Abstract: A heat sink-type cooling device is provided which can enhance the amount of heat dissipated without increasing the size of the fins, and which is miniaturized and has high cooling capacity. A heat sink-type cooling device comprises a heat sink that is provided with a passage through which coolant flows, and that removes heat from electronic devices contacting with the upper surface of the heat sink. Fin groups are provided in the passage, each of which is comprised of a plurality of fins that are disposed in parallel with the direction of the coolant flow and are aligned in the thickness direction thereof. Fins of a fin group and other fins of another fin group adjoining the fin group in the direction of the flow are placed at a distance in the thickness direction of the fins.

Abstract: The present invention is to provide a wind guide device for a cooling fan mounted on a CPU of a computer comprising a first shroud and a second shroud. A first opening at one side of the first shroud having the fan mounted thereon is coupled to a vent opening on a housing of the computer for convection. A first opening at one side of the second shroud is coupled to a second opening at the other side of the first shroud to form an upper air passage and a lower air passage. Fins on one side of the CPU are partially enclosed by an L-shaped frame element extended from the second shroud so as to cause an air current generated by the fan to accelerate through the upper and lower air passages for cooling the CPU and other electronic elements therearound.

Abstract: A cooling unit having a fan and a heat sink thermally connected to a heat generating component. The heat sink includes a receptacle in which the fan is contained, a plurality of air paths which are arranged to surround an outer peripheral portion of the fan, and through which the air exhausted from the outer peripheral portion flows, and at least one partition which divides the respective air paths into a plurality of regions. The partition extends toward a downstream of the air paths from the outer peripheral portion of the fan.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

Abstract: An electronic controller module including a heat-resistant material to substantially surround and physically protect the controller, at least one electrically-conductive member to provide input or output of at least one electrical signal through the material to the controller, and a heat-resistant lid including a heat sink configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the electronic controller, wherein the material and the lid are operatively associated to completely surround the controller. These modules are particularly suitable for use in automotive applications.

Abstract: A retention mechanism for an electronic assembly which has a substrate and a heat sink. The retention mechanism includes a substrate slot that receives the substrate and a heat sink slot that receives the heat sink. There may be two retention mechanisms that are attached to a printed circuit board adjacent to an electrical connector. There may be two heat sink slots symmetrically located about the substrate slot so that the mechanism can be mounted to a left side or a right side of the connector. The symmetric slots eliminate the need for a left side mechanism and a right side mechanism. The retainer mechanism may also have a nut retainer that captures a nut that is used to attach the mechanism to the printed circuit board. The nut retainer allows the nut to be transported with the retainer mechanism during an assembly process.

Abstract: The disclosed device is directed towards an air inlet bezel. The air inlet bezel comprises a body and a system air inlet grill contiguous with the body. A power supply air inlet grill is contiguous with the body and proximate to the system air inlet grill. A pair of ejector tabs is formed in the body. The ejector tabs are configured to manually couple the air inlet bezel to a power supply assembly.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is described. The heat sink has a first face on which a plurality of cooling fins are formed and a second face on which at least one pedestal is formed. The pedestal has a contacting surface to thermally couple to at least one of the multiple components to dissipate heat therefrom. The heat sink is designed to prevent a junction temperature at the contact area where the heat sink and each of the components abut one another from exceeding a maximum design value for the system. In one embodiment of the present invention, the heat sink has a groove formed in the second face. A conductive gasket is disposed in the groove and contacts a metal trace on the circuit board when the heat sink is attached to the circuit board to form a Faraday cage or EMI shield.

Abstract: A heat dissipating module of the invention, used to dissipate the heat irradiated from a heat-emitting element, comprises a heat sink. The heat sink comprises a plurality of heat dissipating plates, formed by stamping, that are axially stacked over one another while being angularly rotated relative to one another to form a spiral and stepped shape, each heat dissipating plate being further provided with a plurality of convection holes. The heat dissipating module further includes a fan and a guiding plate to achieve optimal heat dissipation performance. Since the heat sink is principally formed by stamping with an increased surface area, the manufacture cost is reduced while the heat dissipation effects are improved.

Abstract: A heat dissipation device includes a heat sink (30), a metal plate (50), and a clip (20). The heat sink has a chassis (36) with thermally conductive material (40) applied thereunder. The metal plate is attached to the material in order to be in thermal contact with the chassis. The metal plate is then directly attached to a CPU (60). The clip is engaged with a socket (70) that supports the CPU, to facilitate the metal plate intimately contacting the CPU. The metal plate prevents the CPU from moving from the socket should the heat dissipation device be accidentally moved or displaced. This reduces any risk of damage to the CPU. In addition, heat generated from the CPU is efficiently removed.

Abstract: A retainer device for attaching a heat sink (20) to a CPU (62) includes a retention module (50), a clamp (10), a U-shaped crank holder (30), and a crank (40). The retention module has a rectangular base frame (51), and four posts (52, 54, 56, 58) extending upwardly from corners of the base frame. The clamp has two hinge portions (18) rotatably attached to two rear posts. A hook (22) depends from a front of the clamp. Two pivot rods (32) extend outwardly from opposite ends of the crank holder, and are rotatably received in two corresponding slots (53) defined in two front posts. The crank has an offset pressing portion (42) and an operation rod (46). The pressing portion is disposed between supporting arms (39) of the crank holder. When the operation rod is rotated toward the heat sink and locked in position, the pressing portion presses the hook.

Abstract: In a cooling structure for a vehicle control unit in which semiconductor elements are housed in a case 34 made of a resin, such as a power distributor, a heat sink member 56 which is connected to the semiconductor elements in a heat transferable manner is disposed on an outer face of the case 34. A plurality of fins 56f are formed on a face of the heat sink member which is exposed to the outside of the case. Ribs 34f are formed on the outer face of the case. The ribs 34f cover end portions of the fins 56f in positions where the ribs are joined to the end portions of the fins, respectively.

Abstract: A reliable bracket for CPU cooler having a latched piece on each of four corners is provided. Bracket comprises a rectangular hollow frame, a flat area extended between frame and a central opening for supporting cooler, a lower surface of flat area being in proximity to CPU, four upright members on four corners of frame, an opening on each upright member, each opening being secured to corresponding latched piece; a tunnel on each corner of flat area; and a well on a lower part of each tunnel and including a channel aligned with tunnel. Tunnels and channels of wells are driven through by fasteners to secure bracket to mainboard.

Abstract: A heat sink that dissipates heat from an electronic device. The heat sink comprises a base and one or more fins. The base is copper and is thermally coupled to an integrated circuit that includes a high-powered processor. The fins each include a copper portion and an aluminum portion. The copper portion of the fin is thermally coupled to the base to conduct thermal energy away from the base. The remainder of the fin is formed from aluminum.

Abstract: A low cost computer is suitable for small size configuration. Casings 4 and 32 are formed by aluminum, which is a heat radiating material, and CPUs 6 and 36, hard disk devices 8 and 38, control ICs 40 and 42 and a memory IC are mounted on the casing 4 directly or by the heat radiating material. The casings 4 and 32 are utilized as heat radiators, thereby making the entire computer a smaller size.

Abstract: A thermal resistance variable heat sink structure is provided that can improve the quality during operation and that can change the shape of a heat sink and reduce the number of steps attaching and detaching. Solder balls 1 are disposed for connection of a LSI 2. A mounting plate 3 on which a heat sink is mounted, screws 4 for mounting the heat sink, a radiation fin 5, and a thermal resistance adjuster 6 are disposed on the back surface of the LSI 2. The thermal resistance adjuster 6 is placed on the middle of the back surface to cut the cooling air.

Abstract: A radial base heatsink is provided to dissipate heat from a heat source. Such a heatsink comprises a cylindrical core; and a plurality of cooling fins projecting outwardly from the cylindrical core and defining a series of channels in a substantially radial pattern with a fin orientation relative to a center line of the cylindrical core, for dissipating heat generated from a heat source, via the cylindrical core.

Abstract: A heat dissipating assembly (1) includes a pair of concertinaed heat pipes (10), a plurality of fins (20), a shell (30), a heat-conductive block (40) and a fan (50). The fins are spaced and stacked one above the other. A plurality of channels (22) is defined through opposite sides of the fins, for insertion of the heat pipes thereinto. The shell includes a frame (32) and a cover (34) mounted to a top side of the frame, thereby defining a space for accommodating the fins and the heat pipes therein. A plurality of openings (362, 342) is defined in a bottom plate (36) of the frame and in the cover, for extension of bottommost and topmost portions of the heat pipes therethrough. A horizontal end portion (12) of each heat pipe extends over the cover and engages with the block. The fan is mounted to one end of the shell.

Abstract: A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

Abstract: This invention provides a combined base frame for supporting and fixing a CPU heat sink. The base frame has a left-side frame body and a right-side frame body. The buckling pieces are integrally formed under the base frame. The base frame can be efficiently mounted on a circuit board by the engagement between the left-side frame body and a right-side frame body. When an operator needs to install a CPU onto the circuit board, the base frame can be disassembled in a short time.

Abstract: The present invention is directed to an improved circuit board support. The present invention provides for quick-assembly, limits circuit board flex, and supports a heat sink. In one aspect of the present invention, an apparatus suitable for supporting a circuit board, includes a support suitable for attachment to a chassis of an information handling system, wherein a heat sink may be attached through a printed circuit board to the support so as to enable the heat sink to be supported by the chassis.

Abstract: A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the extending part of the heat sink, and the first surface of the die adheres to the heat sink. In addition, the die is connected to the substrate by the wires, and the plastic mold encapsulates the die, the heat sink and the wires. The chip package according to the invention possesses the small size and high efficiency of heat dissipation; besides, it also decreases the production cost for eliminating the conventional procedures of taping and de-taping.

Abstract: An electronic controller module including a heat-resistant material to substantially surround and physically protect the controller, at least one electrically-conductive member to provide input or output of at least one electrical signal through the material to the controller, and a heat-resistant lid including a heat sink configured and dimensioned to dissipate a sufficient amount of heat to inhibit or avoid damage to the electronic controller, wherein the material and the lid are operatively associated to completely surround the controller. These modules are particularly suitable for use in automotive applications.

Abstract: A radial finned heat sink assembly for an electrical component is constructed from a graphite material, which may be resin impregnated. The assembly includes a base, and a plurality of spaced parallel planar fin members supported by the base. Each fin member includes a planar fin of an anisotropic graphite material having graphite layers aligned primarily with the plane of the fin. In a first construction the fin members include integral core portions. In a second construction the core portions are separately formed so that the graphene layers of the core portion are aligned primarily parallel to the core axis so that heat is efficiently transmitted from the base to the plate members along the core axis.

Abstract: An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.

Abstract: A heat sink mounting structure is constructed to include a bottom rack fixedly fastened to a motherboard by screws to hold a heat sink, two fasteners adapted for securing the heat sink to the bottom rack keeping the heat sink in contact with the CPU at the motherboard, each fastener having a double-end hook mounted in one locating groove of the heat sink and adapted for hooking in retaining holes in corner uprights of the bottom rack, a holding down plate adapted for holding down the double-end hook, and a locking lever pivoted to the double-end hook and adapted for locking the holding down plate.

Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Abstract: A clip (10) includes a first member (12) and a second member (14). The first member includes a spring portion (122), a first leg (126) extending from one end of the spring portion, and a handle (128) extending from an opposite end of the spring portion. The spring portion has flanges (130) extending from opposite sides thereof and folded back thereover for reinforcing the clip. The handle defines a cutout (134) including a receiving section (136) and a locking section (138). The second member includes a connect portion (144) forming a plurality of teeth (148) on opposite edges thereof, and a second leg (142). The connect portion is received in the receiving section and engages in the locking section. A slot (146) in the connect portion facilitates elastic deformation. The effective length of the second member is adjustable according to the particular teeth selected to engage in the locking section.

Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The heat dissipation system and method further includes an array of substantially parallel fin structures having top and bottom portions. The thermally conductive base plate is attached to the array such that the thermally conductive base plate is in close proximity to the bottom portion. The top and bottom portions extend outwardly from the thermally conductive base plate. The top portion of the array further extends laterally beyond the bottom portion of the array. The top and bottom portions of the array are of sufficient size so as to allow components on a motherboard to encroach around the integrated circuit device.

Abstract: The components of a multiphase converter, which contains semiconductor power components and a capacitor on a support containing cooling devices, are arranged in an optimally compact configuration, in which the support containing the cooling device is configured as a hollow body, the capacitor is or the capacitors are insertable in its interior in as tightly and precisely fitted fashion as possible, and the semiconductor power components are arranged on its outer side, where the height of the hollow body corresponds substantially to the height of the necessary capacitor. For a three-phase converter, the hollow body may be in the shape of a hexagon on the outer side, so that an overall shape approximating a cylinder is created, and a cylindrical cover protects everything and makes a compact component available, and for a two-phase converter, a parallelepipedal volume is optimally utilized.

Abstract: A clip (10) includes a first member (12) and a second member (14). The first member includes a spring portion (122), a first leg (126) extending from one end of the spring portion, and a handle (128) extending from an opposite end of the spring portion. The spring portion has flanges (130) extending from opposite sides thereof and folded back thereover for reinforcing the clip. The handle defines a cutout (134) including a receiving section (136) and a locking section (138). The second member includes a connect portion (144) forming a plurality of teeth (148) on opposite edges thereof, and a second leg (142). The connect portion is received in the receiving section and engages in the locking section. A slot (146) in the connect portion facilitates elastic deformation. The effective length of the second member is adjustable according to the particular teeth selected to engage in the locking section.

Abstract: A method and apparatus for safely and quickly mounting a heat sink in heat conducting relation with an electronic component on a supporting member such as a printed circuit board, allow sequential assembly of the heat sink and a wire clip for mounting the heat sink on the supporting member in a manner which reduces the possibility of damaging the electronic component or components on the supporting member. A load centering part is arranged between an elongated central portion of the wire clip and the heat sink to help locate the clip force on the heat sink generally opposite the electronic component without retaining the central portion of the mounting device on the heat sink.

Abstract: A cooling apparatus for power semiconductors, which apparatus is essentially box-shaped, has two extruded cooling sections (14, 15) joined to each other. One of the cooling profiles (14) forms a first heat-conducting side wall (16), and the other cooling profile (15) forms a second heat-conducting side wall (17), opposite the first side wall (16), of the cooling apparatus (1). The side walls (16, 17) have cooling partitions (18, 19) formed on the inner sides of the latter, which cooling partitions bound cooling channels through which a cooling fluid can be conducted. Power semiconductors (4, 5) are to be attached to the outer sides of the side walls (16, 17) in a heat-conducting manner. In order to achieve the largest possible cooling surface of the cooling apparatus, the cooling partitions (18) formed on the first side wall (16) project between the cooling partitions (19) formed on the second side wall (17).

Abstract: A heat sink device retainer structure includes one press member and a retaining member; the said press member bends downwardly to form a press portion with resilience; one end thereof bends downwardly to form a retaining hole; two sides of the bottom portion at the other end extend to form a pair of opposite fastening panels; an insert hole is disposed on the said fastening panel and the tail end thereof outwardly forms an opening; a wrench portion is disposed at the upper end of the said retaining member; the wrench portion bends downwardly to form an upper body; the lower end of the upper body extends as a support for connecting a lower retaining body; a retaining hole is disposed on the lower retaining body; two convex blocks are disposed on two sides of the said support and inserted correspondingly into the insert holes for positioning.

Abstract: Heat sink and electrically non-conducting thermal interface having shielding to attenuate electromagnetic interference. The interface comprises a generally planar substrate having first and second outwardly facing surfaces. The substrate is formed from a material, preferably a polymer, that is both thermally conductive and has a high dielectric strength. Formed upon the outwardly facing surfaces are layers of a thermally conductive compound for facilitating heat transfer. The invention further comprises an improved heat sink comprising a baseplate coupled with a folded-fin assembly, the latter being compressively bonded thereto via a pressure clip and pressure spreader assembly. The base plate is attachable to a heat-dissipating component, and may optionally include a ground contact connection for use with components that are not already grounded.

Abstract: An electronic component cooling apparatus capable of firmly mounting a fan unit mounting frame on a heat sink without increasing mechanical strength of the fan unit mounting frame. The fan unit mounting frame includes a pair of mounting legs provided thereon with hooks, which are engaged with hook engagements provided on a base of the heat sink. A top plate of the fan unit mounting frame is provided thereon with projections acting as a first pivotal movement preventing engagement structure and fitted in gaps defined between adjacent radiation fins of a radiation fin unit. Also, the top plate is provided thereon with projections which are abutted against end surfaces of the radiation fins positioned in a second direction, to thereby act as a second pivotal movement preventing engagement structure for preventing pivotal movement of the top plate in the second direction.

Abstract: A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A plurality of resilient legs extend inward from the sides of the retaining device. Retaining edges are also formed on two sides of the retaining device. The resilient legs fall into the gaps between the fins when the retaining device is positioned on the heat dissipater to secure a CPU assembly. In an orientation, the legs are placed on the pads or recesses of the heat dissipater and in an orthogonal orientation, the legs are placed directly on the top surface of the heat dissipater. Therefore, CPU assemblies of different thickness can be accommodated by rotating the retaining device or the heat dissipater 90 degrees.

Abstract: A heat sink used in an electronic assembly includes mounting surfaces on a first side of a base portion and extended heat dissipating surfaces (e.g., fins) extending from a second side of the base portion. One or more electronic component boards, such as printed wiring boards (PWBs), are mounted to the mounting surfaces on the heat sink at one or more levels. Some of the mounting surfaces can be formed on mounting ridges, which define channels. Ventilation apertures located between the fins extend through the base portion such that air is drawn through the channels and up through the apertures creating a “chimney” effect. The heat sink is also grounded to at least one of the PWBS and electrically isolated from the chassis. Isolator bushings can be mounted in one or more of the fins for receiving pins extending from the chassis to insure mechanical support and isolation/dampening and to insure electrical isolation from the chassis.

Abstract: A heat sink including a first and a second group of heat dissipating members integrally formed and extending upwardly from a base portion. The first group of heat dissipation members includes a plurality of fin-shaped members each having main heat dissipation surfaces surrounded by thin peripheral edges including a top edge, an inside edge and an outside edge. The thin peripheral top edges generally extend from the interior of the base portion towards the outside periphery of the base portion. The main heat dissipation surfaces on adjacent heat dissipation members are substantially opposing to each other, and the second group of heat dissipation members is disposed between the first group of heat dissipation members and the center of the base portion.

Abstract: A device for assisting the cooling of computers, especially laptop computers, provides material having an upper surface distributed over at least two levels, preferably a corrugated surface, whereby it contacts the base of the laptop over only a part of said base, permitting the free passage of air across the support and between the laptop and the support, said support being formed from a material of high thermal conductivity, with a surface adapted for rapid transfer of heat between the material and air passing over said surface.

Abstract: A computer cabinet cooling system comprising an upright tower cabinet having a front panel with an equipment bay for holding heat producing components, a lower aperture and a plurality of air openings. A fan unit having a fan plenum is mounted within the lower aperture of the front panel below the equipment bay near the air openings. An inner door is provided having a plurality of air inlet ports, a plurality of air outlet ports, a plurality of spaced apart horizontal air ingress slots and a fan shroud. When the inner door is closed against the front panel, the air outlet ports will align with the air openings in the front panel, the air ingress slots will align with the heat producing components in the equipment bay and the fan shroud will contact the fan unit. An outer door is also provided having an air plenum, a lower orifice with air deflector, and a plurality of spaced apart horizontal air ingress slots.

Abstract: A method and apparatus for safely and quickly mounting a heat sink in heat conducting relation with an electronic component on a supporting member such as a printed circuit board, allow sequential assembly of the heat sink and a wire clip for mounting the heat sink on the supporting member in a manner which reduces the possibility of damaging the electronic component or components on the supporting member. A load centering part is arranged between an elongated central portion of the wire clip and the heat sink to help locate the clip force on the heat sink generally opposite the electronic component without retaining the central portion of the mounting device on the heat sink.

Abstract: A heat removal system for a computer comprising a casing enclosing a hard drive and a microprocessor, the casing including an opening in an exterior surface thereof; a heat sink positioned between the hard drive and the microprocessor, the heat sink being aligned with the opening in the casing so as to form a thermal chimney; and a spreader plate disposed between the microprocessor and the heat sink, the spreader plate conducting heat from the microprocessor to the heat sink.

Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.

Abstract: A heat sink assembly includes a heat sink (10), and a clip (30). The heat sink includes a base (12) defining an annular groove (14), and a plurality of upwardly extending fins (16). A cavity (18) defined in the fins accommodates a fan (20). The clip includes a generally annular body (32), a first arm (34) pivotably attached to the body, and a second arm (42) fixedly attached to the body. The body defines a cutout (36) for facilitating elastic deformation thereof. The body further defines a pair of apertures (40), and the first arm forms a pair of projections (46). The first arm is rotated and the body is squeezed so that the projections are engaged in the apertures. The body is thereby securely received in the groove and engaged with the base. When the projections are disengaged from the apertures, the body is disengagable from the base.

Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.

Abstract: A clip (10) comprises a pressing body (12) adapted to press onto a heat sink (40). First and second arms (14, 15) extend outwardly and upwardly from opposite ends of the pressing body. A pair of flanges (36) extends perpendicularly outwardly from opposite edges of the second arm. A horseshoe-shaped locking slot (38) is defined in each flange. An operation portion (24) extends upwardly and then downwardly from an end of the second arm. The operation portion has an engaging hole (18) for engagingly receiving a socket (50). A pair of locking bars (34) extends from opposite edges of the operation portion, and is slidably accommodated in the locking slots. Pushing the operation portion causes the locking bars to slide along the locking slots until they snap into place, whereby the clip is securely attached to the socket and firmly presses the heat sink against an electronic device (60).

Abstract: A radiation fin assembly formed of a number of radiation fins connected in parallel, each radiation fin having a plurality of flat peripheral connecting strips, each flat connecting strip having a hook hole and an arrowhead-like hook portion; the arrowhead-like hook portions of the flat connecting strips of one radiation fin being respectively hooked in the hook holes of the flat connecting strips of another, keeping the radiation fins connected in parallel.