Abstract: It is an object to facilitate assembly of an application device. A device (101) is provided with a heat sink (51) to radiate loss heat of an IGBT element (11) as a power semiconductor element to an external radiation fin. External terminals (5 and 6) connected to an external circuit substrate protrude in the direction in which the exposed surface of the heat sink (51) is directed. Accordingly, when assembling an application device by mounting the device (101) on the external circuit substrate together with other circuit elements, it is possible to mount the device (101) and other circuit elements together on the common main surface of the circuit substrate, i.e., on its main surface on the side opposite to the side where the radiation fin is attached. Accordingly, it is possible to collectively apply solder on the common main surface of the circuit substrate and collectively solder the device (101) and the other circuit elements.

Abstract: An operating and control device, for example for an electric motor, includes a support having by a first metal part in which is formed a network of conduits conveying a cooling fluid for electrical elements, and a second part, made of insulating material, housing electrical links for connections with those electrical elements, a source of energy and other electrical components. The invention applies in particular to automobiles with an electric motor.

Abstract: A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween. A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally. The circuit board can be formed to be compact. In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner. It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer. Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

Abstract: A three-dimensional compact array of electronic circuitry includes a plurality of stacked modular compact arrays of electronic circuitry. Each modular compact array of electronic circuitry includes a substrate-less multi-chip module supporting a number of integrated circuits and interconnect which electrically connects the integrated circuits. Each modular compact array of electronic circuitry further includes an integrated heat exchanger and stacking connector supporting the substrate-less multi-chip module. The integrated heat exchanger and stacking connector includes a transverse connector region including a plurality of connector vias for connection to the interconnect of the substrate-less multi-chip module, and a transverse flow region including channels for circulating a coolant to remove heat from the substrate-less multi-chip module.

Abstract: A PCMCIA card manufacturing process is disclosed, including the steps of (1) providing a top cover and a bottom cover made of a metal, preferably stainless steel, each of the top cover and bottom cover being provided with a plurality of hooks along two opposite lateral edges, (2) placing the top cover and bottom cover respectively into a first mold and a second mode for injection molding a first frame member on the top cover with the hooks of the top cover embedded in the first frame member and a second frame member on the bottom cover with the hooks of the bottom cover embedded in the second frame member, each of the first and second frame member being provided with at least one notch that match each other to define at least a connector slot, (3) disposing a circuit board between the first and second frame members with the connector thereof received within the connector slot, and (4) jointing the first and second members together, preferably by ultra sonic welding.

Abstract: A high density electric power supply device formed by stacked circuit modules including top, bottom and intermediate modules, each of the modules having electrical contact elements retained in engagement with complementing contact elements on an adjacent one of the stacked modules under a force having a direction to press the top and bottom modules against the intermediate modules. Each of at least the intermediate modules have supply and return ports parallel to the direction of the aforementioned force and at least some of the modules having a passageway for circulation of cooling fluid between the supply and return ports therein. An elastic seal circumscribes each of said supply and return ports on at least the intermediate modules for maintaining a continuous fluid-tight passageway through the supply and return ports among the stacked circuit modules, the elastic seals being maintained under compression by the compressing force.

Abstract: An electro-mechanical assembly includes a high power IC package and a low power IC package which are mounted with a space between them on a single substrate. Both of these IC packages have flat top surfaces which dissipate heat; and due to various manufacturing tolerances, those surfaces are non-coplanar with respect to each other. To cool these two IC packages, a single heat sink is provided which has a thin flat core that overlies both of the IC packages as well as the space between them, and cooling fins extend from the top of the core.

Abstract: A circuit board includes a circuit-conductor layer, a ground layer and a power source layer superposed in a multilayer form through dielectric layers therebetween, A heat conduction through inside of the circuit board is enhanced so that circuit chips mounted on the circuit board can be cooled down to a level capable of operating normally, The circuit board can be formed to be compact, In order to enhance the heat transfer in the circuit board, at least one of the ground layer and power source layer is formed in a multilayer manner, It is preferable to form these layers at a thickness larger than that of the circuit-conductor layer, Further, preferably, the pin of the chip mounted on the board and at least one of the ground layer and power supply layer are connected to each other in such a manner as to enhance the heat conduction.

Abstract: A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.