Abstract: A method for plating film on a heat dissipation module includes the steps of: cleaning the heat dissipation module; injecting hydrogen and tetra-methylsilane gases and applying an electric current to generate a bias electric field within a working chamber, thereby plating an adherent film on the heat dissipation module; injecting hydrocarbon gas together with the hydrogen and tetra-methylisilane gases into the working chamber, thereby plating a mixed film on the adherent film; and injecting the hydrogen and tetra-methylisilane gases together with hydrocarbon gas into the working chamber, thereby plating a noncrystalline DLC film on the mixed film.

Abstract: This invention is to provide an electronic substrate device which is capable of reliably and stably transferring heat generated by a heat generating component to a base member serving as a heat dissipater without intermediation of an electronic substrate.

Abstract: An electronic unit, in particular a control device for a motor vehicle, has a printed circuit board, populated with electronic components, and a housing enclosing the printed circuit board. The printed circuit board has at least one first section, arranged at a distance from the housing and equipped with electronic components on both sides thereof, and at least one second section which is connected to the housing by way of a heat-conducting adhesive layer.

Abstract: A device and associated method of heat removal from electronic optoelectronic and photonic devices via incorporation of extremely high thermally conducting channels or embedded layers made of single-layer graphene (SLG), bi-layer graphene (BLG), or few-layer graphene (FLG).

Abstract: In some embodiments, transpiration cooling and fuel cell for ultra mobile applications is presented. In this regard, an apparatus is introduced having an integrated circuit device, a fuel cell to power the integrated circuit device, wherein the fuel cell produces water as a byproduct, a chassis to house the integrated circuit device and the fuel cell, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device and a water absorbent layer of hydro gel configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. In the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25.

Abstract: An apparatus includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The apparatus also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The apparatus further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.

Abstract: According to one embodiment, a component-embedded printed circuit board includes an opening for member fixation provided on part of a peripheral edge of an outer layer side of the first substrate, a metal member for heat radiation laminated to outer layer side, except for the opening for member fixation, of the first substrate with an insulating layer therebetween, a through-hole penetrating the first and second substrates and communicating with the opening for member fixation, and a through-hole conductor provided on an internal wall of the through-hole.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Abstract: In a disc array apparatus having a plurality of disc units, and a plurality of first connectors, each of which disc units includes a disc casing surrounding at least one recording disc rotatable therein on a rotatable axis, a casing holder on which the disk casing is mounted, and a second connector (detachably) connectable to corresponding one of the first connectors so that at least an electric connection between the disc casing and the corresponding one of the first connectors is capable of being formed through the second connector, the disk casing is connected to the casing holder in such a manner that a heat energy generated for at least one of recording an information onto the recording disc and reading out the information from the recording disk is capable of transferring from the disk casing to the casing holder.

Abstract: A portable electronic device includes a cover (10), a container (20) and a heater (40). The container is provided on the cover. The heater includes some exothermic materials. The heater is received in the container.

Abstract: A control device as a module comprises a control board, a sub-module and a housing cover. A microcomputer is mounted on the control board. The sub-module has a sub-module case provided with a wiring layer into a wall of the sub-module case. Electronic parts are mounted in the sub-module case to electrically connect to the control board through the wiring layer. A housing cover accommodates the control board and the sub-module. A housing base is joined with the housing cover. The accommodation portion has a shape corresponding to a shape of each of the electronic parts is arranged in the housing cover. The sub-module is mounted to the housing cover with a heat radiation adhesive between the accommodation portion and each of the electronic parts.

Abstract: An electrical configuration having at least one component which has at least one current bar, particularly a lead frame, and having an electronic circuit which has at least one heat dissipation surface and at least one electric terminal that is connected mechanically and electrically to the current bar. It is provided that the unit made up of the component and the electronic circuit is mounted on a support layer that effects the heat dissipation in such a way that, because of the fastening of the component onto the support layer, the heat dissipation surface is pushed against the support layer, based on the spring property of the current bar.

Abstract: A thermally enhanced coreless thin substrate with embedded chips, which mainly includes a patterned carrier metal layer, at least one chip, at least one dielectric layer and at least one wiring layer, is disclosed. The chip is attached to a heat sink portion of the patterned carrier metal layer. The dielectric layer is formed over the patterned carrier metal layer and covers the chip. The wiring layer is formed on the dielectric layer for electrically connecting the patterned carrier metal layer and the chip. In the process of manufacturing the thermally enhanced coreless thin substrate with embedded chips, the heat sink portion is formed by patterning the patterned carrier metal layer after finishing the formation of the wiring layer. Thus, a thin board type electronic device that combines a heat sink, a carrier substrate and embedded chips together to form an integral unit is fabricated.

Abstract: A heat exchange structure includes elongated air ducts. Each air duct has a first opening and a second opening at two ends of the air duct to allow air to enter and exit the air duct, respectively. The heat exchange structure includes an exterior heat exchange surface and interior heat exchange surfaces, in which the exterior heat exchange surface is configured to receive thermal energy from heat generators that are mounted on the exterior heat exchange surface, and the exterior heat exchange surface dissipates a portion of the thermal energy received from the heat generators and transfers another portion of the thermal energy to the interior heat exchange surfaces. The interior heat exchange surfaces are in the elongated air ducts and configured to exchange thermal energy with air flowing in the air ducts, enhancing air flow in the air ducts by buoyancy of heated air.

Abstract: A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.

Abstract: Exemplary embodiments provide a system for thermally controlling an electronic display. A glass substrate containing a pyrolytic electrically conductive layer is utilized. The electrically conductive layer may be used as a passive thermal insulator or may be electrically energized to further heat the glass substrate. The glass may be used with a closed loop plenum which may further heat/cool the display. Additional glass layers may be added in order to polarize light or provide anti-reflective properties.

Abstract: A system and method are provided for cooling exhaust from a power center, such as in the event of an arc fault. In one embodiment, a system is provided that includes a power center having an enclosure, an exhaust duct coupled to the enclosure, and a phase change material disposed in the enclosure, the exhaust duct, or both, wherein the phase change material is configured to rapidly cool exhaust in response to a high temperature in the enclosure. A method is provided that includes cooling an exhaust at a high temperature from a power center by changing phase of a phase change material from a solid to a vapor. Another method is provided that includes providing a phase change material configured to cool an exhaust at a high temperature from a power center by changing phase from a solid to a vapor.

Abstract: A thermal interface member includes a bulk layer and a surface layer that is disposed on at least a portion of a surface of the bulk layer. The surface layer is highly thermally conductive, has a melting point exceeding a solder reflow temperature, and has a maximum cross-sectional thickness of less than about 10 microns.

Abstract: A protective device (10) comprises a cap (100) and a strap (120) connecting with the cap (100). The cap (100) defines a cavity (102) which is adapted for accommodating thermal interface material (300) spread on a bottom surface (204) of a heat sink (200). At least three sides of the heat sink (200) are encircled by the strap (120), thereby the cap (100) is firmly attached to the heat sink (200) via the strap (120).

Abstract: Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation.

Abstract: A conformable paste comprising porous agglomerates of carbon black dispersed in a paste-forming vehicle is disclosed. The paste is useful as an interface material for improving the thermal contact between two proximate solid surfaces, such as the surfaces of a heat source and a heat sink. Upon compression between the two solid surfaces, the paste forms a material that enhances the thermal contact between said surfaces. This invention also discloses a conformable interface material which, upon compression between two proximate solid surfaces, forms a material that enhances the thermal contact between said surfaces. This interface material comprises (i) a sheet and (ii) a conformable, spreadable and thermally conductive paste on each of the two opposite sides of the sheet, said paste comprising porous agglomerates of carbon black dispersed in a paste-forming vehicle. In addition, a method of providing a thermal contact between two solid surfaces is disclosed.

Abstract: A heat sink includes a metallic heat conducting layer, a non-metallic heatsink layer combined with the metallic heat conducting layer and having a porous structure, and a hollow receiving space defined between the metallic heat conducting layer and the non-metallic heatsink layer. Thus, the heat produced by a heat source is conducted quickly and distributed evenly on the metallic heat conducting layer to form an evenly heat conducting effect, while the hollow receiving space has a heat convection effect to quickly transfer the heat on the metallic heat conducting layer to the non-metallic heatsink layer which produces a heatsink effect to dissipate the heat so that the heat is dissipated quickly by provision of the metallic heat conducting layer, the hollow receiving space and the non-metallic heatsink layer.

Abstract: A heat dissipating device includes a heat sink, and a block. The heat sink includes a base and a plurality of fins formed on the base. A bottom portion of the base defines a first groove. The block defines a second groove in one surface of the block. The block is received in the first groove, and an electronic component is received in the second groove.

Abstract: A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink.

Abstract: A circuit carrier structure has at least one electronic component and is formed using SMD technology. Underneath the at least one electronic component is arranged a continuous recess in a circuit carrier. A die made of a heat-conducting material is inserted with one end of a joining area into the recess and fixed in place with a layer of heat-conducting cement and connected to the component in a heat-conducting manner. Further the die has on its other side a linkage area, whose cross-sectional area is at least in part of larger dimensions than the recess in the circuit carrier and whose end is connected to a heat sink in a heat-conducting manner.

Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

Abstract: A hand-held portable electronic device frame assembly including a heat spreader made from a thermally conductive material; and an overmolded frame member which has been overmolded onto the heat spreader. The overmolded frame member includes a molded polymer material which forms a thermal insulator on the heat spreader. The frame member is adapted to structurally support at least one component of a hand-held portable electronic device thereon.

Abstract: In a memory module, a plurality of semiconductor memory packages are arranged and mounted on a module board, and a control semiconductor package is disposed in a central region of the arrangement of the semiconductor memory packages, and mounted on the module board. A control semiconductor radiator thermally connected to the control semiconductor package, and a semiconductor memory radiator thermally connected to the plurality of memory packages are disposed without being thermally connected to each other in relation to a direction in which the semiconductor memory packages are arranged.

Abstract: A thermal interface material (130) facilitates heat transfer between an integrated circuit device (120) and a thermally conductive device (140). According to an example embodiment, a thermal interface material (130) includes carbon nanotube material that enhances the thermal conductivity thereof. The interface material (130) flows between an integrated circuit device (120) and a thermally conductive device (140). The carbon nanotube material conducts heat from the integrated circuit device (120) to the thermally conductive device (140).

Abstract: A coupling between a device and a mating part includes an elastic material and perhaps a tensioner coupled to the elastic material. The elastic material is wrapped around at least part of the device. The tensioner or other method is used to stretch the elastic material, thereby reducing the thickness of the elastic material. With the thickness of the elastic material reduced by the stretching, the device is inserted into a hole in a mating part. Then the tension on the elastic material is removed, allowing the elastic material to increase in thickness, so as to fill at least part of the gap between the device and the mating part. The coupling may act as an effective heat transfer device for transmitting (by conduction) heat produced by the heat-producing device, to the mating part, which may act as, or be thermally coupled to, a heat sink.

Abstract: The present invention relates to an electronic device having a passive heat-dissipating mechanism. The electronic device includes a circuit board and a radiation enhancement layer. The circuit board has at least an electronic component thereon. The radiation enhancement layer is attached onto at least a portion of a surface of the electronic component for facilitating radiating the heat from the electronic component to the ambient air via natural convection. The radiation enhancement layer is made of a ceramic material.

Abstract: In some embodiments, transpiration cooling for passive cooled ultra mobile personal computer is presented. In this regard, an apparatus is introduced having a plurality of integrated circuit device(s), a power source to power the integrated circuit device(s), a chassis to house the integrated circuit device(s) and the power supply, and a skin to cover the chassis, the skin comprising a waterproof layer configured to prevent water from contacting the integrated circuit device(s) and a water absorbent layer configured to absorb water. Other embodiments are also disclosed and claimed.

Abstract: Embodiments of a device are described. This device includes an integrated circuit and a heat spreader coupled to the integrated circuit. This heat spreader includes a first layer of an allotrope of carbon. Note that the allotrope of carbon has an approximately face-centered-cubic crystal structure. Furthermore, the allotrope of carbon has a thermal conductivity greater than a first pre-determined value and a specific heat greater than a second pre-determined value.

Abstract: A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip is mounted on an upper surface of the joined assembly, or stated otherwise, on an upper surface of the circuit board, with a solder layer interposed therebetween. A heat sink is joined by a solder layer, for example, onto a lower surface of the joined assembly, or stated otherwise, onto a lower surface of the plate member, thereby making up a heat sink module.

Abstract: A protective cover for protecting heat-conductive material of a heat sink includes a first plate with an opening to enclose the heat-conductive material and a second plate foldable to the first plate. Such that the heat-conductive material can be precisely protected by the protective cover to be isolated from contamination but with good air-circulation.

Abstract: A heat exchange structure includes a plurality of elongated air ducts. The heat exchange structure has an exterior heat exchange surface and interior heat exchange surfaces, the interior surfaces being in the elongated air ducts. The heat exchange structure includes a plurality of heat generators that are distributed on the exterior heat exchange surface along an elongated direction of the air ducts, in which air flowing in the air duct is heated successively by heat from the heat generators, and air flow in the air duct is enhanced by buoyancy of heated air.

Abstract: A 3D multi-layer heat conduction diffusion plate comprises at least one super conduction diffusion plate which is capable of quickly conducting heat energy, has a short cooling time, and can dissipate heat to a surrounding environment. A soft and bendable material capable of transmitting electrical signals or a fiber glass material capable of transmitting signals can be affixed on an upper and lower surface of the aforementioned super conduction diffusion plate. A micro-porous air-permeable ceramic plate having a high thermal conductivity, which is provided with irregularly arranged air-permeable holes can also be affixed to the aforementioned super conduction diffusion plate, so as to allow air to quickly conduct heat energy to the surrounding environment.

Abstract: A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

Abstract: In one embodiment, an apparatus comprises a semiconductor device a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an alloy having a low indium content.

Abstract: An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member, and a part of the recessed metallic member into a solid solution.

Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

Abstract: The present invention is a cooling device for removing heat from an integrated circuit. In one embodiment, the cooling device includes a conduit and a flexible channel having a first open end and a second closed end. The flexible channel's first open end has an internal width and is coupled with the conduit. The flexible channel is comprised of a resilient material having spring-like characteristics. In one embodiment, this material provides a spring-like restoring force when compressed. The cooling device also includes an interconnect mechanism between the conduit and the flexible channel to allow a gas or a fluid introduced within the conduit to move between the conduit and the flexible channel.

Abstract: A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The heat source connection means are left exposed and utilized for connection to the electronic system. The heat source, the set of thermal transfer media configured to partially surround the heat source, and the thermal transfer shell partially surrounding the set of thermal transfer media form a thermal transfer module. Thermal transfer modules may be placed in thermally conductive cells. A set of thermal transfer sheets are placed in contact with both or either of the thermal transfer module and the thermally conductive cell, facilitating a heat exchange with an environment external to the thermal transfer module.

Abstract: A thermal interface material includes a matrix, a plurality of carbon nanotubes, and at least one phase change layer. The matrix includes a first surface and an opposite second surface. The carbon nanotubes are embedded in the matrix uniformly. The carbon nanotubes extend from the first surface to the second surface and have two opposite ends. At least one of the two opposite ends of the carbon nanotubes is exposed out of one of the first and second surfaces of the matrix. The at least one phase change layer is formed on the exposed end of the carbon nanotubes.

Abstract: A heat transfer assembly includes a printed circuit board assembly supporting an electronic component assembly including one or more semiconductor chips. A heat sink assembly is adapted to be placed in thermal engagement with the one or more semiconductor chips. Included is a loading assembly for loading the one or more semiconductor chips toward engagement with the heat sink assembly. An encapsulating mechanism is provided that contains a sufficient amount of a thermally conductive medium to transfer heat between a surface of one or more of the semiconductor chips and the heat sink assembly, wherein the thermally conductive medium fills any gaps or space between the one or more semiconductor chips and the heat sink assembly.

Abstract: A portable electronic device includes a heat source which generates heat in association with generating, charging, or consuming electric power. A housing base member is disposed in proximity to the heat source, and a radiation film is disposed on at least a portion of an external surface of the housing base member. The radiation film has an emissivity that is higher than an emissivity of the housing base member.

Abstract: Embodiments include electronic packages and methods for forming electronic packages. One method includes providing a die and a thermal interface material on the die. A metal body is adapted to fit over the die. A wetting layer of a material comprising indium is formed on the metal body. The thermal interface material on the die is brought into contact with the wetting layer of material comprising indium. The thermal interface material is heated to form a bond between the thermal interface material and the wetting layer so that the thermal interface material is coupled to the metal body, and to form a bond between the thermal interface material and the die so that the thermal interface material is coupled to the die.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member and a part of the recessed metallic member into a solid solution.