Abstract: A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which component B) commences softening is less than the curing temperature of component A). A thermal interface material is prepared by: 1) interposing the composition between an electronic component and a heat spreader to form a bondline, 2) heating the composition to a temperature higher than the temperature at which component B) commences softening but less than the curing temperature of component A) and optionally applying pressure to the composition, and 3) heating the composition to a temperature greater than or equal to the curing temperature of component A). The average particle size of component B) is greater than or equal to the bondline thickness.

Abstract: A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: A thermal interface material may be covalently bonded to a bottom surface of a heat dissipating device and/or a backside surface of a heat generating device. The heat dissipating device may be thermally coupled to the heat generating device, the thermal interface material disposed between the bottom surface of the heat dissipating device and the backside surface of the heat generating device. The thermal interface material may comprise a polymer material with thermally conductive filler components dispersed therein. For one embodiment, the thermally conductive filler components may be covalently bonded together. For one embodiment, the thermally conductive filler components may be covalently bonded with the polymer material.

Abstract: An electronic system generally includes a flatwire electronic site and a flatwire bus electronically connecting the flatwire electronic site and an electronic device in the engine compartment. The flatwire electronic site has a flexible substrate with electronic components attached to the substrate for operation of the electronic device. The flatwire electronic site is mounted to the engine side of the bulkhead for thermal cooling of the flatwire electronic site. A cover is attached to the bulkhead which encloses a flatwire electronic site for environmental protection.

Abstract: A heat radiating structure for an electronic device, for cooling an electronic part by transferring the heat generated in the electronic part to a heat spreader has a grading layer, which is located between the electronic part and the heat spreader and having a coefficient of thermal expansion varied such that it is substantially equal or approximate at its portion on the electronic part side to the coefficient of thermal expansion of the electronic part and such that it is substantially equal or approximate at its portion on the heat spreader side to the coefficient of thermal expansion of the heat spreader.

Abstract: Disclosed is an electronic board comprising a plurality of individual devices, each device having a plurality of connectors, the connectors mated to receptacles on the board, and a heat dissipating cover connected to the board and forming a cavity incarcerating the plurality of devices, the cover thermally contacting a plurality of the individual devices, the cover having a dimensional pattern such that its outer surface area is greater than its planar area.

Abstract: An assembly comprising a heat generating electronic device and a heat sink is provided with an intermediate gradient region between them. This intermediate region comprises a material having a coefficient of thermal expansion substantially matching the coefficient of thermal expansion of the heat generating electronic device, and a thermal conductivity greater than the thermal conductivity of the electronic device but less than the thermal conductivity of the heat sink. Provision of this intermediate layer substantially reduces stress on the electronic device caused by thermal cycling.

Abstract: An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.

Abstract: Numerous embodiments of a coating for a heat dissipation device and a method of fabrication are disclosed.

Abstract: A device for fixing a heat distribution covering on a printed circuit board includes at least one fixing foot disposed on a placement area next to a plurality of heat-generating electronic components. The fixing foot is attached above a further conductor track plane that extends below a conductor track plane that interconnects the electronic components. The fixing foot carries a fixing element that can be brought into engagement with the heat distribution covering.

Abstract: A heat sink system and method for a radiographic sensor device includes a heat sink formed of a first material possessing a predetermined thermal conductivity. The heat sink system further includes a thermal channel device formed of a second material possessing a predetermined thermal conductivity. The thermal channel device includes at least one contact portion adapted to contact the radiographic sensor device and an extending member that extends away from the at least one contact portion and contacts the heat sink. The thermal channel device is designed to extend between and substantially contact the heat sink and the radiographic sensor device when the heat sink system is assembled. The thermal channel device conducts heat from the radiographic sensor device to the heat sink.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identification of location(s) of high tensile and/or shear stress so that additional thermal interface material may be deposited between the integrated heat spreader and a die in corresponding locations. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.

Abstract: A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of symmetric leads. A heat spreader is directly attached onto the bare top heat-slug of the sub-packages, planar magnetic parts and top surfaces of other components with thermally conductive insulator. The heat dissipated by the sub-packages is transferred to the attached heat spreader by the bare top heat-slug, and further transferred to the ambient. The assembly features compact and inexpensive power converter package with improved electrical performance and enhanced thermal management.

Abstract: A method and related structure for dissipating heat, particularly in electronic components. The method includes mixing magnetite particles and epoxy into a paste-like state, subjecting the mixture to opposing polarities of a magnetic field on opposing sides of the mixture until the epoxy hardens to urge the magnetite particles into alignment and to form elongate structures to conduct heat away from a heat source, such as an electronic component on which the epoxy is applied.

Abstract: In a power module, a wiring substrate to which a heat generating component is connected electrically and a heat sink are connected through the medium of a thermally conductive and electrically insulating member. The thermally conductive and electrically insulating member is a curable composition containing (A) a thermosetting resin, (B) a thermoplastic resin, (C) a latent curing agent, and (D) an inorganic filler. The thermally conductive and electrically insulating member is bonded to the heat generating component in such a manner as to be deformed complementarily to unevenness in shape and height of the heat generating component. Heat generated from the heat generating component is radiated by means of the heat sink. Thus, a power module that allows heat generated from an electronic component to be radiated evenly and efficiently and achieves high-density mounting, and a method of manufacturing the power module are provided.

Abstract: The heat-sink assembly of the invention is attached to the PC board with the use of surface mount technology. The assembly comprises a base part or a base member soldered to the PC board and a top part or a heat-sink member snapped-on through the central opening of the base member by irreversibly deforming bendable lugs which may have a radial or any other suitable shape. The bottom of the heat-sink member may be pushed down to physical contact with the top of the chip or to a position that leaves a space between the bottom of the heat-sink member and the top of the chip, so that the aforementioned space may be filled with a heat-conducting medium. It is an option to use the base part only. If necessary, a second heat-sink member of the same type, which could have different dimensions, can be soldered to the PC board side opposite to the chip. The heat sinks could be used with or without a fan.

Abstract: A heat spreader for cooling an electronic component. The heat spreader includes a thermal interface material disposed in a cavity in the body of the heat spreader. The thermal interface material is at least partially enclosed in the cavity by a surface of the electronic component or a heat sink.

Abstract: An improved heat sink for surface mounted power devices. According to one embodiment of the invention, the electrical contacts of a surface mounted power device are soldered to printed circuit board solder pads. The opposite, non-component, side of the printed circuit board is provided with thermal transfer pads, which are aligned in a parallel plane with the solder pads on the component side of the printed circuit board. The solder pads and thermal transfer pads are connected together by a number of plated through holes which provide a thermal conduction path. The thermal transfer pads are placed in proximity to a heat sink such that a high thermal conductivity exists between the surface mounted power device and the heat sink, allowing heat generated by the surface mounted power device to be conducted to the heat sink and dissipated. A thermal interface material may be used to improve thermal conductivity between the thermal transfer pads and the heat sink.

Abstract: Disclosed is a battery pack, comprising a secondary battery unit including at least one secondary battery, the at least one secondary battery comprising an electrode group and an insulating case having the electrode group housed therein, and the battery pack further comprising a heat conductive sheet which is provided at at least a part of the surface of the secondary battery unit and has a heat conductivity higher than a heat conductivity of the case.

Abstract: A thermal management device includes anisotropic carbon encapsulated in an encapsulating material that is applied directly to the anisotropic carbon, wherein the anisotropic carbon includes graphite. An electrical system includes the thermal management device and electrical contacts and/or devices provided on the surface of the thermal management device. A method of fabricating a thermal management device includes cleaning a surface of anisotropic carbon, applying a coat of encapsulating material directly to the cleaned surface, and repeating the step of applying until the anisotropic carbon is encapsulated. Other embodiments of the invention are also described.

Abstract: A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally conductive element is coupled to the active area of the integrated circuit device outwardly of the separator.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: A cooling body-conductor strips arrangement for electrical devices has a cooling body for withdrawing heat to a surrounding area, a base plate composed of an electrically insulating material and provided with a first conductor strip unit which is embedded in the material of the base plate, the base plate being flatly connected with the cooling body.

Abstract: A heat dissipating system utilizes a thin layer of a high conductivity liquid metal to provide cooling for electronic sub-assemblies, such as semiconductor chips. The liquid metal preferably is gallium or its alloy which transfers heat from the chip to a heat sink or heat spreader. The system includes one or more vents that allow for filling and venting of the space occupied by the liquid. It also utilizes a flexible seal, such as an O-ring or a membrane held in place with a retainer ring, or a plug that seals the filling vent. The seal flexes to accommodate expansion and contraction of the liquid, as well as phase changes from the liquid phase to the solid phase.

Abstract: A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.

Abstract: A heat spreader for use with an integrated circuit in a package, where the heat spreader is formed as a plate having a centrally disposed aperture with a diameter that is smaller than a minimum diameter of the integrated circuit. The heat spreader has an overall diameter that is no greater than a minimum diameter of the package. In this manner, the aperture in the heat spreader allows the plastic injected through a top gated mold form to pass through the heat spreader and more uniformly encapsulate the integrated circuit.

Abstract: A release liner particularly adapted for use with a layer of a thermal interface material having a first surface and a second surface which is bondable to the heat transfer surface of a thermal dissipation member. The liner has an exterior surface and an interior surface disposable in adhering contact with the first surface of the thermally-conductive material. The liner interior surface has one or more first zones defined thereon which exhibit a first release value relative to the first surface of the thermally-conductive material, and one or more second zones bordered by the first zones which exhibit a second release value relative to the first surface of the thermally-conductive material which is lower than the first release value of the first zones.

Abstract: An electrical system and heat sink assembly is provided. The electrical system and heat sink assembly has a heat sink and more than one different electrical operational unit directly thermally coupled to the heat sink. At least one of the electrical operational units has a plurality of electrical components. A distribution panel is electrically connected to the electrical operational units. The distribution panel is directly electrically coupled to at least two of the electrical operational units. The distribution panel distributes power and control signals to the electrical operational units.

Abstract: A printed circuit board is formed with a heat transfer region and at least one via in thermal communication with the region that transfers heat to the at least one region. A chassis is placed in thermal contact with the region so as to receive and dissipate heat from the region. A heat generating component is mounted on the printed circuit board so as to be in thermal communication with the at least one via. Thus, the heat generated by the component is transferred by the via to the region and subsequently dissipated by the chassis via convection.

Abstract: In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center portion and a perimeter portion. The center portion and the perimeter portions are structurally coupled to each other. In another embodiment, the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.

Abstract: A structure comprises a thermal energy generating component and a thermal dissipating device in thermal conductive contact with the component, the device comprising a substrate with a fullerene coating. A method of producing a computer comprises applying a layer of fullerene onto a substrate and disposing the substrate in a heat dissipation relationship to a microprocessor.

Abstract: A heat dissipation device includes a heat sink (30), a metal plate (50), and a clip (20). The heat sink has a chassis (36) with thermally conductive material (40) applied thereunder. The metal plate is attached to the material in order to be in thermal contact with the chassis. The metal plate is then directly attached to a CPU (60). The clip is engaged with a socket (70) that supports the CPU, to facilitate the metal plate intimately contacting the CPU. The metal plate prevents the CPU from moving from the socket should the heat dissipation device be accidentally moved or displaced. This reduces any risk of damage to the CPU. In addition, heat generated from the CPU is efficiently removed.

Abstract: Cilia-like micro surface actuators are applied to fins of a heat sink to improve heat dissipation. The surface actuators act as active surface features whose motion disrupts the boundary layer fluid flow by entraining cool fluid towards the heat transfer surfaces of the fins and ejecting relatively warmer fluid away from the surfaces. This disruption reduces the thermal resistance between the heat sink fins and the fluid (e.g., the convection resistance). The motion of the surface actuators also induces a net flow along the surface of the fin(s) and can, therefore, be viewed analogously to a “pump” moving fluid (such as air) over the surface. The surface actuators can be fabricated using plastic microelectromechanical systems (MEMS) technology and can be actuated to generate their motion using several techniques.

Abstract: A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.

Abstract: Disclosed is a heat sink of a module with a built-in integrated circuit (IC) including a circuit board formed with a plurality of first through holes extending from an upper surface of the circuit board to a lower surface of the circuit board, a metal-attached IC mounted to the lower surface of the circuit board and attached at an upper surface thereof with a metallic member, a first conductive material provided at the upper surface of the circuit board, the first conductive material filling the first through holes so that it is in contact with the metallic member, a module case adapted to receive the circuit board therein while including upper and lower cases made of a metal, and a depressed structure formed at the upper case and adapted to allow the first conductive material on the upper surface of the circuit board to be in contact with the upper case.

Abstract: A thermally enhanced IC chip package has a dielectric substrate member with conductive circuit patterns on top and bottom surfaces thereof and an opening therethrough. An IC chip having active and inactive sides is received in the opening. The active side of the chip and the top surface of the substrate face to a same direction and electrically connect each other. A thermally and electrically conductive adhesive layer is disposed on the inactive side of the chip and the bottom surface of the substrate in a completely enclosing shape around the opening. A thermally and electrically conductive planar member is attached to the thermally and electrically conductive adhesive layer. A molding material encapsulates the chip, the opening and the top surface of the substrate.

Abstract: An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside.

Abstract: A heat-dissipating member sandwiched between a heat dissipating electronic component which reaches a higher temperature than room temperature due to operation, and a heat-dissipating component for dissipating the heat produced from this heat dissipating electronic component. The heat-dissipating member of this invention has an interlayer comprising a metal foil and/or metal mesh having a thickness of 1-50 &mgr;m and heat conductivity of 10-500 W/mK, and a layer comprising a thermally-conducting composition containing 100 wt parts of a silicone resin and 1,000-3,000 wt parts of a thermally-conducting filler formed on both surfaces of the interlayer such that the overall thickness is within the range of 40-500 &mgr;m.

Abstract: An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G′) at 125° C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G′/G″ of ≧1, where G″ is the loss shear modulus of the thermal interface material. The values for G′ and G″ are measured by a strain-controlled rheometer.

Abstract: A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller than that of the metallic matrix. The radiator plate has a heat-receiving surface, on which an electric device serving as a heat generator is disposed, and a heat-radiating surface for radiating heat received from the heat-receiving surface. The dispersant is dispersed more on the heat-receiving-surface side than on the heat-radiating-surface side. Thus, the radiator plate is inhibited from warping, and is good in terms of the dimensional stability as a final product. Moreover, the thermal resistance is diminished between the heat-receiving surface and the heat-radiating surface. Accordingly, the heat-radiating ability of the radiator plate is secured. Also disclosed is a process for manufacturing the radiator plate.

Abstract: An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G′) at 125° C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G′/G″ of ≧1, where G″ is the loss shear modulus of the thermal interface material. The values for G′ and G″ are measured by a strain-controlled rheometer.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: An electronic control unit installed on a high temperature heat source or in its vicinity exhibits an improved heat dissipation ability within its installation environment. The electronic control unit has a chassis incorporating a printed circuit board where electronic devices are mounted. The outer surface of the chassis on the side of the high temperature heat source has a coating for lowering infrared absorption, while the outer surface of the chassis on the side away from the high temperature heat source has a coating for enhancing heat emissivity. Preferably, the inner surfaces of the chassis are subject to a surface treatment for increasing infrared absorption.

Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.

Abstract: A mounting structure for a semiconductor device of the present invention includes a substrate, a semiconductor device, a plurality of connecting members and a member. The substrate has a first surface and a plurality of pads on the first surface. The semiconductor device has first and second main surfaces and a plurality of terminals provided, on the second main surface, at locations corresponding to the pads. The connecting members connect the pads to the terminals, respectively. The member has at least one surface which is coupled to the first main surface. The thermal expansion coefficient of the member is equal to, or substantially equal to, that of the substrate.

Abstract: A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

Abstract: The invention provides a housing for an electronic apparatus whose components can be worked through a reduced number of steps without deteriorating the shielding performance against electromagnetic waves. The housing for an electronic apparatus includes a plurality of metal plates including a first metal plate and a second metal plate and each having a coated face coated over an overall area thereof and a non-coated face. The metal plates are assembled to form the housing such that the coated faces thereof are exposed as outer faces to the outside of the housing. The first metal plate is bent back at a portion thereof such that the non-coated face thereof is exposed to the outside to form a contact portion on a side edge of the first metal plate. The first metal plate is coupled to the second metal plate with the non-coated face of the contact portion thereof held in contact with the non-coated face of the second metal plate to establish electric connection between the first and second metal plates.

Abstract: A stack of multilayer modules has a segmentation layer disposed between neighboring multilayer modules. The segmentation layer facilitates the separation of neighboring multilayer modules. The stack of multilayer modules includes a first multilayer module and a second multilayer module. Each multilayer module includes a plurality of active layers each comprising a substrate, at least one electronic element, and a plurality of electrically-conductive traces. The second multilayer module is disposed to be neighboring the first multilayer module with at least one segmentation layer between the first and second multilayer modules. The segmentation layer includes a metal layer and at least one thermoplastic adhesive layer. When heat is applied, the metal layer conducts heat to the thermoplastic adhesive layer.