Abstract: The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.

Abstract: An electronic device package with enhanced heat dissipation effect comprises a lead frame and an outer frame with electrically insulating surface. The outer frame encloses the electronic device with a predetermined gap therebetween. The lead frame has a plurality of inner leads extending to the upper surface of the electronic device and a plurality of outer leads enclosing the outer surface of the outer frame. Each inner lead and each outer lead are linked by a slanting portion. The plurality of outer leads includes at least one ground outer lead with larger cross section area than other outer leads. Therefore, the heat generated by the electronic device can be conducted outside through the ground outer lead when the ground outer lead is connected to other device.

Abstract: A heat-dissipating structure is designed for use on an integrated circuit (IC) package, such as a BGA (Ball Grid Array) integrated circuit package, for heat dissipation from the integrated circuit package during operation. The heat-dissipating structure includes a heat-conductive piece having a first side and a second side, with the first side being exposed to the outside of the integrated circuit package; a buffer pad made of a heat-conductive material having an equivalent CTE as the integrated circuit chip enclosed in the integrated circuit package, the buffer pad having a first side and a second side, with the first side being attached to the second side of the heat-conductive piece; and a flexible adhesive layer having a first side attached to the second side of the buffer pad and a second side attached to the integrated circuit chip.

Abstract: A ball grid array semiconductor package includes a substrate, a die mounted on the substrate and electrically connected to the substrate by bonding wires, a heat ring mounted on the substrate to surround the die and the bonding wires, and a heat slug mounted on the heat ring to entirely cover the die and the bonding wires thereby providing improved heat dissipation efficiency and overall electrical performance. Encapsulation material is filled into an inner space surrounded by the heat ring, heat slug and substrate to form an encapsulant for protecting the die and bonding wires. The heat ring and heat slug has at least a portion of surface area sequentially coated with a metal medium layer and an insulation layer to enhance the bonding degree between the encapsulant and the heat ring and heat slug.

Abstract: A heat transfer housing for a printed circuit board, which has an electrical component having a thermal contact area, includes an extruded section having a contact area and contours for receiving the printed circuit board. One of the walls of the housing is initially formed displaced outwardly through an angle. When the printed circuit board is installed in the housing, the outwardly displaced wall is rotated inwardly and held in place by a cover. The wall includes a portion which bears against the printed circuit board and forces the thermal contact area of the electrical component to bear against the contact area of the housing for efficient heat transfer.

Abstract: The heat sink fan for cooling a heat generating device as disclosed in the present invention is provided with a heat sink that is to be directly mounted on the heat generating device to thereby absorb or disperse the heat generated by the heat generating device, and a housing that is detachably engaged to the heat sink and equipped with a fan, which in turn creates air flow to forcibly cool the heat sink. The housing has a top wall portion and a pair of side wall portions extending vartically downwardly from both sides of this top wall portion, the side wall portions being disposed at both sides of the heat sink and provided with an engaging element at which tip an engaging projection is formed. The housing may be detachably coupled with the heat sink the engaging projection being permitted to engage a retaining means formed on a circuit board on which the heat sink or the heat generating device is mounted.

Abstract: A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink is affixed to a surface of the die by way of a thermally compliant material. The compliant material reduces the stresses caused by temperature fluctuations which cause the heat sink and the die to expand and contract at different rates. A first molding material is deposited around the periphery of the die, compliant material and heat sink, thereby leaving exposed substantially an entire surface of the heat sink.

Abstract: In a semiconductor package, a die has electrical circuits formed on a first side surface. A lead frame for connecting the electrical circuits to a power source is connected to the electrical circuits of the die. A package body made of a dielectric material is formed around the die and the lead frame. One or more fins made of a thermally conductive material are independently attached to the die by a thermally conductive bond. The fins, receive heat directly from the die, and dissipate the heat by radiative or convection cooling into the surrounding environment.

Abstract: A multilayer circuit board or laminated circuit board for use in a motor controller is described. The multilayer circuit board is preferably utilized as a power substrate module. The power substrate module includes a mounting area provided in a recess, window or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The single circuit board layer at the mounting area provides a heat conductive yet highly electrically insulated mounting area for receiving a heat sink. The heat sink can be mounted on a side opposite the electrical device. The heat sink may be standard heat sink or a copper coil directly soldered to the circuit board. The multilayer circuit board includes an enhanced conductive layer for receiving the surface mount device. The enhanced conductive layer preferably includes an insulative frame which holds copper slugs.

Abstract: A surface mount area-array integrated circuit package is disclosed. The package consists of a package substrate having conductive vias and internal and external conductive traces, a semiconductor die electrically and mechanically connected to the top surface of package substrate, an area-array of conductive surface mount terminations electrically and mechanically connected to the bottom of the package substrate, and at least one adhesive mass. The at least one adhesive mass is located on the bottom of the package substrate and replaces the conductive terminations in the area(s) where the joint strain energy density is calculated to be the greatest. When mounted on a substrate, the at least one adhesive mass adheres the package to the substrate. Increased mechanical and electrical reliability is thus achieved.

Abstract: A thermal board is used for bonding wires in semiconductor manufacturing process for providing high temperature to increase the wire bonding efficiency while preventing the die paddle of a lead frame from being oxidized. The thermal board has a base board and a platform disposed on the base board. The platform has a center portion defined therein a chamber to receive the die paddle. A plurality of supporting posts are formed on the bottom of the chamber to support the die paddle so that the die paddle does not directly contact with the bottom of the chamber.

Abstract: A heat sink adapted for use with an electrical and/or electronic device, in particular with a semiconductor chip such as an integrated circuits, or with a casing for such a device, is formed from a material including whiskers.

Abstract: A novel and apparatus for cooling, supporting, and packaging power electronics. An elongated heat exchanger having a rectangular cross-section may carry and cool plural electronic devices. Plural heat exchangers may be arranged to form a chassis for two-sided cooling. Electronic devices on the heat exchangers may be interconnected and configured using circuitry bonded to a power pack cover. Circuitry on the cover, e.g., for reducing internal inductance, CTE mismatch and preventing voltage overshoot at turn-off, may be cooled through physical connections with electronic devices carried by the heat exchangers.

Abstract: An integrated circuit package has a printed circuit board, a die mounted on the printed circuit board, and a heat spreader attached to the printed circuit board to cover the die and contact with the backside of the die. The heat spreader is formed by a piece body and a plurality of supporting leads extended downward from the periphery of the piece body. The supporting leads of the heat spreader are attached to the printed circuit board by surface mounting technology. The piece body of the heat spreader abuts on the backside of the die so that heat from the die can be conducted both upward to the outer environment and downward to the printed circuit board through the heat spreader, thereby enhancing the heat dissipation efficiency.

Abstract: A thermal vias-provided cavity-down IC package structure of the invention is provided. The thermal vias-provided cavity-down IC package structure includes a substrate, a heat sink and an adhesive layer for attaching the substrate to the heat sink. The substrate is formed of multiple layers of printed circuit boards which are attached to each other, and have a cavity formed at the center thereof. A plurality of thermal vias is formed surrounding the substrate. The head sink is divided into a chip mount area and a thermal via joint area. The chip mount area is used for a chip mount pad to be disposed thereon, wherein a chip is connected to the heat sink through the chip mount pad. The thermal via area is electrically coupled to the thermal vias thereby to form an approximate short path or a short path. Thus, heat energy is transferred not only by the heat sink directly, but also from the heat sink to the substrate through the thermal vias.

Abstract: A radiating device for an electronic appliance is provided with a plurality of embossed portions at surfaces thereof and vents in the embossed portions, portions thereof which are not embossed or the embossed portions and the portions thereof which are not embossed. Thus, the radiating device according to the present invention protects other components of the electronic appliance which are not strong enough to endure heat by rapidly radiating the heat generated from a transistor or an integrated circuit.

Abstract: A heat-dissipating module for dissipating heat generated by an electronic component includes a fan base formed with a fan mounting cavity, a heat-dissipating fan mounted in the fan mounting cavity, a heat-conducting plate adapted to contact a heat-dissipating side of the electronic component, and a connecting shaft having a mounting section that is mounted on the heat-conducting plate and a pivot section that extends from the mounting section and that is mounted pivotally on the fan base, thereby permitting movement of the heat-conducting plate toward and away from the heat-dissipating side of the electronic component.

Abstract: An integrated spring assembly having a first part for attachment to a miniature electric fan, a second part for attachment to a heat sink and a third part for attachment to a printed circuit board. A calibrated spring force is exerted by the first, second and third parts to insure efficient heat transfer from the printed circuit board to the heat sink.

Abstract: A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side, wherein the microelectronic die active surface includes at least one contact. A flex component is attached by a first surface to the microelectronic die active surface. At least one conductive trace is disposed on a second surface of the flex component and extends through the flex component to contact at least one of the contacts. An encapsulation material is adjacent the microelectronic die side and a bottom surface of the flex component. A moisture barrier is disposed on the flex component and the conductive trace(s). A second moisture barrier may be disposed on the encapsulation material. A heat dissipation device may also be incorporated into the chip-on-flex package.

Abstract: An external storage device includes an external storage device main includes a thin type external storage device module formed into a package sealed on one side from a storage element containing at least one non-volatile semiconductor memory device, and a flat type external connection terminal connected to an input/output terminal of the storage element and led and exposed to a backside of the module, and an external storage device unit that includes an external storage device main detachable section for engaging, insertedly attaching, and detaching the external storage device main, a resilient contact electrically connecting to the external connection terminal of the external storage device main, and at least a part of a circuit for driving and controlling the storage element.

Abstract: A method and apparatus are provided for mounting a Very Large Scale Integration (VLSI) chip such as a microprocessor on the back plane of a computer chassis. In one embodiment, the mounting on the computer chassis is configured to provide a current supply connection for delivering a high level of current to the microprocessor from a current source through the computer chassis. Also provided are a method and apparatus for mounting a VLSI chip such as a microprocessor on the chassis of a computer system in order to dissipate heat from the VLSI chip to the ambient outside the computer system through the computer chassis. Also provided are a method and apparatus for signal interconnections among one or several VLSI chips such as microprocessors mounted on the chassis of a computer to provide signal capacity with strong integrity. Also provided are a method and apparatus for mounting a power supply for a VLSI chip package on the back chassis of a computer.

Abstract: A heat sink assembly includes a heat sink having torque bars, the torque bars including lips and guides extending from the lips. A package is located between the heat sink and a circuit board. A heat sink retainer includes riser arms and ends connected to the riser arms, where the ends press against the lips. The riser arms press the guides towards the package and press apertures of the heat sink away from the package. In this manner, the retainer imparts torque on the heat sink which causes the heat sink to impart a downward force on the package. This downward force creates the thermal contact between the heat sink and the package.

Abstract: The heat sink fan for cooling a heat generating device as disclosed in the present invention is provided with a heat sink that is to be directly mounted on the heat generating device to thereby absorb or disperse the heat generated by the heat generating device, and a housing that is detachably engaged to the heat sink and equipped with a fan, which in turn creates air flow to forcibly cool the heat sink. The housing has a top wall portion and a pair of side wall portions extending vertically downwardly from both sides of this top wall portion, the side wall portions being disposed at both sides of the heat sink and provided with an engaging element at which tip an engaging projection is formed. The housing may be detachably coupled with the heat sink the engaging projection being permitted to engage a retaining means formed on a circuit board on which the heat sink or the heat generating device is mounted.

Abstract: Plural units each composed of a metallic frame and a dielectric substrate mounted on the frame are stacked on one another, thereby forming a unitary case. A superconducting circuit such as a resonator is formed on an upper surface of the substrate, and a ground plane, made of a metallic material, preferably, a superconducting material, is formed on a lower surface of the substrate. The ground plane is exposed to a center opening of the frame, so that the ground plane of one substrate faces the superconducting circuit of another substrate which is stacked underneath the one substrate with a space therebetween. Thus, a plurality of the superconducting circuits are mounted in a compact unitary case.

Abstract: Integrated circuit chip packaging modules and lid structures having improved heat dissipation performance are characterized by a customized lid understructure which enables a reduction in the amount of compliant thermally conductive material in the primary heat dissipation path. The lid structures and modules are made by processes wherein the lid understructure is customized for the chip(s) to be housed. The customization is achieved by the use of shims and a deformable lid understructure.

Abstract: The present invention provides a multiple-component clamp for use with multiple, heat-generating components and a heatsink. In one embodiment, the multiple-component clamp comprises a clamp body having first and second regions, and a deformable region positioned between the first and second regions. The deformable region allows the clamp body to adjust to a thickness of at least one of the heat-generating components to thereby provide substantially even clamping forces against each of the heat-generating components when the multiple-component clamp is affixed to the heatsink.

Abstract: An electronic cartridge which includes a cover. The cover is coupled to a substrate which has an integrated circuit package. A portion of the cover extends over and is spaced from a plurality of conductive pads located along an edge of the substrate. The conductive pads can be inserted into a card edge electrical connector that is mounted to a motherboard. The cover of the present invention protects the conductive pads while allowing the substrate to be plugged into a card edge connector.

Abstract: Aluminum heatsinks are plated with a solderable layer and are overplated with a solder release layer. The release layer comprises a tin-lead-indium alloy. The heatsinks are mounted on individual IC modules or banks of IC modules that are interconnected to a printed circuit card. A mechanically compliant, thermally conductive adhesive is used to join the heatsinks to the modules. An oxide formed on the release layer readily bonds with the thermally conductive adhesive. In the event that heatsinks need to be removed to repair or rework the modules, local heat may be applied to melt the release layer to remove a heatsink without need for use of significant applied torque and normal forces. Because the release layer has a low melting point that affords easy separation from the adhesive layer, both component delaminations and the partial reflow or melting of solder joints on adjacent components are eliminated from the heatsink removal process.

Abstract: A heat-dissipating structure for an electrical device comprises a PC board with a dissipating opening, and an electrical device. The PC board has an upper surface thereof and a lower surface thereof located opposite to the upper surface. The electrical device has a plurality of leads thereof extruding from a bottom surface thereof for anchoring the electrical device on the upper surface of the PC board with a substantial spacing in between. The dissipating opening is located under the electrical device for providing an air convection space to dissipate the heat generated by the electrical device. Also, dissipating plates can be installed above or under the PC board for enhancing the heat-dissipating efficiency.

Abstract: A line circuit module is disclosed which comprises effectively all of the required circuitry for a line card apart from mechanical components such as relays and edge card connectors. The module includes a small ceramic substrate 2.0 inches by 0.825 inches on to which surface mount components which include a heat sensitive integrated circuit and a field effect transistor are mounted to one side and thick film components which include two battery feed resistors are printed on an opposite side. Various innovative techniques are disclosed which significantly reduce compromising component thermal interactions. Heat concerns from using a small thermally conductive substrate have been managed through advantageous use of printed battery feed resistor layouts which provide for larger portions of heat to be dissipated in resistor portions removed from a heat sensitive integrated circuit than resistor portions adjacent to the heat sensitive integrated circuit.

Abstract: An array of electronic modules on the top of a circuit board is cooled by a heat sink secured to the bottom of the board. Vias transfer heat through the board to a compliant interface pad which permits heat to flow to the heat sink while maintaining electrical isolation between the vias. The heat sink is held on the board by push pin assemblies including springs that compress the interface pad between the circuit board and the heat sink. The body of each push pin assembly includes flexing legs supporting locking barbs, and flex of the legs is limited by a strut defining a closed end slot in the shank of the body.

Abstract: A power pack including a power device and driver circuit sandwiched between a base plate and a lid. The base plate and lid having flat exterior surfaces for bonding with heat exchangers and/or an external bus to provide both two-sided cooling and two-sided electrical access. The driver circuit and power device are spaced apart to allow parallel and separate thermal conduction paths to both the base plate and lid. The power pack further including a seal enclosing the power device and driver circuit between the base plate and lid.

Abstract: A sealing resin mixed with filler is used to seal a space between a flip-chip mounted semiconductor device and a printed circuit board. An integrated circuit chip joined to the printed circuit board by metal bumps, has the sealing resin interposed in the space between the chip and the board. The density of the filler in the sealing resin varies such that there is a relatively greater amount of filler at or near the integrated circuit chip. This allows the coefficient of thermal expansion of the resin layer adjacent the chip to better match the coefficient of thermal expansion of the silicon which makes up the chip.

Abstract: An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.

Abstract: High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding pads. A printed circuit board for mounting semiconductor chip(s) includes conductive traces on both sides of a base material, the first traces on a first surface of the base material having first bonding pads, the second traces on a second opposite surface of the base material having the second bonding pads. The bonding pads are located in rows adjacent each other with the base material having openings leading to the second bonding pads, such that chip bonding wires are connectible from the chip directly to the first bonding pads and through the openings to the second bonding pads.

Abstract: A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region and installed in a socket, is provided. A clip member is provided with a central female-threaded bore. A collar, having outer male threads and inner female threads is threadably receivable within the bore of the clip member. The collar is threaded down into the bore to communicate with an upper surface of the ceramic portion of a semiconductor device at a first pressure which is high enough to maintain the package in electrical communication with its socket. A heat dissipating member, having a male-threaded base, is threadably installed into the female-threaded bore of the collar to engage the upper surface of the silicon portion of the semiconductor package.

Abstract: Provided is a multi-piece integrated heat spreader/stiffener assembly which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener assembly has two pieces, both composed of a high modulus, high thermal conductivity material shaped to attach to each other and a die on the surface of a packaging substrate. A first piece of this assembly is bonded to the substrate surface adjacent to an electrically connected die and to the top surface of the die prior to the dispensation and curing of underfill material which provides the mechanical connection between the die and the substrate. With the first piece of the assembly in place, access may still be had to at least one edge of the die to dispense and cure the underfill epoxy.

Abstract: A die-down HBGA package includes an integrated-circuit die mounted to a substantially flat lower surface of a die-carrier/heat spreader. A flexible insulated tape layer with a central opening for the die has its upper surface adhesively fixed to the lower side of the die-carrier/heat spreader. Wire-bonding sites and a number of contact areas are connected by traces on the lower surface of the tape layer. Bonding-wire loops are connected between the wire-bonding pads on the die and the wire-bonding sites on the insulated tape layer. A rigid board, such as an epoxy or ceramic circuit board, with electrically conductive plated-through holes is fixed to the insulated flexible tape layer with adhesive. Conductive adhesive material connects the contact areas with the top surfaces of the plated-through holes. Alternatively, pins join the carrier/heat spreader and the rigid circuit board. Solder pads for solder balls are formed on the bottom surface of the printed-circuit board.

Abstract: According to the invention, a common connecting clip (5) is used in the cse of connecting two or more power semiconductors (4) on a board (3) to a cooling plate (1).

Abstract: A semiconductor package includes a semiconductor die, a lead frame and die attach paddle, and a thermally conductive metal foam porous sponge attached to the die attach paddle to conduct heat generated by operation of the die to the outside of the semiconductor package. In another embodiment the chip is mounted directly on the sponge. A flip-chip interconnection is also disclosed. In the method, a die and lead frame assembly is placed on a sponge in the cavity of a package two-part mold, the mold is closed and filled with encapsulant. A ball grid array semiconductor package with an internal sponge heatsink mounted directly on or in a substrate such as a printed circuit board with circuitry metallization, and a semiconductor die, wire-bonded or soldered to the metallization and adhered to the sponge heatsink, is also included.

Abstract: The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

Abstract: The present invention provides printed circuit boards for mounting to a semiconductor integrated circuit die. In one embodiment the printed circuit boards comprise a rigid dielectric substrate having a planar face, a plurality of circuit lines affixed to the face of the substrate, and a plurality of conductive bumps affixed to the face of the substrate. Each conductive bump has an upper bonding surface that is substantially planar and a lateral surface which is essentially perpendicular to the face of the substrate. The conductive bumps and the circuit lines are formed from a single metallic layer. The conductive bumps and circuit lines constitute a unitary, integral structure, i.e., each conductive bump and connecting circuit line lack a physical interface therebetween. The upper surfaces of the conductive bumps extend to essentially the same height above the surface of the substrate, i.e., the upper surfaces of the conductive bumps are substantially coplanar relative to each other.

Abstract: A system for securing an electronic component, such as a CPU, includes a support extending substantially in a plane and a fastener coupled to the support. The support may be a heat sink secured to a component for dissipating heat generated during operation of the component. The fastener extends through extensions or fins of the heat sink, generally parallel to the plane of the heat sink and component package. A biasing spring urges the fastener toward a disengaged position. A biased retainer maintains the biasing spring and fastener within the assembly. The component is initially engaged in a receiving socket for installation. The fastener is then engaged in the mechanical support to draw the component into full engagement. A reference surface on the securement assembly contacts the mechanical support to limit engagement of the component. The fastener may include a torque-limiting assembly for limiting the torque applied to the mechanical support upon full engagement of the component.

Abstract: The present invention provides a structure and a method of fabricating a thermoelectric Cooler directly on the backside of a semiconductor substrate. The thermoelectric (TE) cooler (thermoelectric cooler) disperses heat from an integrated circuit (IC) that is formed on the front-side of the silicon substrate. Spaced first bonding pad holes 28 are formed in the backside of a substrate that expose bonding pads 24. Second holes 32 are formed between the spaced first bonding pad holes 28. A first insulating layer 34 is formed over the backside of the substrate, but not over the bonding pad 24. A metal layer is formed lining the first bonding pad holes 28. A polysilicon layer 46 is formed over the surface of the backside of the substrate in the second holes. The polysilicon layer is implanted thereby forming alternating adjacent N and P doped sections 46p 46n in the second holes. The adjacent N and P doped polysilicon sections 46n 46p are electrically connected to the bonding pads 24 by the metal layer 38.

Abstract: A heat sink mounting device for closely attaching a heat sink to a CPU which has been mounted to an electrical connector, consists of two mounting ears formed on the electrical connector. A clip has an arced middle portion pressing the heat sink toward the CPU, a first arm vertically extending from an end of the middle portion to fixedly engage with one of the mounting ears, and a second arm defining a handle portion for receiving a pressing force. A flap has an upper end pivotably engaging with the second arm and a lower end fixedly engaging with the other mounting ear.

Abstract: A reworkable circuit board assembly including a flip chip adapted for removal in the event of a failure and a method for fabricating the same is disclosed. The reworkable circuit board assembly includes a heat sink having a coefficient of thermal expansion substantially matched to the coefficient of thermal expansion of the flip chip. It also includes a deformable circuit board having a first side and a second side, wherein the first side is secured to a side of the heat sink in thermal communication therewith. The flip chip is bonded to the second side of the deformable circuit board without underfill or with weak bond strength underfill to facilitate removal of the flip chip in the event of a rework.

Abstract: A quad flat pack (QFP) integrated circuit package that is modified to include a tab that increases the thermal efficiency of the package. The package contains an integrated circuit that is mounted to a die paddle of a lead frame. A plurality of leads extend from a first side of the die paddle. Placing all of the leads on one side of the package minimizes the difference in signal length between the leads. The tab extends from a second side of the die paddle. Both the leads and the tab extend from a plastic housing which encapsulates the integrated circuit. The tab provides a large conductive area which increases the heat transfer rate from the integrated circuit to the ambient, or an external thermal element.

Abstract: A cooling device for a machine, especially, but not limited to, a device for cooling the central processing unit (CPU) of a desktop computer, thereby increasing the speed at which it can operate. In the preferred embodiment, the cooling device includes a copper evaporation chamber and a conduit made of copper pipe having a condensation coil, which are connected in a single closed loop, and contain water. As heat is absorbed by the evaporation chamber from the CPU or other heat generating component, the water changes from liquid to gas, and gravity and pressure differences cause the water to circulate through the conduit. As heat is transferred from the conduit to its surroundings, the water changes from gas to liquid, and returns to the evaporation chamber. The high heat of vaporization and condensation of water allows heat to be efficiently transferred with a small difference in temperature between its liquid and gaseous states.

Abstract: A semiconductor component includes a leadframe (11, 40) having leads (12, 41) and a ground plane (13, 42) wherein the ground plane (13, 42) has an opening (15, 45). A semiconductor substrate (21) is located in the opening (15, 45) and is approximately coplanar with the ground plane (13, 42). The coplanarity shortens the ground plane wire bonds (23) and improves the electrical performance of the semiconductor component.

Abstract: An apparatus for dissipating heat transferred to a circuit board. A board on which to mount an electronic device includes a conductive layer. A first board heat dissipation element is thermally coupled to the conductive layer and extends away from a surface of the board to dissipate heat from the conductive layer to the ambient.