Abstract: A system and method for dissipating thermal energy created by multiple electronic circuit boards packaged within a single housing and while in operation are disclosed. The system and method enhances heat convection and heat conduction across and through the housing. A heat conductive housing having a plurality of longitudinally extending fins for increasing the surface area of the housing and correspondingly increasing heat convection to the housing is utilized. Furthermore, the multiple electronic circuit boards are packaged such that a heat conductive path, defined by a thermally conductive material, is disposed between the plurality of electronic circuit boards. Finally, the heat conductive material is applied to the inner surface of the housing and between each of the electronic circuit boards. The present invention increases heat conduction of the thermal energy generated by the plurality of electronic circuit boards to the housing, thereby preventing circuit board damage.

Abstract: A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.

Abstract: A compact cooling method and apparatus arranged for simultaneously drawing heat from both a processor and from the voltage regulator. The invention provides for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation. The invention includes a processor requiring at least one bias voltage, and further includes a companion voltage regulator for providing the bias voltage. The voltage regulator is arranged sufficiently proximate to the processor, so as to limit inductance of electrical coupling therebetween.

Abstract: A protective device for a central processing unit contains a supporter disposed on a central processing unit (CPU), wherein a window is formed in the central portion of the supporter; a plurality of predetermined support spring pieces are formed around the window for holding a heat sink to contact the CPU in a stable manner so that the heat produced by the CPU can be efficiently conducted to the heat sink.

Abstract: A device for attaching a heat sink having a first and a second surface to an element generating heat in an electronic system, which element has an upper plane side contacting the first surface of the heat sink and a lower connector side connected to a printed circuit board, comprises a pair of holes formed on the upper plane side of the element at both sides of the heat sink attached to the element, a clip attached to the second surface of the heat sink having two hooked ends respectively connected with the pair of holes, a lever hinged to the clip, and a support hinged to the lever, wherein the lever is swung so as to cause the support to press or release the heat sink against or from the element. Preferably, the clip has a lever holding seat to hold a first fixing lug formed on the lever swung to cause the support to press the heat sink, thereby preventing the lever from inadvertent reverse swing.

Abstract: A heat-dissipating module for dissipating heat generated by an electronic component includes a fan base formed with a fan mounting cavity, a heat-dissipating fan mounted in the fan mounting cavity, a heat-conducting plate adapted to contact a heat-dissipating side of the electronic component, and a connecting shaft having a mounting section that is mounted on the heat-conducting plate and a pivot section that extends from the mounting section and that is mounted pivotally on the fan base, thereby permitting movement of the heat-conducting plate toward and away from the heat-dissipating side of the electronic component.

Abstract: The present invention provides a two-phase thermosyphon (100) and a method for forming the two-phase thermosyphon (100). The two-phase thermosyphon (100) includes a hermetically sealed housing (101) including a first outer surface (107), a second outer surface (109) opposite the first outer surface (107), a first inner surface (111), and a second inner surface (113). The two-phase thermosyphon (100) also includes a finned area (114) thermally coupled to the hermetically sealed housing (101), the finned area (114) including a plurality of fins (115) disposed on a part of the first outer surface (107). The two-phase thermosyphon (100) also includes a plurality of air feed through slots (105) disposed in the housing (101). The air feed through slots (105) underlie the fins(115) and provide increased heat dissipation by increasing the air flow about the fins (115). The present invention is particularly useful in applications that require a two-phase thermosyphon utilized in a generally horizontal orientation.

Abstract: In a preferred embodiment, an electronic power device heatsink clamping system, including: a heatsink; at least one electronic power device disposed adjacent a side of the heatsink; at least one clamping spring, having first and second ends, disposed so as to press the at least one electronic device against the side of the heatsink; and a pressure enhancing member pressing against the at least one clamping spring, intermediate the first and second ends, causing the clamping spring to act as a simple beam spring.

Abstract: A cooling device mounts a fan unit above a heat sink. The heat sink is mounted on a heat-generating element or buried therein. The cooling device produces an effective air flow and achieves a uniform cooling action by having the heat sink formed in various shapes. The cooling fan is disposed away from the heat sink or to the side of the sink and is used for effective cooling through an air conduit passage formed by pipes or a cover.

Abstract: Cooling apparatus for electronic systems and a computer system with such apparatus is disclosed. The apparatus dissipates heat from circuit boards of such systems to the surroundings, thus effectively cooling the circuit boards. The cooling apparatus has a cooling unit, having a board seat defined in its bottom and side walls and seating a circuit board in the seat. A fan is exteriorly seated on the unit at a position opposite to the board seat. An air passage extends from the fan to the board seat, thus dissipating heat from the circuit board to the surroundings using air. Such a cooling unit is detachably set in the main body of a computer system with both a central processing board being seated in the board seat of the unit and a system board being set in the main body.

Abstract: A cooling system for a computer includes a chassis having a sidewall with an opening formed therein. A heat spreader plate is mounted in the chassis including a heat sink attached thereto adjacent the sidewall. The heat sink has a side mounted base and a plurality of fins extending laterally from the base toward the sidewall. One of the fins is attached to the heat spreader plate. A heat pipe is connected to the heat spreader plate and extends into engagement with the heat sink. Each of the fins has a terminal edge and opposed ends. The fins at one of the opposed ends are uniformly sloped at an angle toward the base and are exposed to the opening in the sidewall, thus providing the appearance of an inlet grill.

Abstract: An airflow heat exchange apparatus. One embodiment includes a housing configured to removably mate with an electronic device. The housing has a vent on a substantially horizontal surface and a fan positioned to increase airflow through the electronic device when the electronic device is mated with the housing. An electronic connector is positioned to be electronically coupled to signal lines from the electronic device when the electronic device and housing are mated.

Abstract: Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primary heat dissipation path. The lid structures and modules are made by processes wherein the lid understructure is customized for the chip(s) to be housed. The customization is achieved by the use of shims and a deformable lid understructure.

Abstract: A pin-less retainer for mounting a press-pack device, which includes circumscribing fins for preventing arc formation between terminal faces thereof, onto the rods of a clamping mechanism used to stack a plurality of such devices and heat sinks together. The retainer is constructed out of a semi-flexible sheet having two mirrored sections, each section having a void therein and at least two extending tabs. The voids are sized such that the retainer may be press-fitted into interstices between the fins, and the tabs are shaped and sized to suspend the press-pack device from the rods and axially align the press-pack device with other elements of the stack. The retainer, being a pin-less mount, facilitates the easy and rapid removal of a press-pack device from a stack without having to completely disassemble it.

Abstract: A foldable retention mechanism includes a pair of bases, two retaining arm members and two locking members. The retaining arm members are attached to the corresponding base. Each retaining arm member defines a guiding slot. A locking member is positioned proximate a free end of each retaining arm member. Each retaining arm member defines a receiving space for engaging with a corresponding projection of a heat sink.

Abstract: An information processing apparatus includes a plurality of processor boards arranged parallelly on the main board and the DC--DC converters for generating operation voltages for processor devices each disposed between the adjacent processor boards. Further, a metal plate with high thermal conductivity is placed in close contact with an area of each of the processor boards where devices generating a large amount of heat are mounted. Heat dissipating fins are joined to the surface of each of the metal plates so that when the processor boards are mounted on the main board, the heat dissipating fins do not contact the DC--DC converter. The heat dissipating fins and the DC--DC converters are arranged so that they are vertically disposed one over the other with respect to the main board.

Abstract: An extruded, tiered high fin density heat sink (10) uses extruded first base, second base and bridging elements (12, 16, 14) having an arrangement of closely spaced, parallel fins (20, 26, 32, 38) and recesses (22, 28, 34, 40) for receiving opposing fins in the elements. The fins (20, 38) in the first and second base elements (12, 16) are bonded to recesses (28, 34) in opposite common faces (24, 30) of bridging elements (14) while fins (26, 32) extending from both opposing faces (24, 30) of bridging element (14) are bonded in aligned recesses (22, 40) in the first and second base element (12, 16) forming an extruded, tiered, high fin density heat sink (10).

Abstract: An electronic assembly which includes a heat sink. The assembly includes first and second integrated circuit packages that are mounted to a substrate. The heat sink may be in direct thermal contact with the first integrated circuit package and include a channel that is located adjacent to the second integrated circuit package. The channel allows air to flow across the second integrated circuit package and remove heat generated within the package.

Abstract: Heatsink structures for integrated circuit chips, chip packages, printed wiring boards and the like are disclosed. The heatsink structures according to the present invention have thin flexible cooling fins which move and vibrate under the flow of a cooling fluid. In one embodiment, the fins comprise a thin metal film, such as copper or aluminum, which is laminated to a thin polymeric layer. The polymeric layer provides resilience and elasticity to the metal film and the cooling fins.

Abstract: A heat sink is constructed in accordance with this invention to increase the spacing surrounding radiating pins which extend outward from a base at the region of highest thermal stress, and to increase the mass of the radiating pins a distance from said region of highest thermal stress to enhance the effects of a thermal differential.

Abstract: A cooling device mounts a fan unit above a heat sink. The heat sink is mounted on a heat-generating element or buried therein. The cooling device produces an effective air flow and achieves a uniform cooling action by having the heat sink formed in various shapes. The cooling fan is disposed away from the heat sink or to the side of the same and is used for effective cooling through an air conduit passage formed by pipes or a cover.

Abstract: An extruded, tiered high fin density heat sink (10) uses extruded first base, second base and bridging elements (12, 16, 14) having an arrangement of closely spaced, parallel fins (20, 26, 32, 38) and recesses (22, 28, 34, 40) for receiving opposing fins in the elements. The fins (20, 38) in the first and second base elements (12, 16) are bonded to recesses (28, 34) in opposite common faces (24, 30) of bridging elements (14) while fins (26, 32) extending from both opposing faces (24, 30) of bridging element (14) are bonded in aligned recesses (22, 40) in the first and second base element (12, 16) forming an extruded, tiered, high fin density heat sink (10).

Abstract: A heat dissipating device for CPU generally comprises a bracket, a cooling fan, a specially designed air hose that connects the inlet of the cooling fan and the inlet of the computer housing, and an upper lid. The specially designed air hose is connected to the inlet of the cooling fan. The other end of the hose is arranged such that it may draw the fresh air into the computer housing. The bracket is preferably made from aluminum and can be properly mounted onto the top surface of the CPU. When the cooling fan operates, the cooling air can be readily sucked and directed to the mounting recess of the bracket. The heat built-up resulted from the operation of CPU can be readily dissipated by those introduced airflow. When the airflow passes through the heat dissipating fins, the heat from the CPU can be effectively dissipated.

Abstract: In a liquid cooling device (1) for a high-power semiconductor module (14), which contains a plurality of heat-generating submodules (8a-h) arranged next to one another on a cooling surface (3) and is fusion-bonded to the cooling surface (3), an improved load cycle resistance is achieved by the liquid cooling device (1) having a housing (2) which encloses a liquid space (4), through which a cooling liquid flows, and the upper side of which forms the cooling surface (3), and by the housing (2) of the liquid cooling device (1), at least in the region of the cooling surface (3), consisting of a metal-ceramic composite material, the coefficient of thermal expansion of which is adapted to the coefficient of thermal expansion of the ceramic substrates or of the power semiconductor devices of the submodules (8a-h) and, by additional means (11a-h; 12) for improving the heat transfer between the cooling surface (3) and the cooling liquid being provided in the liquid space (4) of the liquid cooling device (1).

Abstract: A heat sink for use in a computer for dissipating heat which includes a flat base plate having elongated coupling grooves and upright cylindircal sockets in the coupling grooves, a plurality of U-shaped radiating fins respectively mounted in the elongated coupling grooves at the flat base plate, and a slotted holding down plate covered on the flat base plate and secured to the upright cylindrical sockets at the flat base plate to hold down the radiating fins.

Abstract: A heat sink for a computer includes a base frame having a plurality of upright locating plates, each upright locating plate having pairs of locating flanges of triangular cross section symmetrically raised from two opposite lateral side walls at different elevations, and a Plurality of radiating fins respectively mounted on the upright locating plates at different elevations, the radiating fins each having a longitudinal mounting slot, which receives one upright locating plate of the base frame, and two longitudinal coupling flanges obliequely raised along two opposite lateral sides of the longitudinal mounting slot and stopped between two vertically spaced pairs of locating flanges at one upright locating plate of the base frame.

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control means for controlling the fluid flow within the fin field. In one embodiment, the fluid control means utilizes the low pressure created by flow bypass to vent relatively high pressure fluid within the fin field. Alternatively or in conjunction, the fluid control means substantially prevents premature egress of fluid from the top of the fin field caused by the high pressure region within the fin field.

Abstract: Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section,The cooling fins are in the form of cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.

Abstract: An apparatus for dissipating heat transferred to a circuit board. A board on which to mount an electronic device includes a conductive layer. A first board heat dissipation element is thermally coupled to the conductive layer and extends away from a surface of the board to dissipate heat from the conductive layer to the ambient.

Abstract: An enclosure containing heat generating electrical components is provided with exterior heat fins and is enclosed within a perforated cover. The heat fins are generally planar and parallel to define vertical channels between adjacent pairs of fins. The fins are formed with a plurality of aligned notches to define a plurality of horizontal channels. The perforations in the cover are arrayed along a plurality of horizontal lines, with at least one of the horizontal lines overlying each of the horizontal channels.

Abstract: A stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess opening are sized and shaped such that an interference fit is formed when the button-like projection of one fin layer is pressed into the recess of another fin layer. The use of an adaptor to increase or decrease the effective size of the button-like projection of the bottommost fin layer is described. Relieving gases that may be entrapped in the recess during assembly is described. Circular, elliptical and polygonal shapes (outlines) for the fin layers are described.

Abstract: A heat sink structure of a module substrate includes a plurality of stripe-like bottom regions extending in a longitudinal direction and repeated in a lateral direction with a predetermined pitch, a plurality of stripe-like top regions extending in said longitudinal direction and repeated in the lateral direction with said predetermined pitch, such that the stripe-like bottom regions and the stripe-like top regions are repeated alternately in the lateral direction, wherein the stripe-like top regions and the stripe-like bottom regions have respective lateral edges that are connected with each other by cooling fins.

Abstract: A cooling device for a mounting module in which heat generated from a predetermined number of circuit elements mounted on the mounting module is dissipated by a cooling arrangement. The cooling device is comprised of at least one conduction element which thermally connects the circuit element with the cooling arrangement, the conduction element includes a predetermined number of first conductive members which is placed in a respective hole formed in the conduction arrangement and is movably supported by a first conductive material filled between the side surface of the first conductive member and the surface of the conduction element so as to complete a thermal flow from the circuit element to the cooling arrangement.

Abstract: A heat sink adapted to dissipate heat from an electronic component wherein a plurality of heat dissipating perforated fins project generally outwardly from a planar base and are spaced apart by channels therebetween. The height of the perforated fins to the width of the channels is at least about 8 to 1. The perforations through the fins are such that the flow of cooling fluid through the fins generally emulates the flow through a comparable pin grid array heat sink. The fin structure is such that the fin is structurally supported against deformation, particularly during cross-cutting operations.

Abstract: An enclosure for a machine control panel assembly including an enclosure body having an outer periphery, a first enclosure side, and a second enclosure side; a heat sink formed along the second enclosure side; and a cover plate having at least two edges, wherein the cover plate is located between the heat sink and the outer periphery. The cover plate also including lips along the at least two edges to direct moisture away from the enclosure body.

Abstract: Heat sinks and methods particularly suited for use on packaged integrated circuits which are not amenable to the use of snap-on heat sinks and on which cemented-on heat sinks prevent conventional probing or reworking of the integrated circuit in the event trouble-shooting of the circuit is required after mounting of the heat sink. In accordance with the invention, a scalable post, based on heat sink size, mass and integrated circuit size, is cemented to the integrated circuit package in a configuration and location not interfering with the later probing or reworking of the integrated circuit, and without interfering with the printed circuit board layout. The post is then used to removably and independently hold a heat sink onto the integrated circuit so that good heat transfer between the integrated circuit and the heat sink is achieved, but still allowing the removal of the heat sink at any time if probing of the integrated circuit is later required. Alternate embodiments are disclosed.

Abstract: A heat sink for semiconductor components has a fin base and a plurality of spaced fins that all have the same height. A side of the base facing the fins is configured convexly with respect to the side of the fin base facing the semiconductor component, so that when the heat sink is used as intended, the roots of its fins are arranged on a surface of constant temperature. This yields a finned heat sink that attains a heat flux density hitherto achievable only with evaporative or fluid coolers.

Abstract: In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.

Abstract: Device for cooling of electronics units (1) carried by a support structure (2) with flat sections (3, 4, 5) and comprising several flat antenna elements (6). The support structure (2) and the flat antenna element (6) extend generally in the vertical direction and present an intermediate cavity (16) having an air inlet opening arranged at a lower region and an outlet opening arranged at an upper region. In this manner, air is forced to flow through said cavity by means of self-circulation.

Abstract: The cooling apparatus has cooling fins attached to heat generating units of electronic devices and provided with a plurality of elemental fins. According to one embodiment, the cooling apparatus has a first cooling fin composed of elemental fins that are uniform in fin density in the height direction of the cooling fin from a fin base. The cooling apparatus also has a second cooling fin composed of elemental fins with a zero or small fin density at the lower portion close to a fin base of the cooling fin as compared with the fin density at the upper portion of the cooling fin. The first and second cooling fins are positioned adjacent to one another. Various different embodiments of cooling fins are disclosed.

Abstract: A method and apparatus simultaneously supporting a circuit board and dissipating heat from an electrical device on the circuit board. In a computer including the circuit board and a mother board connected to the circuit board, a heat dissipator not only dissipates any heat produced by the electrical device, but also secures the circuit board to the mother board. The heat dissipator includes three frame plates and two support plates, each made of a thermally conductive material. The first frame plate is directly connected to the electrical device. The first and second frame plates are proximate to and parallel with the front and back faces of the circuit board, respectively and the third frame plate connects the first and second frame plates. The first and second support plates attach the first and second frame plates, respectively, to the mother board.

Abstract: The present invention relates to the packaging of commercial off-the-shelf (COTS) electronic modules and equipment for use in harsh military or commercial environments. The ruggedized container of this invention is a light-weight container weighing less than half of the weight of commercially available containers having similar functionalities and which is intended for use in similar harsh environments. The reduced weight and size of the ruggedized container of this invention are consistent with size and/or weight critical applications such as transport of portable flight line testers, submarines, space craft, air craft, and the like. The ruggedized container of this invention, comprises five major components: a transit case, a card cage, a vibration isolator assembly, cooling system, and power supply. Each element of the chassis is individually enhanced for size and weight.

Abstract: Electronic systems utilizing a plurality of integrated circuit packages having a stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess opening are sized and shaped such that an interference fit is formed when the buttonlike projection of one fin layer is pressed into the recess of another fin layer. The use of an adaptor to increase or decrease the effective size of the button-like projection of the bottom-most fin layer is described. Relieving gases that may be entrapped in the recess during assembly is described. Circular, elliptical and polygonal shapes (outlines) for the fin layers are described.

Abstract: A cooling device mounting a fan unit above a heat sink mounted on a heat-generating element or buried therein, which produces an effective air flow and achieves a uniform cooling action by having the heat sink shown in various shapes. Further, a cooling fan disposed away from the heat sink or to the side of the same is used for effective cooling through an air conduit passage formed by pipes or a cover.

Abstract: A heat sink comprising a bottom plate and a plurality of fin groups on the bottom plate is disclosed, the plurality of the groups being spaced from one another, and aligned in a matrix form or arranged in a staggered pattern, and each of the group comprising a plurality of plane parallel plates or pins that are integral with the bottom plate.

Abstract: An adjustable fastening device for integrated circuit chips of varying thicknesses includes a radiating fin, a base plate, a number of resilient cramps and a number of screws. The radiating fin has at least two opposite sides which each include an upper ledge, a lower ledge and a longitudinal recess therebetween. Each upper ledge defines at least one vertical through-hole. Each lower ledge defines at least one recess corresponding to the vertical through-hole. The base has at least two opposite sides from each of which a hook downwardly extends. The cramps corresponding to the hooks have a top portion, a side portion and an arcuate portion extending therebetween. The top portion defines a hole to engagingly receive one of the screws. The side portion defines a slot configured to receive a corresponding hook. An integrated circuit chip is received between the radiating fin and the base.

Abstract: Method of cooling electronic systems and semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing an electronic system or a semiconductor device with a heat sink including at least a first element having a generally flat shape with a shoulder projecting from one generally flat surface, and configured to thermally engage similar elements. In one embodiment, a first and a second heat sink element are provided, with one of the first and second elements having a protrusion and the other of the first and second elements defining a depression configured to receive and retain said protrusion. Alternatively, the first and second elements may be bonded together with a thermally conductive adhesive.

Abstract: A power electronics package includes a heat exchanger having a plurality of faces, a plurality of semiconductor devices mounted on the plurality of faces and at least one bus structure for interconnecting electrodes of the semiconductor devices. The package is enclosed by a cover and structure is provided to connect other electrodes of the semiconductor devices to an external circuit.

Abstract: An improved heat sink apparatus that utilizes either natural or forced convection to transfer heat generated by a high temperature medium to a lower temperature medium or converts cold energy from a low temperature fluid or solid medium to a different or higher temperature stage or condition of energy. The apparatus includes a thermally conductive base plate, a plurality of thick corrugated finned assembly components constructed and arranged in abutting relationship and offset from each other so as to cause a circuitous path of fluid flow therethrough. The apparatus also may include the base plate and a plurality of thick, sawtooth shaped, or segmented fins mounted thereon. The length of fluid travel from one finned component to an abutting finned component along the heat transfer surface is controlled in order to prevent development of thermal boundary layer on the inner surface of the finned assembly components.

Abstract: A stackable heat sink assembly is formed by press-fit assembly of two or more identical fin layers. Each fin layer is formed using powdered metallurgy and has a button-like projection extending from its bottom surface and a recess opening in its top surface. The button-like projection and recess opening are sized and shaped such that an interference fit is formed when the button-like projection of one fin layer is pressed into the recess of another fin layer. The use of an adaptor to increase or decrease the effective size of the button-like projection of the bottommost fin layer is described. Relieving gases that may be entrapped in the recess during assembly is described. Circular, elliptical and polygonal shapes (outlines) for the fin layers are described.