With Air Circulating Means Patents (Class 361/694)
  • Patent number: 10468010
    Abstract: An apparatus is provided. The apparatus includes a plurality of flow guiding structures spatially aligned in a first row, each of the plurality of flow guiding structures comprising a fin-shape to funnel airflow at a trailing edge of each of the plurality of flow guiding structures. The apparatus also includes a plurality of flow separating structures spatially aligned in a second row interleaved between each of the plurality of flow guiding structures, each of the plurality of flow separating structures comprising a fin-shape configured to split airflow received from the plurality of flow guiding structures.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: November 5, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Ching-Yu Chen, Liang-Yu Wu
  • Patent number: 10420238
    Abstract: A housing kit (90) includes a housing body (20) and a ventilation member (10). The housing body (20) has a vent hole (21). The ventilation member (10) has a leg portion (26). The leg portion (26) is a portion adapted to be inserted into the vent hole (21). The housing body (20) has an inner peripheral surface (23) that defines the vent hole (21). The inner peripheral surface (23) includes a first rounded segment (23R1), a first straight segment (23S1), a second rounded segment (23R2), and a second straight segment (23S2) that are formed in order from an exterior space (24) side to an interior space (22) side of the housing body (20). The first rounded segment (23R1) and the second rounded segment (23R2) each form a curve convex toward a central axis (O) of the vent hole (21) in a cross section of the housing body (20) including the central axis (O). The first straight segment (23S1) and the second straight segment (23S2) each form a straight line in this cross section.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: September 17, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Kou Uemura, Youzou Yano
  • Patent number: 10406468
    Abstract: A baffle plate filtering system is disclosed which is adapted to be operatively associated with an external housing wall of a piece of machinery or equipment, through which cooling air is to be ingested or inducted in order to cool internal operative components of the machinery or equipment, wherein the baffle plate filtering system will effectively prevent the ingestion or induction of ambient particulates, contaminants, grease, dirt, and the like into the internal regions of the machinery or equipment such that the operative components of the machinery or equipment do not become contaminated or fouled by means of the ambient particulates, contaminants, grease, dirt, and the like.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: September 10, 2019
    Assignee: A. J. ANTUNES & CO.
    Inventor: Ignacio Vega
  • Patent number: 10385876
    Abstract: A vibration-proofed fan frame includes a housing and a base surrounded by the housing. A hollow tube is arranged on the base and has the rotary connection with an impeller of the heat dissipation fan. The base includes a disc and a plurality of ribs extending outwards from periphery of the disc. The fan frame further includes a buffer member within the structural interconnections between the disc and the housing. The buffer member includes first elements. The first elements are embedded in the disc. A heat dissipation fan having the fan frame described is also presented.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: August 20, 2019
    Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: Hsien-Chou Lin, Xiao-Guang Ma, Yung-Ping Lin, Chien-Nan Cheng, Zheng Luo
  • Patent number: 10231361
    Abstract: In some embodiments, a rack system is configured to comprise a removable fan system. The fan system enables thermal management of the rack system. The removable fan system includes a replaceable fan tray that can be assembled in the rack system by engaging a connecting mechanism and connecting a connecting cable. The fan tray is engaged with the connecting mechanism to be securely attached to the rack system. The fan tray is connected to a bus bar to receive power or necessary data to be operated. The fan tray can be disassembled from the rack system while the bus remains active, and enables access to the server or the rack system. The replaceable fan tray enables easy replacement of the fan system and access to the rear side of the rack system.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: March 12, 2019
    Assignee: Quanta Computer Inc.
    Inventors: Chao-Jung Chen, Chih-Ming Chen
  • Patent number: 10201111
    Abstract: Various embodiments of the present invention generally relate to operating an electronic gaming machine to generate a wager-based game. A game control unit and a secure enclosure are provided. The secure enclosure is divided into two compartments. A game control unit including a game controller and two heat dissipation units is disposed within the first compartment. In a second compartment, which is fluidly coupled to the first compartment, fans are provided. The fans drive air from outside the secure enclosure through the heat dissipation units in the first compartment to cool electrical components associated with the game controller which are mounted on an outside of the heat dissipation units. The two heat dissipation units can each include fins and heat pipes. The ends of the fins of the two heat dissipation units can be substantially touching one another to provide a compact form factor.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: February 5, 2019
    Assignee: QUIXANT PLC
    Inventors: Frank Wen, Hans Chou
  • Patent number: 10194558
    Abstract: Various embodiments of the present invention generally relate to operating an electronic gaming machine to generate a wager-based game. A game control unit including a secure enclosure are provided. The secure enclosure is divided into two compartments. The first compartment securely contains the game control unit, which includes a game controller used to generate the wager-based game and heat dissipation units. The second compartment includes two fans and is accessed by an easily removable magnetically attached cover. The fans and heat dissipation units provide cooling for electrical components associated with the game controller. The fans can be maintained and replaced without compromising the security of the game controller. This feature reduces costs associated with maintaining the electronic gaming machine.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: January 29, 2019
    Assignee: QUIXANT PLC
    Inventors: Frank Wen, Hans Chou
  • Patent number: 10098255
    Abstract: A ventilation closure device for a telecommunication equipment enclosure includes opposed planar panels and aligned openings through each of the panels for passage of air therethrough for ventilating ambient atmospheric air to or from an equipment enclosure. One or more closures are disposed between the opposed panels and adapted to be drawn across the aligned openings for preventing passage of air, and a pivotal attachment to the closures disposes the closure into alignment with the opening. An actuator pivots the closures between an open position for allowing air passage through the openings and a closed position for impeding airflow. The pivotal attachment counterbalances the closures for mitigating force to pivot the closures. Counterbalancing of the closures minimizes actuation force required for drawing the closures across the openings.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: October 9, 2018
    Assignee: Schrofftech Technologies International, Inc.
    Inventor: Richard De Felice
  • Patent number: 10064309
    Abstract: A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: August 28, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Lee-Lung Chen, Tse-Hsin Wang, Ying-Chi Chen, Wu-Chi Li
  • Patent number: 10045465
    Abstract: An effective cooling system is provided by the configuration including: a blower; a first rectifier comprising a first opening that lets a first diversion pass through and a second opening that lets a second diversion divided from airflow pass through downstream a first electronic device; a mixing room that is arranged at a downstream portion of the first rectifier and that mixes the first diversion having passed through the first opening and the second diversion having passed through the second opening; and a second rectifier that is arranged at a downstream portion of the mixing room and includes a third opening and a fourth opening, a mixed airflow of the first diversion and the second diversion passing through the third opening and the fourth opening.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: August 7, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Takashi Ichinose, Shinichi Kobayashi, Kenji Aoki
  • Patent number: 9972887
    Abstract: A system for securing the wireless access point within a ceiling or wall. The system includes a rough-in bracket including a frame member defining a window that closely receives an enclosure box sized to contain the wireless access point. The enclosure box includes a rear housing that extends through the rough-in bracket window and two pairs of rotatable dog ears that secure the enclosure box therein. Air vents are provided in only two sides of the enclosure box which are intended to be aligned with the longitudinal space between ceiling joists. Magnets on an inside face of anesthetic cover are attracted to ferromagnetic screws in the enclosure box used to rotate the dog ears. The enclosure box also features flexible arrangement of cable knockouts and includes structure for securing standard and nonstandard wireless access point devices therein.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: May 15, 2018
    Assignee: ANLA, Inc.
    Inventors: Hagai Feiner, Bryce Alan Nordstrand
  • Patent number: 9699941
    Abstract: A chassis of an information handling system (IHS) includes a lateral segment that spans across a directional path of air travelling from an air intake side to an air exhaust side and including receiving affordances for insertion of a lateral support for a directional air mover. A user can select one of a first lateral support and a second lateral support that is insertable into the lateral segment and securable to the receiving affordances. The first lateral support has apertures of a first size to receive respective first fan modules and the second lateral support has apertures of a second size to receive respective second fan modules. An inserted one of the first and second lateral supports is selected based on a cooling air requirement corresponding to user selected compute components placed within the chassis to operate within the IHS.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: July 4, 2017
    Assignee: Dell Products, L.P.
    Inventors: Daniel Alvarado, Edmond I. Bailey, Walter R. Carver
  • Patent number: 9674983
    Abstract: In accordance with embodiments of the present disclosure, an information handling system may include heat-rejecting media thermally coupled to one or more information handling resources, a connector for receiving a modular information handling resource, the connector having a latch for facilitating insertion or removal of the modular information handling resource to or from the connector, and a removable baffle for directing a flow of air proximate to the heat-rejecting media. The removable baffle may have two substantially planar sides and an edge substantially perpendicular to the two planar sides, such that when the removable baffle is located within a chassis including the heat-rejecting media and the connector, the latch engages with the edge to mechanically maintain a location of the removable baffle within the chassis.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: June 6, 2017
    Assignee: Dell Products L.P.
    Inventors: Chin-An Huang, Chen-Fa Wu, Shin-Chi Hsieh
  • Patent number: 9641788
    Abstract: An image processing apparatus and control method is provided. The image processing apparatus includes a processor including one or more processing modules configured to process data, a power supply configured to supply an operating voltage to the one or more processing modules in a normal operation mode, a sensor configured to detect a temperature of the processor, and a controller configured to change the processor from the normal operation mode to one of a first operation mode and a second operation mode according to the temperature detected by the sensor, control the power supply to supply a lower level operating voltage to at least one of the one or more processing modules when the processor is in the first operation mode, and reset or disable at least one processing module selected from the one or more processing modules when the processor is in the second operation mode.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: May 2, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Il-Young Lee
  • Patent number: 9568161
    Abstract: A ventilation system for a vehicle headlight housing. The ventilation body has an inner part extending into the housing opening as well as an outer part extending circumferentially about the opening wall of the housing opening, which on the one hand offers, in the locked position thereof, a sealing attachment and on the other hand provides a labyrinthic ventilation channel.
    Type: Grant
    Filed: May 8, 2015
    Date of Patent: February 14, 2017
    Assignees: Hella KGaA Hueck & Co., AZ Ausruestung und Zubehoer GmbH & Co. KG
    Inventors: Frank Hansmann, Jens Oliver Meyer, Michael Wysok
  • Patent number: 9565788
    Abstract: The present mobile processing data center comprises a support structure, which consisting in ISO standard containers of 10, 20, 40 or 53 feet, wherein the container comprises: a) automatic transfer switch; b) uninterruptible power system; c) precision air conditioners; d) cabinets having a bearing and rails system, and 42 RMS in order to install the IT equipment; f) two levels of trays ladder type installed on the top of the cabinets, one tray for data wiring and other for power wiring; g) removable floor panels; and h) additionally the mobile data center comprises a fire protection system “zero-footprint”.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: February 7, 2017
    Assignee: SIXSIGMA NETWORKS MEXICO, S.A., DE C.V.
    Inventors: Sergio Rosengaus Leizgold, Santiago Suinaga Sainz, Dax Didier Simpson
  • Patent number: 9560793
    Abstract: Enclosures and systems that can control airflow and signal connectivity in a blade enclosure are provided. Some examples include a front section including a number of blade server modules, a rear section including a number of switch modules; and a middle section having a number of openings and a number of connectors, wherein the middle section controls airflow between the front section and the rear section in the blade enclosure with the number of openings and the middle section controls signal connectivity between a number of blades in the number of blade server modules and a number of switches in the number of switch modules with the number of connectors.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: January 31, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Kevin B. Leigh, David W. Sherrod, George D. Megason
  • Patent number: 9472797
    Abstract: The battery pack includes: a battery cell including a cell tab; a housing configured to accommodate the battery cell; a middle cover configured to close the housing in a state where the cell tab extends outward through the middle cover; a bus bar electrically connected to the cell tab extending outward through the middle cover; a sensing circuit board disposed on the bus bar and electrically connected to the bus bar; an isolation plate coupled to the middle cover to cover the bus bar and the sensing circuit board; and a battery management system disposed on the isolation plate and electrically connected to the sensing circuit board.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: October 18, 2016
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jungyeop Han, Seungsoo Jang
  • Patent number: 9395773
    Abstract: A laptop cooling pad includes a cover including a top louver, an intermediate recess, openings between the louver and the recess, a rear channel communicating the recess with an open rear end, and two stop members pivotably disposed on the rear end of the cover; a casing releasaby secured to the cover and including extendible legs pivotally on a bottom of the front portion of the cover; a transverse fan in the casing and under the louver, the transverse fan including a shock absorbing member; and a PCB for supplying power to the transverse fan and configured to control the transverse fan. In response to activating the transverse fan, cooling air is drawn into the transverse fan via the louver and flows upward and rearward respectively.
    Type: Grant
    Filed: May 12, 2015
    Date of Patent: July 19, 2016
    Inventor: Cheng Yu Huang
  • Patent number: 9363929
    Abstract: An apparatus includes an enclosure defining an interior space and at least one server-rack port configured to engage one or more of racks such that one or more servers installed in each rack are contiguous to the interior space. The enclosure is inside of a room and includes at least one stability control unit at the bottom of the enclosure. Each server includes a fan that draws air from the interior space into the server and expels the air outside of the enclosure into the room. The apparatus also includes a mixing chamber that is contiguous to the enclosure. The mixing chamber includes a first set of one or more dampers that are contiguous to natural air outside of the room and a second set of one or more dampers that are contiguous with air in the room.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: June 7, 2016
    Assignee: Yahoo! Inc.
    Inventors: Scott Noteboom, Albert Dell Robison, Jesus Suarez, Norman Holt
  • Patent number: 9357668
    Abstract: Provided are a power management system and method. At least one frame module includes at least one bay and a plurality of first connectors at a rear portion of the at least one bay and at least one power conversion unit positioned in the at least one bay. The at least one power conversion unit includes a plurality of second connectors. Each second connector is removably coupled to a first connector of the plurality of first connectors. The first and second connectors include a combination of high power, cooling, and control connectors.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: May 31, 2016
    Assignee: Moog Inc.
    Inventors: Franklin B. Jones, Stuart A. Jones, Andrew I. Nehring, Daniel Jones
  • Patent number: 9357675
    Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s).
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: May 31, 2016
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
  • Patent number: 9351425
    Abstract: A container-type data center is provided, which can be transported while having outdoor units of an air conditioning facility installed therein, and having an enhanced cooling effect. A partition panel 10 is provided for separating a container 100 into an IT equipment accommodation chamber 18 and an outdoor unit installation chamber 15, and on both ends of the panel are provided pillar sections 14e and 14f for the partition panel. The length-direction dimension of the outdoor unit installation chamber 15 is within the range of 1.6 to 2 meters, which can be selected arbitrarily according to the size of the outdoor units 6a through 6d. The outdoor units 6a through 6d are arranged so that their air discharge openings face the outer side in the width direction of the container. Regarding the outdoor units 6a through 6d, it is possible to set up an angle steel rack and stack two outdoor units vertically.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: May 24, 2016
    Assignee: HITACHI SYSTEMS, LTD.
    Inventors: Kenichi Tabe, Takeshi Kobayashi, Yutaka Asano
  • Patent number: 9345174
    Abstract: The present invention provides a container-type data center having an air conditioning facility, which enables to effectively cool IT equipment by applying the arrangement to an existing container. A system ceiling 50 is attached to a ceiling surface 25 to send out cooling air to a cooling area 2 from a vent 31a of an indoor unit 31 of an air conditioning device disposed in a container 1, and a draft air duct is defined by the system ceiling 50, a down-wall 51 and the ceiling surface 25. A vinyl curtain 60 is provided on an upper portion of a rack 40 so as to prevent cooling air having reached the cooling area 2 from flowing out to a heat exhaust area 3 without passing through the rack 40 loading the IT equipment, and a vinyl curtain 70 in a form of a shop curtain is disposed at an area used as a path for operators entering the cooling area 2.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: May 17, 2016
    Assignee: HITACHI SYSTEMS, LTD.
    Inventors: Kenichi Tabe, Takeshi Kobayashi, Yutaka Asano
  • Patent number: 9326431
    Abstract: In a server cooling device having a cold zone and a hot zone, a flow of cold air is determined depending on an air conditioner disposed in the hot zone and a size of a casing. A server cooling system is provided in which a chamber is substantially divided into two parts with a cold aisle formed in one part and a hot aisle formed in the other part, and a server rack is disposed on a boundary between the cold aisle and the hot aisle. The server cooling system includes: an air conditioner provided on the hot aisle side; a circulation path disposed so as to extend from the air conditioner to the cold aisle; and a shield provided on the boundary excluding the server rack. The shield is provided with a gallery capable of venting from the cold aisle to the hot aisle.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: April 26, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takahiro Matsushita, Satoshi Uzawa, Hiroshi Tsujimura
  • Patent number: 9204562
    Abstract: An electrical junction box includes a case that includes a bottom plate portion and a case-side peripheral wall portion, the case having an opening that opens to a lateral side, and a cover that closes the opening of the case and includes a lid plate portion and a cover-side peripheral wall portion covering a perimeter of the case-side peripheral wall portion. A protruding length of a second upper plate portion of the cover-side peripheral wall portion that is located on the upper side in a state in which the electrical junction box is used is set at such a length that the second upper plate portion protrudes slightly outward beyond an outer surface of the bottom plate portion.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: December 1, 2015
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tatsuya Shimizu, Takehiro Mizuno
  • Patent number: 9159642
    Abstract: Embodiments of a silicon-based heat dissipation device and a chip module assembly utilizing the silicon-based heat dissipation device are described. In one aspect, the chip module assembly includes a chip module and a primary heat dissipation module. The chip module includes a board and at least one heat-generating device. The board includes a first primary side and a second primary side opposite the first primary side. The at least one heat-generating device is disposed on the first primary side of the board. The primary heat dissipation module includes at least one silicon-based heat dissipation device disposed on the at least one heat-generating device.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: October 13, 2015
    Inventors: Gerald Ho Kim, Jay Eunjae Kim
  • Publication number: 20150124404
    Abstract: Embodiments relate generally to network system and apparatus for heat management of high volume network devices. More specifically, disclosed are system and apparatus that provide for improving heat dissipation of the network devices through improved air circulations, including a PCB with at least one slot and a connector cage mounted on the printed circuit board, the connector cage being within a certain distance from the at least one slot in the PCB.
    Type: Application
    Filed: July 15, 2014
    Publication date: May 7, 2015
    Inventors: Lin Shen, Stephen Ong, Mark Siechen, Timothy Lee
  • Patent number: 9017154
    Abstract: A chassis and rack system is disclosed in which a chassis separated into two separate enclosures by a central partition. Each of the enclosures is sized to receive a computer system. The partition includes a pair of vertically oriented vents, with each of the vents in fluid communication with one of the enclosures and the computer system contained therein. Heated air is removed from each computer system through the vent in the partition that is associated with the computer system. Multiple chassis may be placed one atop another in a vertical configuration in which each chassis is either directly above or directly below another chassis. In this vertical configuration, the vents form a vertically oriented common plenum that can be used to evacuate air from multiple chassis arranged in a rack.
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: April 28, 2015
    Assignee: Dell Products L.P.
    Inventors: David L. Moss, Shawn P. Hoss
  • Publication number: 20150109732
    Abstract: A device for generating a flow of air, particularly for cooling electronic components, with an annular piezo element and an emitter element, wherein the annular piezo element can be vibrated radially by applying an alternating voltage, the emitter element is coupled radially to the annular piezo element, and wherein the radial vibration of the annular piezo element is configured so as to set the emitter element into axial vibration to generate the air flow which thereby permits a device of small dimensions for generating the an air flow to be created that is simultaneously characterized by low energy consumption and a long service life.
    Type: Application
    Filed: June 4, 2013
    Publication date: April 23, 2015
    Inventors: Oztzan Akif, Randolf Mock, Thomas Vonz
  • Publication number: 20150092348
    Abstract: A thermal management system includes a distributor plate secured to and parallel to a circuit board. The circuit board has a module secured thereto and the distributor plate defines an area on an inner surface thereof secured to or otherwise in thermal contact with the module. Heat pipes embedded in the distributor plate include a portion over the module and a portion over the circuit board outward from the module. A portion of the heat pipes outward from the module may be substantially perpendicular to a direction of airflow between the circuit board and distributor plate. The module may be located closer to one edge of the circuit board and the heat pipes may according extend from adjacent that edge to an opposite edge of the circuit board. An inward facing surface may include fins extending toward the circuit board and the fins may be contoured to the circuit board.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: Cyan Inc.
    Inventors: Todd Andrew Newhouse, Colin John Wilson
  • Patent number: 8988878
    Abstract: An electronic device and housing thereof are provided. The electronic device includes housing, a partition, multiple electronic elements, and a fan. The housing has a side edge, where the side edge is provided with a slit. The partition is disposed in the case, is separated by a distance with the slit, and divides the interior of the case into a first and a second space. The partition has a through hole, the second space is in communication with the first space through the through hole, and the first space is in communication with the outside of the case through the slit. The electronic elements and the fan are disposed in the second space, and an air outlet of the fan is adjacent to the through hole, so that air in the second space can be driven to flow from the first space to the outside through the slit.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: March 24, 2015
    Assignee: Wistron Corporation
    Inventors: Ming-Chen Lin, Ren-Tsung Huang, Shih-Hua Chen
  • Publication number: 20150077934
    Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.
    Type: Application
    Filed: November 19, 2014
    Publication date: March 19, 2015
    Inventors: Hendrik Pieter Jacobus de Bock, William Earl Gross, JR., Bryan Patrick Whalen, Robert Paul Meier
  • Patent number: 8982552
    Abstract: An embodiment of a system and method disaggregate I/O resources from a server's compute resources, such as CPU and memory, by moving the server's local I/O devices to a remote location apart from the server's compute resources. An embodiment uses optical technology to accomplish the fast communication speeds needed between the compute resources and the remotely located I/O resources. Specifically, an embodiment uses fiber-optic cables and electrical-to-optical conversion to facilitate communication between the compute resources and the I/O resources. The compute resources and the remotely located I/O resources can be designed differently to allow conductive liquid cooling for the compute resources and air cooling for the I/O resources.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: March 17, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Arlen L. Roesner, Brandon Rubenstein, John F. Hutton, Richard Stanton Self
  • Patent number: 8982563
    Abstract: A chip package includes a processor, an interposer chip and a voltage regulator module (VRM). The interposer chip is electrically coupled to the processor by first electrical connectors proximate to a surface of the interposer chip. Moreover, the interposer chip includes second electrical connectors proximate to another surface of the interposer chip, which are electrically coupled to the first electrical connectors by through-substrate vias (TSVs) in the interposer chip. Note that the second electrical connectors can electrically couple the interposer chip to a circuit board. Furthermore, the VRM is electrically coupled to the processor by the interposer chip, and is proximate to the processor in the chip package, thereby reducing voltage droop. For example, the VRM may be electrically coupled to the surface of the interposer chip, and may be adjacent to the processor. Alternatively, the VRM may be electrically coupled to the other surface of the interposer chip.
    Type: Grant
    Filed: June 28, 2011
    Date of Patent: March 17, 2015
    Assignee: Oracle International Corporation
    Inventors: Kannan Raj, Ivan Shubin, John E. Cunningham
  • Patent number: 8976313
    Abstract: Provided is an outdoor display apparatus having an improved configuration to effectively prevent deterioration of a panel included therein. The outdoor display apparatus includes: a casing body having an air inlet and an air outlet; first and second display panel modules in the casing body to display images on front and rear surfaces of the casing body, respectively; transparent members fitted respectively to the front surface and the rear surface of the casing body to protect the first and second display panel modules; an air suction unit to suction the air into the casing body through the inlet and to discharge the air through the outlet; and an air distribution unit to distribute the air discharged from the air suction unit to at least one of the first display panel module and the second display panel module.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: March 10, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sru Kim, Jin Hyun Cho
  • Patent number: 8976524
    Abstract: An electronic device including a first body, a rotating base and a transmission module is provided. The rotating base has a first ventilation opening. The rotating base is pivoted on the first body and suitable for rotating between a using position and a retracted position in relative to the first body. When the rotating base is located at the retracted position, the first ventilation opening is exposed from the first body. When the rotating base is located at the using position, the first ventilation opening is retracted in the first body. The transmission module is connected to the rotating base for outputting a mechanical force to actuate the rotating base.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: March 10, 2015
    Assignee: Compal Electronics, Inc.
    Inventors: Tzu-Hung Wang, Chia-Huang Chan, Jung-Sheng Chiang
  • Patent number: 8976525
    Abstract: An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: March 10, 2015
    Assignee: General Electric Company
    Inventors: Hendrik Pieter Jacobus de Bock, William Earl Gross, Jr., Bryan Patrick Whalen, Robert Paul Meier
  • Publication number: 20150062814
    Abstract: An image forming apparatus includes a main body, an upper-portion device, a substrate, an electronic wire, and a duct. The main body has an upper surface and an insertion hole formed in the upper surface. The upper-portion device is disposed above the main body. The substrate is disposed inside the main body. The electronic wire is inserted into the insertion hole to connect the substrate and the upper-portion device. The duct has an interior space extending from the insertion hole and guides the electronic wire from a rear side of the main body and the upper-portion device into insertion hole.
    Type: Application
    Filed: August 21, 2014
    Publication date: March 5, 2015
    Applicant: KYOCERA DOCUMENT SOLUTIONS INC.
    Inventor: Yoshifumi OKAUCHI
  • Publication number: 20150062813
    Abstract: A cooling device for cooling an electronic component, such as a power semiconductor, includes a cooling body which can be thermally coupled to the component, at least one sonotrode element for generating ultrasonic waves having a predetermined wavelength directed towards the cooling body, and a resonance tube that is associated with the sonotrode element and that is arranged between the sonotrode element and the cooling body, wherein a distance between the sonotrode element and the cooling body corresponds to an integral multiple of a quarter of a wavelength, such that a standing wave is formed between the at least one sonotrode element and the cooling body.
    Type: Application
    Filed: April 3, 2013
    Publication date: March 5, 2015
    Inventors: Martin Honsberg-Riedl, Jakob Löschke, Gerhard Mitic, Randolf Mock, Thomas Vontz
  • Patent number: 8971042
    Abstract: A computer system is provided. The computer system includes a housing, a mainboard, a first heat source, a second heat source and a flow field modulator. An inlet and an outlet are formed on the housing. The mainboard is disposed in the housing. The first heat source is located on a first location of the mainboard. The second heat source is located on a second location of the mainboard. The flow field modulator is disposed on the mainboard including a control unit, a piezoelectric element and a guiding sheet. The control unit is electrically connected to the mainboard. The piezoelectric element is electrically connected to the control unit. The guiding sheet is connected to the piezoelectric element.
    Type: Grant
    Filed: November 7, 2012
    Date of Patent: March 3, 2015
    Assignee: Wistron Corp.
    Inventor: Sheng-Fu Liu
  • Patent number: 8971043
    Abstract: Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: March 3, 2015
    Assignee: Elwha LLC
    Inventors: Philip Lionel Barnes, Hon Wah Chin, Howard Lee Davidson, Kimberly D. A. Hallman, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T. Kare, Brian Lee, Richard T. Lord, Robert W. Lord, Craig J. Mundie, Nathan P. Myhrvold, Nicholas F. Pasch, Eric D. Rudder, Clarence T. Tegreene, Marc Tremblay, David B. Tuckerman, Charles Whitmer, Lowell L. Wood, Jr.
  • Patent number: 8964375
    Abstract: Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Alan Claassen, Hendrik F. Hamann, Madhusudan K. Iyengar, James A. Lacey, Yves C. Martin, Roger R. Schmidt, Theodore G. van Kessel
  • Patent number: 8964384
    Abstract: Embodiments provide methods, apparatuses, and systems for providing a cooling flow to a component. In various examples, a chip socket may include a cavity configured to couple to the component. The chip socket may include a first channel and a second channel. The first channel may act as an ingress channel while the second channel may act as an egress channel. The ingress and egress channels may be configured to facilitate cooling of the component.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: February 24, 2015
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kevin B Leigh, George D Megason
  • Patent number: 8964374
    Abstract: Systems and methods are provided for cooling electronic equipment in a data center. Ambient air is vertically circulated from a workspace across a plurality of rack-mounted electronic devices. The electronic devices are located in a plurality of trays such that each tray has a major plane that is substantially parallel to a side plane of the rack. The circulated air is cooled with a heat exchanger that is connected to a vertical end of the rack via a sealed interface. Multiple racks can be arrayed in a distributed cooling arrangement, which increases reliability and scalability of the data center.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: February 24, 2015
    Assignee: Google Inc.
    Inventors: Honggang Sheng, Sangsun Kim
  • Patent number: 8957316
    Abstract: Example electrical component assemblies are described. In some examples, the electrical component assembly may include a printed board and an electrical component on the printed board, the electrical component defining a first surface adjacent the printed board and one or more second surfaces other than the first surface. The assembly may also include a thermal bridge comprising a plurality of vias extending through the thermal bridge, and a thermally conductive member interposed between the one or more second surfaces of the electrical component and the thermal bridge. In some examples, the thermally conductive member extends at least partially through the plurality of vias of the thermal bridge. During operation of the electrical component, the assembly configuration may facilitate thermal transfer from a first direction defined by the thermally conductive member to a second direction defined by the thermal bridge to transfer thermal energy away from a surface of the electrical component.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: February 17, 2015
    Assignee: Honeywell International Inc.
    Inventors: Chris R. Fields, Jerry Keller
  • Patent number: 8953321
    Abstract: A small form factor desktop computing device having a suitable internal cooling arrangement is disclosed. The device can be formed of a single piece seamless housing machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic shielding. The device can also include a removable foot, a heat producing element, a fan, an air processing manifold having a plurality of angled fins, and a heat exchanger.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: February 10, 2015
    Inventors: Eric A. Knopf, David P. Tarkinton, Matthew D. Rohrbach
  • Patent number: 8953315
    Abstract: In an axial fan, a housing includes a side wall arranged to surround an outer circumference of an impeller, and a substantially square or substantially rectangular flange arranged to project radially outward from an outer circumferential surface of the side wall. The side wall preferably includes three slit groups each including a plurality of slits arranged in a circumferential direction and arranged to extend through the side wall from an inner circumferential surface to the outer circumferential surface thereof. Two of the slit groups are defined in portions of the side wall which correspond to two adjacent corner portions in an upper half portion of the flange, while the remaining slit group is defined in a portion of the side wall which corresponds to a lower half portion of the flange. The upper and lower half portions are divided at a line parallel or substantially parallel to two opposing sides of the flange and passing through a central axis.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: February 10, 2015
    Assignee: Nidec Corporation
    Inventors: Shinji Takemoto, Yoshiaki Oguma, Ryosuke Ishida
  • Patent number: 8943757
    Abstract: A data center module is a data center that can be prefabricated using generally standardized off-the-shelf components, and quickly assembled on a collocation site where a shared central facility is provided. The data center module is typically configured to be deployed with other identical data center modules around the central facility both in side-to-side and/or in back-to-back juxtapositions, typically without the need for interleaving space between adjacent modules in order to maximize real estate use. Each data center module typically comprises harden party walls, several floors for accommodating all the necessary electrical and cooling subsystems and for accommodating all the computing machinery (e.g. servers). Though all the data center modules share similar physical configuration, each data center module can be independently customized and operated to accommodate different needs.
    Type: Grant
    Filed: January 21, 2013
    Date of Patent: February 3, 2015
    Assignee: Vert.com Inc.
    Inventors: Marc Parizeau, Éric Mateu-Huon, Philippe Savard
  • Patent number: RE45376
    Abstract: In one embodiment, a cooling system is disclosed. The cooling system comprises: a cooling channel for receiving a cooling media, a substrate disposed near the cooling channel, and a fluidic jet disposed within the substrate and in fluid communication with the cooling channel. The cooling channel is for thermal communication with a component to be cooled. The cooling channel has a height of less than or equal to about 3 mm and a width of less than or equal to 2 mm. The fluidic jet comprises a cavity defined by a well and a membrane. In one embodiment, a method of cooling an electrical component comprises: passing a cooling media through a cooling channel, drawing the cooling media into one or more of the fluidic jets, expelling the cooling media from the one or more fluidic jets into the cooling channel, and removing thermal energy from the electrical component.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 17, 2015
    Assignee: General Electric Company
    Inventors: Mehmet Arik, Todd Garrett Wetzel, Stephen Adam Solovitz