Abstract: A corrosive resistant electronics assembly 10 is provided including at least one heat generating electronics component 12 mounted on a substrate 14 and positioned within potting material 18. A thermally conductive block element 24 is thermally mounted to the at least one heat generating electronics component 12 and positioned within the potting material 18, thereby providing a corrosive resistant electronics assembly 10 with improved thermal dissipation.

Abstract: A system for cooling an electronic device containing a heat-generating component, comprises a surface thermally coupled to the heat-generating component to be heated by the component. A fabric material is positioned proximate the surface, and includes a plurality of fibers having heat conductive properties. The fabric material is configured for engaging the heated surface such that the heat conductive fibers of the fabric material are operable for conducting heat away from the surface to cool the component and the electronic device.

Abstract: To prevent generation of air bubbles in thermal grease 37 when a wired board 24 is bent due to a difference of thermal expansibility between a CPU chip 31 and a heat sink 32 in a CPU package 21, the thermal grease 37 being filled between the CPU chip 31 and a plate member 34 of the heat sink 32. A through-hole 38 is formed almost in the center of a plate member 34 so as to go through the plate member 34.

Abstract: A package structure includes a heat spreader, a ground plane affixed to the heat spreader, and a flex tape interconnect substrate affixed to the ground plane. An aperture in the ground plane reveals a die attach surface on the heat spreader, and an aperture in the flex tape interconnect structure is aligned with the ground plane aperture such that the aligned apertures together with the revealed ground plane surface define a die cavity. The aperture in the ground plane is formed so as to form aperture walls substantially perpendicular to the ground plane. According to the invention the heat spreader, the ground plane, and the flex tape interconnect substrate have specified characteristics. Particularly, the heat spreader is provided as a metal sheet or strip, usually copper, having a “velvet type” oxide, usually a velvet black copper oxide, on at least the surface of the heat spreader to which the ground plane is to be affixed.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a to contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: A thermal pad for use in facilitating heat flow between a heat source surface and a heat sink surface includes a carbon fiber fabric that is impregnated with a thermal substance.

Abstract: A device and method for identifying and compensating for tensile stress due to heat caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method will change the shape of the integrated heat spreader based upon the identification of the location of the highest tensile and/or shear stress so that additional thermal interface material is deposited between the integrated heat spreader and a die. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.

Abstract: Providing a layer of ZnCr intermediate a dielectric substrate and a heat spreader enhances the adhesion between the dielectric substrate and heat spreader.

Abstract: A heat dissipation ball grid array package includes the following elements. A plurality of first thermal ball pads is formed on the underside of a substrate in the area covered by chip. A plurality of second thermal ball pads or a heat dissipation ring is formed outside the first thermal ball pads. A plurality of signal ball pads is formed outside the second thermal ball pads or the heat dissipation ring. The second thermal ball pads or heat dissipation ring is connected to the first thermal ball pads by conductive trace lines. A plurality of first thermal balls is attached to the respective first thermal ball pads. The signal balls are attached to the respective signal ball pads. The first thermal balls and the signal balls are in contact with corresponding contact points on a printed circuit board. A plurality of second thermal balls is attached to the respective second thermal ball pads or the surface of the heat dissipation ring.

Abstract: A natural-resource-conservative, environmentally-friendly, cost-effective, leadless semiconductor packaging apparatus, having superior mechanical and electrical properties, and having an optional windowed housing which uniquely seals and provides a mechanism for viewing the internally packaged integrated semiconductor circuits (chips/die). A uniquely stamped and/or bent lead-frame is packaged by a polymeric material during a unique compression-molding process using a mold, specially contoured to avoid the common “over-packaging” problem in related art techniques. The specially contoured mold facilitates delineation of the internal portions from the external portions of the lead-frame, as the external portions are the effective solderable areas that contact pads on a printed circuit board, thereby avoiding a laborious environmentally-unfriendly masking step and de-flashing step, streamlining the device packaging process.

Abstract: A support element is described which can combine components used in Microsystems technology to form a single unit. Because of the very small dimensions of the support element, it is difficult to keep the components at different temperatures if this is required for them to operate. With the support element, this difficulty is avoided by the fact that at least one thermal insulation device, which shields the plate and the cover of the support element with respect to internal and external environments in certain regions, is provided.

Abstract: A first heat-conductive rubber is disposed on a surface of a printed wiring film, which is an opposite side to a driver IC, a second heat-conductive rubber is disposed on a surface of the driver IC, which is an opposite side to the surface of the printed wiring film, and the first heat-conductive rubber is made harder than the second heat-conductive rubber. In addition, heat-conductive grease is coated on a surface of the first heat-conductive rubber, which contacts the printed wiring film, and on a surface of the second heat-conductive rubber, which contacts the driver IC.

Abstract: A thermal management device includes an isotropic carbon encapsulated in an encapsulating material that improves the strength of the carbon. The encapsulating material may be e.g. polyimide, epoxy resin, acrylic, polyurethane, polyester, or any other suitable polymer.

Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being

Abstract: The present invention relates to a heat dissipation structure for a notebook type computer, capable of effectively dissipating heat generated from a high temperature element (such as a CPU). The heat dissipation structure comprises a main body, a display device and a hinge shaft for coupling the main body with the display device, wherein the hinge shaft is arranged above the main body at a distance therefrom, and a heat dissipation means is provided in the main body.

Abstract: An electronic assembly is provided having a die, a heat spreader, and a solidified solder material. A die includes a die substrate and an integrated circuit on a bottom surface of the die substrate. The heat spreader is located above the die and has left and right inclined faces. The left inclined face tapers from a point near a center of the die to a point upward and to the left of the upper surface. The right inclined face tapers from a point near the center upward and to the right above the upper surface. A solidified solder material fills regions between the upper surface and the inclined faces of the lower surface.

Abstract: A compressible and melt-flowable thermally conductive interface may be either tacky and pressure sensitive or be non-tacky and dry, and may include one of more thermally conductive fillers in one or more forms. The interface either melt flows or cures at low temperature, such as about 40-50° C. Certain embodiments provide a bond strength between a heat generating component, such as an integrated circuit, power transistor and the like, and a heat dissipating element, such as a heat sink or cold plate, sufficient to permit elimination of the need for mechanical fasteners.

Abstract: A heat radiation packaging structure without getting a board itself larger, but with an excellent heat radiation ability and a low cost is provided. A bus bar 12 is fixed onto a wiring board 11, a connecting lead 15A of a relay 15 etc. being joined onto the bus bar 12, and the wiring board 11, the bus bar 12 and the relay 15 etc. are sealed all together with a heat conduction resin 23. Additionally, the bus bar 12 comprises a thermal diffusion portion 17 which is bent via a bent portion 12B and is apart from the wiring board 11. By means of such a structure, a heat radiation ability is enhanced and the heat radiation packaging structure for an electric part is realized at low cost without getting a board itself larger.

Abstract: Durability and lifetime of a resin sealed electronic device is improved by reducing thermal stresses acting on the power element and the parts mounting on the board. A power element of which the protective film on the power element is coated with a polyimide group resin at manufacturing the element is used, and a metallic heat sink of which the reverse side surface (portion of mounting on a board) is not plated is used. Further, a linear expansion coefficient of the molding resin is within a range of 3×10−6/°C. to 17×10−6/°C. The durability and the lifetime of the resin sealed electronic device is improved, because the thermal stresses are reduced by balancing linear expansion coefficients of the parts.

Abstract: An integrated circuit that includes a die having a circuit area and outer edges. A guard ring surrounds the circuit area within the outer edges of the die. The guard ring includes a projection that extends to at least one outer edge of the die to extract heat from the die that is generated during operation of the integrated circuit.

Abstract: A device for assisting the cooling of computers, especially laptop computers, provides material having an upper surface distributed over at least two levels, preferably a corrugated surface, whereby it contacts the base of the laptop over only a part of said base, permitting the free passage of air across the support and between the laptop and the support, said support being formed from a material of high thermal conductivity, with a surface adapted for rapid transfer of heat between the material and air passing over said surface.

Abstract: An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled to the die to dissipate heat generated by the components. The heat dissipating characteristics of the heat dissipation structure are tailored to match the heat generated by each of the first and second components.

Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.

Abstract: An electronic control module 100 is provided wherein a power device 102 is secured to a rigidizer, or heat spreader, 110 such that a thermally conductive path is created for a conduction of heat from the power device to the rigidizer. A thermally conductive and electrically insulated interface 208, preferably anodized aluminum, is disposed between device 102 and rigidizer 110 and is solder bonded to each of the device and the rigidizer, facilitating the creation of a thermal path from the device to the rigidizer. In order to solder bond the device to the interface and the interface to the rigidizer, solderable coatings 206, 210, 214 are respectively applied to the surfaces 207 and 209 of the interface and surface 215 of the rigidizer.

Abstract: A heatsink assembly includes a rigid thermally conductive block having a relatively flat unobstructed surface area and a plurality of legs extending beyond and straddling that surface area, and a thermally conductive compliant pad positioned against the surface area. The assembly is adapted to be positioned over a chip package on a circuit board so that the block covers the package and the pad deforms initially to conform to the abutting surface of the package to establish intimate thermal contact between the package and the block. Suitable fasteners secure the block to the circuit board.

Abstract: A semiconductor device has a case, a printed circuit board, a fin, and a ceramic substrate mounting a semiconductor element thereon. The case contains the printed circuit board, the ceramic substrate and the fin. The fin and the case radiate heat transmitted from the ceramic substrate. The fin has protrusions on a contact face facing a contact face of the case. The fin contacts the case though the protrusions when the fin is fixed to the case. The protrusions serve as heat radiating path.

Abstract: A method for fabricating an object to attenuate thermal sensation when handling the object at non-body temperature, and an object fabricated in accord with the method. There is first provided a substrate which has a first surface subject to handling. There is then formed upon the first surface of the substrate a coating. The coating has an optimal density, an optimal thermal conductivity and an optimal thickness such that when the substrate having the coating formed thereupon is equilibrated at a non-body temperature differing from a body temperature and the coating is subsequently contacted with a body at the body temperature during handling, the temperature of the surface of the coating at a contact point of the body with the coating changes precipitously to a temperature near the body temperature and subsequently returns towards the non-body temperature at a rate which permits handling of the coating at the location of the first surface of the substrate by the body with attenuated thermal sensation.

Abstract: An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside.

Abstract: A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across a surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The assembly further includes a thermal interface for attaching to the surface of the thermal spreader and aligning to contact a portion of the surface of the heat generating component when the thermal dissipation assembly is placed in contact therewith. The thermal interface is patterned to cover only a portion of the surface of the heat generating component to selectively thermally couple the thermal spreader to the surface of the heat generating component.

Abstract: The invention relates to a method and a device for creating a thermally conductive path between a component of a printed circuit board and a heat sink using a electrical insulator material and a thermally conductive material. The electrical insulator material is adhesive, to assist in adhering surfaces against which it is applied. Typically, the circuit board is affixed to the heat sink, creating a gap between the component and the heat sink. The electrical insulator material is applied in the gap. Then, the thermally conductive material is applied within the electrical insulator material, causing the thermally conductive material to spread beyond the perimeter of the electrical insulator material. The electrical insulator material thus confines the thermally conductive material within the gap in thermally conductive contact between the electronic component and the heat sink.

Abstract: A multi-board BGA package comprises a chip, a plurality of circuit boards, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The circuit boards are formed on a same plane. Between adjacent circuit boards there is a galley for passing through metal bonding wires to connect chip with circuit board and molding package body easily. The plurality of circuit boards together hold the chip so as to reduce thermal stress caused by CTE mismatch.

Abstract: To prevent generation of air bubbles in thermal grease 37 when a wired board 24 is bent due to a difference of thermal expansibility between a CPU chip 31 and a heat sink 32 in a CPU package 21, the thermal grease 37 being filled between the CPU chip 31 and a plate member 34 of the heat sink 32. A through-hole 38 is formed almost in the center of a plate member 34 so as to go through the plate member 34.

Abstract: A net-shape molded composite heat exchanger is provided which includes a plurality of thermally conductive fins overmolded onto one end of a metallic heat pipe for use both as an antenna in a cellular telephone and a heat exchanger to dissipate the heat generated within the device. The heat exchanger is formed by net-shape molding the fins over one end of the heat pipe, from a thermally conductive composition, such as a polymer composition. The molded heat exchanger is freely convecting through the part, which makes it more efficient and has an optimal thermal configuration. In addition, the metallic heat pipe serves the additional function of conducting radio frequency waves to and from the cellular telephone device.

Abstract: The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.

Abstract: The object of the invention is to produce a surface layer that can prevent from uncomfortable sensation upon manual handling of component such as metal chassis used in electronic devices. The surface is coated with a special paint material or a resinous coating material that include insulating material or foamed structure. For example, gaseous entrapments are incorporated in the layer by pre-mixing a foaming material in the paint, followed by foaming the layer at a high temperature. A decline in the restoring strength of the foaming material is supplemented by the top coating with the bead-containing paint.

Abstract: A portable electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and containing the electrical device; and a film on the external surface including a granulated insulating material providing thermal insulation from the electrical device.

Abstract: A component shim 310 is used with printed circuit boards 306 and heat spreaders 314, for example, where each of the printed circuit board 300 and heat spreader 314 has a surface 304, 312 that are in different spaced apart planes. A component 300 has one lead attached to the surface 304 of the printed circuit board 306. The component shim 310 has a conductive section 320 with an upper attachment layer 326 and a lower attachment layer 332 secured to opposed sides 322, 324 of the conductive section 320. The upper attachment layer 326 is secured to a bottom 308 of the component 300 and the lower attachment layer 332 is secured to a surface 312 of the heat spreader 314. The total thickness of the conductive section 320 and upper and lower attachment layers 326, 332 of the component shim 310 is substantially equal to a distance from the bottom 308 of the component 300 to the surface 312 of the heat spreader 314.

Abstract: A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed circuit board and the integrated circuit. A thermal grease is applied to the top surface of the integrated circuit. A lid is attached to the bracket to capture the printed circuit board. The lid has a platen that is separated from the integrated circuit by a space which has a predetermined thickness. The space defines the thickness of the thermal grease. Any excess thermal grease is pushed out of the space by the lid so that a consistent thickness of thermal grease is applied for each integrated circuit assembly. The bracket, lid, integrated circuit and printed circuit board can be mounted to a motherboard as a single integrated circuit module. Alternatively, the lid can be detached from the base so that the grease covered integrated circuit can be removed from the tool for subsequently assembly.

Abstract: In order to provide a cooling/heating apparatus for a semiconductor processing liquid being highly resistant to corrosive chemicals and free from elution of harmful impurities, a heat exchanging substrate 3 is formed by heat-depositing a fluorine-contained resin sheet 3B to a processing liquid contact surface of a graphite substrate 3A.

Abstract: The assembly has a metal sole plate forming a heat sink carrying a printed circuit card. The sole plate includes bearing surfaces which project slightly beyond the rest of the sole plate. The printed circuit is supported on these bearing surfaces and they include fixing means which interact with supplementary means of the printed circuit card to fix the printed circuit card onto the sole plate. A thermally conducting and electrically insulating material is interposed between the said card and the sole plate. The printed circuit card and the sole plate exert compression stress on the thermally conducting and electrically insulating material.

Abstract: A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.

Abstract: A heat transfer interface is disclosed. The surface of the heat dissipating panel of a radiator formed by a heat dissipating substrate is machined, and then a second heat transfer layer is added thereon. The heat transfer layer is connected to the heat dissipating substrate through plating, physical vapor deposition, hot forging, or soldering. The second heat dissipating layer is a thin layer for enhancing the lightness of the contact surface of the heat dissipating substrate, reducing the hole gap on the surface of the heat dissipating substrate, reducing the amount of the soft filling material, reducing the filling thickness of the soft filling material, increasing the heat spreading, and thus reducing contact resistance.

Abstract: A mobile information processing apparatus of the present invention having a main body and a display unit that opens and closes, attempts to improve heat releasing efficiency by allowing a transfer of heat which is released from a heat generating unit of the main body to the display unit, so that the heat is also spread to the display unit, without making the configuration complex. In order to do so, a thermally conductive material having a flexible property is placed on the main body and the display unit of the mobile information processing apparatus. Further, the thermally conductive material includes a thermally conductive sheet made of a thermally conductive fiber that has a high thermal conductivity and an outer cover such as leather. The thermally conductive sheet will be attached to CPU of the main body.

Abstract: A method of providing thermal connection between a thermal cooling device and an integrated circuit package is provided. An adhesive is applied to a thermal interface outside a heat transfer area thereof. The thermal interface is attached to the cooling device. The device to be cooled is attached to the thermal interface.

Abstract: A cooling system can cool electronic devices with assurance following the heights of the electronic devices mounted on a printed board. The cooling system is thin and light in weight and can easily inspect and maintain the electronic devices. A cooling pipe is disposed in a U-shape about a plurality of electronic devices mounted on the printed board. The cooling pipe is jointed with the cooling plate by caulking from the opposite side of the printed board. A thermal conduction plate is engaged with the cooling plate from the upper portion thereof and the thermal conduction members each having the notched portion are inserted into the insertion holes of the thermal conduction plate. The thermal conduction members can be slid up and down and turned to the right and left in the insertion holes and they are pressed and biased against the electronic devices by a leaf spring provided on the thermal conduction plate.

Abstract: An electrical apparatus includes an electrical device generating heat in operation; a metal case conducting the heat generated by the electrical device, having an external surface, and containing the electrical device; and a film on the external surface including a foamed layer providing thermal insulation from the electrical device.

Abstract: Obtained is a power module which is excellent in electromagnetic shielding effects, is rarely influenced by external noises and acts as an external noise source with difficulty. An insulating substrate (5) is bonded through a solder (4) to a top surface of a heat sink (3) fixed to a support plate (2). A DC capacitor (16) is fixed to a bottom face of the heat sink (3) by adhesion. A control substrate (11) having a control IC (13) mounted thereon is fixed to the support plate (2). Moreover, a plurality of electrodes (10), a DC side electrode and refrigerant inlet-outlet (9) and a control connector (15) are provided on the support plate (2). A case (1) is fixed to a peripheral portion of the support plate (2), and surrounds the insulating substrate (5), the control substrate (11), the heat sink (3) and the DC capacitor 16 together with the support plate (2). Both the case (1) and the support plate (2) have conducting property.

Abstract: A heat sink assembly and process for fabricating the assembly in which a semiconductor chip is formed with at least one high conductivity layer on its back side and some of the integrated circuits are high power circuits and, during operation, generate “hot spots” of high temperature but, due to the presence of the high conductivity layer, the “hot spots” are dissipated and the maximum chip temperature is lowered to create a uniform and lower temperature across the chip.

Abstract: A heat spreading cap is placed over a chip or integrated circuit. The cap is shaped or sized to provide a distinct heat spreading and/or stiffness characteristic that differs as it extends into different regions of the module. The areas of differing stiffness or CTE reduce the warpage (or bending) of the module, thereby reducing the overall stress in the BGA.

Abstract: A heat sink of an alternating current generator for a vehicle has a heat sink body formed from aluminum die-cast. An insert member is provided on the heat sink body and a diode is provided on the insert member. The insert member (1) surrounds the side walls of the diode, (2) is (a) a metal having a good solderability other than aluminum or (b) a metal having a good solderability adhered onto a base metal other than aluminum, and (3) provides a solder connection between the diode and the heat sink body.