Abstract: Functional element units are fixedly mounted on a circuit board, and unit-side connectors are electrically wired to base-board-side connectors. A predetermined wiring circuit has been formed on the circuit board, with the result that the wiring work is simplified as much, and the disused connectors can be disposed of, so that the number of connectors is reduced. In addition, the electrical connection of the functional element units through those connectors, provides the following effects: the wiring is orderly and reasonable, the number of wires is small, the occurrence of wiring errors is prevented, and in addition the application of external noises to the wires is prevented. That is, the operation of the motor control system high in reliability.

Abstract: An integrated coolant fluid supply and exhaust distribution pathdefining structure is employed to provide a substantially planar cooling system for an electronic assembly which includes a substrate having electronic modules or electronic chips disposed thereon. The pathdefining structure includes interleaved supply and exhaust channels with the supply channels including apertures disposed adjacent to heat sink shafts which are connected to planar heat sink structures in thermal contact with chips or modules being cooled. The pathdefining structure produces a fluid flow path which is initially aligned with the surface area enhancing heat sink shafts and which exits therefrom in a plurality of directions which ultimately lead to the exhaust channels provided in the path-defining structure. The assembly, which includes an exterior housing and the substrate, provides a compact cooling mechanism for electronic components.

Abstract: A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

Abstract: A heat spreader with one or more integrally formed open regions discourages the formation of air bubbles in the encapsulant of a plastic packaged integrated circuit. Little or no air bubbles can be trapped between the heat spreader and the encapsulant surface. Any air bubbles that do form in the encapsulant can escape through the open regions of the heat spreader. The heat spreader of the invention is placed on the surface of a liquid encapsulant and the encapsulant fills the open regions of the heat spreader and covers the sides of the open regions. When the encapsulant hardens, a form fitting bond between the heat spreader and the upper surface of the encapsulant is created. This form fitting bond provides for secure attachment of the heat spreader to the surface of the encapsulant. One embodiment of the heat spreader of the invention includes integrally formed tabs with which a supplementary heat spreader, such as heat tower, is inserted for even greater heat dissipation capability.

Abstract: A heat sink assembly (100) employs multiple heat sinks (401-403) that are juxtaposed to provide pneumatically coupled air flow pathways. At least one of the heat sinks (401) preferably includes an air circulator to force the air flow towards a periphery of the heat sink. A plurality of heat radiating surfaces provide pneumatic pathways (201) for the air flow, and at least two of the pneumatic pathways (201) are arranged substantially non-parallel. In this manner, the air is forced (i.e., when an air circulator is provided) radially from a center point of the heat sink (200) toward a periphery. Similarly, the air is directed (i.e., when an air circulator is not provided) toward a central locale from the periphery of the heat sink (300).

Abstract: A heat pipe which is flexible and thus conformable to the space in which it is to be deployed consists of two or three layers, namely, a relatively thin, highly conductive plate as a bottom layer, a plastic sheet as a top layer and wicking as an optional middle layer. The bottom plate has a relatively high modulus of elasticity and it is stiff, yet ductile. It is preferably made of metal, such as aluminum, or a plastic sheet or plate. To manufacture the heat pipe, the bottom and top layers are aligned, with the wicking between them, and sealed together around three edges. Liquid coolant is then added and the fourth edge is sealed. The sealing is preferably performed by heat sealing. The heat pipe may include heat-dissipating fins or ridges on the end of the pipe that operates as a condenser. The opposing end of the pipe, which acts as the evaporator, is positioned proximate to a heat-generating component.

Abstract: Total thermal management accomplishes self-cooling from acoustic air movement in a light-weight loudspeaker system for professional sound applications: a cast aluminum front panel, forming the front baffle portion of a total enclosure, is configured to include on the front panel a horn opening, a woofer opening with a ring mount for a conventional woofer cone, a pair of bass reflex ports, and, extending rearwardly, a woofer frame with a mount for a conventional woofer driver, a horn structure with a threaded mount for a conventional horn driver, and an amplifier mounting shelf, all thermally combined by a pattern of generally vertical integral cooling vanes. The lower portions of the vanes are shaped to form structural legs of the woofer frame, and their upper portions are integrally attached to the horn. A shelf for mounting an amplifier in the speaker enclosure is formed by a transverse cooling vane.

Abstract: A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

Abstract: A rack of electronic equipment is convection cooled. Each unit in the rack has oblique cooling fins oriented in a same direction, to cause heated air to flow to a hot air pathway by a chimney effect, and to draw surrounding air along a cool air pathway to each of the units. A preferred unit has two housing sections thermally insulated from each other. Each housing section has its cooling fins on a side surface, some of the fins being aligned with fins on the other section, so that cooling air flows first over the cooler section and then over the hotter section. The cooler section is arranged for enhanced heat transfer from a heat sensitive element, and heat liberating units are heat sinked to the hotter section.

Abstract: The coil of an electric control device is energized by ac power controlled by a remotely generated logic level signal through a control module mounted in a cavity in the exterior of the device housing. The module contains a pair of back-to-back silicon controlled rectifiers (SCRs) mounted on a finned aluminum wall of the module which serves as a heat sink. An opto-coupler comprising a light emitting diode (LED) energized by the logic level signal and an opto-triac in series with resistors connected across the gates and cathodes of the back-to-back SCRs provides electrically isolated control of the conduction angles of the SCRs by the logic level signal.

Abstract: A semiconductor device is provided with a rectangular package body, a large number of leads projecting out from the body, and a heat radiating fin assembly on top of the package body. The heat radiating fin assembly is constructed of a support column extending vertically from the top surface of the package body and at least one heat radiating fin extending outwardly from the support column in a radial direction. The heat radiating fin is supported by direct or indirect engagement within a container for accommodating and holding the semiconductor device. The support is achieved in such a way that the leads of the device are held out of contact with the inside of the container and such that the device is accommodated and held within the container in a predetermined orientation.

Abstract: A heat sink having pin-shaped fins, for example, for use in disposing of heat in printed boards for computers comprises a heat dissipating base plate and a plurality of comblike fin members arranged in parallel at a predetermined spacing on one surface of the base plate approximately perpendicular thereto, each of the fin members comprising pin-shaped fins arranged in a row and connector connecting the fins together each at one end thereof, the connector of each fin member being joined to the surface of the base plate. The fins are given a greater height and arranged with a reduced pitch with a higher density for disposal of increased amounts of heat. To prepare the heat sink, the fin members are blanked out from a metal sheet, the fin members and spacer plates are arranged alternately on one surface of a heat dissipating base plate approximately perpendicular thereto, the connectors of the fin members are joined to the base plate and the spacer plates are thereafter removed.

Abstract: A heat sink according to the invention comprises a multilayered body prepared by laying one upon the other a plurality of heat sink fin elements having pin-fin sections formed by cutting a number of slits through thin plates of a thermally conductive material with spacers, each being inserted between two adjacent heat sink fin elements to separate them by a given distance.

Abstract: A heat radiating apparatus for a semiconductor device, in which said semiconductor device mounted on a circuit board is cooled by a radiator. The radiator is provided with a stepped portion, and fixing spring hardware having slit grooves is provided with a notch engaging with the stepped portion, so that the end of radiator is brought into contact with the outer surface of the semiconductor device when the stepped portion of the radiator engages with the notch portion of the fixing spring hardware. The stepped portion of the radiator is constituted of two stages, and the notch of the fixing spring hardware is provided with two notch portions engaging with the two-stage stepped portions of the radiator, respectively, so that the larger-diameter portion of the two-stage stepped portions of the radiator engages with the farthermost portion of the notch.

Abstract: A convertible cooling module, especially for use in conjunction with a wide range of computer systems ranging from workstations to massively parallel processors is employable with both air and water cooling systems. In particular, a cooling module is convertible from a heat sink modality to an air cooling modality, and finally to a liquid cooling modality in response to either increased performance demands or an increase in the number of processors or circuit components employed. The conversion may be carried out in the field and provides a flexible and less costly upgradeability path for computer customers.

Abstract: Pin-finned heat sink having good heat dissipating characteristics satisfy the following inequality: ##EQU1## where d is the diameter of pins, c is the distance between pins, and h is the height of pins. This heat sink can increase the level of integration of semiconductor devices with which it is used.

Abstract: Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like.

Abstract: A heat sink is provided, comprising a base with an array of tubular pins extending outwardly therefrom. The pins are engaged within apertures recessed into the base by means of an expansion member positioned within the tubular portion of each pin, wherein the expansion member causes the wall of the pin to deform outwardly to clampingly engage the pin within the aperture.

Abstract: The high performance, high reliability compact heat dissipator is useful for cooling electronic components (3, 12, 25). It can be used on transfer surfaces (2, 13, 26) with various orientation for natural convection, or with a combination of natural convection and forced flow of the cooling medium. It consists of a highly heat conductive layer (1, 7, 11, 19 27 27C) with extensions (5A, 5B, 8A, 8B, 8A1, 8B1) having louver-like structures with fins (6, 9) for virtually boundary-layer free efficient heat transfer with a single layer (1, 11, 27), or with nested multiple layers (7, 19). It can be incorporated into the structure of a new component, or it can be attached to an existing component by heat conductive adhesive bonding (4).

Abstract: A heat sink in adapted to be attached to a pin grid array comprising a pair of grooves extending along opposite sides into which grooves the tops of attachment clips are disposed. The heat sink has a pair of indentations on opposite sides of each clip holds each clip in place in the groove, the heat sink with the clips attached being positioned between two compression sections of a pair of attachment pliers and when a pin grid array is positioned adjacent to the heat sink, compression of the plier handles connects the clips to the pin grid array. Removal is accomplished by a pair of pliers having projecting points which fit beneath the clips so that compression of the plier handles forces the clip away from the pin grid array disconnecting it.

Abstract: A housed integrated circuit unit package is provided with a heat sink for removal and dissipation of heat from electronic circuits housed in packages. The heat sink, mounted on an outer surface of the package, includes a plurality of pins secured at one end with a retainer and flared out at the other end into a starburst or bouquet configuration, the pins being in the form of rods selected from solid cylinders and tubes. The bottom of the retainer-bound end is coated with a securing substance, such as solder or a heat-conducting adhesive, which is planarized to facilitate positioning of the heat sink on the package. The heat sink is secured to the package by means of solder or a heat-conducting adhesive. The heat sink is produced by securing a plurality of elongated rods by retainers placed at intervals corresponding to a height of the heat sink, cutting off said rods adjacent to one side of the retainer, and flaring the rods at the other free end of the cut-off rods into a starburst-like configuration.

Abstract: An optical network unit for field installation adjacent to an optical fiber transmission line, for separating multiplexed video and telephony signals for delivery to subscribers residences as electrical signals over metallic drop cables, has a hollow housing formed of heat-conductive material. The unit has a sealing front cover and rear cover, a cable entrance port for cable connections, and a backplane assembly mounted in the housing which incorporates optical-to-electrical signal conversion components and connectors for electrical signals. Slots are formed in the interior surfaces of the housing for positioning a plurality of printed circuit board cards for sliding installation into electrical contact with the backplane assembly.

Abstract: An electronic package that has a lid that is in direct contact with an integrated circuit that is mounted to a substrate. The lid includes a plate portion that is in contact with the integrated circuit, an outer frame portion that is attached to the substrate, and a bellows portion that couples the plate portion to the outer frame portion.

Abstract: A light emitting diode exposure head for a recording apparatus which comprises an aligned assembly of a plurality of diode modules, each module including an array of said diodes and associated circuit boards mounted on a common base, the diode modules being supported in elevated position above the base, and interconnection circuit strips for the modules disposed on the base in partial overlapping relation beneath the margins of the elevated modules, the interconnection strips having a line of bonding pads for making wire-bonded connections with the circuit boards.

Abstract: Previously known circuit boards as components of devices having a housing have a plastic rear wall of the housing and the circuit board creates a connection between at least two printed circuit boards in the housing. Furthermore, processes for the production of three-dimensional printed circuits are known. Taking these as a point of departure, a one-piece circuit board as an integral portion of the housing of the device is created. One that not only produces the function of an electrically-conductive connection between the aforementioned printed circuit boards, but also serves as a mounting for the printed circuit boards, i.e., it can assume mechanical functions. This is solved by virtue of the fact that the rear wall (1) of the housing consists of plastic and embodies a circuit board having metallized strip conductors (2) and flat surfaces (3) that conduct electricity. And, on the interior of the rear wall (1), protruding connectors are moulded.