Abstract: An apparatus for housing and cooling circuit card assemblies employed in communication and other systems is disclosed including a chassis having opposed end walls which are formed with a series of spaced inlet card guides and correspondingly spaced outlet card guides, respectively. A straight-pass heat exchanger is directly mounted to each circuit card assembly via thermally conductive material, and opposed ends of the heat exchanger are mounted by a wedge lock to respective inlet and outlet card guides. The heat exchanger employs unique angled interface geometry that creates a gasketless airtight joint with complimentary inlet and outlet card guide geometry through which cooling air passes.

Abstract: An electronic equipment case structure aims to provide bracing and cooling for an electronic element. The electronic equipment is housed in the case which has a plurality of protrusive sections on the outer side that are spaced from one another at a selected distance to serve as a bracing structure. By means of using material of a high thermal conductive coefficient and increasing the radiation area, cooling efficiency increases. The electronic equipment case structure can provide a bracing and cooling function.

Abstract: Structures and methods for mounting electronic devices and associated heat sinks to computer modules and other structures are described herein. In one embodiment, a structure for holding a heat sink in contact with an electronic device includes an electronic device holding portion and a heat sink holding portion. The electronic device holding portion is configured to support the electronic device, and the heat sink holding portion is configured to position the heat sink in contact with the electronic device. The structure can further include a spring holding portion configured to laterally support a coil spring. When the coil spring is laterally supported in the spring holding portion, the coil spring exerts a transverse compression force against the heat sink causing the heat sink to press against the electronic device with a uniform, or an approximately uniform, pressure.

Abstract: A daughter card includes a number of circuit modules generating heat and a spring member transmitting the heat to a thermal bus extending along a circuit board adjacent to one side or to each side of a connector to which the daughter card is releasably attached. One or more contact surfaces of the spring member releasably contact one or more mating surfaces of a thermal bus at a side of the connector or at both sides of the connector. A heat pipe may additionally be used to direct heat from the thermal bus to a heat absorber.

Abstract: A housing for hot-pluggable network tap modules. The housing allows a user to maintain all network taps in any given system in one housing and location. This increases the ease of maintaining multiple network taps and allows the network tap modules to be powered by a power supply included with the housing. The housings can greatly simplify the process of managing multiple taps. Moreover, the housing are compatible with hot-pluggable network tap modules as well as legacy network tap modules that were developed in the past.

Abstract: An apparatus for cooling memory modules installed in adjacent sockets on a circuit board is provided. The apparatus includes a fan for directing cooling air through air gaps between adjacent memory modules. The air gaps extend in a longitudinal direction from a first end of the modules to an opposite second end of the modules. The cooling air in adjacent air gaps moves in opposite directions from the first end of the memory modules to the second end of the memory modules.

Abstract: A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.

Abstract: A receptacle assembly includes a plurality of guide frames, each of the guide frames having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module. Each of the plurality of guide frames have a heat sink opening extending through one of the top, bottom and side walls. A heat sink is mounted over each of the guide frames and extends through a respective one of the heat sink openings. Each respective heat sink has an engagement surface located proximate the interior cavity of each respective guide frame. The engagement surface of each heat sink is configured to physically contact a respective module when installed in each respective interior cavity. A heat sink clip spans the plurality of guide frames.

Abstract: A packaging approach reduces the overall footprint for interconnecting multiple semiconductor devices. In an embodiment, a processor mounts onto the center of a substrate with flexible appendages and memory components mount to the flexible appendages. The appendages fold over the processor to produce a processor/memory module. The processor/memory module occupies less area on the main printed circuit board than the laterally interconnected processor and memory devices would occupy.

Abstract: A casing member for a WDM add/drop multiplexer unit, the casing member comprising a backplane for interconnection of components of the WDM add/drop multiplexer unit inserted in the casing member, and at least one heat sink opening formed in a wall of the casing member disposed to, in use, receive a heat sink structure of a component of the WDM add/drop multiplexer unit in a manner such that the heat sink structure is exposed to an ambient around the casing member when the component is mounted in the casing member, for facilitating maintaining a controlled temperature environment inside of the component.

Abstract: A mounting rack for aircraft has one or more rows, which are located one above the other, each having time or more compartments which are located alongside one another, for holding electronics units, with a compartment being designed for independent insertion and withdrawal of an electronics unit. A compartment in each case being associated with a first electrical plug connector, such that the first plug connector can interact with the corresponding second plug connector of an electronics unit solely as a result of the insertion of the electronics unit into the compartment.

Abstract: A compliant interconnect for compactly, releasably packaging vertically-spaced electrical devices. The compliant interconnect includes at least one substrate for supporting and electrically connecting to the electrical devices, a layer of anisotropic conductive elastomer (ACE) between each electrical device and each immediately adjacent electrical device, and a layer of ACE between the substrate and the electrical device closest to the substrate. The ACE layers provide electrical connection through the package, and also conduct heat from the electrical devices.

Abstract: A method of making an integrated circuit device using an encapsulated semiconductor die having leads extending therefrom and attaching a heat spreader to each of the major outer encapsulant surfaces thereof. One or both of the heat spreaders has a pair of end posts configured for allowing further encapsulation of portions thereof and insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.

Abstract: A modular electronic housing system is provided, having a plurality of modules. Each module includes a plurality of bolt holes for attachment of various components and other modules, and a gasket interface for placement of gaskets for electromagnetic shielding or drip proof protection. The electronic housing further includes a removable end panel for convenient access to the contents of the electronic housing, and a support system is provided for isolation—of contents from vibration or shock. The electronic housing is designed to facilitate integration inside submarines or through small hatches. Cabling and wiring do not need to be removed during integration of the electronic housing.

Abstract: The power semiconductor module (1) comprises a housing (5), a covering panel (11) and at least two submodules (21, 22). The submodules (21, 22) each comprise at least one semiconductor chip, which has two main electrodes which are electrically conductively connected to main connections (3, 4) of the submodules. The submodules (21, 22) are arranged alongside one another, and one of their two main surfaces is pressed against the covering panel (11) of the module. The submodules are electrically connected in series. The maximun blocking voltage of the module is doubled by connecting the submodules, which are arranged alongside one another, in series. This reduces the length and the costs of the stack for hihg-voltage switch since fewer components are required for the same blocking voltages, in particular fewer modules and cooling elements.

Abstract: In order to progress a mounting consistency of electric devices on a substrate, an electronic device assembly, comprising a lower electronic device having electrodes in a surface opposed to the substrate and an upper electronic device having a plurality of the leads each extending from the side surface of own package toward the substrate.

Abstract: To provide a computer device wherein liquid penetration into a ventilation hole from its periphery can be prevented or reduced without sacrificing design and without limitation of the size and operation. Coating films 7a and 7b in frame form are applied on a periphery of a ventilation hole 6. A wet-characteristic of the coating film 7a and 7b is different from a wet-characteristic of material composing a housing 3. For example, when an angle of contact of coating films 7a and 7b for water is larger than an angle of contact of material composing the housing 3, if water is spilled on the outside of the coating film 7b the coating film 7b prevents the water flow into the ventilation hole 6.

Abstract: A retainer includes a device having at least one dovetail-shaped portion, a frame configured to receive the dovetail-shaped portion, and at least one expanding device. The expanding device is configured to compress the dovetail-shaped portion against the frame, thereby securing the device against the frame.

Abstract: An assembly device for an electronic component in sandwich type of construction. The electronic component includes at least one semiconductor element which is contacted in a planar fashion on its lower side and its upper side each by one circuit substrate. Using the assembly device, the two circuit substrates may be simply adjusted with respect to each other during assembly of the electronic component. For this, the assembly device includes a first lower shell including an accommodation for the first of the two circuit substrates, an arrangement for the defined alignment of the first circuit substrate in the accommodation, and a second, upper shell including an arrangement for adjusting the second circuit substrate positioned on the semiconductor element. A method for assembling an electronic component in sandwich type of construction, using such an assembly device, is also described.

Abstract: A fault-tolerant power supply module for a personal computer processor includes a primary frame that has two corresponding slide racks located therein to form a retrieval space to house a power supply device and a secondary frame fastened to a seal side of the primary frame with a front end formed a power supply socket cluster. The retrieval space corresponds to a wide span area of a preset opening formed on the rear end of the personal computer processor and the power supply socket cluster corresponds to a narrow span area of the opening such that the structure conforms to existing common opening specifications and also can accommodate the retrievable fault-tolerant power supply module.

Abstract: An electronic apparatus includes a thermally insulated vessel having a cooling part therein. Disposed inside the thermally insulated vessel are a first electronic part and a second electronic part. The second electronic part is spaced apart from the cooling part while the first electronic part is in direct contact with the cooling part, such that the two electronic parts can operate at different cooling temperatures.

Abstract: A display device includes a circuit board having a number of light devices, a plate engaged onto the circuit board and having one or more grooves forming one or more characters or digits, and aligned with the light devices, to receive the light generated by the light devices. A transparent filling or insert is engaged and filled into the grooves of the plate, for allowing the display device to be manufactured by mass production procedures. A number of reflective panels may be engaged into the grooves for reflecting the lights.

Abstract: A computer cooling system adapted to be installed in a drive bay of an existing computer casing to cool the inside of the casing. The cooling system includes a thermo-electric heat exchanger defining first and second superposed air channels respectively in heat transfer communication with the hot and cold sides of Peltier devices. The cooled ambient air is discharged into the computer casing while the heated ambient air is directed into an evaporator for evaporating the condensate formed during cooling of the air discharged into the computer casing.

Abstract: A stack assembly comprising a housing into which an alternating sequence of elements such as heat sinks and printed circuit boards (PCBs) carrying press-packaged semiconductor devices may be mounted and placed under pressure by a clamping device for use in a variety of power system applications. The PCBs are mounted to the heat sinks by a bracket which axially aligns the press-packaged devices with a longitudinal axis defined by the clamping device. Heat sink compartments in the housing are sized slightly larger than the heat sinks to allow the heat sinks some horizontal play within the compartment when the clamping device is loosened. This is further achieved by using floating anchors to connect the heat sinks to the housing and a flexible connector to connect the heat sinks to a power source. The heat sinks may thus be easily shifted to remove a malfunctioning PCB whilst the bulk of the stack remains in the assembled state, thereby facilitating the rapid re-assembly of the stack.

Abstract: A circuit panel chassis having a plurality of angled slots in a top surface thereof. The angled slots improving flame containment inside the circuit panel chassis while providing for cooling the circuit components of the circuit panel.

Abstract: An integrated circuit device including an integrated circuit die having at least a first and a second heat-generating components formed thereon, and a heat dissipation structure thermally coupled to the die to dissipate heat generated by the components. The heat dissipating characteristics of the heat dissipation structure are tailored to match the heat generated by each of the first and second components.

Abstract: The power supply apparatus has a plurality of power modules, a holder-case housing a parallel arrangement of power modules in a plurality of rows and columns, and a fan. The interior of the holder-case is divided into a plurality of partitions by walls. Wall surfaces follow the contours of power module surfaces to establish cooling ducts of uniform width. The holder-case has flow inlets opened through the first surface plate and exhaust outlets opened through the second surface plate. The power supply apparatus uses the fan to divide and induce air flow through flow inlets into a plurality of partitions, and expels air which has passed through cooling ducts out the exhaust outlets thereby cooling power modules disposed inside the partitions.

Abstract: The power supply apparatus has a plurality of power modules, a holder-case, and a fan. The holder-case is box shaped with a first surface plate and second surface plate as two surfaces, and contains a plurality of power modules arranged laterally, parallel, and in the same plane. Walls are provided between the plurality of laterally arranged power modules, and divide the holder-case interior into a plurality of rows of partitions. One row of power modules is disposed in each partition row. The power supply apparatus uses the fan to divide and induce air flow through flow inlets in the first surface plate into the plurality of partitions, and expels air out exhaust outlets in the second surface plate to cool power modules disposed inside each partition.

Abstract: An apparatus and method for cooling heat generating components within a compartment are disclosed. A cooling assembly isolates heat produced by a processor in a personal computer (“PC”) system and exhausts it from the PC prior to adversely affecting other components within the PC. A fan causes air to blow across the processor having an attached heat sink disposed within the cooling assembly, and the air exits the cooling assembly without adversely affecting the other components surrounding the processor. In one example, an alternative passage is provided for the air.

Abstract: An integrated circuit device has a heat spreader attached to each of the major outer encapsulant surfaces. One or both of the heat spreaders has a pair of end posts configured for insertion into through-holes in a substrate to position and support the device during and following the outer lead solder reflow step at board assembly. The heat spreaders provide high heat dissipation and EMR shielding, and may be connected to the substrate ground to become ground planes.

Abstract: A multi-chip module is provided with a structure for disposing of a large amount of surplus solder at soldered portions. In this multi-chip module, a cooling member (structure) is soldered directly at the back side of heat generating member such as a semiconductor integrated circuit element. In order to dispose of the surplus solder, the present invention has a first metallized part formed at a cooling member which is larger than a second metallized part formed at the back side of semiconductor integrated circuit element which is solder with the first metallized part.

Abstract: A rack (70) for a plurality of internal electronics modules that includes a mechanism for mounting external electronics modules (69). The rack (70) includes a heat exchanger (63) disposed between the rack (70) and the external electronics module (69). The external electronics module (69) includes a heat coupling surface for efficiently using the heat exchanger (63) for dissipating heat of the external electronics module (69).

Abstract: A method and system of thermally connecting internal components of a computer system to a heat sink. The components are arranged as modular units, each having at least one component heat conductor extending from it. For each component heat conductor, an arterial heat conductor extends from the heat sink. Each module heat conductor is attached orthogonally to its associated arterial heat conductor, using a special thermal connector.

Abstract: A modular coolant manifold for use with a power electronics device having a heat sink is disclosed. The modular coolant manifold comprises a base unit having an inlet side, an outlet side, and a pair of interconnecting sidewalls. A portion of the base unit defines a recess adapted to receive the heat sink of the electronics device. The base unit includes an internal coolant passage extending between an inlet port defined in the inlet side and an outlet port defined in the outlet side. The coolant passage is in flow communication with the recess. An inlet manifold is adapted for attachment to the base unit inlet side. The inlet manifold includes an inlet port, a transfer port, and a coolant passage interconnecting the inlet port and the transfer port. The inlet manifold transfer port is in flow communication with the base inlet port. An outlet manifold is adapted for attachment to the base unit outlet side.

Abstract: In an electronic unit which comprises a heat source, is supported in a casing, and should be kept below an allowable temperature, a movable heat sink is brought into thermal contact with the heat source and an external heat sink of the casing. Preferably, the movable heat sink is movable into and out of the thermal contact with the heat source and is slidably guided by a guide member of the casing. More preferably, a resilient thermal conductive member is interposed between the heat source and the movable heat sink.

Abstract: A pair of risers are mounted on a mother or circuit board and trap one or two electronic circuit modules in an upstanding disposition and a bridging member extends between the risers. The bridging member forms a channel on its underside which engages a rail on a heat sink on one surface of the electronic module. The trappings of the rail by the bridging member positively restrains the module against movement away from the circuit board.

Abstract: An apparatus for electrically connecting a plurality chips to a circuit board includes a pair of ceramic chip carriers that have flexible circuits connected to the electrical contact locations on each ceramic chip. The apparatus for electrically connecting a plurality chips to a circuit board may also include an area between two chip connect surfaces which has multiple metallization layers isolated from one another by flexible isolation material. A flexible circuit extends beyond the edge of the ceramic chip or the chip-connect area and forms a flap. The flexible circuit flap includes electrical paths to pads on the chip-connect area of the device. Each flap portion of the flexible circuit has a set of pads. The pads on the flaps of the first and second ceramic chips are positioned to connect to a third set of pads on a printed circuit board. The printed circuit board is provided with pads positioned so that the pads on the flaps will correspond to the pads on the flaps of the ceramic chips.

Abstract: The computer housing of a modular computer device includes a rectangular housing body-having a front panel formed with at least one module receiving opening, a side door mounted pivotally on the housing body and operable so as to close and open an open lateral side of the housing body, and a connector unit disposed in the housing body and having at least one electrical connecting set registered with a corresponding module receiving opening. A computer main board is mounted on an inner surface of the side door and is connected electrically to the connector unit. At least one computer peripheral module has a module housing that is disposed slidably and removably in a corresponding module receiving opening and that has a rear side provided with a module connector set. The module connector set engages mechanically and electrically an aligned corresponding electrical connecting set of the connector unit to establish electrical connection between the computer peripheral module and the computer main board.

Abstract: A structure for supporting and at least transferring heat energy away from at least a first heat source interconnected thereto is disclosed. In one embodiment, the structure includes a deck member having a plurality of layers of thermally conductive fibers packed within a matrix material. Fibers of at least a first layer are orientable to transfer heat energy toward at least a first sidewall of the deck member, and fibers of at least a second layer are orientable about .+-.45.degree. relative to the fibers of the first layer to enhance the structural strength of the deck member. In another embodiment, fibers of at least a first layer of thermally conductive fibers of the deck member are orientable to transfer heat energy from a first heat source to a second, cooler heat source, both of which are interconnectable to the deck member, such that the first and second heat sources operate at substantially uniform temperatures.

Abstract: The invention concerns a power electronic module comprising two individual modules (1) each comprising a power electronic component (5) having a contact face (6) mounted on a metallic face (7) of a substrate (8), power connections (11, 13, 20) a metallic heat exchanger (2) mounted on the other face (12) of the substrate (8).In accordance with the invention the two individual modules (1) are face to face, the power electronic component (5) of one individual module (1) facing the power electronic component (5) of the other individual module (1), and separated from each other by at least one spacer (3) comprising control leads (14) for controlling the individual modules (1) and power leads (13) for transmitting power to the individual modules (1) or between individual modules (1).

Abstract: A rack mounted rectifier has a cooling fan module which is removable and replaceable in the field for servicing the rectifier when a cooling fan failure occurs. The rack mounted rectifier module includes a rectifier unit, a housing, DC output contacts, AC input contacts, and a data signal connector. The cooling fan module has a mounting bracket, a cooling fan unit which is secured to the mounting bracket, and a cooling fan connector which is mounted to the mounted bracket and electrically connected to the cooling fan motor. The housing of the rectifier unit has a socket for receiving the cooling fan module and a mating cooling fan connector for engaging the cooling fan connector to electrically connect the cooling fan unit to electric power when the cooling fan module is fully inserted within the socket.

Abstract: The invention is a method of assembling an integrated computer by successively placing various components into an open-top weldment or "tub." The assembly method is particularly suited to rapidly and cost-effectively assembling an integrated computer module in an automated, assembly line environment.

Abstract: The present invention aims to radiate heat efficiently from the inside of an equipment housing, with a simple structure. First and second through air passageways are formed at the sides of first to third equipment housings and the second through air passageway communicates with a recess air passageway to supply air from the first through air passageway into the first to third equipment housings, discharge the exhaust from the first equipment housing directly out of the equipment through a second window portion, and lead the exhaust from the second and third equipment housings into the second through air passageway through the second window portion and the recess air passageway and discharge it out of the equipment.

Abstract: A three-dimensional multi-chip module is formed as a stack of two-dimensional multi-chip modules comprising substrates which have electrically signal paths connecting integrated circuit chips and has vertical interconnections of the signal paths, provided by interconnection or via chips. The individual chips or other inner components on a substrate are in mechanical contact with a surface of an adjacent substrate and constitute the distance device maintaining the substrates spaced from each other. Thus heat developed in components can be conducted essentially perpendicularly to the substrates. Thermally conducting chips can be used for improving the conducting of heat. Cooling devices are located only at the top and bottom surfaces of the stack.

Abstract: A combination support and heat sink structure is mounted within a computer housing for pivotal movement between connected and disconnected positions and includes a pair of cooling plates, one air cooled and the other liquid cooled, carried in a spaced apart, parallel opposing relationship. The two cooling plates are movable toward and away from one another and a pair of manually operable spring clip members permit a processor card to be removably sandwiched and clamped between the cooling plates without the use of tools.

Abstract: A repeater case for high-density subscriber lines includes a repeater base and repeater case housing formed of a fiberglass composite and together forming a sealed enclosure for a pressurized atmosphere. The repeater case housing has a removable cover secured in position by torque bolts, a sealing gasket to sealingly receive the cover, a plurality of high-density subscriber line module slots and a plurality of printed circuit boards mounted to certain of the slots with gaps between adjacent printed circuit boards, the printed circuit boards being adapted to receive respective high-density subscriber line modules. The repeater base has a cable inlet, and each of the plurality of printed circuit boards is provided with a connection to the cable inlet and a connector to electrically receive one of the high-density subscriber line modules. The repeater base also includes an electrically insulating barrier between the cable inlet and the printed circuit boards.

Abstract: A dual-board host or main printed wiring structure of a circuit module with increased component mounting area is made plug-compatible with a backplane to which single-board host or main boards may be attached with connectors of differing dimensions and pin configurations, the center line of which are offset from each other. The connection sides of the two boards are respectively bonded to a heat sink frame structure having a thickness which corresponds to the connector offset on the backplane such that the total thickness of one of the printed wiring boards, the heat sink frame and the two bonding layers with respect to board to center line distances equals the connector offset on a given backplane. Direct connections to both boards of the dual-board structure can thus be made from the backplane to reduce connection length and reliability relating to a mezzanine board mounted on a single-board host.

Abstract: The device is disclosed for the mounting and cooling of a capacitor. The device comprises of a pair of metal bars made of a thermally and electrically conductive material. The capacitor is fastened to the pair of metal bars. Water is circulated through channels defined in the pair of metal bars for cooling the capacitor.

Abstract: An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.

Abstract: A radio frequency compatible multi-board cluster (300) having three shielded housings (301, 301, 303) for containing three component parts of a radio, namely, the controller, the transmitter, and the receiver. These shielded housings (301, 301, 303) are electrically and physically intercoupled with one another at 90.degree. angles to form a bracket-receiving cavity (401) there between.