Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Abstract: An airflow management system that can be fitted to an electrical cabinet intended to accommodate electrical devices in the internal volume thereof, the system comprising: a casing comprising at least one air input intended to be placed in communication with the internal volume of the electrical cabinet, at least two air outputs and at least one principal throat arranged to connect the air input to the two air outputs, a switch device arranged inside said principal throat, between the first air output and the second air output, the switch device comprising movable flaps that can be controlled between a first position in which the air input communicates solely with the first air output and a second position in which the air input communicates at least with the second air output.

Abstract: A coupling assembly includes: a screw rod; a holder mounted on the screw rod; a shaft sleeve set and a connection rod set. The shaft sleeve set includes: a first shaft sleeve embedded in the holder; and a second shaft sleeve fitted over the screw rod at an outer side and slidable on the screw rod. The connection rod set includes: a first connection rod having an end fixedly coupled to the first shaft sleeve; and a second connection rod having an end fixedly coupled to the second shaft sleeve, the second connection rod and the first connection rod crossing and being coupled at a junction. The first connection rod and the second connection rod cross to form an angle.

Abstract: A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.

Abstract: A welding-type power supply including a balanced plate rectifier to rectify high frequency alternating current from one or more transformers. The balanced plate rectifier includes an output terminal symmetrically connected to the plates of the plate rectifiers. The impedance between the output terminal and each plate is substantially equal.

Abstract: An information handling resource blank configured to populate a slot of an information handling system in lieu of an information handling resource may include a form factor having at least some features in common with that of the information handling resource and one or more false fans mechanically coupled to the form factor. Each of the one or more false fans may be configured to have a first airflow impedance when airflow through such false fan is below a threshold airflow and have a second airflow impedance when airflow through such false fan is above the threshold airflow.

Abstract: A diagnostic system includes a fan control circuit coupled to an electric fan and a microcontroller, and a sense line coupled to the fan control circuit and the microcontroller. The fan control circuit outputs a fan command sense signal at a duty cycle through the sense line to the microcontroller. A tachometer generates a tachometer signal at a frequency indicative of the rotational speed of the electric fan. A fan tachometer circuit receives the tachometer signal and outputs the tachometer sense signal at a frequency to the microcontroller in response to the tachometer signal. The microcontroller sets a second diagnostic flag to an error value indicating that the sense line has impaired operation if the frequency of the tachometer sense signal is within a desired frequency range, and a first diagnostic flag is equal to a first error value.

Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.

Abstract: Systems, methods, apparatuses for fan type identification are disclosed. A predetermined pulse width modulation duty cycle is used to obtain a sequence of fan speeds from a fan over a time period. A fan type of the fan is determined based on the sequence of fan speeds.

Abstract: Embodiments of this application disclose a housing structure and a terminal device. The housing structure includes a bottom shell and a lifting shell. A first end of the bottom shell is connected to a first end of the lifting shell, a second end of the bottom shell and a second end of the lifting shell are spaced by a first distance, and space between the bottom shell and the lifting shell forms a heat dissipation channel. A heat dissipation panel is disposed on the bottom shell, a first surface of the heat dissipation panel is in contact with a heat emitting component, and a second surface of the heat dissipation panel is located in the heat dissipation channel. Therefore, the housing structure provided in the embodiments of this application can better dissipate heat for the heat emitting component in the bottom shell.

Abstract: A bi-directional fan device that is field replaceable within an electronic system is provided. The bi-directional fan device includes a fan unit that cools an electronic system when connected to a power source, and an electrical connector constructed at both ends of the fan unit to electrically connect to the power source.

Abstract: A charger is provided with an intake hole through which outside air may flow into the interior of and through the body of the charger, and an exhaust hole from which the outside air is discharged through by the driving a cooling fan. A first vertical wall that surrounds the intake hole or a region exposed to water that drops down the intake hole in a fence-shaped manner, and a second vertical wall that surrounds the exhaust hole or a region exposed to water that drops down the exhaust hole in a fence-shaped manner are provided on a bottom plate of the housing. An electrical circuit board is disposed outward of an area where the first vertical wall surrounds the intake hole and also disposed outward of an area where the second vertical wall surrounds the region exposed to water that drops down the exhaust hole etc.

Abstract: A fan cage is at least adapted to a first fan and a second fan smaller than the first fan. The fan cage includes a cage body and an adjustment member. The cage body defines a first accommodation portion in a size fitting the first fan. The adjustment member is movably disposed on the cage body and switchable between a laid down status and an upright status within the first accommodation portion. When the adjustment member is in the upright status, the adjustment member is upright in the first accommodation portion so that the adjustment member and the cage body together define part of the first accommodation portion as a second accommodation portion in a size fitting the second fan.

Abstract: A support assembly configured to support a display component, includes: a housing comprising a mounting cavity; a circuit board assembly assembled in the mounting cavity; and a heat dissipation assembly assembled to the circuit board assembly.

Abstract: A heating, ventilation, and/or air conditioning (HVAC) unit includes a cabinet defining a cabinet interior configured to house components of the HVAC unit. The cabinet includes an opening defining an air flow path between the cabinet interior and an external environment. The HVAC unit also includes a fan assembly including fan blades configured to move an air flow through the opening, wherein the fan assembly is configured to enable translation of the fan blades through the opening between a shipping arrangement in which the fan blades are disposed in the cabinet interior and an operational arrangement in which the fan blades are disposed in the external environment.

Abstract: A frequency changer cabinet includes a transformer cabinet to accommodate a transformer, a first air outlet being disposed at a top of the transformer cabinet, and a first air inlet being disposed at a side wall; and a power unit cabinet to accommodate at least one power unit, a second air inlet being disposed at a front side wall, and a rear side of the being connected to the transformer cabinet. In an embodiment, a first air passage baffle and a second air passage baffle are respectively disposed at an upper end and a lower end of a secondary coil, such that air entering from the power unit cabinet to the transformer cabinet can be directly sent to the secondary coil. Further, air entering from the first air inlet can pass through a primary coil and the secondary coil, and then flow out of the transformer cabinet.

Abstract: Provided herein is an example heat sink including a heat dissipation unit including a plurality of heat dissipation fin groups including a plurality of heat dissipation fins, the plurality of heat dissipation fin groups forming a laminated structure and a plurality of heat pipes, one end portions of which are thermally connected to a heating element and other end portions of which are inserted into a space provided between the plurality of heat dissipation fin groups forming the laminated structure and thermally connected to the heat dissipation unit.

Abstract: A fan assembly includes a socket to receive a fan module, a fan flap coupled to a first side wall of the socket, and an anti-reflow device coupled to a second side wall of the socket. The fan flap moves in a curved path between a first position and a second position. The anti-reflow device has an attachment feature, an embossed feature, and a stopping feature. The attachment feature attaches the anti-reflow device to the second side wall. The embossed feature extends through a first aperture in the second side wall. The stopping feature extends through a second aperture in the second side wall and contacts the fan flap. When the fan module is removed, the stopping feature retains the fan flap in the first position to block the socket and prevent air from reflowing through the socket.

Abstract: A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.

Abstract: An information handling system may include a chassis having a first region and a second region, wherein the first region includes a memory module, and wherein the second region includes a processing unit; at least one air mover configured to provide airflow; and an airflow shroud including an airflow baffle. When the airflow shroud is installed in the information handling system in a first orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the first region. When the airflow shroud is installed in the information handling system in a second orientation, the airflow baffle may be configured to block at least a portion of the airflow from flowing through the second region.

Abstract: A power conversion system includes a housing (outer housing) and a power converter. The power converter is arranged in an internal space of the housing. An outer peripheral surface of the housing is provided with an air inlet and an air outlet. The air outlet communicates with the air inlet via the internal space of the housing and is located below the air inlet.

Abstract: Described herein are systems, modes, and methods for an electronics enclosure cooling apparatus comprising a plurality of air intake holes located on at least one surface of the enclosure, a plurality of air exhaust holes located on at least one surface of the enclosure different from that of the surface wherein the air intake holes are located, an air plenum piece that comprises a substantially planar portion and a hole located on the substantially planar portion, the air plenum piece of such dimension and placement within the enclosure such that a first volume of the interior is created and a second volume of the interior is created, and wherein the air plenum piece is further adapted to create an air channel that substantially separates the first volume of the interior of the enclosure from the second volume of the interior, and wherein the first volume is in fluid engagement with the plurality of air intake holes, and further wherein the second volume is in fluid engagement with the plurality of air exhau

Abstract: A data storage system includes a chassis housing multiple data storage devices, such as hard disk drives, a compartment housing cooling fans, and an air plenum positioned between the fans and the storage devices. A multibody chambered acoustic attenuator, which may be installed in the air plenum, includes a plate part having airflow holes therethrough and may include a convex arched part having airflow holes therethrough and coupled with the plate part to form a chamber. Acoustic damping material lines an interior surface of the plate part and the interior and exterior surfaces of the arched part, and the airflow holes of the plate part and of the arched part are not aligned, such that direct acoustic emissions and reflections would contact the acoustic damping material and a circuitous airflow path is provided from the cooling fans to the storage devices, to reduce the acoustic sound pressure upon the devices.

Abstract: Embodiments of the invention provide an adjustable barrier assembly for enclosure, and related methods of installation. The adjustable barrier assembly includes a barrier panel that includes a first panel slidable relative to a second panel to accommodate different depths of different enclosures. The assembly further includes a top support bracket, an upper barrier plate, a bottom support bracket, and a lower barrier plate. Each of the upper barrier plate and the lower barrier plate can be secured to the top support bracket and the bottom support bracket, respectively, at different relative orientations in order to accommodate different heights of different enclosures.

Abstract: Disclosed is a prefabricating and stacking combined data center. The data center is formed block structures in a multi-dimensional stacking manner. The block structures are disposed to be a fire protection layer, an air return layer, a bridge architecture wiring layer, a top-cabinet wiring layer, a cabinet device layer, and an air supply layer from up to down, which are independent from each other. Provided is a prefabricating and stacking combined data center. Operation difficulty of site construction is greatly reduced by prefabricating block structures by a factory, forming the data center by multi-dimensional stacking, and connecting the block structures with each other by splicing on site. In addition, according to different requirements of customers, corresponding ancillary facilities may be designed based on volume of an IT device, and the device and a computer room may be reasonably and effectively arranged according to the corresponding national standards and specifications.

Abstract: A fan blade and a fabricating method thereof are provided. The fan blade includes a rough coating layer on a surface thereof. The rough coating layer includes a plurality of recessed regions. A maximum depth of recess of the recessed regions is between 50 ?m to 130 ?m.

Abstract: A crossflow air deflector part for directing airflow includes a front central spine, a first arcuate wall extending from the spine to a first back lateral edge of the airflow deflector, and a second arcuate wall extending from the spine to a second back lateral edge of the airflow deflector opposing the first back lateral edge. Such an airflow deflector can be implemented into a storage server, positioned between a laterally adjacent pair of data storage device (DSD) chambers and a pair of vertically stacked fans, such that the crossflow air deflector functions to direct airflow from one of the lateral DSD chambers into the lower fan and to direct airflow from the other lateral DSD chamber into the upper fan. Independent airflow control for each DSD chamber and each corresponding DSD is thereby provided.

Abstract: A notebook computer cooler using a thermoelectric element includes a housing, a base plate, as an top surface of the housing, having a thermal pad made of a thermally conductive material and on which a notebook computer is seated; a thermoelectric pad disposed in the housing such that a cooling surface thereof is in contact with an inner surface of the thermal pad; a fan disposed on a side opposite the cooling surface of the thermoelectric pad; and a plurality of vent holes penetrated through the base plate and a lower surface of the housing. According to the notebook computer cooler using a thermoelectric element, it is possible to provide an excellent cooling function of the notebook computer by efficiently absorbing the heat of the notebook computer through the thermal pad of a conductive material by using the heat absorption function of the thermoelectric element.

Abstract: A power converter includes: a plurality of semiconductor devices; a heat receiving plate; and a first partition member. The semiconductor devices constitute a power conversion unit. The heat receiving plate includes a first surface supporting the semiconductor devices. The first partition member is fixed to the heat receiving plate and partitions the semiconductor devices.

Abstract: The present disclosure relates to a display device, an electronic device and a device mounting member. The display device includes: a first display module having a first backplane; a second display module having a second backplane located on an opposite side of the first backplane; a first heat sink located between the first backplane and the second backplane; and a second heat sink connected to the first heat sink in thermal conduction.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: A server information handling system may include a processor; a network interface device (NID); a power source; a vertical backplane for providing electrical and data coupling to a plurality of hard disk drives (HDDs) operatively coupled to the vertical back plane; a plurality of vent holes formed through the vertical backplane; and an acoustic dampening device including a duct extension protruding away from the plurality of vent holes formed through the vertical backplane; the duct extensions to acoustically separate a fan system of the server information handling system from the plurality of HDDs within the information handling system server by mitigation of acoustic energy transmission generated by airflow through the plurality of vent holes.

Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.

Abstract: A data centre (10) includes one or more controllable air circulation systems (e.g. air optimiser (11)), one or more cold aisles (15) and/or one or more hot aisles (16), one or more rows of racks (14), the data centre being so arranged that in use cooling air (18) passes, under the control of the one or more controllable air circulation systems, from a cold aisle (15) through the racks (14) and/or through the racks (14) to a hot aisle (16). An access door (20), which provides access to at least one of the aisles, is movable between an open position allowing personnel access to the aisle and a closed position. The door (20) has an aperture (25) in which is provided a controllable air intake arrangement, for example comprising a vent (17) in the form of multiple vertically extending rotatable blades (28).

Abstract: A disclosed system includes (1) at least one hardware component mounted to a drawer of a chassis, (2) a fan module capable of generating airflow to cool the hardware component, and (3) an extensible airduct coupled between the hardware component and the fan module such that, when the drawer of the chassis is opened, the extensible airduct stretches out to lengthen a distance between the hardware component and the fan module and, when the drawer of the chassis is closed, the extensible airduct contracts to shorten the distance between the hardware component and the fan module. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An ultrasound imaging system includes a thermally conductive frame and a number of electronic components and a display that are sealed within the frame. The frame further includes a plenum extending through the frame with surfaces that are thermally coupled to the electronic components and the display. An active cooling mechanism, such as one or more fans, moves air through the plenum to remove heat generated by the electronic components and display. The plenum is environmentally sealed so that moisture, dust, air or other contaminants drawn into the plenum do not contact the sealed electronic components and display in the frame.

Abstract: Systems and methods that may be implemented to provide supplemental cooling air for a portable information handling system from one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned at multiple different locations relative to a portable information handling system, such as notebook computer or laptop computer. In one example, the disclosed systems and methods may be implemented to have one or more mechanically-adjustable cooling air supply outlets that may be positioned and/or repositioned to align with differing geometries of cooling air inlet opening locations that correspond to different portable information handling system sizes and/or designs.

Abstract: A tray for accommodating electronic components is disclosed. The tray has a body that defines a storage space for accepting electronic components in a side-by-side configuration. The body also defines a first airflow channel for guiding airflow from the storage space towards the outside of the body. The body has air inlets and air outlets for providing fluid communication with the storage space. The component bodies of the electronic components are configured to at least partially define a second airflow channel in the storage space for guiding, in use, the airflow from the air inlets to the air outlets, and has been selected for increasing a surface area of the first electronic component being in contact, in use, with the airflow in the storage space.

Abstract: An air mover assembly may be configured such that during insertion of the assembly into an air mover gantry, one or more spring features integral to the gantry apply a first spring force opposite to a direction of insertion of the assembly relative to the gantry in order to maintain the assembly in an unseated position until the first spring force is overcome by an opposite force to fully seat assembly into the gantry and when the assembly is fully seated within the gantry, the one or more spring features integral to the gantry apply a second spring force to the assembly in a direction of air flow through an air mover of the assembly that biases an exhaust portion of the air mover toward a face of the gantry opposite of the one or more spring features.

Abstract: A fan module frame is configured to fix a fan module in a chassis. The fan module frame includes a first frame component, a second frame component and two latches. The first frame component connects a server fan unit to the second frame component by an elastic fastener. The second frame component has a plurality of chambers, and each of the chambers is configured for the server fan unit to be placed therein. The latches are disposed on two opposite sides of the second frame component and connected to the second frame component. The second frame component fixes the fan module in the chassis through the latches. As such, the fan module is detachably fixed in the chassis and can be removed from the chassis without additional tools, and the fan module frame is compatible with various servers and models, thereby saving design costs and saving space.

Abstract: A compute device for operation in a rack of a data center includes a substrate, a solid state drive array, a fan array, and a plurality of physical resources. The components of the compute device are arranged on the substrate to prevent or reduce shadowing of heat-producing physical resources, such as a processor, by other heat-producing physical resources relative to an airflow generated by the fan array. To do so, ruler solid state drives are used to facilitate positioning of the fan array toward a front edge of the substrate.

Abstract: The disclosure provides a luminous fan including a main body, a light guide member and a light source. The main body includes a fan frame and a plurality of propellers, and the plurality of propellers are rotatably mounted on the fan frame. The light guide member includes an outer light guide ring and a plurality of inner light guide rings, the plurality of inner light guide rings are mounted on the fan frame, the plurality of inner light guide rings each have an air channel, the plurality of propellers are respectively located in the air channels, the outer light guide ring is mounted on the plurality of inner light guide rings and surrounds the plurality of inner light guide rings, and the outer light guide ring is exposed from the luminous fan. The light source is disposed between the outer light guide ring and the inner light guide ring.

Abstract: An enclosure configured to at least partially surround a data storage library, and a system including a data storage library and enclosure(s). The enclosure includes at least one surface configured to surround the at least one library access opening and form a chamber and to permit movement of the movable panel to permit access to the interior of the data storage library, and at least one enclosure access opening in the at least one of the surface to permit access to the interior of the chamber. The enclosure is configured to resist environmental conditions from intruding into the interior of the enclosure, and is further configured to permit exterior environmental conditions from within the interior of the library to intrude into the chamber of the enclosure.

Abstract: A power conversion device includes a housing, a power conversion unit, a fan, and a flexible shutter. The shutter is in a sheet shape. The shutter includes an end portion and a movable portion, the end portion being fixed to at least one of the housing and a frame body, the movable portion being movable with respect to the housing. The shutter is configured to be deformed by wind from the fan in a case where the fan is driven and to form a gap through which the wind passes between the shutter and at least one of the housing and the frame body.

Abstract: Apparatuses and methods include at least one push fan assembly and at least one pull fan assembly and at least one constriction channel or pathway designed to compress air pulled in by the push fan so that as the compressed air exits the at least one constriction channel or pathway, the air undergoes an expansion and cools and the push-pull fan arrangement pulls the cooled air through the housing improving the cooling of computer or electronic components housed in the housing.

Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An air baffle for optimizing thermal performance of memory components provided in a chassis is disclosed. The air baffle has a body and one or more venting units provided on the body. The body is configured to be removably coupled to the chassis. The body covers the memory components when coupled to the chassis. The one or more venting units direct air flowing through the chassis. Each of the venting units includes vent openings and a corresponding number of adjustable venting plates. The vent openings are each aligned with the memory components when the body is coupled to the chassis. Each of the adjustable venting plates have an open position or a closed position. A respective venting plate of the adjustable venting plates in the open position allows airflow through a respective vent opening of the vent openings. The respective venting plate of the adjustable venting plates in the closed position blocks airflow through the respective vent opening of the vent openings.

Abstract: Apparatuses, methods and storage medium associated with coolant systems for computer and electrical environments are disclosed herein. In embodiments, an apparatus for selectively transferring of heat within a computer environment may include a cold plate thermally coupled to a liquid line of a liquid coolant system of the computer environment, the cold plate to transfer heat to the liquid line and a thermally-conductive body to cool a component of the computer environment. The apparatus may further include a thermoelectric cooler (TEC) thermally coupled with the cold plate on a first side of the TEC and thermally coupled with the thermally-conductive body on a second side of the TEC, the TEC to increase an amount of heat transfer from the second side of the TEC to the first side of the TEC in response to energy provided to the TEC.

Abstract: An air baffle insertable between a chassis wall and a computer component such as a GPU and heat sink mounted on a GPU tray to divert air flow to the computer component is disclosed. The air baffle includes a single sheet having a bottom panel, a top panel, and a pair of parallel side walls. Each of the parallel side walls are connected to the bottom and top panels. A first end wall is joined to the side walls and the top and bottom panel. The first end wall directs air flow toward the computer component.

Abstract: A component-level cooling system for cooling components in a chassis includes a fan in a housing positioned on a circuit board. The housing has a fan inlet on a side, a first fan outlet on one end and a second fan outlet on a second end opposite the first end. The first fan outlet may direct a first airflow in a first direction to a vent on a first panel of the chassis. The second fan outlet may direct a second airflow in a second direction opposite the first direction. A duct comprises a duct inlet for receiving the second airflow, an elbow for redirecting the second airflow in a third direction to avoid the second airflow from colliding with a main airflow to reduce acoustic noise, and a duct outlet located to avoid heated air exiting the duct from re-entering the fan inlet.