Abstract: A cooling system configured to remove heat from a chimney of a server cabinet. The cooling system including a first chimney portion adjacent to the server cabinet, a second chimney portion extending from a top of the first chimney portion, wherein the second chimney portion is disposed above the server cabinet, a chimney heat exchanger disposed in the second chimney portion and above the server cabinet, a fluid inlet for providing a working fluid to the chimney heat exchanger, a fluid outlet for discharging the working fluid from the chimney heat exchanger, and an air handler heat exchanger connected to the chimney heat exchanger by a return air plenum, wherein the chimney heat exchanger has an upstream surface that receives waste heat generated by a server disposed in the server cabinet and a downstream surface that discharges air to the return air plenum.

Abstract: A blind insert fluid connection module includes a first fluid connector located on a first assembly and a second fluid connector located on a second assembly. The second fluid connector is used to engage the first fluid connector in a first direction to form a fluid channel. The second assembly includes a main body, a guide structure, and a cushioning resilient member. The fastening member is located on the main body. The guide structure is located on the main body, and the second fluid connector is fixed on the guide structure. The cushioning resilient member is connected to the guide structure to provide a buffer displacement of the second fluid connector along the second direction when the first and second fluid connectors are joined, wherein an included angle is formed between the second direction and the first direction.

Abstract: An information handling system, including a plurality of computing modules; a rack-mountable tray including: a plurality of bays, each bay including a thermal pad, wherein i) each computing module is engaged with one or more of the bays of the plurality of bays and ii) one or more of the thermal pads are in thermal communication with a respective computing module of the plurality of computing modules; and a fluid circulation system positioned within the tray and coupled to each of the thermal pads, the fluid circulation system circulating fluid proximate to the thermal pads to transfer heat from the computing modules through the thermal pads.

Abstract: One aspect is directed to a system for controlling airflow in a facility having a ceiling-ducted aisle airflow containment system having a first damper system for controlling airflow. The system includes an input to receive parameters related to airflow in the facility, wherein the parameters include at least one airflow resistance value for a device in the facility, an output to provide output data including at least one setting for one or more controllable devices in the facility, and one or more processors configured to receive the parameters related to airflow, determine airflow values associated with the airflow containment system and based on the airflow values, generate the at least one setting for the one or more controllable devices, including at least one setting for the first damper system.

Abstract: A display device is disclosed. The display device includes a display panel, a frame positioned behind the display panel, a PCB coupled to the frame and including a heating element, and a vapor chamber including an internal space for fluid to flow, wherein the vapor chamber includes a heat-absorbing part in contact with the heating element, a heat-releasing part positioned above the heat-absorbing part and spaced apart from the PCB, and a plurality of lines formed at an outer side of the vapor chamber, wherein the plurality of lines extend in a first direction corresponding to an axis that connects a center of the heat-absorbing part to a center of the heat-releasing part.

Abstract: The present document describes a passive thermal-control structure for speakers and associated apparatuses and methods. The architecture of the passive thermal-control structure is such that heat is transferred from electronic subsystems of the electronic speaker device to the passive thermal-control structure, which acts as an internal, structural frame of the electronic speaker device and provides both thermal mitigation and structural stability. The passive thermal-control structure conducts heat from the electronic subsystems to a housing of the electronic speaker device. The housing of the electronic speaker device may dissipate the heat to the ambient environment to prevent thermal runaway of the electronic subsystems, and the internal frame mitigates the temperature of the housing from exceeding ergonomic temperature limits.

Abstract: The present disclosure relates to a cooler and to a display device having the same, where a heat-exchanger of the cooler is arranged on a side surface of a display unit in order to simplify the structure and to make a slimmer display device. The cooler includes a closed air circulation pathway circulating between the front, rear and sides of the display unit; an open air flow pathway that flows in the length direction of the side of the display unit; and a cooling module that is installed on the side of the display along the length direction of the display, and that includes the heat-exchanger, where the closed air circulation path and the open air flow part are adjacent, thereby causing heat-exchange.

Abstract: A method of cooling a data centre, and a data centre, is disclosed. Optionally, the data centre comprises: a cooling air source (201); at least one rack room (202) having a floor and rack storage areas (203a-203d) on the floor, each rack storage area accommodating racks in which items of electronic equipment having at least one fan (204) are housed; one or more cold aisles (205) in the rack room, each cold aisle being adjacent to a rack storage area; one or more hot aisles (206) in the rack room, each hot aisle being adjacent to a rack storage area; and an air supply corridor (207) for transporting cooling air, above the floor, from the cooling air source to the one or more cold aisles. The method optionally comprises transporting cooling air from the cooling air source (201) to the one or more cold aisles (205) substantially under the control of the fans (204) of the items of electronic equipment.

Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.

Abstract: In one embodiment, a method for operating and controlling an immersion cooling system in a normal operating mode includes obtaining sensor data of fluid within an immersion tank of the immersion cooling system, wherein the sensor data includes temperature values of the fluid and fluid level values of the fluid, obtaining temperature values of at least one electronic device immersed in the fluid of the immersion tank, determining if the temperature values are within a required range of temperature values, and if the temperature values are not within the required range of temperature values, determining if the temperature values are higher than the required range. The method further includes, if the temperature values are higher than the required range, increasing a return pump speed of the immersion cooling system. Methods for operating and controlling an immersion cooling system also include control strategies for initial installation and maximum cooling conditions.

Abstract: A method of cooling an electronics cabinet includes inducing a flow of cooling air to enter into the electronics cabinet, passing the flow of cooling air over electronic modules arranged within the electronics cabinet to convectively transfer heat to the flow of cooling air from the electronic modules, and directing the flow of cooling air through a door heat exchanger at an end of the electronics cabinet to exhaust the flow of cooling air from the cabinet. A first coolant flow is directed through the door heat exchanger, and heat is transferred from the flow of cooling air to the first coolant flow as they pass through the door heat exchanger. A second coolant flow is circulated through a coolant loop that is arranged within the electronics cabinet, and passes though cold plates that are joined to at least some of the electronic modules to transfer heat from those modules to the second coolant flow.

Abstract: A process for continuous, on-demand production of dilute acrolein liquid on-site, at or near the point of acrolein injection, by the liquid dehydration of glycerol in an improved tubular reactor where non-aqueous glycerol is combined with a heteropolyacid catalyst, including silicotungstic acid, phosphotungstic acid, or phosphomolybdic acid. The acid catalyst is evenly dissolved and dispersed in the glycerol upstream of the reactor vessel. The reaction is conducted in a tubular reactor which is heated to an elevated reaction temperature. The dilute acrolein produced in the tubular reactor is directed downstream, optionally through a liquid-liquid heat exchanger and then an air-liquid heat exchanger to reduce temperature, and then diluted prior to being injected into sulfide contaminated systems (such as oil & gas water floods, water disposal systems, producing oil wells, and fuel oil storage) via a pressure conduit.

Abstract: The present disclosure relates to semiconductors. Some embodiments may include a series circuit arrangement of power semiconductors comprising: cooling-water boxes arranged on the semiconductors and electrically connected to them; two cooling-water distributor lines; respective branchings on the cooling-water distributor lines for the cooling chambers; and a control electrode arranged on the cooling-water distributor lines. The cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream. The cooling chambers are connected to the branchings via a respective connecting line. For at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.

Abstract: A power semiconductor module for a motor vehicle. a plurality of unhoused power semiconductor chips are provided, which are arranged so that a liquid coolant that is introduced into the power semiconductor module through a liquid coolant feed line can circulate directly around them.

Abstract: A server heat dissipation channel structure, used in a server having a plurality of heat generating sources installed therein, includes an upper guiding shield, a lower guiding shield and a fan. The upper guiding shield includes an upper entrance section and a flow guiding channel extended therefrom. The lower guiding shield includes a lower entrance section and a first heat dissipation channel extended therefrom. The fan includes an air output plane facing toward the upper entrance section and the lower entrance section correspondingly at the same time. In addition, the upper guiding shield includes a downward slanted channel at a rear end of the flow guiding channel opposite from a rear end of the first heat dissipation channel and a second heat dissipation channel extended from the first heat dissipation channel. The first and second heat dissipating channels respectively pass through different heat generating sources installed inside the server.

Abstract: An electrical connector used to be electrically connected to a circuit board includes: an insulating body; a plurality of terminals, accommodated in the insulating body; a shielding shell, accommodating the insulating body and mounted to the circuit board; and at least one heat dissipation member, located on at least one side of the shielding shell and simultaneously abuts the circuit board and the shielding shell. The heat dissipation members are provided on one or more sides of the shielding shell, and simultaneously abut the shielding shell and the circuit board, so that the heat generated in the operation of the electrical connector is transferred to the heat dissipation members via the shielding shell, and the heat is further transferred to the outside and the circuit board by the heat dissipation members, thus improving the heat dissipation efficiency of the electrical connector, and ensuring the stable operation of the electrical connector.

Abstract: A housing of a power conversion device is partitioned into sealed and open parts. A first housing containing a primary-side electronic component connected to a primary winding of a transformer has a first opening through which a first connection conductor is inserted, the first opening being blocked by an aperture surface included in a third housing containing the transformer and filled with an insulating member. A shortest distance between the first connection conductor and an edge of the first opening is greater than or equal to a first threshold. A second housing containing a secondary-side electronic component connected to a secondary winding of the transformer has a second opening through which a second connection conductor is inserted, and is blocked by the aperture surface. A shortest distance between the second connection conductor and an edge of the second opening is greater than or equal to a second threshold.

Abstract: A cooling system for cooling air in a rack mounted equipment such as computer systems. The cooling system includes a split and staggered cooling system where the cooling is carried out by two different parallel coolers. One of the coolers is pressed against the walls of the cooling duct, but allows some amount of the air to pass around the cooler. The output of that first cooler is also constricted to a similar amount as the air output that passes around the first cooler. The second cooler is downstream of the first cooler, and receives all the air that passes around the first cooler and provides cooling to that air. In this way, two different split coolers can be used to cool the air stream.

Abstract: The device provides an optical coherence tomography system; a first bank of light emitting diodes emitting light centered about a first wavelength; a second bank of light emitting diodes, emitting light centered about a second wavelength; a prism, said prism including a first surface transmissive of the wavelength of the probe beam of the optical coherence tomography system, and a second surface which is also transmissive of the wavelength of the probe beam, and where the second is surface coated from a first edge to a midpoint so to be reflective of light at the first wavelength and transmissive of light at the second wavelength, and from the midpoint to a second edge transmissive of light at the first wavelength and reflective of light at the second wavelength; and one or more detector arrays. Alternate embodiments are taught.

Abstract: A fuel cell includes a cell side insulation (2) separating an internal space of a pressure vessel (205) into an outer space (5) and an inner space (6), a plurality of cell stacks (101) disposed in the inner space, and a lower damper (11-i). In the cell side insulation, a plurality of lower flow passages (7) which connect a lower portion of the outer space to a lower portion of the inner space and a plurality of upper flow passages (8) which connect an upper portion of the outer space to an upper portion of the inner space are formed. The lower damper adjusts a flow rate of a gas that flows toward the inner space from the outer space via the plurality of lower flow passages and flows toward the outer space from the inner space via the plurality of upper flow passages.

Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.

Abstract: A portable data center includes a cooling system comprising a cooling circuit, one or more air plenums, and one or more air moving devices. The cooling circuit circulates a heat transfer fluid through a portion of the cooling circuit that passes through the one or more air plenums. The heat transfer fluid that passes through the one or more air plenums cools air flowing through the one or more air plenums via the one or more air moving devices. The cooling circuit also circulates the heat transfer through a separate portion of the portable data center where heat is rejected from the heat transfer fluid into the separate portion of the portable data center. In some embodiments, the air plenums and at least a portion of the cooling circuit are mounted in a sub-floor space between a platform within the portable data center and an outer structure of the portable data center.

Abstract: A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a processor, a user interface communicatively coupled to the processor, and a thermal management application. The thermal management application may include a program of instructions embodied in non-transitory computer-readable media, and may be configured to, when executed by the processor receive measurements associated with a plurality of parameters of a thermal system of the information handling system, calculate a calculated thermal resistance based on the measurements, and report information regarding the calculated thermal resistance via the user interface.

Abstract: A system includes a substantially sealed, substantially airtight cabinet sized for housing a vertical array of heat-producing units, the cabinet having an exterior shell and the system including an interior divider wall disposed inside the cabinet, the shell and divider wall providing an equipment chamber adapted to support the array such that the array cooperates with the shell and divider wall in use to define a first plenum, the first plenum having a first inlet defined by the divider wall for receiving a flow of cooling gas and having a first outlet defined by a plurality of openings through the array whereby the first plenum communicates with the openings in use to exhaust substantially all of the flow of cooling fluid through the openings and hence through the array, wherein the divider wall is configured to allow the first inlet to admit the gas to the first plenum in a substantially horizontal direction.

Abstract: A cooling unit (10) includes a housing (12) having a front (14) and a back (16), one or more fans (28) provided at either the front (14) or the back (16) of the housing (12), and a V-shaped evaporator (30) positioned within the housing (12) and coupled to a source of liquid refrigerant. The V-shaped evaporator (30) has two panels extending from adjacent to the bottom (22) of the housing to adjacent to the top (24) of the housing (12) when positioning the evaporator (30) in the housing (12). The arrangement is such that an inside of the panels of the evaporator (30) faces air being drawn through the housing (12) of the cooling unit (10) by the fan (28).

Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets configured to house computer equipment. At least two coolant supply lines from which the cabinets receive coolant are made available, with each of the supply lines providing the coolant to multiple cabinets. Moreover, the cabinets are arranged in rows and columns such that the cabinets along a row are spaced closer together than the cabinets along a column. Furthermore, each row of the cabinets receives coolant from alternating coolant supply lines.

Abstract: An electronic device includes a chassis, a partition plate mounted in the chassis, a semiconductor refrigeration piece, a first heat sink, a second heat sink, a heat dissipation shell, and a fan. A space of the chassis is partitioned to a first space and a second space by the partition plate. The first heat sink is received in the first space, and engaged with a heating surface of the semiconductor refrigeration piece. The second heat sink is received in the second space, and engaged with a cooling surface of the semiconductor refrigeration piece. The heat dissipation shell is received in the second space, and the second heat sink is received in the heat dissipation shell. The first fan is mounted on a first end of the heat dissipation shell, and a second end of the heat dissipation pipe defines an air outlet.

Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

Abstract: An electronics compartment with a component space which is sealed off from a surrounding environment by walls, including an internal panel arranged in the component space along a wall of the electronics compartment for delimiting an internal channel between the wall and the internal panel. Air flowing in the internal channel can improve transfer of heat through the wall, and consequently, cools electric components in the component space.

Abstract: A method of operating a fan control of a cooling arrangement having at least one exhaust air unit that withdraws air heated by electrical or electronic parts of a plurality of plug-in components, and having at least one cooling unit that cools air used for cooling purposes including determining a selected temperature difference for the air used for cooling the server rack relative to power consumption of the at least one exhaust air unit and the at least one cooling unit depending on the temperature difference; measuring at least one actual temperature difference between at least two temperatures of the air used for cooling purposes; and adjusting the speed of a fan for the at least one exhaust air unit depending on a deviation between the determined optimized temperature difference and the actual temperature difference measured.

Abstract: Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N?1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z?1.

Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.

Abstract: The invention relates to an arrangement for operating a current converter, in particular an inverter, wherein the converter is located at a path of travel of land vehicles or at a parking space of a land vehicle, the converter being adapted to support operation of at least one vehicle, the converter is combined with a cooling device adapted to cool the converter during operation, the cooling device is designed to use a heat transport medium in order to transport heat away from the converter, the arrangement comprises at least one pole and/or at least one supporting structure which is also located at the path of travel or at the parking space, the pole and/or the supporting structure extends upwards from ground, the arrangement comprises a conduct for conducting the heat transport medium and the conduct extends from the cooling device to the pole and/or to the supporting structure and also extends inside the pole and/or inside the supporting structure so that heat can be transferred from the heat transport med

Abstract: An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure, a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure.

Abstract: A container data center includes a container and a server cabinet received in the container. The server cabinet includes a rack and a number of heat dissipation devices mounted to a rear side of the rack. Each heat dissipation device includes a case fixed to the rack, a fan mounted to an outer side of the case, and a heat dissipation plate received in the case and aligning with the fan. The heat dissipation plate defines a vent. The fan draws heat air through the vent of the heat dissipation plate from the rack, and the heat air is cooled by refrigerant received in the heat dissipation plate to become cool air. The cool air flows in the container, and circularly flows into the cabinet from a front side of the cabinet.

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract: A thermosyphon heat exchanger includes a first set of first conduit elements for heat absorbing and a second set of second conduit elements for heat releasing. A first end of the first set can be connected to a first end of the second set by at least one manifold and a second end of the first set is connected to a second end of the second set by at least one other manifold. At least one first set of first conduit elements and the at least one second set of second conduit elements are at least partially arranged such that a stack is formed.

Abstract: The invention provides storage enclosure, comprising an enclosure housing; one or more drawers slidably arranged within the enclosure housing, wherein each drawer has a pivotably mounted midplane having storage media coupled thereto wherein the storage media are coupled to both sides of the pivotably mounted midplane.

Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.

Abstract: A datacenter may use heat collected from a heat exchanger at the exhaust portion of a cooling system to heat inlet louvers for an atmospheric intake. The louvers may have fluid passages through which heated fluid may pass and cause the louvers to heat up. The heated louvers may operate during periods of snow, rain, high humidity, or other conditions to eliminate condensation, snow and ice buildup, or other problems. In some embodiments, a liquid may be passed through the louvers, while in other embodiments, heated air or other gas may be passed through conductive paths in the louvers. In a heated air system, holes in the louvers may allow the heated air to enter the incoming airstream to regulate the incoming temperature to the datacenter.

Abstract: A server includes a housing, a motherboard and a heat dissipating module. The motherboard is disposed inside the housing and includes multiple heat sources. The heat dissipating module includes a cooling plate disposed inside the housing and in thermal contact with multiple heat sources. The cooling plate includes a substrate, a casing and multiple fins. The substrate is in thermal contact with multiple heat sources. The casing is disposed on the substrate, while the casing and the substrate form a chamber. Multiple fins are disposed on the substrate and are inside the chamber.

Abstract: An electronics enclosure has a blower and diffuser received within an enclosure. Electronic components are also received within the enclosure. The blower diffuser is positioned in contact with at least one of the electronic components. A shroud surrounds the blower diffuser and the at least one electronic component, and is spaced from an outer surface of the at least one electronic component. An opening is formed through the shroud, such that air can be driven within the shroud from the blower diffuser, and across at least one electronic component, and then outwardly of the opening. A heat exchanger is positioned in the path of air leaving the opening.

Abstract: Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is substantially parallel to a side plane of the rack. The circulated air is cooled with a heat exchanger that is connected to a vertical end of the rack via a sealed interface. Multiple racks can be arrayed in a distributed cooling arrangement, which increases reliability and scalability of the data center.

Abstract: A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.

Abstract: A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted in the container such it can move from a position abutting a front of an enclosure cooling unit to a maintenance and access position spaced apart from the enclosure cooling unit. Each enclosure cooling unit is capable of providing varying amounts of cool air to the rack enclosure it abuts, so that the interior of each rack enclosure can be maintained at a different temperature.

Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.

Abstract: A shelter comprises an enclosure for delimiting an air-conditionable enclosure interior and a container that is externally mounted to the enclosure and has a container space for receiving a cooling installation. The enclosure comprises at least one passage for heat recirculation from the enclosure interior to the container space. The shelter provides protection against detrimental exterior influences so that a reliable and energy-efficient cooling of the enclosure interior is ensured.

Abstract: An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.

Abstract: A vehicle system includes a power electronics device and a coolant circuit thermally coupled to the power electronics device. The coolant circuit includes a fluidic pump and a fluid/air heat exchanger, an air pump configured to transfer air across the fluid/air heat exchanger, and a shutter device configured to control airflow across the fluid/air heat exchanger. A controller controls the fluidic pump to control coolant flow through the fluid/air heat exchanger to reject heat from the power electronics device to the coolant and correspondingly controls the air pump and the shutter device to control airflow across the fluid/air heat exchanger to reject heat from the coolant to achieve a preferred heat rejection from the power electronics device.