With Heat Sink Or Cooling Fins Patents (Class 361/697)
  • Patent number: 10798839
    Abstract: A solid state drive (SSD) device includes a cage with a top wall and a bottom wall spaced a distance from the top wall so as to define a cage interior between the top and bottom walls. In addition, at least 10% of an area along a side of the cage is open to the cage interior to permit airflow through the side of the cage. At least one printed circuit board (PCB), which includes at least one integrated circuit component, is also provided within the cage interior.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: October 6, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Le Gao, Yang Sun, Na Feng, Yepeng Chen
  • Patent number: 10798853
    Abstract: The present invention relates to an inverter device having an inverter module for converting DC power stored in an energy storage system (ESS) of a photovoltaic power generation system into AC power and supplying the AC power to a load. The inverter device comprises a case, an input/output terminal unit, and a heat dissipating fan. The case has an inverter module housed therein and a plurality of heat dissipating holes formed on the rear surface thereof. The input/output terminal unit is fixed to an upper portion of the front surface of the case through a first fastening member, and a plurality of cables are connected to an inner surface thereof through a second fastening member so as to be energized. The heat dissipating fan is fixed to the front surface of the case while being disposed below the input/output terminal unit, and discharges heat generated by the inverter module.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: October 6, 2020
    Assignee: LSIS CO., LTD.
    Inventor: Hyuk-Il Kwon
  • Patent number: 10673429
    Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of ā€œUā€ shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A sub-miniature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.
    Type: Grant
    Filed: September 15, 2017
    Date of Patent: June 2, 2020
    Assignee: Zonit Structured Solutions, LLC
    Inventors: Steve Chapel, William Pachoud
  • Patent number: 10532489
    Abstract: A power tool includes a housing, a saw blade for cutting a workpiece, a motor for driving the saw blade to rotate about a first axis, a circuit board for controlling the motor, a heat sink for cooling, and a base plate being formed with a flat surface for contacting with the workpiece during cutting. The housing includes a first containing portion being formed with a first container for containing the motor, a second containing portion extended along a direction substantially parallel to the flat surface from one of the two ends of the first containing portion along a direction substantially perpendicular to the first axis. The second containing portion is formed with a second container which is communicated with the first container. The circuit board and the heat sink are disposed in the second container.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: January 14, 2020
    Assignee: Nanjing Chervon Industry Co., Ltd.
    Inventors: Weipeng Chen, Hongwei Wang, Xiangqing Fu
  • Patent number: 10529649
    Abstract: A heat dissipation module configured to dissipate heat from a heat source of an electronic device is provided. The heat dissipation module includes a heat pipe, a plurality of fins, and a fan. One end of the heat pipe is in thermal contact with the heat source. The fins are stacked up to be combined with one another and structurally propped against another end of the heat pipe. The fins form a plurality of flow inlets and a plurality of flow outlets. The fan is disposed at the flow inlets, and air flow generated by the fan flows in via the flow inlets and flows out via the flow outlets. A portion of the fin at the flow outlet forms a bending, and a pitch between any adjacent fins at the bending is less than 1 mm to be qualified to achieve a safety certification.
    Type: Grant
    Filed: December 1, 2017
    Date of Patent: January 7, 2020
    Assignee: Acer Incorporated
    Inventors: Shun-Ta Yu, Wen-Neng Liao, Cheng-Yu Cheng, Jau-Han Ke, Cheng-Wen Hsieh
  • Patent number: 10522450
    Abstract: An electronic device may include a semiconductor package, that may include a package substrate. The package may include a semiconductor die. A plurality of package interconnects may include a first pillar extending from a surface of the package substrate. The electronic device may include a socket that may be configured to couple with the semiconductor package. The socket may include a plurality of socket interconnects configured to engage with the package interconnects. The plurality of socket interconnects may include a first contact, and the first contact may include an arm. The arm of the first contact may be configured to engage with the first pillar, and the arm may be configured to laterally displace when engaged with the first pillar. The engagement of the arm with the first pillar may establish an electrical communication pathway between the semiconductor package and the socket.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: December 31, 2019
    Assignee: Intel Corporation
    Inventors: Gregorio Murtagian, Saikumar Jayaraman
  • Patent number: 10491073
    Abstract: A flywheel energy storage system includes a flywheel housing that encloses a flywheel rotor, a motor/alternator, and a power electronics unit. The power electronics unit includes a power electronics housing directly mounted on the flywheel housing, and one or more power electronic circuits enclosed by the power electronics housing. The direct mounting of the power electronics housing on the flywheel housing enables thermal distribution for passive cooling purposes. The design of the flywheel energy storage system also reduces the vibrational forces imparted by the power electronics housing on the flywheel housing.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: November 26, 2019
    Inventors: Roger Nelson Hitchcock, Peter Vasilnak, Matthew K. Senesky, Mark J. Holloway, Daniel Bakholdin, Seth R. Sanders
  • Patent number: 10409430
    Abstract: An electronic device has a force touch function which is capable of minimizing a degradation of picture quality, wherein the electronic device may include a housing having a receiving space, an image display module disposed in the receiving space, and a force sensing panel disposed between a bottom surface of the housing and the image display module, which enables a user's force touch to be sensed through the force sensing panel, and to minimize a degradation of picture quality caused by heat.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: September 10, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: JongGu Heo, JongHee Hwang
  • Patent number: 10410953
    Abstract: A power conversion device includes a semiconductor module with switching elements incorporated therein, a plurality of components electrically connected to the semiconductor module, and a laminated cooler provided with a plurality of cooling plates. A laminate is constituted by laminating at least the plurality of cooling plates and the semiconductor module, at least one among the plurality of cooling plates constituting the laminate is a large area cooling plate in which a projected area when viewed from the stacking direction is larger than the other cooling plates, and at least one of the components is a specific arrangement component which, when viewed from the stacking direction, is arranged in a specific position which overlaps the large area cooling plate, and, when viewed from a direction orthogonal to the stacking direction, overlaps with the laminate.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 10, 2019
    Assignee: DENSO CORPORATION
    Inventor: Taijiro Momose
  • Patent number: 10389270
    Abstract: A power conversion device includes a main board, a connector module, an input conversion module, a capacitor, an output conversion module, a control module and a conducting part. The main board includes two lateral edges along a first direction and two lateral edges along a second direction. The connector module is mounted on the main board, and includes an input connector and an output connector. The output connector is located under the input connector. The input conversion module, the output conversion module and the control module are perpendicularly mounted on the main board. The conducting part is in parallel with the control module and electrically coupled with the input connector or the output connector. The connector module, the input conversion module, the capacitor and the output conversion module are mounted on the main board and arranged in a line along the second direction.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: August 20, 2019
    Assignee: DELTA ELECTRONICS (THAILAND) PUBLIC COMPANY LIMITED
    Inventors: Jia Sun, Junlai Huang, Xuanshun Qi, Kai Dong, Zhongwei Ke
  • Patent number: 10285303
    Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: May 7, 2019
    Assignee: Apple Inc.
    Inventors: Reuben J. Williams, Vinh H. Diep, Jonathan Matheson
  • Patent number: 10174924
    Abstract: A heat sink arrangement can be comprised of a substantially planar base and fins extending upwards from the planar base. The planar base can be shaped in accordance with a light-emitting diode (LED) light fixture. An improved heat sink that the planar base is a component of can be capable of fitting within the LED light fixture. The space between the fins can form air pathways. Each fin can be substantially arced in shape, originating from a central region of the planar base and ending at an outside edge of the planar base.
    Type: Grant
    Filed: December 28, 2012
    Date of Patent: January 8, 2019
    Inventor: Gary K. Mart
  • Patent number: 10146277
    Abstract: A vehicle adapter configured to be mounted to a vehicle. The vehicle adapter includes a body sized and shaped to receive and hold a portable communications device, the body including a surface configured to press against the portable communications device. The vehicle adapter further includes a cooling system coupled to the body, the cooling system including a conduit configured to deliver a coolant to an internal channel of the portable communications device. The conduit defines a projection sized and shaped to press against and open a valve on the portable communications device when the portable communications device is received into the vehicle adapter.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: December 4, 2018
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Alexander Gomelsky, Yaakov Moseri, Evgeny Bialik, Yossi Mizrahi, Michael Astanovsky
  • Patent number: 10064311
    Abstract: A first thermal management approach involves an air flow through cooling mechanism with multiple airflow channels for dissipating heat generated in a PCA. The air flow direction through at least one of the channels is different from the air flow direction through at least another of the channels. Alternatively or additionally, the airflow inlet of at least one channel is off-axis with respect to the airflow outlet. A second thermal management approach involves the fabrication of a PCB with enhanced durability by mitigating via cracking or PTH fatigue. At least one PCB layer is composed of a base material formed from a 3D woven fiberglass fabric, and conductive material deposited onto the base material surface. A conductive PTH extends through the base material of multiple PCB layers, where the CTE of the base material along the z-axis direction substantially matches the CTE of the conductive material along the x-axis direction.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: August 28, 2018
    Assignee: ELBIT SYSTEMS LTD.
    Inventors: Oleg Naigertsik, Alex Fischman, Ian Engleman, Isaac Jak Kettner
  • Patent number: 9924610
    Abstract: A reduced-depth rack server for a reduced depth rack includes a data storage device rotated a quarter turn within a carrier. An interposer cable connects at one end to a laterally presented electrical connector of the data storage device and presents another connector to an end that is inserted inwardly into a rack server chassis to electrically connect with a backplane of the reduced-depth rack server. In one embodiment, a data storage assembly of the data storage device, carrier and interposer cable is inserted from a front end of the chassis. In one embodiment, the data storage assembly is inserted from a top of the chassis to facilitate airflow.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: March 20, 2018
    Assignee: Dell Products, L.P.
    Inventors: Shane Michael Chiasson, James Frederic McKinney, Alan Jacob Brumley
  • Patent number: 9897850
    Abstract: A display apparatus for displaying an image, including: a liquid-crystal panel which displays the image; a back light which emits light toward a rear face of the liquid-crystal panel; a rear frame which supports the back light via a screw; and a rear cover which covers part of a face of the rear frame which is different from a face of the rear frame on which the back light is provided, wherein the back light extends beyond an inner-frame region of the rear frame covered by the rear cover, and the screw is provided only in the inner-frame region.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: February 20, 2018
    Assignee: FUNAI ELECTRIC CO., LTD.
    Inventors: Akira Yokawa, Akihiro Fujikawa, Yasuyuki Fukumoto
  • Patent number: 9871424
    Abstract: In the present invention, a housing having a trunk part accommodating therein a brushless motor and an output part to which a tip tool is to be connected, a handle part having one end connected to the trunk part, and an accommodation part provided at an other end of the handle part is used, and a FET serving as a switching element that supplies power to the motor is accommodated in the accommodation part from which a power supply cord is pulled out. It is possible to reduce the length of the trunk part in the front-rear direction compared to a case where the FET is disposed in the front-rear direction of the motor.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: January 16, 2018
    Assignee: HITACHI KOKI CO., LTD.
    Inventor: Naoki Tadokoro
  • Patent number: 9863320
    Abstract: The invention relates to a heat exchanger of an air circulation channel of a turbomachine, the heat exchanger being configured so as to have fluid to be cooled passing through it and including a plurality of fins protruding from a support surface, the heat exchanger being characterized in that each fin includes a base and a preferably continuous leading face which extends axially from the base in the air circulation direction while tapering from upstream to downstream along an axis parallel with the support surface.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: January 9, 2018
    Assignee: SNECMA
    Inventors: Imane Ghazlane, Gabriela Philippart
  • Patent number: 9832908
    Abstract: A plurality of vent perforations are formed on a side face of an electronic apparatus and communicate the inside and the outside of the electronic apparatus with each other therethrough. The electronic apparatus includes a fan which sucks or discharges air through the plurality of vent perforations. A groove is formed on the side face of the electronic apparatus and extends in a forward and rearward direction. The plurality of vent holes are formed on an inner face of the groove of the side face. With the structure, the vent holes can be suppressed from being closed up when the electronic apparatus is placed vertically, and the drop of the ventilation efficiency can be suppressed.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: November 28, 2017
    Assignee: SONY INTERACTIVE ENTERTAINMENT INC.
    Inventor: Sumii Tetsu
  • Patent number: 9759496
    Abstract: In order to suppress an increase in the temperature of a leeward heat sink without increasing cost, a heat dissipating structure 140 according to the present invention includes a plurality of regions arranged along the direction of airflow from an air blower unit 150, wherein the regions are arranged in descending order of thermal resistance in each region, from windward to leeward.
    Type: Grant
    Filed: March 18, 2016
    Date of Patent: September 12, 2017
    Assignee: NEC Corporation
    Inventor: Tomoyuki Mitsui
  • Patent number: 9709064
    Abstract: An integrated fan blade and a fan having the same are provided. The fan includes a stator (1) and a fan blade (2); the stator (1) is provided with a stator pivoting member (10) and disposed on and electrically connected to a circuit board (11); the fan blade (2) includes a blade wheel (20), a fan blade pivoting member (21) formed at the center of the blade wheel (20) and axially extended; and a plurality of blade pieces (22) annularly formed at the outer periphery of the blade wheel (20), and the fan blade pivoting member (21) is pivoted with the stator pivoting member (10), wherein the fan blade (2) is formed with a magnetic material area and formed through an integrally forming means. With the fan blade (2) being integrally formed, the fan operating property can be effectively improved.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: July 18, 2017
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa Tsai, Shih-Wei Huang
  • Patent number: 9342110
    Abstract: A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: May 17, 2016
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Chun-Chieh Wong, Cheng-Yu Wang
  • Patent number: 9341395
    Abstract: A room air conditioner with a liquid-to-air heat exchanging device for the exchange of heat between a liquid and air has a first flow channel for the air and a second flow channel for the liquid, and at least one Peltier element. The heat exchanging device is subdivided into a first stage in which a heat exchange occurs in a passive manner between the liquid and air, and a subsequent second stage in which heat is pumped from the liquid to the air or from the air to the liquid by supplying an electrical current to the at least one Peltier element.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: May 17, 2016
    Assignee: MENTUS HOLDING AG
    Inventors: Stefan Heule, Alexandr Sologubenko
  • Patent number: 9345160
    Abstract: Provided is an electronic device that is provided with a filter circuit that suppresses the effects of electromagnetic noise propagated through space from a circuit board and reduces parasitic inductance, and can output a voltage with adequately reduced noise. To solve the above problem, in an electronic device provided with a cabinet (101), a circuit board (132) provided in the cabinet, an output terminal (122) that passes through a through hole provided in the cabinet and outputs the output of the circuit board to the outside, the present invention constructs a loop composed of a filter means (142) having a filter capacitor (142a), an output terminal, a cabinet, and wires (142b, 142c) for connecting these parts. The wire (142c) connected to the cabinet is connected to a position close to the output terminal, and reduces the size of the loop. In addition, a shield (102) is provided between the filter means and the circuit board.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: May 17, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Keisuke Fukumasu, Akihiro Namba, Hidenori Shinohara
  • Patent number: 9324678
    Abstract: An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: April 26, 2016
    Assignee: Intel Corporation
    Inventors: Sanka Ganesan, Ram S. Viswanath
  • Patent number: 9310138
    Abstract: Techniques for cooling concentrating solar collector systems are provided. In one aspect, an apparatus for cooling a photovoltaic cell includes a heat exchanger having a metal plate with a bend therein that positions a first surface of the metal plate at an angle of from about 100 degrees to about 150 degrees relative to a second surface of the metal plate, and a plurality of fins attached to a side of the metal plate opposite the first surface and the second surface; a vapor chamber extending along the first surface and the second surface of the metal plate, crossing the bend; and a cladding material between the vapor chamber and the heat exchanger, wherein the cladding material is configured to thermally couple the vapor chamber to the heat exchanger. A photovoltaic system and method for operating a photovoltaic system are also provided.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: April 12, 2016
    Assignees: International Business Machines Corporation, King Abdulaziz City for Science and Technology
    Inventors: Ayman Alabduljabbar, Abdullah I. Alboiez, Yaseen G. Alharbi, Alhassan Badahdah, Hussam Khonkar, Yves C. Martin, Naim Moumen, Robert L. Sandstrom, Theodore Gerard van Kessel
  • Patent number: 9300133
    Abstract: Various techniques are employed alone or in combination, to reduce the levelized cost of energy imposed by a power plant system. Solar energy concentrators in the form of inflated reflectors, focus light onto photovoltaic receivers. Multiple concentrators are grouped into a series-connected cluster that shares control circuitry and support structure. Individual concentrators are maintained at their maximum power point via balance controllers that control the flow of current that shunts this series connection. DC current from clusters is transmitted moderate distances to a centralized inverter. The inductance of transmission lines is maximized using an air-spaced twisted pair, enhancing the performance of boost-type three phase inverters. Cluster outputs are separate from individual inverters in massively interleaved arrays co-located at a central location.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: March 29, 2016
    Assignee: Maxout Renewables, Inc.
    Inventor: Eric Bryant Cummings
  • Patent number: 9282275
    Abstract: According to one embodiment, an electronic apparatus includes a housing, a heat sink in the housing, a heat pipe including a curved portion toward the heat sink, and a fan including a cutout portion accommodating the curved portion.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: March 8, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Akifumi Yamaguchi, Tomohiro Hamada, Seiji Hashimoto
  • Patent number: 9280139
    Abstract: An image forming apparatus including a fan cover including a wall portion disposed to overlap a rotational axis of a fan in an axis direction along the rotational axis, the wall portion extending in an orthogonal direction perpendicular to the axis direction, a first section disposed on one side relative to the wall portion in the orthogonal direction, the first section having a first opening disposed on one side relative to the fan in the axis direction and on the one side relative to the rotational axis in the orthogonal direction, and a second section disposed on an other side relative to the wall portion in the orthogonal direction, the second section having a second opening disposed on the one side relative to the fan in the axis direction and on the other side relative to the rotational axis in the orthogonal direction.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: March 8, 2016
    Assignee: Brother Kogyo Kabushiki Kaisha
    Inventors: Masahito Saeki, Hirotaka Tatematsu
  • Patent number: 9252074
    Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: February 2, 2016
    Assignee: Amtek Semiconductors Co., Ltd.
    Inventor: Chien-Ping Huang
  • Patent number: 9237677
    Abstract: A cooling device includes: a heat sink and a heat pipe that are connected with each other; a metal plate that is connected with the heat pipe; an elastic member that is provided in the metal plate; and a securing member that is attachable with a printed circuit board on which a heating part is mounted, is able to be secured to the elastic member to be elastically deformed such that the metal plate is pushed to the heating part, and is able to position the metal plate in a state where the securing member is not secured to the elastic member.
    Type: Grant
    Filed: February 11, 2013
    Date of Patent: January 12, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Shuji Honda, Masao Honda
  • Patent number: 9200854
    Abstract: The present disclosure relates to a plate for use with a heatsink. The plate is adapted to engage with the heatsink and a fan subassembly, and comprises a first substantially planar section which is adapted to engage with the heatsink and a second substantially planar section which is adapted to engage with the fan subassembly.
    Type: Grant
    Filed: May 3, 2013
    Date of Patent: December 1, 2015
    Assignee: CONTROL TECHNIQUES LIMITED
    Inventor: Charles Anthony Cachia
  • Patent number: 9192079
    Abstract: An improved cooling mechanism for a power electronics device is provided. More specifically, a cooling mechanism is provided that includes an air passageway configured to allow cooling air to bypass a portion of a heatsink adjacent to the rectifier circuitry and direct cooling air into an area of the heatsink that is nearer to the inverter circuitry. Another embodiment employs an air passageway with an air directing structure configured to provide an air flow that impinges on a lateral surface of the heatsink. In another embodiment, the air directing structure is chosen to provide a turbulent air flow in the heat dissipating structure within the vicinity of the inverter circuitry.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: November 17, 2015
    Assignee: Rockwell Automation Technologies, Inc.
    Inventor: Michael William Loth
  • Patent number: 9167729
    Abstract: An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.
    Type: Grant
    Filed: August 28, 2013
    Date of Patent: October 20, 2015
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Xiaohu Liu
  • Patent number: 9155432
    Abstract: A central vacuum cleaning system can include a vacuum unit, a plurality of inlet valves, an exhaust, a cleaning air path from the inlet valves through the vacuum unit to the exhaust, and a control unit. An example control unit can include a power input, a power output, motor control circuitry to control application of power from the power input to the power output, a first port, a second port, a conduit providing a conduit air path between the first port and the second, a heat sink in thermal contact with the conduit air path and a component of the motor control circuitry, wherein the control unit is connected through the first port and the second port in the cleaning air flow path between the inlets and the exhaust, and the power output is connected to a power input of the vacuum unit.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: October 13, 2015
    Assignee: CUBE INVESTMENTS LIMITED
    Inventors: J. Vern Cunningham, Mircea Dan Paul, Daniel Budurea
  • Patent number: 9155906
    Abstract: A light-emitting diode (LED) therapeutic apparatus includes a body portion formed of a light-weight resin material into a rectangular housing; a printed circuit board including a plurality of LEDs having different emission colors mounted linearly in a plurality of rows at required intervals; a thermal radiating plate provided with a plurality of thermal radiating studs formed of a light-weight thermally conductive material; and a transparent plate mounted on an opening surface of the body portion. The thermal radiating plate is mounted in tight contact in the body portion, and the printed circuit board is mounted in tight contact with the heat radiating studs. The heat generated by the LEDs is radiated from the surface of the body portion via the thermal radiating plate from the thermal radiating studs. The LEDs may be maintained to a junction allowable temperature or lower so that a long life span without noise is achieved.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: October 13, 2015
    Assignee: ATOM MEDICAL CORPORATION
    Inventors: Kazuo Matsubara, Terumi Matsubara, Naoki Honma, Hiroki Suma
  • Patent number: 9089078
    Abstract: A method of cooling a computer server that includes a plurality of server modules, and is positioned in an enclosed room, includes transferring heat generated by a server module of the plurality of server modules to a hot plate of a liquid cooling system. The liquid cooling system may be positioned within the server module, and the hot plate may have a surface exposed to the enclosed room. The method may also include positioning a cold plate of a room-level cooling system in thermal contact with the hot plate. The method may also include directing a cooling medium through the room-level cooling system to transfer heat from the hot plate to a cooling unit positioned outside the room.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: July 21, 2015
    Assignee: ASETEK DANMARK A/S
    Inventor: Steven B. Branton
  • Patent number: 9075584
    Abstract: Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: July 7, 2015
    Assignee: INTEL CORPORATION
    Inventors: Mark MacDonald, Shawn S. McEuen
  • Publication number: 20150139662
    Abstract: Electronic or opto-electronic on-board connector and method to dissipate heat from such a connector. The connector is positioned within the scope of a cooling air flow. The component includes a heat sink with a heat sink base carrying a plurality of upwardly extending elements, such as pins or fins. The heat sink base makes an angle with the flow direction of the cooling air flow.
    Type: Application
    Filed: October 17, 2012
    Publication date: May 21, 2015
    Inventor: Ulrich Keil
  • Patent number: 9033028
    Abstract: A heat dissipation module includes a centrifugal fan and a heat pipe. The centrifugal fan includes an outer housing, a heat dissipation fin array, a retaining wall, an impeller and a rotation-driving device. The outer housing includes an axial air inlet, an axial air outlet and a radial air outlet. The heat dissipation fin array is located at an inner wall of the radial air outlet. The retaining wall is located on a flat wall of the outer housing on which the axial air outlet is located. The retaining wall is in contact with an inner wall of an electronic device to collectively form a circulation channel so as to guide airflows output from the axial air outlet through the flat wall with which the heat dissipation fin array is aligned, and into the axial air inlet. The heat pipe is in contact with the heat dissipation fin array.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: May 19, 2015
    Assignee: QUANTA COMPUTER INC.
    Inventor: Che-Ming Wang
  • Patent number: 9029814
    Abstract: An LED light source device capable of making the amount of light of an emitting region a predetermined amount of light or more and uniformizing the amount of light is provided. The LED light source device 1 includes an ultraviolet LED array 3 including an LED juxtaposition region R in which LEDs 10 that emit ultraviolet light toward the front are juxtaposed, and a light transmitting member 4 provided on the front side of the LED juxtaposition region R of the ultraviolet LED array 3 so as to be opposed thereto, showing a rectangular parallelepiped outer shape, and formed of a material containing quartz. At a front surface 10a of the LED 10, an emitting surface S surrounded by a marginal portion 11 of a predetermined width H and for emitting the ultraviolet light is provided.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: May 12, 2015
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Ryotaro Matui, Hideaki Yokoyama
  • Patent number: 9030821
    Abstract: An electronic device includes a case having an exhaust vent, an electronic component, a radiation component including radiation fins adjacent to the exhaust vent and formed of first plates disposed parallel to one another to form first air channels, the radiation component radiating the heat received from the electronic component to air passing through the first air channels, a fan disposed at a position having a space from the radiation fins to send air toward the radiation fins, a dust filter including second plates disposed parallel to one another to form second air channels and disposed in the space between the radiation fins and the fan to transfer the air to the radiation fins while capturing dust. The dust filter is removable and the second plates have a shape to be inserted in the first air channels so as to push the dust out of the first air channels.
    Type: Grant
    Filed: August 7, 2012
    Date of Patent: May 12, 2015
    Assignee: Fujitsu Limited
    Inventor: Akinobu Kawano
  • Patent number: 9008518
    Abstract: A system includes an optical transmitter package comprising an optical transmitter to generate optical transmission signals based on electrical transmission signals. The system also includes an optical receiver package comprising an optical receiver to generate electrical reception signals based on optical reception signals. The system further includes a printed circuit board (PCB) on which the optical transmitter package and the optical receiver package are mounted. The PCB includes a heat generating circuit component. The optical transmitter package can be mounted to the PCB to subjected to less heat from the heat generating circuit component than the optical receiver package.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: April 14, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael Renne Ty Tan, Glenn C. Simon, Sagi Varghese Mathai
  • Patent number: 9007764
    Abstract: There is provided an electric device configured to cool a plurality of plug-in units, the electric device including a plurality of slots, each slot configured to install a plug-in unit, a first fan configured to create a current of air for cooling the plug-in units, a first plug-in unit installed into a first slot, and a second plug-in unit including a second fan configured to create a current of air for cooling the first plug-in unit, the second plug-in unit being installed into a second slot adjacent to the first slot, arranged to a side of mounting component of the first plug-in unit.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: April 14, 2015
    Assignee: Fujitsu Limited
    Inventors: Minoru Fujii, Mitsuaki Hayashi, Kenji Joko, Osamu Saito, Wataru Takano, Takashi Shirakami, Kouichi Kuramitsu, Yusuke Kira
  • Patent number: 8995933
    Abstract: In a communication device, a heat sink includes a solderable top surface with multiple upward facing swaging protrusions. A spacer is placed on top of the top surface of the heat sink with locating cut-outs on the spacer aligned with the swaging protrusions. A solder pre form is inserted into an opening in the spacer. The solder pre form includes locating features for alignment with the spacer and the swaging protrusions. The spacer is configured to restrict melted flow from the solder pre form to a defined area of the heat sink top surface. A printed circuit board including cut-outs and input and output connections for inserting a radio frequency device and further including locating holes for aligning the printed circuit board with the swaging protrusions is placed on top of the solder pre form and secured to the heat sink prior to a manufacturing process.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: March 31, 2015
    Assignee: Motorola Solutions, Inc.
    Inventors: John M. Waldvogel, Herman J. Miller
  • Patent number: 8982557
    Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.
    Type: Grant
    Filed: June 8, 2012
    Date of Patent: March 17, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideki Watanabe, Shigeo Hayashi
  • Patent number: 8982561
    Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: March 17, 2015
    Assignee: Delphi Technologies, Inc.
    Inventors: Chris R. Snider, Vineet Gupta, Joseph K. Huntzinger, Michael G. Coady, Curtis Allen Stapert, Kevin Earl Meyer, Timothy D. Garner, Allen E. Oberlin
  • Publication number: 20150062818
    Abstract: According to one embodiment, an electronic apparatus includes a first housing and a second housing. The first housing includes a first wall, a second wall opposite to the first wall, and a third wall between the first wall and the second wall. The third wall faces the second housing when the second housing is raised from the first housing. The third wall includes an outmost portion of the third wall in a direction from a fan toward the third wall, a first area obliquely extending between the outmost portion and the first wall and including a first opening, and the second area obliquely extending between the outmost portion and the second wall and including a second opening.
    Type: Application
    Filed: April 9, 2014
    Publication date: March 5, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yasuyuki Horii, Hikaru Hirata, Hisao Tsukazawa
  • Patent number: 8967586
    Abstract: A supporting apparatus, configured to support a heat dissipating device, includes a bracket, two adjusting structures, and two mounting portions. Each of the two mounting portions defines a mounting hole. Each of the two adjusting structures is engaged in each of the mounting holes and includes an adjusting member and an installation member engaged with the adjusting member. Each of the adjusting members defines a through hole. The two adjusting members are rotatable relative to the two mounting portions from a first position to a second position. When the adjusting members are in the first position, a first line is running through the two through holes. When the adjusting members are in the second position, a second line is running through the two through holes, and a length of the first line is less than a length of the second line.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: March 3, 2015
    Assignees: Hong Fu Jin Precision Industry (WuHan) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chao-Jun Zhu, Jin-Biao Ji, Zhi-Jiang Yao
  • Publication number: 20150055297
    Abstract: Modules, systems, and methods are provided for cooling components of an inspection or testing apparatus, such as a borescope. In some exemplary embodiments, the modules include two heat sinks, with the top-most heat sink having a fan assembly approximately centrally disposed therein. The fan assembly can be operated to draw air into the top-most heat sink, and then exhaust airflow out of the top-most heat sink such that the exhaust air passes across at least a portion of the second heat sink to help cool both the first and second heat sinks, and components of the apparatus associated therewith, using the same fan assembly. As a result, the components of the apparatus can be cooled more easily, and the performance and efficiency of these components is improved, all while reducing the overall size and weight of the inspection apparatus.
    Type: Application
    Filed: August 26, 2013
    Publication date: February 26, 2015
    Applicant: General Electric Company
    Inventors: Theodore Chilek, Nicholas Stancato