Abstract: A method for reducing a magnitude of a rate of current change of an integrated circuit is provided. The method uses a plurality of transistors controlled by a finite state machine, such as a counter, to gradually reduce current sourced from a power supply. Further, the finite state machine is controlled by a micro-architectural stage that determines when the integrated circuit needs to be powered down.

Abstract: The present embodiments and associated methods provide for an integrated EMI shield for effective shielding not only from emissions perpendicular to the integrated circuit (IC) chip carrier but also parallel (edgewise) to the carrier. In one embodiment, a method includes forming at least a portion of an internal ground layer along at least a portion of a chip carrier edge, applying an electrically conductive layer to at least a portion of the chip carrier edge, the conductive layer being applied over the exposed portion of the ground layer and in electrical contact with said ground layer, and forming at least one cavity within the top surface of the chip carrier, where the at least one cavity configured to hold one or more integrated circuit chips therein.

Abstract: The temperature of multiple integrated circuit modules is regulated by a heat exchanger which is sequentially squeezed against, and separated from, a respective uneven contact surface on each of the modules. The heat exchanger has a face of a malleable metal that stays in a solid state and deforms while the squeezing occurs. The surface of the malleable metal has a coating of a release agent that prevents the malleable metal from sticking to the contact surface.

Abstract: A cavity-down ball grid array (CDBGA) semiconductor package with a heat spreader is provided, in which a substrate is formed with at least a ground ring, a plurality of ground vias, a ground layer, and at least an opening for receiving at least a chip. The substrate is mounted in a cavity of the heat spreader, and an electrically conductive adhesive is disposed between an inner wall of the cavity and edges of the substrate, so as to allow the ground layer and the ground ring exposed to the edges of the substrate to be electrically connected to the heat spreader by means of the electrically conductive adhesive. By the above arrangement with the heat spreader being included in a grounding circuit path of the chip, ground floatation and excess ground inductance and resistance can be prevented for the semiconductor package, thereby solving heat-dissipation, electromagnetic interference and crosstalk problems.

Abstract: A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/−90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.

Abstract: A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302) is attached to one side of a die (304). The die (304) fits into the opening (104) of the carrier (102) with the heat sink (302) abutting one side (208) of the carrier and the die being wire bonded (402) to the other side (108) of the carrier. The packaging assembly (400) can be oriented either device side up or down.

Abstract: The present invention refers to an electronic apparatus, preferably a microchip testing device, comprising at least one circuit board mounted on a cooling device. This circuit board supports at least one microchip. The circuit board supports the microchip on a side turned to the cooling device, wherein the cooling device is adapted for providing a cooling of a side of the microchip, which side is turned to the cooling device. A thermal conductor is arranged between the microchip and the cooling device for providing a thermal contact between the cooling device and the one side of the microchip turned to the cooling device. The thermal conductor comprises at least one of a group comprising: a thermally conductive knead, a plasticine, a kneadable and thermally conductive material, and a plastically deformable and thermally conductive material.

Abstract: A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting sites. The insulating substrate has at least one aperture providing access between a second side of the insulating substrate and the one or more mounting sites. The insulating substrate has one or more signal paths on the second side that couple the one or more apertures to one or more contact sites disposed about the insulating substrate. A series of conductive tabs is coupled to corresponding contact sites.

Abstract: A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector. Also optionally, heat-generating devices may be mechanically and electrically coupled with the second printed circuit board through interposers configured (upon assembly) to raise the heat-generating devices through the openings in the first printed circuit board to contact a heat sink.

Abstract: An electrical assembly 10 is provided, including a heat sink 14, a heat generating component 12, a gap 22 defined between the heat generating component 12 and the heat sink 14, at least one pre-cured thermal adhesive member 26 positioned within the gap 22, and a post-cured thermal adhesive filling said gap 22.

Abstract: A flexible assembly system and mechanism adapted for optical projection apparatus, the flexible assembly system includes a flexible element, a heat-sink element, a digital micro-mirror device module, an optical holder and a locked element, wherein the locked element is serially connected the flexible element, the heat-sink element, the digital micro-mirror device module and the optical holder, for making each element be formed in one-piece, whereby using the flexible element to eliminate the accumulative tolerance between each assembly element, and producing a compact combination between the heat-sink element and the digital micro-mirror device module, so that the digital micro-mirror device module has a best heat dissipating effect.

Abstract: A method for removing heat from an active area of an integrated circuit device is provided. The method includes applying a separator to the active area of the integrated circuit device. A thermally conductive element is coupled to the active area of the integrated circuit device outwardly of the separator.

Abstract: Heat dissipater for integrated circuits comprising a dispersion element able to be associated to an integrated circuit, through securing means constituted by two locking elements mounted on the dispersion element in mutually opposite positions. The locking elements have each a latching pin and are able to slide laterally to the dispersion element from a lower position in which the pins are inferiorly distanced from the base and form between them a passage for the coupling of the dissipater on an integrated circuit, to an upper position in which the pins are proximate to the base and are mutually approached. The dissipater further comprises elastic means interposed between the dispersion element and the locking elements to thrust them towards the upper position.

Abstract: A method for fabricating a semiconductor device heat spreader from a unitary piece of metallic material. The metallic material is stamped to form a unitary heat spreader having an upper heat dissipation region, a lower substrate contact region, and supports connecting the upper heat dissipation region and the lower substrate contact region. A recess is formed within the supports and the upper and lower regions for receiving a semiconductor device.

Abstract: In one embodiment, an integrated circuit includes an electrically active interconnect line within a dielectric layer having a top and bottom surface, the bottom surface of the dielectric layer being coupled to the top surface of a substrate underlying the dielectric layer. The dielectric layer has horizontally arranged heat dissipating layers. An electrically inactive conductor or cooling fin is located within the dielectric layer at a heat dissipating layer below and closer to the substrate than said active interconnect line. The electrically inactive conductor is coupled to said electrically active interconnect line as an extensions of electrically active interconnect line to dissipate heat therefrom.

Abstract: A heat dissipation system for a semiconductor device having a plurality of semiconductor chips, includes a heat dissipation member which cools the semiconductor chips, an exterior heat dissipation member which is provided opposite to the heat dissipation member, engaged to the semiconductor device and connected to an electrical ground, an electric conductor member which is provided between the heat dissipation member and the exterior heat dissipation member, and electrically connects the heat dissipation member and the exterior heat dissipation member to each other, and a thermal conductivity insulating member which is inserted between the heat dissipation member and the exterior heat dissipation member. Accordingly, the resistance against common mode noise is increased. Furthermore, the heat dissipation efficiency of the semiconductor device is also increased. The head dissipation system improves the heat dissipation efficiency of the semiconductor device to control noise.

Abstract: An electronic control module provides dual insulation layers between an internal line voltage and a separate tool housing that serves as a heat sink, thereby allowing versatility in mounting the electronic control module within the tool housing interior, and thereby also eliminating the risk of electrical shock to a user making contact with an exterior tool housing surface. The control module includes a power device, connected to a line voltage, and a thermal pad. The power device provides a first layer of electrical insulation between the line voltage and an external tab of the power device while the thermal pad provides a second layer of electrical insulation. The combined first and second layers provide a minimum amount of electrical insulation between the line voltage and the tool housing thereby preventing electrical shock. Alternatively, the thermal pad is provided between the control module and the tool housing.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: Disclosed are novel methods and apparatus for provision of a heat dissipation device with improved EMI suppression characteristics. In accordance with an embodiment of the present invention, an apparatus is disclosed. The apparatus may include a printed circuit board, which forms at least one grounding pad and at least one mounting hole. The apparatus may further include an integrated circuit, a heat dissipation device mounted on the integrated circuit, and a frame mounted on the printed circuit board through the mounting hole. The frame may include at least one frame leg in electrical contact with the grounding pad. The frame may form an electromagnetic interference (EMI) shield to limit an EMI leakage generated by the integrated circuit.

Abstract: In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.

Abstract: An edge stiffener added to a lead-frame based circuit module provides protection of the peripheral flange of the circuit module during handling and manufacturing processes. The edge stiffener may be coupled to leads of the lead-frame for providing electrical contacts at the periphery of the circuit module or may be form widened portions of a tie bar that is connected to the lead frame by leads extending through gaps between the ends of the edge stiffener portions. Singulation of the circuit module will result in edge stiffener portions that are not coupled to the lead frame, but are secured within the encapsulant.

Abstract: A spring spacer assembly maintains thermal contact between a thermal transfer surface of a heat sink and a heat-generating electrical component mounted on a printed circuit board between the printed circuit board and the thermal transfer surface. The spring spacer assembly comprises a face defining a fixation segment and a deflectible finger extending from the fixation segment, and a fixation element for securing the face to the heat sink. A spacer extends from the fixation segment for passage through the printed circuit board into abutment with the thermal transfer surface. A protrusion extends from the finger for passage through the printed circuit board into contact with the heat-generating electrical component. The finger is biased toward the thermal transfer surface and urges the heat-generating electrical component into thermal contact with the thermal transfer surface. The fixation element secures the face to the heat sink with the spacer secured in abutment with the thermal transfer surface.

Abstract: In a power module, a wiring substrate to which a heat generating component is connected electrically and a heat sink are connected through the medium of a thermally conductive and electrically insulating member. The thermally conductive and electrically insulating member is a curable composition containing (A) a thermosetting resin, (B) a thermoplastic resin, (C) a latent curing agent, and (D) an inorganic filler. The thermally conductive and electrically insulating member is bonded to the heat generating component in such a manner as to be deformed complementarily to unevenness in shape and height of the heat generating component. Heat generated from the heat generating component is radiated by means of the heat sink. Thus, a power module that allows heat generated from an electronic component to be radiated evenly and efficiently and achieves high-density mounting, and a method of manufacturing the power module are provided.

Abstract: An improved apparatus and method for cooling integrated circuit assemblies uses a heat sink having a base and a displacement element having a size substantially similar to an area of heat concentration appropriately positioned on the integrated circuit. A compressive force placed upon the displacement element between the heat sink and the integrated circuit provides an optimum thermal resistance at an interface between the IC and the heat sink for efficient transfer of heat to the heat sink.

Abstract: A semiconductor device is disclosed in which a heat sink is difficult to warp and which is inexpensive.

Abstract: An efficient heat diffusing structure comprising a power module having a mounting substrate that has a high thermal conduction efficiency. The mounting substrate is comprised of a mounting surface on which an electric power circuit for controlling electric power is mounted, and a heat dissipating surface that has a corrugated section formed thereon that serves to dissipate heat. This heat diffusing structure allows the size of the device to be reduced, and also allows costs to be reduced.

Abstract: A three-dimensional stacked heat spreader assembly is provided which includes an upper heat spreader of generally rectangular shape having a first edge portion extending downwardly; a lower heat spreader of generally rectangular shape having a second edge portion extending upwardly; a cavity formed in-between the upper heat spreader and the lower heat spreader by engaging the first edge portion and the second edge portion together adapted for receiving an electronic device.

Abstract: An IC package with an implanted heat-dissipation fin is introduced. The IC package provides a plastic package to seal an IC chip. One end of the heat-dissipation fin is implanted inside the plastic package, and another end is left outsides for directly heat-exchanging with a surrounding heat-transfer media. By providing the implanted heat-dissipation fin, a more efficient and broader heat-dissipation path for the IC package can be established so that the total heat dissipation of the IC package can be enhanced.

Abstract: An electrically conductive strap is connected to an electrically conductive first connector at one end and connected to an electrically conductive second connector at the other end. Both connectors are mounted on the substrate so that the connected strap extends over a portion of the mechanical component, or otherwise cooperates with the mechanical component, to secure the mechanical component in the desired position. Also, the connection between the strap and the first connector electrically couples the strap to the first connector while the connection between the strap and the second connector electrically couples the strap to the second connector. At least one of the connectors, the first connector for example, is also electrically coupled to a first reference voltage preferably available on the substrate. The electrical condition of the second connector may then be used to indicate whether the strap and therefore the mechanical component is in place on the substrate.

Abstract: A device having features for enhancing the cooling of an electronic package subject to laminar air flow. The features include a bluff body, located adjacent the electronic package and within the laminar air flow, for creating turbulence in the air flow to enhance the cooling of the package. The turbulence creates a greater cooling effect of the air flow on the electronic package, and the bluff body can include a rod or other structure mounted adjacent the electronic package. The bluff body can also be mounted on the electronic package or on a heat sink mounted on top of the package.

Abstract: Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Abstract: A high power density thermal packaging solution. A highly efficient thermal path is provided using a lid of a unique design configuration that connects the chip back-side to both a heat sink and thermally conductive substrate vias thus establishing two thermal paths to carry heat from the die. The thermal interface between the chip back-side to lid and lid-to-substrate is enhanced with a thermally conductive elastomer. The heat is conducted through the substrate through thermal vias that are added to the perimeter of the substrate or which may be configured from preexisting electrical shielding structures that connect the top surface of the substrate to the bottom of the package. The bottom surface connection then conducts the heat to a copper ground plane in the printed circuit card. The heat from the die to the heat sink is transferred in the conventional method using the thin layer of thermally conductive elastomer to complete the thermal path from chip to lid to heat sink.

Abstract: A snap-in heat sink assembly that has an injection molded one piece frame having a plurality of spring members extending outwardly with protrusions at the free ends thereof. The assembly has a spring located against the frame and an electronic component is located atop of the spring. A heat sink has lateral surfaces with elongated grooves formed along those lateral surfaces. The sink is affixed to the frame by a simple step of inserting the heat sink into the space between the spring members such that the protrusions of the spring members snap into the grooves when the heat sink is in the desired location. By sandwiching the spring between the frame and the electronic component, the spring creates a bias to force the electronic component against the heat sink to assure good conductivity of heat from the electronic component through the heat sink.

Abstract: A printed circuit board (PCB) has at least a first surface. A patterned electrically and thermally conductive layer is disposed on the first surface. A surface mount device (SMD) is disposed on an area of the layer and is attached thereto with solder. Heatsink elements, each including at least one flat surface, are placed by a pick and place assembly robot and permanently attached to the area with solder.

Abstract: A heat dissipating assembly for electronic components mounted on a circuit board includes a first thermal plate (10), a second thermal plate (30), and a copper adjusting screw (60). The first thermal plate forms a plurality of offset portions (12) and thereby defines a plurality of recesses at the offset portions respectively. Depths of the recesses correspond to heights of the electronic components. The first and second thermal plates are secured to opposite sides of the circuit board. The first and second thermal plates respectively define first and third holes (14, 32) movably receiving the adjusting screw therein. The adjusting screw is tightened so that it improves thermal contact between the offset portions and the electronic components. Because the adjusting screw is made of highly heat conductive material, heat in the first thermal plate is conducted to the second thermal plate through the adjusting screw.

Abstract: An electronic package includes a heat-generating electronic component such as an integrated circuit chip, a thermally conductive member, which may be an integrated heat spreader, and a low modulus thermal interface material in heat conducting relation between the electronic component and the thermally conductive member. Increased thermal performance requirements at the electronic component level are met by the thermal interface material, which includes a polymer matrix and thermally conductive filler, which has a storage shear modulus (G′) at 125° C. of less than about 100 kPa, and which has a gel point, as indicated by a value of G′/G″ of ≧1, where G″ is the loss shear modulus of the thermal interface material. The values for G′ and G″ are measured by a strain-controlled rheometer.

Abstract: A heat dissipation device is mounted to a light emitting diode device for removing heat from the light emitting diode which includes a substrate having a top side on which a light-emitting unit is formed and an opposite bottom side from which terminals extend. The heat dissipation device includes a plate made of heat conductive material and forming a receptacle for receiving and at least partially enclosing and physically engaging the substrate of the light emitting diode device for enhancing heat removal from the light emitting diode device.

Abstract: A CPU and circuit board mounting arrangement in which a CPU connector is installed in a circuit board for top loading of a CPU to electrically connect respective bottom pads of the CPU to respective contacts of the circuit board by respective sloping terminals in the CPU connector, and a pressure member is pivoted to the CPU connector and locked to hold down the CPU in positive contact with the terminals of the CPU connector.

Abstract: In accordance with the teachings of the present invention, the electronic system comprises a housing having a base and a lid. A circuit board is installed on the base of the housing. At least one solder pad is disposed on the circuit board for receiving an electronic component. The solder pad provides both an electrical connection and a mechanical support to the electronic component. The electronic system is also provided with a devise that is capable of distributing power to the electronic component and simultaneously removing heat away from the electronic component. The device is also mounted on the solder pad and positioned adjacent to the electronic component.

Abstract: A mounting system for mounting a semiconductor device to a heat sink is disclosed. The mounting system is for mounting a semiconductor package having a semiconductor die, a heat spreader, a body of non-conductive material around the semiconductor die, and a plurality of leads to a heat sink comprising a sheet of thermally conductive material. The mounting system comprises two primary elements: a rigid retainer and a pressure clamp. The rigid retainer comprises a block of non-conductive material having recess open to at least two adjacent faces of the block of non-conductive material and configured to expose at least a portion of the heat spreader when the semiconductor package is disposed in the recess with the plurality of leads extending from the retainer. The pressure clamp is configured for disposing against an exterior of the retainer opposite to the body and attaching to the heat sink, for compressing the package against the heat sink.

Abstract: The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate.

Abstract: A package according to the present invention includes: a support for mounting a semiconductor component on the upper surface thereof; a positioning control plate, which is secured to the support and includes an opening or a notch; and a lead provided on the support for establishing electrical continuity between the semiconductor component mounted on the support and an external component. The positioning control plate houses at least a lower part of the semiconductor component inside the opening or the notch, thereby controlling a position of the semiconductor component on the support.

Abstract: An integrated circuit package which includes an integrated circuit that is attached to a first side of a substrate. The package may also have a solder ball and a heat slug that are both attached to a second side of the substrate. The heat slug and solder ball can be attached to a printed circuit board. The heat slug can provide a thermal path from the substrate to the circuit board which has a relatively wide area. The wide area reduces the thermal impedance and the junction temperatures of the integrated circuit for a given amount of heat.

Abstract: Methods and apparatus for mounting a semiconductor to a heat sink. A clamp is provided comprising a spring beam mounted to a clamp body, wherein the body restricts the spring beam ends and the spring beam has a convex curvature relative to an adjacent power semiconductive module. The portion of the spring beam near its apex contacts the module, applying force to bias a heat-transmitting surface of the module against a heat sink. When temperature increases, the spring beam expands to add additional clamping force to the module. Further embodiments provide making the spring beam from a material having a high coefficient of thermal expansion and the clamp body from a material having a low coefficient of thermal expansion, further increasing the force that may be applied by the spring beam with increases in temperature. The spring beam may comprise layers of different materials to increase the applied force.

Abstract: A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the extending part of the heat sink, and the first surface of the die adheres to the heat sink. In addition, the die is connected to the substrate by the wires, and the plastic mold encapsulates the die, the heat sink and the wires. The chip package according to the invention possesses the small size and high efficiency of heat dissipation; besides, it also decreases the production cost for eliminating the conventional procedures of taping and de-taping.

Abstract: Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially the filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: A capacitor includes multiple tiers (302, 304, 306, 1210, 1212, 1310, 1312, 1380, FIGS. 3, 12, 13), which provide capacitance to a load at different inductance values. Each tier includes multiple layers (311-325, 1220, 1222, 1320, 1322, 1382, FIGS. 3, 12, 13) of patterned conductive material, which are separated by layers of dielectric material. In one embodiment, tiers are stacked in a vertical direction, and are electrically connected through vias (330, 332, 334, 1230, 1232, FIGS. 3, 12) that extend through some or all of the tiers. In another embodiment, one or more tiers (1310, 1312, FIG. 13) are located in a center region (1404, FIG. 14) of the capacitor, and one or more other tiers (1380, FIG. 13) are located in a peripheral region (1408, FIG. 14) of the capacitor. In that embodiment, the center tiers and peripheral tiers are electrically connected through one or more additional layers (1370, FIG. 13) of patterned conductive material.

Abstract: According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.