mounted to a printed circuit board are disclosed herein. In embodiments, a socket arrangement may include a header and a first bus bar, wherein the first bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a power supply contact of a component package and to a power supply connection within a proximity of a power source, wherein a power output of the power source is electrically coupled to the power supply connection. The socket arrangement may further include a second bus bar, wherein the second bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a ground contact of the component package and a ground connection within the proximity of the power source. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 15, 2021
    Assignee: Intel Corporation
    Inventors: Brian D. Aspnes, Jeffory L. Smalley, Weimin Shi
  • Patent number: 11028858
    Abstract: The fan assembly provided with a fan ring, including a first leg and a second leg, may be arranged with a shroud that may include a first sidewall, a second sidewall, a third sidewall, a first ring, a second ring, and a third ring. An air passage may be formed between a distal end of the first leg and the third ring, the second ring and the first leg, the second leg and the second sidewall, and a distal end of the first leg and the first ring. The air passage may be configured to improve acoustic performance and air flow efficiency.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: June 8, 2021
    Assignee: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg
    Inventors: Tao Hong, Attila Simofi-Ilyes, John Fleck
  • Patent number: 11032923
    Abstract: A first and second display assembly are moveably mounted to a frame. At least one of the display assemblies includes a cover, an electronic display located behind the cover, and a first and second channel. A fixed plate is attached to the frame and positioned entirely within a cavity located between the display assemblies and the frame. The cavity and the first channel are part of a closed loop pathway, while the second channel is part of an open loop pathway. The closed loop is sealed when the display assemblies are in a closed position, and the fixed plate is accessible when the display assemblies are in an open position.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: June 8, 2021
    Assignee: Manufacturing Resources International, Inc.
    Inventors: William Dunn, Kevin O'Connor, Marcos Diaz