Abstract: A coldplate for use with electronic components in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having multiple raised features on a surface thereof. The raised features are configured for attaching the main portion to a printed circuit board having multiple electronic components attached thereto. The raised features are further configured for maintaining the printed circuit board in a spaced relation relative to the main portion to facilitate air flow between the printed circuit board and the main portion for dissipating heat generated by the plurality of electronic components. The coldplate also includes a protrusion extending from the surface of the main portion. The protrusion is configured for contacting one of the plurality of electronic components attached to the printed circuit board for dissipating heat generated by the electronic component.

Abstract: The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality of linear structures 12 of carbon atoms and a filling layer 14 formed of a thermoplastic resin and disposed between the plurality of linear structures 12.

Abstract: A fully-passive, dynamically configurable directed cooling system for a microelectronic device is disclosed. In general, movable pins are suspended within a cooling plenum between an active layer and a second layer of the microelectronic device. In one embodiment, the second layer is another active layer of the microelectronic device. The movable pins are formed of a material that has a surface tension that decreases as temperature increases such that, in response to a temperature gradient on the surface of the active layer, the movable pins move by capillary flow in the directions of decreasing temperature. By moving in the direction of decreasing temperature, the movable pins move away from hot spots on the surface of the active layer, thereby opening a pathway for preferential flow of a coolant through the cooling plenum at a higher flow rate towards the hot spots.

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s) and a dielectric fluid disposed within the fluid-tight compartment, with the electronic component(s) immersed within the dielectric fluid. A vapor-condenser and one or more wicking components are also provided. The vapor-condenser includes a plurality of thermally conductive condenser fins extending within the fluid-tight compartment, and the wicking component(s) is disposed within the fluid-tight compartment in physical contact with at least a portion of one or more thermally conductive condenser fins of the thermally conductive condenser fins extending within the compartment.

Abstract: An electronic control device comprises a circuit board having a heat generating part mounted thereon; a case for installing therein the circuit board, the case having a heat receiving portion that is in contact with the heat generating part; at least two first fixing units that are constructed and arranged to fix a peripheral portion of the circuit board to the case; and at least one second fixing unit that is arranged to fix a given area of the circuit board to the case while pressing the given area against the heat receiving portion through the heat generating part, the given area being an area where the heat generating part is placed.

Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.

Abstract: An apparatus includes an electrically-powered component, a hermetically-sealed, liquid-impermeable, high thermal-conductivity, container encapsulating the electrically-powered component, and a liquid bath surrounding the hermetically-sealed container. The electrically-powered component can include a computer motherboard, a central processing unit of a computer, or an electrical power transformer. The container can include a substance in direct contact with the electrically-powered component and can include a silicone compound, an epoxy compound, or a polyurethane compound.

Abstract: A coldplate for use with a transformer in an electric vehicle (EV) or a hybrid-electric vehicle (HEV). The coldplate includes a main portion having a recess formed therein, the recess having a floor configured for contacting a bottom surface of a transformer for dissipating heat generated by the transformer. The main portion includes a raised feature configured for contacting a winding of the transformer for dissipating heat generated by the transformer. The coldplate also includes a bracket member for use in securing the transformer in the recess of the main portion, the bracket member configured for contacting the main portion and the transformer for dissipating heat generated by the transformer. The bracket member includes a contact surface for contacting a top surface of the transformer, the contact surface having an area sufficient to contact substantially all of the top surface of the transformer.

Abstract: A structure for efficiently transferring heat generated from an electronic part or the like to a heat dissipation member is provided. A bus bar is used for a wiring pattern in an electronic device (60), such as a power line (2), a GND line (6) and the like. A heat transfer member (25) is held between a first bus bar that is a power line (2) connected to an electronic part and a second bus bar that is a GND line (6) connected to a heat dissipation member (7) to configure a heat dissipation structure in which heat generated from the electronic part is transferred through the power line (2), the heat transfer member (25) and the GND line (6) to the heat dissipation member (7).

Abstract: A thermal interface material facilitates heat transfer between an integrated circuit device and a thermally conductive device. According to an example embodiment, a thermal interface material includes carbon nanotube material that enhances the thermal conductivity thereof The interface material flows between an integrated circuit device and a thermally conductive device. The carbon nanotube material conducts heat from the integrated circuit device to the thermally conductive device.

Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.

Abstract: A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.

Abstract: There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

Abstract: The present disclosure includes a motor drive that includes a rectifier module, an inverter module, drive circuitry, and a heat dissipation feature. The heat dissipation feature is at least partially coated with a diamond-like carbon material in accordance with present embodiments. The diamond-like carbon material is configured to cooperate with the heat dissipation feature placement to dissipate heat from the rectifier module, the inverter module, or the drive circuitry.

Abstract: A circuit board system includes a circuit board (101), at least one electrical component (102), and a conductor part (103) in heat conducting relation with the electrical component. A surface of the circuit board includes a portion (104) that is uneven so as to increase the surface area of the portion. The portion is coated with a coating (105) made of conductor material so that a surface of the coating is uneven. The circuit board includes a heat conductive pathway (106) made of conductor material and extending from the conductor part to the coating. Thus, the coating operates as a cooling element for cooling the electrical component.

Abstract: An electronic controller for a vehicle includes a circuit board on which an electronic component is mounted and a metal housing accommodating the circuit board therein. The housing includes an inner face and an outer face, at least one of the inner face and the outer face being subjected to surface treatment facilitating heat absorption and dissipation. The inner face of the housing further includes a protruding portion extending to a heating portion of the circuit board so as to be close to the heating portion, or includes concavities and convexities at at least a part thereof opposed to a surface of the circuit board on which the electronic component is mounted so as to increase a surface area of the inner face.

Abstract: An electronic device includes an electronic component with a mating surface. A thermal interface sheet is attached to the mating surface. A substrate carries the electronic device and includes a face. The electronic component is secured to the substrate with the thermal interface sheet positioned between the mating surface and the face. The mating surface is relatively less flat than the face and the mating surface is relatively smoother than the face.

Abstract: An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

Abstract: The present invention relates to a heat dissipation element and a communication device using the same. The heat dissipation element comprises a ceramic powder sintered layer and a thermal conductive metal layer. The ceramic powder sintered layer has a plurality of voids. Partial material of the thermal conductive metal layer is formed in the voids of the ceramic powder sintered layer.

Abstract: The sheet structure includes a plurality of linear structures of carbon atoms, a filling layer filled in gaps between the linear structures for supporting the plurality of linear structures, and a coating film formed over at least one ends of the plurality of linear structures and having a thermal conductivity of not less than 1 W/m·K.

Abstract: A hybrid sheet material includes an EMI absorption layer bonded to a thermal absorption layer. The EMI absorption layer may include a homogeneous mixture of a binder, silicon, and at least one metal. The thermal absorption layer may include a homogeneous mixture of a graphite material and a binder. According to a further aspect, a mobile device that includes a hybrid sheet material is provided. Other aspects include methods for producing the hybrid sheet material.

Abstract: Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.

Abstract: A heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.

Abstract: An integrated-inverter electric compressor and an inverter unit thereof are provided, with which sufficient anti-vibration properties can be ensured and weight reduction can be achieved. In an integrated-inverter electric compressor, an inverter unit includes an inverter module in which a power-system metallic board having mounted thereon semiconductor switching elements and so forth is integrated with a plastic case, and a CPU board having mounted thereon a control and communication circuit that operates at a low voltage, such as a CPU, is provided on a top face of the inverter module, and inside the plastic case, a thermosetting resin layer for insulation and anti-humidity purposes is provided so as to cover a top face of the power-system metallic board, and a vibration-absorbing elastomeric adhesive layer that maintains a rubber state in an operating temperature range of the integrated-inverter electric compressor is provided between a bottom face of the CPU board and the thermosetting resin layer.

Abstract: Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.

Abstract: A wiring board includes a substrate having an opening portion, multiple electronic devices positioned in the opening portion, and an insulation layer formed on the substrate such that the insulation layer covers the electronic devices in the opening portion of the substrate. The substrate has a wall surface defining the opening portion and formed such that the opening portion is partially partitioned and the electronic devices are kept from making contact with each other.

Abstract: The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.

Abstract: Systems and methods for thermally enhanced electronic component packaging with through mold vias are described. In some embodiments, a method may include forming one or more vias through an encapsulant with a laser, each of the one or more vias having one end proximal a top surface of an electronic component covered by the encapsulant and another end proximal an outer surface of the encapsulant. The method may also include inserting a thermally conductive material into the one or more vias, providing a heat spreader over the outer surface of the encapsulant, the heat spreader thermally coupled to the thermally conductive material, and reflowing the thermally conductive material.

Abstract: A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Abstract: A heat dissipating system includes a shell, a main circuit board, at least two heat generating elements, and at least one fan. The shell includes a first sidewall, a second sidewall facing the first sidewall, and a third sidewall connected to the first sidewall and the second sidewall. The at least one fan are arranged on the first sidewall. The second sidewall defines a number of vents. The main circuit board is positioned between the at least one fan and the vents. The heat dissipating system further includes a connection assembly positioned between the first and second circuit boards. The main circuit board includes a first circuit board and a second circuit board. The first circuit board is electrically connected to the second circuit board through the connection assembly. The at least two heat generating elements are respectively positioned on the first circuit board and the second circuit board.

Abstract: An electronic device having one or more components that generate heat during operation includes a structure for temperature management and heat dissipation. The structure for temperature management and heat dissipation comprises a heat transfer substrate having a surface that is in thermal communication with the ambient environment and a temperature management material in physical contact with at least a portion of the one or more components of the electronic device and at least a portion of the heat transfer substrate. The temperature management material comprises a polymeric phase change material having a latent heat of at least 5 Joules per gram and a transition temperature between 0° C. and 100° C., and a thermal conductive filler.

Abstract: A semiconductor module socket apparatus including a socket main body in which a socket groove corresponding to a semiconductor module is formed; a socket pin mounted in the socket groove of the socket main body so as to be electrically connected to a module pin of the semiconductor module; and a heat radiating member mounted in the socket main body so as to externally radiate heat that is generated in the semiconductor module and then is delivered from the socket groove and the socket pin. According to the semiconductor module socket apparatus, it is possible to prevent the heat generated in the semiconductor module from being delivered to the main board, to increase the heat radiation efficiency, to significantly save an installation space, to reduce the installation costs, and to realize no-noise and no-vibration of the semiconductor module socket apparatus.

Abstract: A method, system, and apparatus for cooling one or more devices through use of a cooling plate. An example system includes multiple heat generating devices coupled to a cooling plate, each through an individual thermal interface unit. The thermal interface unit includes a compressible solid pad with at least one surface having a plurality of projections carrying a flowable material. The thermal interface units are pressed between the heat generating devices and the cooling plate so that the flowable material is completely enclosed.

Abstract: Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.

Abstract: Electronic devices incorporating a heat dissipation feature include an enclosure, and at least one heat-generating component positioned within the enclosure. The heat dissipation feature is sufficiently coupled to the at least one heat-generating component to facilitate conductive heat transfer from the heat-generating component. The heat dissipation feature includes a plurality of protrusions exposed externally to the enclosure. A thermally insulating material may be disposed on at least a tip portion of at least some of the protrusions. The thermally insulating material is selected to provide a touch temperature that is below a predetermined threshold. In some instances, the thermally insulating material can provide such a touch temperature by selecting the material to include properties for thermal conductivity (k), density (?), and specific heat (Cp) such that the product of k*?*Cp results in a value less than a product of k*?*Cp for human skin.

Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0005 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

Abstract: A component for mounting on a PCB, intended to support an electronics component, with an extension in the longitudinal, lateral and vertical directions. The component has a first and a second main surface, the second main surface being intended for mounting on the PCB. The component is made in a non conducting material, with a first layer of conducting material arranged on its first main surface, the conducting layer being connected to a conducting layer on the second main surface of the component by electrically conducting means. The component's extension in the vertical direction is smaller than its extension in either the longitudinal or lateral direction.

Abstract: According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a metallization layer having a layer thickness of about 0.0005 inches or less. The metallization layer is disposed along at least a portion of the first side of the thermal interface material.

Abstract: Disclosed is a composition, in particular a dispersion, which contains nanofiber material in at least one organic matrix component, said nanofiber material being pre-treated in at least one method step for adjusting the physical properties of the composition.

Abstract: A device includes a circuit board and a dual sided package. The dual sided package fits into an opening provided in the circuit board. The dual sided package includes a first portion with a first set of integrated circuits (ICs), a second portion with a second set of ICs, and a package substrate provided between the first portion and the second portion. The package substrate connects to the circuit board, and the first portion and the second portion face opposite directions.

Abstract: A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent material and laminated on the heat transfer layer for relaxing a strain in the heat transfer layer. The first constituent material includes a graphite, and the second constituent material includes an amorphous material.

Abstract: A heat-dissipation structure includes a first carbon nanotube layer and a metal mesh layer. The first carbon nanotube layer and the metal mesh layer are stacked on each other. The first carbon nanotube layer includes at least one first carbon nanotube paper. An electronic device applying the heat-dissipation structure is also disclosed.

Abstract: According to various aspects, exemplary embodiments are disclosed of adhesive, thermally conductive electrically insulators. In an exemplary embodiment, a thermally conductive, electrically insulating material includes 4 to 40 parts by weight of a macromolecular matrix material; 1 to 20 parts by weight of an adhesive additive; and 40 to 85 parts by weight of thermally conductive electrically insulating particles. The adhesive additive includes a reactive group that is the same as or similar to at least one curable active group in the macromolecular matrix material.

Abstract: A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a structural frame within the portable electronic device and an amorphous diamond-like carbon (DLC) coating deposited on the surfaces and the edges of the structural frame, wherein the amorphous DLC coating increases a thermal conductivity of the structural frame.

Abstract: A probe bar remover (10) for loosening and removing probe bars from the ground includes an elongated member (12) with an engagement end and a handling end. The elongated member (12) also includes a foot plate (18) along the elongated member (12) oriented toward the handling end. A bar engagement member (20) is coupled to the elongated member (12) at the engagement end and can include an engagement gap (22) for engaging a probe bar (15). A fulcrum (24) can be oriented along the elongated member (12), which contacts a ground surface, and a handlebar (26) is removably coupled to the handling end of the elongated member. To remove probe bars from a ground surface, the probe bar remover (10) can be engaged with an exposed portion of a probe bar (15) and a downward force is exerted on the foot plate (18) so as to at least loosen the probe bar (15) from the ground.

Abstract: An overmolded in-line photovoltaic current regulating and heat sink device includes one or more diode elements connected at one or more leads to coils of electrically conductive material. The coils serve a dual purpose; they act as heat sinks to draw heat away from the diode and conduct it to the outside environment; and they act as inductor coils to regulate current through the device. These coils can either be of air core or ferromagnetic core construction. On the opposite end of the diode leads, the coils are connected to either a wire lead protruding from the device or a terminal housed in a connector. The entire assembly is encapsulated in a thermoplastic, thermoset, or combination thereof that maintains intimate thermal contact with the diode and coils. The device may include one or more fuse elements in place of, or in addition to, the one or more diode elements.

Abstract: A power switch and connector that are conventionally included in a body are formed in spaces created at the outer ends of the shafts of hinges other than the body and a display, whereby the body is thinned. Electronic device comprises a body, a display, and a hinge that joins the body and display so that they can be freely opened or closed. A power switch is formed at an end of the shaft of the hinge. Furthermore, the electronic device comprises the body, the display, and another hinge that joins the body and display so that they can be freely opened or closed. A port of a connector opens at an end of the shaft of the hinge.

Abstract: A mechanical arrangement for use in implementing a galvanically-isolated, low-profile micro-inverter primarily, though not exclusively, intended for use with solar panels. The micro-inverter contains a circuitry assembly having a planar transformer formed of two abutting E-shaped core halves, and a chopper device assembly with all chopper devices mounted to a common thermally-conductive plate. To provide passive cooling, heat conduction paths are established, via separate compressive thermally-conductive pads, from a top surface of a top core half of the transformer and from a bottom surface of the conductive plate to large-area portions of opposing internal surfaces of top and base portions, respectively, of an enclosure.