With Heat Exchanger Unit Patents (Class 361/696)
  • Patent number: 11083116
    Abstract: The present disclosure relates to a cooler and to a display device having the same, where a heat-exchanger of the cooler is arranged on a side surface of a display unit in order to simplify the structure and to make a slimmer display device. The cooler includes a closed air circulation pathway circulating between the front, rear and sides of the display unit; an open air flow pathway that flows in the length direction of the side of the display unit; and a cooling module that is installed on the side of the display along the length direction of the display, and that includes the heat-exchanger, where the closed air circulation path and the open air flow part are adjacent, thereby causing heat-exchange.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: August 3, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Ji Won Choi, Se Hyeon Kim, Ju Hyok Kim, Han Choon Lee, Sung Wook Han
  • Patent number: 11071237
    Abstract: A method of cooling a data centre, and a data centre, is disclosed. Optionally, the data centre comprises: a cooling air source (201); at least one rack room (202) having a floor and rack storage areas (203a-203d) on the floor, each rack storage area accommodating racks in which items of electronic equipment having at least one fan (204) are housed; one or more cold aisles (205) in the rack room, each cold aisle being adjacent to a rack storage area; one or more hot aisles (206) in the rack room, each hot aisle being adjacent to a rack storage area; and an air supply corridor (207) for transporting cooling air, above the floor, from the cooling air source to the one or more cold aisles. The method optionally comprises transporting cooling air from the cooling air source (201) to the one or more cold aisles (205) substantially under the control of the fans (204) of the items of electronic equipment.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: July 20, 2021
    Assignee: Bripco BVBA
    Inventors: Paul Rogers, Neil Crow, Lucian Hicks
  • Patent number: 10985537
    Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: April 20, 2021
    Assignee: GE Aviation Systems LLC
    Inventors: Liqiang Yang, Richard Anthony Eddins, Robert Lloyd George, Darrell Lee Grimes
  • Patent number: 10939580
    Abstract: In one embodiment, a method for operating and controlling an immersion cooling system in a normal operating mode includes obtaining sensor data of fluid within an immersion tank of the immersion cooling system, wherein the sensor data includes temperature values of the fluid and fluid level values of the fluid, obtaining temperature values of at least one electronic device immersed in the fluid of the immersion tank, determining if the temperature values are within a required range of temperature values, and if the temperature values are not within the required range of temperature values, determining if the temperature values are higher than the required range. The method further includes, if the temperature values are higher than the required range, increasing a return pump speed of the immersion cooling system. Methods for operating and controlling an immersion cooling system also include control strategies for initial installation and maximum cooling conditions.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: March 2, 2021
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 10893633
    Abstract: A method of cooling an electronics cabinet includes inducing a flow of cooling air to enter into the electronics cabinet, passing the flow of cooling air over electronic modules arranged within the electronics cabinet to convectively transfer heat to the flow of cooling air from the electronic modules, and directing the flow of cooling air through a door heat exchanger at an end of the electronics cabinet to exhaust the flow of cooling air from the cabinet. A first coolant flow is directed through the door heat exchanger, and heat is transferred from the flow of cooling air to the first coolant flow as they pass through the door heat exchanger. A second coolant flow is circulated through a coolant loop that is arranged within the electronics cabinet, and passes though cold plates that are joined to at least some of the electronic modules to transfer heat from those modules to the second coolant flow.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: January 12, 2021
    Assignee: MODINE MANUFACTURING COMPANY
    Inventors: David Samuel Wilks, Nino Veselinov Nenchev
  • Patent number: 10730818
    Abstract: A process for continuous, on-demand production of dilute acrolein liquid on-site, at or near the point of acrolein injection, by the liquid dehydration of glycerol in an improved tubular reactor where non-aqueous glycerol is combined with a heteropolyacid catalyst, including silicotungstic acid, phosphotungstic acid, or phosphomolybdic acid. The acid catalyst is evenly dissolved and dispersed in the glycerol upstream of the reactor vessel. The reaction is conducted in a tubular reactor which is heated to an elevated reaction temperature. The dilute acrolein produced in the tubular reactor is directed downstream, optionally through a liquid-liquid heat exchanger and then an air-liquid heat exchanger to reduce temperature, and then diluted prior to being injected into sulfide contaminated systems (such as oil & gas water floods, water disposal systems, producing oil wells, and fuel oil storage) via a pressure conduit.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: August 4, 2020
    Inventor: David O. Trahan
  • Patent number: 10559519
    Abstract: The present disclosure relates to semiconductors. Some embodiments may include a series circuit arrangement of power semiconductors comprising: cooling-water boxes arranged on the semiconductors and electrically connected to them; two cooling-water distributor lines; respective branchings on the cooling-water distributor lines for the cooling chambers; and a control electrode arranged on the cooling-water distributor lines. The cooling chambers are connected in parallel between the cooling-water distributor lines with respect to a cooling-water stream. The cooling chambers are connected to the branchings via a respective connecting line. For at least some of the cooling chambers, the branchings on the cooling-water distributor lines are arrayed relative to the position of the respective cooling chamber in offset manner in relation to a geometrically shortest possible link to the cooling-water distributor lines, so that a difference of potential between the cooling chambers and the branchings is minimized.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: February 11, 2020
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Johann Holweg, Katrin Benkert, Harald Landes, André Leonide
  • Patent number: 10438869
    Abstract: A power semiconductor module for a motor vehicle. a plurality of unhoused power semiconductor chips are provided, which are arranged so that a liquid coolant that is introduced into the power semiconductor module through a liquid coolant feed line can circulate directly around them.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: October 8, 2019
    Assignee: AUDI AG
    Inventor: Roman Straßer
  • Patent number: 10390464
    Abstract: A server heat dissipation channel structure, used in a server having a plurality of heat generating sources installed therein, includes an upper guiding shield, a lower guiding shield and a fan. The upper guiding shield includes an upper entrance section and a flow guiding channel extended therefrom. The lower guiding shield includes a lower entrance section and a first heat dissipation channel extended therefrom. The fan includes an air output plane facing toward the upper entrance section and the lower entrance section correspondingly at the same time. In addition, the upper guiding shield includes a downward slanted channel at a rear end of the flow guiding channel opposite from a rear end of the first heat dissipation channel and a second heat dissipation channel extended from the first heat dissipation channel. The first and second heat dissipating channels respectively pass through different heat generating sources installed inside the server.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: August 20, 2019
    Assignee: AIC INC.
    Inventors: Chin-Yen Chen, Hsih-Ting You, Yen-Chih Chen
  • Patent number: 10276986
    Abstract: An electrical connector used to be electrically connected to a circuit board includes: an insulating body; a plurality of terminals, accommodated in the insulating body; a shielding shell, accommodating the insulating body and mounted to the circuit board; and at least one heat dissipation member, located on at least one side of the shielding shell and simultaneously abuts the circuit board and the shielding shell. The heat dissipation members are provided on one or more sides of the shielding shell, and simultaneously abut the shielding shell and the circuit board, so that the heat generated in the operation of the electrical connector is transferred to the heat dissipation members via the shielding shell, and the heat is further transferred to the outside and the circuit board by the heat dissipation members, thus improving the heat dissipation efficiency of the electrical connector, and ensuring the stable operation of the electrical connector.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: April 30, 2019
    Assignee: LOTES CO., LTD
    Inventors: Chin Chi Lin, Cheng Wei Lo
  • Patent number: 10256730
    Abstract: A housing of a power conversion device is partitioned into sealed and open parts. A first housing containing a primary-side electronic component connected to a primary winding of a transformer has a first opening through which a first connection conductor is inserted, the first opening being blocked by an aperture surface included in a third housing containing the transformer and filled with an insulating member. A shortest distance between the first connection conductor and an edge of the first opening is greater than or equal to a first threshold. A second housing containing a secondary-side electronic component connected to a secondary winding of the transformer has a second opening through which a second connection conductor is inserted, and is blocked by the aperture surface. A shortest distance between the second connection conductor and an edge of the second opening is greater than or equal to a second threshold.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: April 9, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetoshi Kitanaka, Hirokazu Takabayashi
  • Patent number: 10251311
    Abstract: A cooling system for cooling air in a rack mounted equipment such as computer systems. The cooling system includes a split and staggered cooling system where the cooling is carried out by two different parallel coolers. One of the coolers is pressed against the walls of the cooling duct, but allows some amount of the air to pass around the cooler. The output of that first cooler is also constricted to a similar amount as the air output that passes around the first cooler. The second cooler is downstream of the first cooler, and receives all the air that passes around the first cooler and provides cooling to that air. In this way, two different split coolers can be used to cool the air stream.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: April 2, 2019
    Inventors: Mark David Ortenzi, Chris Orlando
  • Patent number: 10235556
    Abstract: The device provides an optical coherence tomography system; a first bank of light emitting diodes emitting light centered about a first wavelength; a second bank of light emitting diodes, emitting light centered about a second wavelength; a prism, said prism including a first surface transmissive of the wavelength of the probe beam of the optical coherence tomography system, and a second surface which is also transmissive of the wavelength of the probe beam, and where the second is surface coated from a first edge to a midpoint so to be reflective of light at the first wavelength and transmissive of light at the second wavelength, and from the midpoint to a second edge transmissive of light at the first wavelength and reflective of light at the second wavelength; and one or more detector arrays. Alternate embodiments are taught.
    Type: Grant
    Filed: December 11, 2016
    Date of Patent: March 19, 2019
    Inventor: Joshua Noel Hogan
  • Patent number: 10141586
    Abstract: A fuel cell includes a cell side insulation (2) separating an internal space of a pressure vessel (205) into an outer space (5) and an inner space (6), a plurality of cell stacks (101) disposed in the inner space, and a lower damper (11-i). In the cell side insulation, a plurality of lower flow passages (7) which connect a lower portion of the outer space to a lower portion of the inner space and a plurality of upper flow passages (8) which connect an upper portion of the outer space to an upper portion of the inner space are formed. The lower damper adjusts a flow rate of a gas that flows toward the inner space from the outer space via the plurality of lower flow passages and flows toward the outer space from the inner space via the plurality of upper flow passages.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: November 27, 2018
    Assignee: MITSUBISHI HITACHI POWER SYSTEMS, LTD.
    Inventor: Hiroyuki Ozawa
  • Patent number: 10088249
    Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: October 2, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Wu-Chi Lee, Tse-Hsin Wang, Ying-Chi Chen, Lee-Lung Chen
  • Patent number: 9795062
    Abstract: A portable data center includes a cooling system comprising a cooling circuit, one or more air plenums, and one or more air moving devices. The cooling circuit circulates a heat transfer fluid through a portion of the cooling circuit that passes through the one or more air plenums. The heat transfer fluid that passes through the one or more air plenums cools air flowing through the one or more air plenums via the one or more air moving devices. The cooling circuit also circulates the heat transfer through a separate portion of the portable data center where heat is rejected from the heat transfer fluid into the separate portion of the portable data center. In some embodiments, the air plenums and at least a portion of the cooling circuit are mounted in a sub-floor space between a platform within the portable data center and an outer structure of the portable data center.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: October 17, 2017
    Assignee: Amazon Technologies, Inc.
    Inventors: Peter George Ross, Darin Lee Frink, Frank Charles Paterra
  • Patent number: 9763366
    Abstract: A space-saving, high-density modular data pod and a method of cooling a plurality of computer racks are disclosed. The modular data pod includes an enclosure including wall members contiguously joined to one another along at least one edge of each wall member in the shape of a polygon and a data pod covering member. Computer racks arranged within the enclosure form a first volume between the inner surface of the wall members and first sides of the computer racks. A second volume is formed of second sides of the computer racks. A computer rack covering member encloses the second volume and the data pod covering member form a third volume coupling the first volume to the second volume. An air circulator continuously circulates air through the first, second, and third volumes. The method includes circulating air between the first and second volumes via the third volume and the computer racks.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: September 12, 2017
    Assignee: INERTECH IP LLC
    Inventors: Earl Keisling, John Costakis, Gerald McDonnell
  • Patent number: 9690339
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a processor, a user interface communicatively coupled to the processor, and a thermal management application. The thermal management application may include a program of instructions embodied in non-transitory computer-readable media, and may be configured to, when executed by the processor receive measurements associated with a plurality of parameters of a thermal system of the information handling system, calculate a calculated thermal resistance based on the measurements, and report information regarding the calculated thermal resistance via the user interface.
    Type: Grant
    Filed: February 26, 2014
    Date of Patent: June 27, 2017
    Assignee: Dell Products L.P.
    Inventors: Austin Michael Shelnutt, Christopher M. Helberg, Travis C. North
  • Patent number: 9392733
    Abstract: A system includes a substantially sealed, substantially airtight cabinet sized for housing a vertical array of heat-producing units, the cabinet having an exterior shell and the system including an interior divider wall disposed inside the cabinet, the shell and divider wall providing an equipment chamber adapted to support the array such that the array cooperates with the shell and divider wall in use to define a first plenum, the first plenum having a first inlet defined by the divider wall for receiving a flow of cooling gas and having a first outlet defined by a plurality of openings through the array whereby the first plenum communicates with the openings in use to exhaust substantially all of the flow of cooling fluid through the openings and hence through the array, wherein the divider wall is configured to allow the first inlet to admit the gas to the first plenum in a substantially horizontal direction.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: July 12, 2016
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventor: Tony Day
  • Patent number: 9357671
    Abstract: A cooling unit (10) includes a housing (12) having a front (14) and a back (16), one or more fans (28) provided at either the front (14) or the back (16) of the housing (12), and a V-shaped evaporator (30) positioned within the housing (12) and coupled to a source of liquid refrigerant. The V-shaped evaporator (30) has two panels extending from adjacent to the bottom (22) of the housing to adjacent to the top (24) of the housing (12) when positioning the evaporator (30) in the housing (12). The arrangement is such that an inside of the panels of the evaporator (30) faces air being drawn through the housing (12) of the cooling unit (10) by the fan (28).
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: May 31, 2016
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: Rong Long, Jinghua Yu, Ting Zhou
  • Patent number: 9258931
    Abstract: Methods of preventing overheating of computer equipment in a cabinet when a supply coolant to a cooler in the cabinet fails. An example embodiment is a data center that includes a plurality of cabinets configured to house computer equipment. At least two coolant supply lines from which the cabinets receive coolant are made available, with each of the supply lines providing the coolant to multiple cabinets. Moreover, the cabinets are arranged in rows and columns such that the cabinets along a row are spaced closer together than the cabinets along a column. Furthermore, each row of the cabinets receives coolant from alternating coolant supply lines.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: February 9, 2016
    Assignee: International Business Machines Corporation
    Inventors: Madhusudan K. Iyengar, Roger R. Schmidt
  • Patent number: 9229498
    Abstract: An electronic device includes a chassis, a partition plate mounted in the chassis, a semiconductor refrigeration piece, a first heat sink, a second heat sink, a heat dissipation shell, and a fan. A space of the chassis is partitioned to a first space and a second space by the partition plate. The first heat sink is received in the first space, and engaged with a heating surface of the semiconductor refrigeration piece. The second heat sink is received in the second space, and engaged with a cooling surface of the semiconductor refrigeration piece. The heat dissipation shell is received in the second space, and the second heat sink is received in the heat dissipation shell. The first fan is mounted on a first end of the heat dissipation shell, and a second end of the heat dissipation pipe defines an air outlet.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: January 5, 2016
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Qiang Chen
  • Patent number: 9226426
    Abstract: An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: December 29, 2015
    Assignee: International Business Machines Corporation
    Inventors: Paul F. Bodenweber, Jon A. Casey, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka
  • Patent number: 9167730
    Abstract: An electronics compartment with a component space which is sealed off from a surrounding environment by walls, including an internal panel arranged in the component space along a wall of the electronics compartment for delimiting an internal channel between the wall and the internal panel. Air flowing in the internal channel can improve transfer of heat through the wall, and consequently, cools electric components in the component space.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: October 20, 2015
    Assignee: ABB TECHNOLOGY OY
    Inventors: Juha Tuomola, Brian Baldwin, Dan Crawley
  • Patent number: 9060450
    Abstract: A method of operating a fan control of a cooling arrangement having at least one exhaust air unit that withdraws air heated by electrical or electronic parts of a plurality of plug-in components, and having at least one cooling unit that cools air used for cooling purposes including determining a selected temperature difference for the air used for cooling the server rack relative to power consumption of the at least one exhaust air unit and the at least one cooling unit depending on the temperature difference; measuring at least one actual temperature difference between at least two temperatures of the air used for cooling purposes; and adjusting the speed of a fan for the at least one exhaust air unit depending on a deviation between the determined optimized temperature difference and the actual temperature difference measured.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: June 16, 2015
    Assignee: Fujitsu Technology Solutions Intellectual Property GmbH
    Inventor: Gerold Scheidler
  • Patent number: 9038406
    Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack and positioned for air passing through the electronics rack to pass across the heat exchanger. The heat exchanger is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.
    Type: Grant
    Filed: May 26, 2010
    Date of Patent: May 26, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9043035
    Abstract: Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N?1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z?1.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: May 26, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. Chainer, Milnes P. David, Madhusudan K. Iyengar, Pritish R. Parida, Roger R. Schmidt, Mark D. Schultz
  • Publication number: 20150116937
    Abstract: An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure, a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure.
    Type: Application
    Filed: October 23, 2014
    Publication date: April 30, 2015
    Applicant: ABB OY
    Inventors: Till HUESGEN, Christoph SCHRÖDL, Daniel KEARNEY, Gernot RIEDEL, Jarmo SUKANEN, Juha TUOMOLA, Kalle SUOMELA, Krzysztof KASZA, Lukasz MALINOWSKI, Lukasz MATYSIAK, Mikko NUPPONEN, Uwe DROFENIK
  • Publication number: 20150116936
    Abstract: The invention relates to an arrangement for operating a current converter, in particular an inverter, wherein the converter is located at a path of travel of land vehicles or at a parking space of a land vehicle, the converter being adapted to support operation of at least one vehicle, the converter is combined with a cooling device adapted to cool the converter during operation, the cooling device is designed to use a heat transport medium in order to transport heat away from the converter, the arrangement comprises at least one pole and/or at least one supporting structure which is also located at the path of travel or at the parking space, the pole and/or the supporting structure extends upwards from ground, the arrangement comprises a conduct for conducting the heat transport medium and the conduct extends from the cooling device to the pole and/or to the supporting structure and also extends inside the pole and/or inside the supporting structure so that heat can be transferred from the heat transport med
    Type: Application
    Filed: March 22, 2013
    Publication date: April 30, 2015
    Inventors: Manfred Zengerle, Hans-Heinrich Reimers
  • Patent number: 9013873
    Abstract: A container data center includes a container and a server cabinet received in the container. The server cabinet includes a rack and a number of heat dissipation devices mounted to a rear side of the rack. Each heat dissipation device includes a case fixed to the rack, a fan mounted to an outer side of the case, and a heat dissipation plate received in the case and aligning with the fan. The heat dissipation plate defines a vent. The fan draws heat air through the vent of the heat dissipation plate from the rack, and the heat air is cooled by refrigerant received in the heat dissipation plate to become cool air. The cool air flows in the container, and circularly flows into the cabinet from a front side of the cabinet.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: April 21, 2015
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chao-Ke Wei
  • Patent number: 9013872
    Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.
    Type: Grant
    Filed: December 3, 2012
    Date of Patent: April 21, 2015
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 9007771
    Abstract: A thermosyphon heat exchanger includes a first set of first conduit elements for heat absorbing and a second set of second conduit elements for heat releasing. A first end of the first set can be connected to a first end of the second set by at least one manifold and a second end of the first set is connected to a second end of the second set by at least one other manifold. At least one first set of first conduit elements and the at least one second set of second conduit elements are at least partially arranged such that a stack is formed.
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: April 14, 2015
    Assignee: ABB Research Ltd.
    Inventor: Bruno Agostini
  • Patent number: 9007766
    Abstract: The invention provides storage enclosure, comprising an enclosure housing; one or more drawers slidably arranged within the enclosure housing, wherein each drawer has a pivotably mounted midplane having storage media coupled thereto wherein the storage media are coupled to both sides of the pivotably mounted midplane.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: April 14, 2015
    Assignee: Xyratex Technology Limited
    Inventor: Laurence A. Harvilchuck
  • Patent number: 8988879
    Abstract: A datacenter cooling apparatus includes a portable housing having lifting and transporting structures for moving the apparatus, opposed sides in the housing, at least one of the opposed sides defining one or more air passage openings arranged to capture warmed air from rack-mounted electronics, opposed ends in the housing, at least one of the opposed ends defining one or more air passage openings positioned to allow lateral passage of captured air into and out of the housing, and one or more cooling coils associated with the housing to receive and cool the captured warm air, and provide the cooled air for circulation into a datacenter workspace.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: March 24, 2015
    Assignee: Google Inc.
    Inventors: William Hamburgen, Jimmy Clidaras, Winnie Leung, David W. Stiver, Jonathan D. Beck, Andrew B. Carlson, Steven T. Y. Chow, Gregory P. Imwalle, Amir M. Michael
  • Patent number: 8978747
    Abstract: A datacenter may use heat collected from a heat exchanger at the exhaust portion of a cooling system to heat inlet louvers for an atmospheric intake. The louvers may have fluid passages through which heated fluid may pass and cause the louvers to heat up. The heated louvers may operate during periods of snow, rain, high humidity, or other conditions to eliminate condensation, snow and ice buildup, or other problems. In some embodiments, a liquid may be passed through the louvers, while in other embodiments, heated air or other gas may be passed through conductive paths in the louvers. In a heated air system, holes in the louvers may allow the heated air to enter the incoming airstream to regulate the incoming temperature to the datacenter.
    Type: Grant
    Filed: December 31, 2010
    Date of Patent: March 17, 2015
    Assignee: Microsoft Corporation
    Inventors: Eric C Peterson, Christian L. Belady
  • Publication number: 20150062817
    Abstract: A server includes a housing, a motherboard and a heat dissipating module. The motherboard is disposed inside the housing and includes multiple heat sources. The heat dissipating module includes a cooling plate disposed inside the housing and in thermal contact with multiple heat sources. The cooling plate includes a substrate, a casing and multiple fins. The substrate is in thermal contact with multiple heat sources. The casing is disposed on the substrate, while the casing and the substrate form a chamber. Multiple fins are disposed on the substrate and are inside the chamber.
    Type: Application
    Filed: October 14, 2013
    Publication date: March 5, 2015
    Applicants: INVENTEC CORPORATION, Inventec (Pudong) Technology Corporation
    Inventors: Mao-Ching LIN, Kuo-Chin HUANG
  • Patent number: 8964388
    Abstract: An electronics enclosure has a blower and diffuser received within an enclosure. Electronic components are also received within the enclosure. The blower diffuser is positioned in contact with at least one of the electronic components. A shroud surrounds the blower diffuser and the at least one electronic component, and is spaced from an outer surface of the at least one electronic component. An opening is formed through the shroud, such that air can be driven within the shroud from the blower diffuser, and across at least one electronic component, and then outwardly of the opening. A heat exchanger is positioned in the path of air leaving the opening.
    Type: Grant
    Filed: September 30, 2012
    Date of Patent: February 24, 2015
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Joseph Turney, Brian St. Rock, John H. Whiton
  • Patent number: 8964374
    Abstract: Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is substantially parallel to a side plane of the rack. The circulated air is cooled with a heat exchanger that is connected to a vertical end of the rack via a sealed interface. Multiple racks can be arrayed in a distributed cooling arrangement, which increases reliability and scalability of the data center.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: February 24, 2015
    Assignee: Google Inc.
    Inventors: Honggang Sheng, Sangsun Kim
  • Patent number: 8953316
    Abstract: A container includes first and second long sides parallel to the container's length. Racks are organized in rows parallel to the container's width. Each rack is receptive to installation of equipment along a height of the data rack parallel to the container's height. Openings are defined within the first and/or second long sides of the container. Heat exchangers may be installed, where each exchanger is installed on a rack to cool air exhausted by any equipment installed on this rack. Each row may include as many of the racks positioned side-to-side, length-wise, and parallel to the width of the container as can fit within the container. The racks of each row may be slidable in unison back and forth along the length of the container, between a first position at which the racks block an opening and a second position at which the racks block another opening.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: February 10, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Paul A. Wormsbecher, Gregory J. McKnight, Michael S. Miller, Howard V. Mahaney
  • Patent number: 8947879
    Abstract: A container that holds rack mountable electronics equipment includes a plurality of rack enclosures and a corresponding plurality of enclosure cooling units. Each rack enclosure is movably mounted in the container such it can move from a position abutting a front of an enclosure cooling unit to a maintenance and access position spaced apart from the enclosure cooling unit. Each enclosure cooling unit is capable of providing varying amounts of cool air to the rack enclosure it abuts, so that the interior of each rack enclosure can be maintained at a different temperature.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: February 3, 2015
    Assignee: Smartcube, LLC
    Inventors: John P. Broome, Thomas S. Oberlin, Eduardo W. Nusser, Donald W. Kauffman
  • Patent number: 8943757
    Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: February 3, 2015
    Assignee: Vert.com Inc.
    Inventors: Marc Parizeau, Éric Mateu-Huon, Philippe Savard
  • Patent number: 8939524
    Abstract: A shelter comprises an enclosure for delimiting an air-conditionable enclosure interior and a container that is externally mounted to the enclosure and has a container space for receiving a cooling installation. The enclosure comprises at least one passage for heat recirculation from the enclosure interior to the container space. The shelter provides protection against detrimental exterior influences so that a reliable and energy-efficient cooling of the enclosure interior is ensured.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: January 27, 2015
    Inventor: Erwin Gasser
  • Patent number: 8941993
    Abstract: An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: January 27, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Eric A. Eckberg, Howard V. Mahaney, Jr., William M. Megarity, Roger R. Schmidt, Tejas Shah, Scott A. Shurson
  • Publication number: 20150022973
    Abstract: A vehicle system includes a power electronics device and a coolant circuit thermally coupled to the power electronics device. The coolant circuit includes a fluidic pump and a fluid/air heat exchanger, an air pump configured to transfer air across the fluid/air heat exchanger, and a shutter device configured to control airflow across the fluid/air heat exchanger. A controller controls the fluidic pump to control coolant flow through the fluid/air heat exchanger to reject heat from the power electronics device to the coolant and correspondingly controls the air pump and the shutter device to control airflow across the fluid/air heat exchanger to reject heat from the coolant to achieve a preferred heat rejection from the power electronics device.
    Type: Application
    Filed: July 18, 2013
    Publication date: January 22, 2015
    Inventors: CHRISTOPHER D S BALLNIK, DAVID J. LILLER, XIAOWEN LUO
  • Patent number: 8934242
    Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.
    Type: Grant
    Filed: May 21, 2012
    Date of Patent: January 13, 2015
    Assignee: Schneider Electric IT Corporation
    Inventors: John H. Bean, Jr., John Christopher Niemann
  • Publication number: 20150009626
    Abstract: An electric equipment includes: an electric component box; a control board accommodated in the electric component box and provided thereon with a heat-generating electric component; a heat sink thermally connected with the electric component; and a sheet material provided between the electric component box and the control board, wherein the sheet material is made of an elastic material and provided with an opening section through which the heat sink projects outward, the opening section is provided with a convex section formed integrally with the sheet material and configured to be elastically deformed to engage the sheet material with the heat sink, and the electric component box is provided with a heat sink hole through which the heat sink and the convex section project outward of the electric component box. An air conditioner is provided with such electric equipment.
    Type: Application
    Filed: February 25, 2013
    Publication date: January 8, 2015
    Inventors: Tian Lan, Kenji Gajina
  • Patent number: 8929075
    Abstract: An air-cooling method is provided which includes providing a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: January 6, 2015
    Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
    Inventors: Eric A. Eckberg, Howard V. Mahaney, Jr., William M. Megarity, Roger R. Schmidt, Tejas Shah, Scott A. Shurson
  • Publication number: 20140369003
    Abstract: A system for cooling an electronic image assembly using a heat exchanger with an internal fan assembly. Circulating gas may also be used to cool a front portion of the electronic image assembly or any other internal cavity of the electronic display housing. The circulating gas may be drawn through a heat exchanger so that heat may be transferred to an ambient gas. The heat exchanger may have an internal fan assembly for drawing ambient air through the heat exchanger and exhausting it out of the display housing. The heat exchanger may be divided into two portions so that the fan assembly is placed between the two portions.
    Type: Application
    Filed: September 2, 2014
    Publication date: December 18, 2014
    Inventors: Tim Hubbard, William Dunn
  • Patent number: 8913381
    Abstract: A server cooling device is described that includes an enclosure defining an interior space and at least one server rack port configured to engage a rack such that one or more rack mounted units installed in the rack interface with the interior space. The server cooling device also includes a mixing chamber including one or more cooling coils that is connected to the interior space defined by the enclosure.
    Type: Grant
    Filed: March 8, 2013
    Date of Patent: December 16, 2014
    Assignee: Yahoo! Inc.
    Inventors: Scott Noteboom, Albert Dell Robison, Jesus Suarez, Norman Holt
  • Patent number: 8890464
    Abstract: A drive system for a grid blower of a vehicle is provided. The system includes: an electrical bus, a grid of resistive elements connected to the electrical bus, the grid of resistive elements configured to thermally dissipate electrical power generated from braking of the vehicle, the electrical power being transmitted on the electrical bus to the grid of resistive elements, an electrical power modulation device configured to modify electrical power received from at least one of the electrical bus and the grid of resistive elements, and a grid blower motor coupled to an output of the electrical power modulation device, wherein a speed of the grid blower motor varies based on the electrical power that has been modified by the electrical power modulation device.
    Type: Grant
    Filed: April 18, 2012
    Date of Patent: November 18, 2014
    Assignee: General Electric Company
    Inventors: Ajith Kuttannair Kumar, Bret Worden, Sudhir Kumar Gupta, Theodore Clark Brown