Abstract: A semiconductor package is provided with a low thermal conductivity plate that covers an entire upper surface of a heat dissipating component, by which heat dissipation from the heat dissipating component can be inhibited during a reflow process. Accordingly, sufficient heat can be transmitted to solder balls, so as to heat the solder balls up to a desired temperature. As a result, the semiconductor package and a substrate can be fully bonded via the solder balls, and thereby an excellent mounting performance is achieved.

Abstract: A radio frequency transceiver having a printed circuit board (PCB) on which are located a plurality of components, the PCB being sandwiched between a base and a cover. The cover having a plurality of components for accommodating each of the plurality of components to separate the plurality of components into a number of virtual modules. All interconnects between the number of virtual modules are in the PCB. The PCB has a radio frequency (RF) layer, a RF ground layer, a direct current (DC) layer, and a DC ground layer. There is a plurality of via holes from the RF ground layer to the DC ground layer to provide virtual RF ground.

Abstract: A system is provided for heat sinking and environmental dissipation of heat generated by one or more ICs mounted to a printed circuit board. The system includes a primary thermally conductive plate and one or more thermally conductive discs attached to the primary plate. The one or more thermally conductive discs make intimate contact with the one or more ICs mounted to the printed circuit board such that the heat generated by the one or more ICs in operation transfers through the one or more discs and onto the plate, whereupon the heat laterally distributes across the primary plate and dissipates into the environment.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.

Abstract: A printed circuit board structure for heat dissipation of an integrated circuit includes a printed circuit board having an opening, and a thermal conductive material disposed within the opening, wherein the integrated circuit is disposed over the opening and the thermal conductive material is thermally connected to the integrated circuit. The opening can be designed to have a specific shape to allow the opening to be completely filled by the thermal conductive material during a fillet process, therefore obtaining better heat dissipation performance and protecting the integrated circuit from over heating.

Abstract: In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processability. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.

Abstract: An embodiment of the present invention is a technique to fabricate a package. A heat spreader (HS) array on a HS support substrate is formed. The HS array has a plurality of heat spreaders. A diced wafer supported by a wafer support substrate (WSS) is formed. The diced wafer has a plurality of thin dice. The thin dice in the diced wafer are bonded to the heat spreaders in the HS array to form HS-bonded thin dice between the HS support substrate and the WSS.

Abstract: According to one embodiment, a cooling device includes: a heat transfer unit including a passage, through which a coolant circulates, a heat-receiving section, which is thermally connected to a heating element, and a heat-sinking section for dissipating heat received by the heat-receiving section; a heat dissipation member thermally connected to the heat-sinking section; and a fan that blows air to the heat dissipation member. The heat transfer unit includes: a first plate member, in which a groove corresponding to the passage is formed; and a second plate member, which covers the groove. The heat-receiving section and the heat-sinking section are provided on one of the first and second plate members. The fan is provided on one side of the first or second plate member that is provided with the heat-receiving section and the heat-sinking section.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: A thermal dissipating module comprises a heat pipe with a first end and a second end, a first joint component connected to the first end, a second joint component connected to the second end, a first thermal conductive plate, and a second thermal conductive plate. It also can be used in an electronic apparatus with a thermal dissipating module.

Abstract: The 3D chip-stack package comprises a component-embedded plate and a side IC. The PCB has a plurality of conductive contacts. The component-embedded plate comprises a dielectric layer; an active component embedded in the dielectric layer, one surface of each active component exposed outside the dielectric layer, the active components having a plurality of TSVs (Through Silicon Via), one ends of the TSVs exposed outside the exposed surface, the other ends of the TSVs corresponding to the conductive contacts of the PCB; and an electrical circuit on the dielectric layer and in electrical connection between the other ends of the TSVs of the active component and the corresponding conductive contacts of the PCB, respectively. The side IC has a plurality of pads. The pads are electrically connected with the exposed ends of the TSVs of the active component.

Abstract: A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is provided. The IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate. The substrate includes a hole approximate an outer edge of the IC die. The first side of the substrate is then positioned in contact with at least a portion of the first side of the backplate. The IC die is positioned within the cavity with a second side of the IC die in thermal contact with the backplate. The substrate and at least a portion of the backplate are overmolded with an overmold material, which enters the cavity through the hold to substantially underfill the IC die and substantially fill an unoccupied portion of the cavity.

Abstract: An inverter type drive unit for feeding AC electric power of variable parameters to an electric motor has an electronic control section, and a power converting and output section which includes one or more identical power modules, each forming a complete 3-phase output stage. The power modules are arranged side-by-side in a multiplying direction and are clamped by retaining devices to a cooling structure. The power modules are connected in parallel to DC input terminals and to AC output terminals via conductive sheets which are insulated from each other. The DC connected conductive sheets cover substantially the entire physical surface area covered by the power modules so as to accomplish an even, simultaneous and low impedance DC current supply to all power modules.

Abstract: The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area.

Abstract: A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink.

Abstract: Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of thermally coupling to heat generating components and adapted to transfer heat from the heat generating components is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

Abstract: On a connection surface 2 of a base substrate 1 composed of a material including Cu, a heat spreader includes a Ni plating layer 3 having a high Cu region 5 where the content of Cu is not less than 1% by mass, in a range of not more than 2 ?m in the thickness direction from an interface with a base substrate 1, and the content of Cu in a foremost surface 6 of the Ni plating layer 3 is less than 0.5% by mass, and the adhesion strength of the Ni plating layer 3 to the base substrate 1 is not less than 90 N/mm2. A semiconductor device includes a semiconductor element, and the heat spreader for removing heat generated when the semiconductor element is operated. In a manufacturing method, a first plating layer to form the high Cu region is formed on the connection surface 2 of the base substrate 1 and heat-treated at a temperature of more than 600° C., and a second plating layer is then formed thereon and heat-treated at a temperature of not more than 600° C.

Abstract: Near net shape heat spreader components are disclosed that comprise at least one pressure-treated powder material. Heat spreaders are also described that include at least one near net shape heat spreader component, and at least one additional part. Methods of forming heat spreaders are also described that include: a) forming a base portion comprising a pressure-treated powder material and having a first surface comprising a perimeter region surrounding a heat-receiving surface; b) forming a frame portion comprising a second material; and c) joining the base portion and the frame portion.

Abstract: In one embodiment, there is disclosed apparatus having a printed circuit board (PCB); a heat sink device for disposition adjacent the bottom surface of the PCB; at least one wiffle tree component disposed adjacent the top surface of the PCB, having a base portion with a plurality of legs extending therefrom; and at least one mechanism to generate a clamping force between the at least one wiffle tree and the top surface of the PCB, and between the bottom surface of the PCB and the heat sink. There is disclosed a method of attaching a printed circuit board (PCB) to a heat sink. In an embodiment, the method includes providing at least one wiffle tree component; disposing one of the at least one wiffle tree component adjacent to the PCB; and securing the one of the at least one wiffle tree component with a fastener. Other embodiments are also disclosed.

Abstract: An electronics unit includes a low multi-point metallic mount on which an insulating layer is arranged. A conductor track system is arranged on the insulating layer and electronic power components are arranged on the conductor track system. The insulating layer is a sintered electrically insulating polymer layer on which the conductor track system, which comprises a sintered glass frit with a noble metal filling, is arranged.

Abstract: A retaining tool for a heat sink includes a frame, at least an operation member and at least an engaging member. The frame is attached to an upper portion of the heat sink with a projection at two opposite sides thereof and the projection has a contact face. The operation member provides a main operation part and a stir part. The main operation part is disposed on top of the contact face and the stir part is angularly lifted for the main operation part being capable of moving relative to the contact face. The engaging member further has a follower part piercing the projection with an end of the follower part connecting with the main operation part pivotally and another end of the follower part being joined to a first elastic part and a second elastic part respectively.

Abstract: The invention comprises a process for joining a first surface and a second surface where the first surface comprises an initially non-solderable surface which comprises coating the first surface with a solder-adhesion layer to produce a solder-adhesion layer on the first surface and providing a Thermal Interface Material (“TIM”) composition comprising solderable heat-conducting particles in a bondable resin matrix where at least some of the solderable heat-conducting particles comprise a solder surface. The TIM composition is placed between the first surface and the second surface to extend between and be contiguous with both the second surface and the solder-adhesion layer on the first surface. Sufficiently heating the TIM composition results in (a) soldering at least some of the solderable heat-conducting particles to one another; and (b) soldering at least some of the solderable heat-conducting particles to the solder-adhesion layer on the first surface.

Abstract: Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices.

Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs.

Abstract: An improved electromagnetic radiation (EMR) shield that has minimal airflow resistance is presented. The EMR shield includes: a base plate; and plurality of columns that project away from the base plate, wherein each of the columns has a first end that is attached to the base plate, a second end that is distal to the base plate, and a side surface that has at least one side hole therein.

Abstract: A thermal conducting device removes heat from a power dissipating device installed within a case, and includes a base coupled to the power dissipating device and a translational portion that is movable in a vertical dimension. The translational portion couples at an upper surface to the inner surface of the case panel. A cavity and piston in the base and the translating portion may provide complementary guide surfaces to constrain movement of the translational portion generally to a vertical dimension. A biasing element may urge the translational portion upward. The translational portion and the external panel may allow movement of their respective surfaces relative to one another. The cavity may include a port allowing air to pass into and out of the cavity. The upper surface of the translational portion may be tiltable with respect to the base. An adhesive layer may couple the base and the power dissipating device.

Abstract: In one embodiment, an apparatus comprises a semiconductor device a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an alloy having a low indium content.

Abstract: To provide a vehicular power converter with high reliability by effectively radiating heat generated in a power circuit section and control circuit section without using a cooling fan. The vehicular power converter includes a power circuit section provided with a switching element; a control circuit section for controlling the switching element; and a housing for accommodating the power circuit section and the control circuit section, wherein a first heat conducting layer intervenes between a base plate having a first heat exchange section for cooling the power circuit section and the power circuit section; a second heat conducting layer intervenes between a cover having a second heat exchange section for cooling the control circuit section and the control circuit section; and the first heat exchange section and the second heat exchange section are disposed on one main surface side and on the other main surface side of an outer circumferential surface part of the housing, respectively.

Abstract: A plasma display device for keeping cooling efficiency of the device uniform between both horizontal and vertical positions. The plasma display device, which has a plasma display panel and a circuit unit for supplying a driving signal to the panel, includes a cavity-type heat dissipator having a plate which is located near a portion of the circuit unit to dissipate heat generated at the circuit unit, and wings which are affixed to the plate and extend from the edges of the plate inward.

Abstract: A service tray for a thermal management system for providing convenient access to components within a liquid thermal management system. The service tray for a thermal management system includes a chassis with an opening and a support unit slidably positioned within the opening. The support unit receives various thermal management devices such as a coolant pump, a filter, a heater and the like. A first rail and a second rail are attached within the interior of the chassis that movably receive a first guide and a second guide of the support unit respectively. Electrical and fluid connectors attached to the chassis and the support unit allow for the connection of the thermal management devices on the support unit to the chassis.

Abstract: A heat dissipation device includes a base and two heat sinks formed by aluminum extrusion and located on the base. Each heat sink includes a heat conducting portion. The two heat sinks include a plurality of first fins extending inwardly from first faces of the heat conducting portions and located between the heat conducting portions, and a plurality of second fins extending outwardly from second faces of the heat conducting portions. Two heat pipes connect the base and the two heat sinks. Each heat pipe includes a first section thermally engaged with the base, and two second sections extending from the base and thermally engaged with the heat conducting portion of a corresponding heat sink. The second sections are located outside a hub and below fan blades of an impeller of a fan mounted on the heat sinks.

Abstract: Integrated circuit-chip hot spot temperatures are reduced by providing localized regions of higher thermal conductivity in the conductive material interface at pre-designed locations by controlling how particles in the thermal paste stack- or pile-up during the pressing or squeezing of excess material from the interface. Nested channels are used to efficiently decrease the thermal resistance in the interface, by both allowing for the thermally conductive material with a higher particle volumetric fill to be used and by creating localized regions of densely packed particles between two surfaces.

Abstract: The present invention relates generally to apparatus and methods for cooling semiconductor integrated circuit (IC) chip package structures. More specifically, the present invention relates to apparatus and methods for thermally coupling semiconductor chips to a heat conducting device (e.g., copper thermal hat or lid) using a compliant thermally conductive material (e.g., thermal paste), wherein a thermal interface is designed to prevent/inhibit the formation of voids in the compliant thermally conductive material due to the flow of such material in and out from between the chips and the heat conducting device due to thermal cycling.

Abstract: A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

Abstract: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

Abstract: An airflow baffle apparatus for a forced-air cooled computer system is comprised of a linearly inflating airflow baffle bladder with a fixable surface and a topologically self-adjusting compliant surface. The linearly inflating airflow baffle bladder is couplable with the computer system. The fixable surface of the linearly inflating airflow baffle bladder is fixedly couplable to a first interior surface of the computer system. The topologically self-adjusting compliant surface of the linearly inflating airflow baffle bladder is couplable to an internal topology of the computer system in response to inflation of said linearly inflating airflow baffle bladder.

Abstract: A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one of a plate shape metallic member and a recessed metallic member on the electronic component by a selected one of vapor deposition processing and plating processing, forming the other of the plate shape metallic member and the recessed metallic member on the heat dissipating member by a selected one of vapor deposition processing and plating processing, and filling a liquid metal in the recessed part of the recessed metallic member thereby to form the liquid metal, the plate shape metallic member and a part of the recessed metallic member into a solid solution.

Abstract: A cooling apparatus and a direct cooling impingement module are provided, along with a method of fabrication thereof. The cooling apparatus and direct impingement cooling module include a manifold structure and a jet orifice plate for injecting coolant onto a surface to be cooled. The jet orifice plate, which includes a plurality of jet orifices for directing coolant at the surface to be cooled, is a unitary plate configured with a plurality of jet orifice structures. Each jet orifice structure projects from a lower surface of the jet orifice plate towards the surface to be cooled, and includes a respective jet orifice. The jet orifice structures are spaced to define coolant effluent removal regions therebetween which facilitate removal of coolant effluent from over a center region of the electronic component being cooled to a peripheral region thereof, thereby reducing pressure drop across the jet orifice plate.

Abstract: A cover is mounted to a heat-generating electronic part (T) for electrical insulation and heat dissipation purposes. The cover comprises a hollow cover body (20) of rectangular prism shape having a top wall (23), bottom wall (24), side walls, open front wall (21) and closed rear wall (22) and defining a hollow interior (27) into which the electronic part (T) is to be inserted. The interior has sufficient dimensions to accommodate the electronic part. The top and bottom walls are formed flat for slidable contact with the electronic part. The bottom wall is at least 0.1 mm thicker than the top wall.

Abstract: Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.

Abstract: A synthetic jet array in a computing device, such as a mobile computing device, to dissipate heat generated by a heat generating component of the mobile computer is described. In one embodiment, a microscale synthetic jet array is integrated within a heat generating component, either on the backside of the heat generating component itself or on a heat spreader coupled to the heat generating component. A method of fabricating a synthetic jet array as an integrated part of a computing device or as a heat spreader is described, as well as a method of use of the synthetic jet array, are described.

Abstract: A cooling structure for interface card for cooling the heating component on an interface card includes a heat sink, a metallic hood, and a water block, wherein the heat sink has a heat conducting seat and a plurality of cooling fins, while the heat conducting seat is attached to the heating component of the interface card. Furthermore, the metallic hood arranged on the heat sink is connected thereto. Finally, the water block is arranged on the metallic hood; thereby, the operational heat, generated from the heating element, is absorbed by the heat-conducting seat and is then conducted to the fins of the heat sink, so that the operational heat is distributed to the metallic hood by heat conducting process, making the operational heat that is generated by the heating component carried away through the heat exchanging function of the water block, and thus a desired cooling effectiveness is achieved.

Abstract: A cooling device for interface card for cooling a heating component on an interface card includes a heat sink and a water cooling head, wherein the heat sink has a heat conducting seat and a plurality of cooling fins. A cooling flow path is formed between any two adjacent cooling fins. In addition, the water block is attached onto the plural cooling fins of the heat sink. Thereby, the operational heat, generated from the heating element, is firstly absorbed by the heat-conducting seat and is then distributed uniformly cross to the plural fins. In addition to the heat dissipation proceeded between the fins and the ambient air, the operational heat is further conducted to the water block, undergoing a heat exchange with the coolant flowing in the water block, and thus a desired cooling effectiveness is achieved.

Abstract: A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A compressible compliance layer is interposed between the one major surface of each IC device and the associated socket into which the IC device is inserted. The module further comprises a single heat sink having a surface in heat transfer relationship with the other of the major surfaces of the IC devices. Also disclosed is an IC device package comprising an IC device including interconnect pins projecting from the device, a socket comprising contact receptacles for receiving the interconnect pins, and a compressible compliance layer interposed between the IC device and the socket, the interconnect pins projecting through the compliance layer and into the contact receptacles in the socket.

Abstract: A heat sink uses a ferrofluid-based pump assembly for controlling the direction of nanofluid flow within the heat sink. The nanofluid is thermally conductive and absorbs heat from a heat source, which is then directed away from the heat source by the ferrofluid-based pump assembly. The ferrofluid-based pump assembly uses a motor to rotate at least one magnet so as to rotate ferrofluid contained in the ferrofluid-based pump assembly. The direction of nanofluid flow within the heat sink is dependent on the movement of ferrofluid in the ferrofluid-based pump assembly.

Abstract: A heat-dissipating device includes a mounting seat and a plurality of tapered heat-dissipating fins. The mounting seat is made of a thermally conducting material, and has an inner side surface adapted to be in thermal contact with a heat source, and an outer side surface. The heat-dissipating fins extend from the outer side surface of the mounting seat in a direction away from the mounting seat. Each of the heat-dissipating fins has a proximate end proximate to the mounting seat, and a distal end distal from the mounting seat. The thickness of each of the heat-dissipating fins reduces gradually from the proximate end to the distal end. The distance between any two adjacent ones of the heat-dissipating fins increases gradually in the direction.

Abstract: An apparatus for attaching a processor and corresponding heat sink to a circuit board includes a board member, a frame member mounted on the board member, a plurality of connector portions on the frame member, and a resilient load member. The resilient load member has a first end moveably connected to one of the connector portions and a second end forcibly connected to another one of the connector portions. A processor socket is mounted on the board member and a processor is seated in the processor socket. Forcible connection of the second end to its connector portion deforms the load member into engagement with the processor and urges the processor into the processor socket. A heat sink is mounted to the frame member and in thermal contact with the processor.

Abstract: An apparatus includes an integrated circuit (IC) package and a heat sink having a base and a plurality of fins extending from the base. The apparatus further includes a plurality of heat pipes. Each heat pipe has a first end and a second end. The first ends of the heat pipes are thermally coupled to the IC package, and the second ends of the heat pipes are thermally coupled to the base of the heat sink to transfer heat from the IC package to the heat sink.

Abstract: A semiconductor device according to an embodiment of the present invention comprises a packaging substrate mounted with semiconductor chips; a heat dissipation metal plate having three or more sides and mounted with the packaging substrates; a frame provided along an external periphery of the heat dissipation metal plate and encircling the packaging substrates; an adhesive provided to between the heat dissipation metal plate and the frame to bond the heat dissipation metal plate and the frame together; and a sealing resin sealing the semiconductor chips and the packaging substrates within a box formed by the heat dissipation metal plate and the frame, wherein the volume of the adhesive at corners of the heat dissipation metal plate is smaller than that on the sides thereof.