Abstract: A heat dissipation device comprising a base portion, having a chamber defined therein, and a plurality of projections extending from the base portion. At least one projection of the plurality of projections also has a chamber defined therein that is in fluid communication with the base portion chamber to form a vapor chamber of a heat pipe.

Abstract: The present invention is directed to an improved circuit board support. The present invention provides for quick-assembly, limits circuit board flex, and supports a heat sink. In one aspect of the present invention, an apparatus suitable for supporting a circuit board, includes a support suitable for attachment to a chassis of an information handling system, wherein a heat sink may be attached through a printed circuit board to the support so as to enable the heat sink to be supported by the chassis.

Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins and at least one porous reticulated foam block that fills the space between the fins.

Abstract: An improved computer heat dissipation structure, mainly comprises of a heat dissipation base with four sides folded upwards from the base plate to form four side walls with a receiving slot at the center; air outlets set respectively on the four side walls; the base plate connected with the air outlets being cut respectively with proper width and folded upwards to form a plurality of conduct current partitions; the cut planes of the conduct current partitions in different angles according to the direction of the wind thus to make the air current inducted by the fan to rapidly diffuse the heat sources absorbed by the base plate towards the air outlets through the wind channels formed by the interference of the conduct current partitions.

Abstract: Microelectronic packages include a first microelectronic substrate, a second microelectronic substrate that is oriented at an acute angle relative to the first microelectronic substrate, and first solder bumps between the first and second microelectronic substrates, adjacent an edge of the second microelectronic substrate, that connect the second microelectronic substrate to the first microelectronic substrate and that are confined to within the edge of the second microelectronic substrate. The edge of the second microelectronic substrate is adjacent the vertex of the acute angle. A third microelectronic substrate also may be provided on the first microelectronic substrate that laterally overlaps the second microelectronic substrate. Second solder bumps connect the third microelectronic substrate to the first microelectronic substrate. The second and third microelectronic substrates may be oriented parallel to one another at the acute angle relative to the first microelectronic substrate.

Abstract: A heat dissipation device includes a thermally conductive base plate and a plurality of thermally conductive fin plates that are in thermal communication with the base plate. Each adjacent pair of the fin plates defines a channel therebetween, through which cool air is forced to flow. Each of the fin plates has a proximate side that is proximate to the base plate, a distal side that is opposite to the base plate, and a plurality of integral ribs that extend from the proximate side to the distal side, thereby permitting heat transfer from the proximate side to the distal side along the ribs. In addition, because each of the ribs enables formation of a small turbulent flow of the cool air, a temperature boundary layer of the air is broken in each of the channels, thereby permitting heat transfer from upstream ends of the channels to downstream ends of the channels. Because the sizes of the ribs are relatively small with respect to the widths of the channels, the cool air can flow smoothly through the channels.

Abstract: A heat sink having a flat base, a plurality of upright radiation fins upwardly extended from the top sidewall of the flat base and arranged in parallel, a plurality of elongated air passageways defined in between the upright radiation fins, and a wave-like top side formed of the topmost edges of the upright radiation fins and adapted for causing the fan-induced axial flow of air to pass through the air passageways at different speeds for causing convection currents.

Abstract: A fluid flow management system for enhancing cooling of a circuit pack. The system includes a bar extending transverse to the direction of fluid flow. The bar breaks up the otherwise laminar flow into a turbulent flow.

Abstract: A securing equipment for a heat dissipater of a CPU includes a holed main body, and a movable element. The heat dissipater is positioned in a holding member for the bottom to abut the top of the CPU. The main body has rear hooks separably connected to rear holes of the holding member. The movable element includes a control part, and a front part having up-sticking portions pivoted to the upper portion of the control part. The lower portion of the control part is pivoted to the front of the main body so as to be pivotable between a vertical position where the up-sticking portions stand upright in a locking position and a horizontal position where the up-sticking portions is in a sloping unlocking position. The front part of the movable element is further formed with hooks, which engage front holes of the holding member when the up-sticking portions stand upright in the locking position, so as to cause the main body to be pressed against the tops of the radiating fins of the heat dissipater.

Abstract: A method and apparatus to retain mounting hardware on a heat-sink or heat-pipe. One embodiment of the invention involves a method to assemble a component having a heat dissipation device with a plurality of heat dissipation fins on a substrate. A second embodiment of the invention involves a method to assemble an electrical component having a heat dissipation device with a plurality of heat dissipation fins on a substrate. A third embodiment of the invention involves an assembled substrate, an electrical component, and a heat dissipation device attached to the electrical component, wherein the heat dissipation device includes heat dissipation fins with holes to contain and shims (or clips) to make captive within the holes, the hardware used to attach the heat dissipation device to the substrate.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: A cooling apparatus for power semiconductors, which apparatus is essentially box-shaped, has two extruded cooling sections (14, 15) joined to each other. One of the cooling profiles (14) forms a first heat-conducting side wall (16), and the other cooling profile (15) forms a second heat-conducting side wall (17), opposite the first side wall (16), of the cooling apparatus (1). The side walls (16, 17) have cooling partitions (18, 19) formed on the inner sides of the latter, which cooling partitions bound cooling channels through which a cooling fluid can be conducted. Power semiconductors (4, 5) are to be attached to the outer sides of the side walls (16, 17) in a heat-conducting manner. In order to achieve the largest possible cooling surface of the cooling apparatus, the cooling partitions (18) formed on the first side wall (16) project between the cooling partitions (19) formed on the second side wall (17).

Abstract: A heat sink includes a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink at one side, and two hook plates respectively hooked in respective mounting grooves on the bottom heat sink unit and the top heat sink unit to secure the two heat sink units together.

Abstract: A heat sink assembly includes a heat sink (30), a clip (20), and a fastener (10). The heat sink has a base (301) and a plurality of parallel fins (302) extending therefrom. A pair of barbs (303) is symmetrically formed on outmost sides of two adjacent central fins. The fastener includes a basal body (101), a pair of side arms (103) extending upwardly from the body, a pair of pressing plates (104) extending horizontally outwardly from top ends of the side arms, a pair of locking arms (105) depending from the pressing plates, and a pair of catches (106) inwardly formed at distal ends of the locking arms for engaging with the barbs of the heat sink. A notch (102) is defined in a bottom of the body, for facilitating the fastener abutting against a pressing section (201) of the clip.

Abstract: An electronic assembly that may include an elastomeric connector. The elastomeric connector may couple the solder ball of a BGA integrated circuit package to a substrate. The elastomeric connector provides an interconnect that may compensate for variations in the solder balls and a lack of flatness in the package and/or substrate.

Abstract: A cooling structure for cooling an exothermic panel such as a plasma display panel by releasing heat therefrom, comprising: a chassis structure for holding the exothermic panel; a plurality of circuit board connecting portions, a plurality of heat radiating fins and a plurality of side frames, which are all integrally formed with the chassis structure on one side thereof. Specifically, at least one sort of the circuit board connecting portions, the heat radiating fins and the side frames are formed in a hollow structure.

Abstract: An electronic module of the invention is so structured that a plurality of first electronic components are mounted on a top surface of a card-like substrate; a first radiating board is commonly stuck to two or more top surfaces of the first electronic components; a plurality of second electronic components are mounted on a bottom surface of the substrate; and a second radiating board is commonly stuck to two or more bottom surfaces of the second electronic components. The heat generated by high-speed operation of the first and second electronic components is radiated to outside air through the first and second radiating boards.

Abstract: A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediately adjacent each other on a circuit board, but without loss of space and computation time efficiencies, because cooling the components individually avoids heat generated by each component from adversely affecting the performance of the cooling system for adjacent components. A heat sink can be coupled to the components for increased heat transfer, and a preferred design of heat sink both dissipates heat and directs the flow of the fluid in an optimum manner.

Abstract: A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the chip (12) when mounted to a flexible substrate (16). Heat is conducted from the chip (12) with a heat-conductive member (26) brought into thermal contact with the surface of the chip (12) opposite solder bump connections (18) that attach the chip (12) to the substrate (16). A biasing member (30) biases the substrate (16) against the chip (12) so as to maintain thermal contact between the chip (12) and the heat-conductive member (26). A thermally-conductive lubricant (32) is preferably provided between the surface of the chip (12) and the heat-conductive member (26) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip (12), substrate (26) and heat-conductive member (26).

Abstract: A portable computer docking base has incorporated therein a thermoelectric cooling system used to provide auxiliary operating heat dissipation for a portable notebook computer operatively docked to the base. The cooling system includes a thermoelectric (Peltier effect) heat pump unit disposed within the docking base housing and having opposite hot and cold sides. A finned heat sink member is secured to the hot side of the assembly and positioned in the path of fan-generated cooling air, and a heat slug member is secured to the cold side of the assembly and projects outwardly through an exterior wall of the docking base housing into its computer receiving area. When the computer is placed in the receiving area and docked, the cooling system heat slug member is brought into heat conductive contact with a similar heat slug member carried within the computer and thermally coupled to its microprocessor.

Abstract: A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.

Abstract: An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other components within the PC. A fan causes air to blow across the processor having an attached heat sink disposed within the cooling assembly, and the air exits the cooling assembly without adversely affecting the other components surrounding the processor. In one example, an alternative passage is provided for the air.

Abstract: A heat sink includes a bottom heat sink unit having parallel upright fins, and a top heat sink unit having parallel bottom fins respectively forced into engagement with the upright fins of the bottom heat sink at one side, and two hook plates respectively hooked in respective mounting grooves on the bottom heat sink unit and the top heat sink unit to secure the two heat sink units together.

Abstract: Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins and at least one porous reticulated foam block that fills the space between the fins.

Abstract: A thermal resistance variable heat sink structure is provided that can improve the quality during operation and that can change the shape of a heat sink and reduce the number of steps attaching and detaching. Solder balls 1 are disposed for connection of a LSI 2. A mounting plate 3 on which a heat sink is mounted, screws 4 for mounting the heat sink, a radiation fin 5, and a thermal resistance adjuster 6 are disposed on the back surface of the LSI 2. The thermal resistance adjuster 6 is placed on the middle of the back surface to cut the cooling air.

Abstract: This invention relates to an apparatus or device for exchanging heat from electronic components or heat sinks, and method thereof. More particularly, this invention is directed to heat sinks which incorporates an innovative thermo-mechanically actuated device which modulates the capability of the heat sink to dissipate heat, and method thereof.

Abstract: A system for cooling an electronic device comprising a heat sink including a channel having an inlet and an outlet, with the channel coupled to an airflow generation system that generates airflow between the inlet and outlet. Heat is removed from an electronic device by decreasing the cross-sectional area of the channel to provide a throttle at a location adjacent to where the channel traverses the electronic device. A plurality of throttles may be formed in the channel, each for cooling a separate electronic device. An airflow control valve is operably connected to the heat sink for controlling the amount of airflow through the heat sink. A device controller connected to the airflow control valve and the air generation system adjusts the airflow control valve according to temperature measurements collected from the electronic device and controls the operation of the air generation system.

Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.

Abstract: The present invention provides a heat sink that, in an advantageous embodiment, includes a spine having a width with first and second opposing sides that are oriented to be abnormal to the substrate when the heat sink is mounted on the substrate. The heat sink further includes an electronic device support leg that extends generally transverse from the first side and that is configured to support a heat generating electrical component thereon. Alternative embodiments of the present invention may include a plurality of such electronic device support legs. A plurality of cooling fins are also included in the present invention, extending from the second side. Moreover, each of the plurality of cooling fins has a depth that is substantially less than the width of the heat sink, which give this unique heat sink an exceptional cooling efficiency. In particular advantageous embodiments, the depth to width ratio of the fins and spine, may range from about 1 to 5 or 1 to 10, respectively.

Abstract: A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.

Abstract: A heat sink device for use in desktop electronic devices comprises a heat sink which can be firmly attached to a CPU assembly with extremely great strength. The holes to be formed in the CPU circuit board of the CPU assembly or the heat sink can be made as small as possible to ensure a great advantage in design. Fastening members, connecting pins or like fasteners used are unlikely to project beyond the outer surface of the CPU assembly to ensure compactness. Furthermore, the heat sink device achieves a high radiation efficiency and is less costly to manufacture.

Abstract: This invention provides a heat sink for dissipating heat from an electronic component to be cooled by air flow. The heat sink includes a base configured to be mounted to the electronic component to receive heat transferred from the electronic component. The base has a center extending along the direction of air flow. The heat sink also includes a plurality of fins projecting from the base. Each of two adjacent fins is positioned on opposite sides of the center of the base and is spaced laterally from the center of the base. The adjacent fins define a gap extending across the center of the base. The gap between the adjacent fins reduces the temperature increase of air flowing adjacent the center of the base. This invention also provides a circuit assembly and a method for cooling an electronic component.

Abstract: A method (and structure) for cooling a portable computer includes attaching a portable computer to a holder, transferring heat of a heat-generating component disposed within the portable computer to the holder, and releasing the transferred heat to the atmosphere. The portable computer includes a fixture for detachably fixing the portable computer to the holder, a heat release device for releasing heat of a heat-generating component disposed within the portable computer to the outside, and a supporter which supports the fixture and the heat release device.

Abstract: A variable area heat sink has a first heat sink area and a second heat sink area. A bridge is connected to the first heat sink area and includes a bi-metallic portion operable to connect and disconnect with the second heat sink area in response to a temperature change in the bridge which is sufficient to distort the bi-metallic portion from a first shape to a second shape. The first heat sink area may be installed in a computer chassis adjacent a first heat producing component. The second heat sink area may be installed in the chassis adjacent a second heat producing component. The combination of heat sink areas may be enlarged or reduced in size due to the coupling or uncoupling.

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: A heat dissipating device includes a plurality of heat dissipating plates. Each of the heat dissipating plates has a stack plate portion and at least one fin plate portion that extends integrally from the stack plate portion. The stack plate portions of the heat dissipating plates are in close contact with one another and cooperatively form a stack part with a flat contact face adapted to be placed on a heat generating article. The fin plate portions of the heat dissipating plates are bent from the stack plate portions to extend divergingly away from the stack part. The fin plate portions have confronting surfaces which diverge away from one another.

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. In a first embodiment of the invention, the heat exchanger comprises a flow guide extending over a top region of the fin field. The flow guide comprises a front portion adjacent to the inlet region of the fin field extending a predetermined distance in front of the fin field, and extending at an angle relative to the front plane of the fin field. The mounting of the flow guides across the top of the fin field and forward of the inlet region enhances acceleration of fluid flow at both the inlet and exhaust regions.

Abstract: A heat exchanger is disclosed for dissipating heat from a heat generating component. The heat exchanger comprises a thermally conductive base in thermal communication with the component, a plurality of thermally conductive plate fins affixed to the base wherein the plate fins define a fin field and channels, and fluid control for controlling the fluid flow within the fin field. Fluid flow enters the fin field at an inlet region and flows through the channels to an outlet region, i.e. from left to right across the figures illustrated. The heat exchanger of the present invention comprises a fin field having an open region formed by the novel configuration and layout of the individual fins forming the fin field. The open region may be formed in various sections of the heat exchanger for achieving the desired results. The open region reduces friction on fluid passing through the channels of the fin field.

Abstract: The invention comprises a main distribution arrangement for a telephone exchange, including a rack (1); several subscriber-related connectors whose positions are affixed to the rack, coordinated to one or more connection terminals (2a); and several external connectors that belong to telephone exchange-related line circuits, also affixed to the rack and coordinated to one or more connection terminals (3a). Said connection terminals are situated close to one another, and are arranged, with required main distribution conductors (23), to connect selected subscriber-related connectors with selected telephone exchange-related external connectors. A predetermined number of telephone exchange-related line circuits are coordinated to a block (10). Each block (10) can be inserted into and removed from the rack along parallel bars (11, 12).

Abstract: A heat sink including a pedestal. The heat sink is used to dissipate heat from an electrical component such as a processor (e.g., a Pentium® Pro processor). The pedestal is arranged on the heat sink such that a gap which is formed between a surface of the electrical component and the heat sink is maintained to be less than an acceptable gap size. The gap between the heat sink and the electrical component can occur, for example, due to excessive warping of a surface of the electrical component. The excessive warping can be caused, for example, from manufacturing process problems or thermal changes. The pedestal can be arranged on an end of the heat sink facing the electrical component in a manner advantageous to cover a maximum surface area of the electrical component caused due to a particular size and shape of warping which uniquely occurs on a particular type of electrical component.

Abstract: A plate type heat pipe comprises: a plate type container which includes a heat absorbing side and a heat dissipating side to form a hermetically sealed hollow portion; at least one heat transfer block which is thermally connected to each of inner walls of the heat absorbing side and the heat dissipating side; a wick which is placed along a side wall of the heat transfer block through the inner wall of the heat dissipating side; and a working fluid enclosed in the hollow portion. A securing member to secure the wick and the heat transfer block in close contact may be further included.

Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.

Abstract: A heat sink includes a thermally conductive body and at least one clip to secure the conductive body to a circuit board with a central processing unit interposed between the heat sink and the circuit board. The conductive body has a base with a flat bottom face positioned on the central processing unit and a top side on which a plurality of fins are formed. The fins are parallel with and spaced from each other to define slots therebetween which serve as air flow passages. The conductive body is made by means of extrusion whereby the fins and the base are integrated with each other as a unitary member. The clip has a U-shaped anchoring section fit into one of the slots and retained by the adjacent fins and a cantilevered arm extending from the anchoring section and having a free end. The free end has a hole for receiving a fastener to secure the clip to the circuit board. The clip is stamped to be a unitary member. Thus, the manufacture of the heat sink is greatly simplified.

Abstract: A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip.

Abstract: The present invention provides a heat dissipating device and a method for making the same. The heat dissipating device includes an aluminum flat base plate integrally forming a number of studs thereon, an aluminum folded fin with a number of inverted U-shaped heat dissipating fins connecting with each by bottom partitions. Each partition defines a number of holes. Thermal grease is uniformly spread on a bottom of each partition. In manufacturing the heat dissipating device, the folded fin is firstly mounted to the base plate to a position that the studs extend through the holes in the partitions. The studs are then subject to pressing operation to fixedly connect the folded fin and the base plate together, whereby the thermal grease entirely fill the gaps between the partitions and the base plate to enable heat absorbed by the base plate to be effectively dissipated by the inverted U-shaped heat dissipating fins.

Abstract: A portable computer includes a base having a heat producing electronic component mounted therein. A heat sink, also referred to as a remote heat exchanger, is positioned in the base adjacent to the heat producing component. A heat pipe has a first end permanently bonded to the heat sink and extends to a second end thermally engaged with the heat producing component. The heat sink and heat pipe assembly is rotatable about an axis of the heat sink so as to move the second end of the heat pipe into and out of thermal engagement with the heat producing component.

Abstract: An efficient heat sink having a high density of fins and a large effective surface area is formed by coiling a flat strip of thermally conductive material in which teeth or millifins have been formed by a stamping operation, for example. A spacer may be employed to insure fin separation. In an alternate embodiment, the strips are stacked. The resulting heat sink is particularly effective in impingement flow cooling of electronic devices, chips, circuits or modules.

Abstract: A cooling unit having a first heat sink and a second heat sink. The first heat sink overlaps a heat-generating component. The second heat sink covers the first heat sink. The first heat sink having a plurality of heat-conducting sections extending away from the heat-generating component. The second heat sink has a plurality of heat-receiving sections, in which the heat-conducting sections are inserted. A first gap is provided between the first heat sink and the second heat sink. A second gap is provided between each heat-conducting section and the heat-receiving section in which the heat-conducting section is inserted. The first gap and the second gap are filled with grease having viscosity. The grease thermally connects the first heat sink and the second heat sink.

Abstract: A semiconductor package comprising multiple stacked substrates having flip chips attached to the substrates with chip-on-board assembly techniques to achieve dense packaging. The substrates are preferably stacked atop one another by electric connections which are column-like structures. The electric connections achieve electric communication between the stacked substrates, must be of sufficient height to give clearance for the components mounted on the substrates, and should preferably be sufficiently strong enough to give support between the stacked substrates.

Abstract: A heat sink is provided for use with stacks of integrated chips. The heat sink includes a thermally conductive body having a heat absorbing section which is inserted within the chip stack, and heat transfer and dissipating sections which are located outside of the chip stack.