Plural Patents (Class 361/721)
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Patent number: 8331094Abstract: A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.Type: GrantFiled: January 24, 2011Date of Patent: December 11, 2012Assignee: Oracle International CorporationInventors: Seshasayee Ankireddi, Vadim Gektin
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Publication number: 20120300409Abstract: A tube includes a tube body and a heat-dissipating member. A light-emitting module and a first electronic component connected electrically to the light-emitting module are disposed in the tube body. At least one opening is formed on the tube body in correspondence to the first electronic component. The heat-dissipating member is placed over the opening. The heat-dissipating member provides a first heat-dissipating path for the first electronic component.Type: ApplicationFiled: April 20, 2012Publication date: November 29, 2012Applicants: LITE-ON TECHNOLOGY CORPORATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.Inventor: TSUNG-CHI LEE
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Patent number: 8289715Abstract: A plasma display device is provided with a chassis supporting a PDP on its front surface, circuit boards located within a specific region of the back surface of the chassis, a back cover including an edge portion covering the outside of the specific region of the back surface of the chassis and a projecting portion accommodating the plurality of the circuit boards, and a fan arranged inside a space defined by the projecting portion. The peripheral wall of the projecting portion is provided with a plurality of air inlets and a plurality of air outlets.Type: GrantFiled: August 26, 2010Date of Patent: October 16, 2012Assignee: Panasonic CorporationInventor: Ichiro Takahara
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Patent number: 8274792Abstract: A 3-Dimensional multi-layered modular computer (3DMC) is disclosed that comprises removable layers of at least one CPU layer, at least one volatile memory layer, and at least one Input/Output (I/O) interface layers. The layers are stacked in parallel and are electrically connected to create a computing apparatus. Each of the layers is formed from encapsulating material having one or more internal cavities for chip dice, passive components, active components, and conductor's traces. A plurality of Thermal Conducting Rods (TCRs) is capable of conducting and removing heat generated by the components in the layers from the 3DMC apparatus to an external medium. Each TCR perpendicularly passes through the layers.Type: GrantFiled: September 6, 2006Date of Patent: September 25, 2012Assignee: Beyond Blades Ltd.Inventor: Aviv Soffer
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Patent number: 8254123Abstract: A mounting apparatus for mounting an expansion card to a printed circuit board (PCB), includes a connector on the PCB, and a latch member pivotably connected to the connector. The connector defines a slot to receive the expansion card. The latch member is a rectangular wire frame comprising a lock portion, two connection arms extending down from the lock portion, and two pivot portions extending from distal ends of the connection arms toward each other. The pivot portions are pivotably attached to two sidewalls of the connector. After the expansion card is plugged into the slot of the connector, the latch member is pivoted to make the lock portion press against a portion of the expansion card, thereby locking the expansion card to the connector.Type: GrantFiled: September 13, 2010Date of Patent: August 28, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventor: Zheng-Heng Sun
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Patent number: 8238104Abstract: A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. At least one of the fins to which the computer systems are coupled extends from the base module such that the fin has a primarily vertical orientation. An electrical power bus in the base module supplies power to computer systems of the fin modules. The site of operation may be indoors, out of doors, or in a limited shelter.Type: GrantFiled: August 9, 2010Date of Patent: August 7, 2012Assignee: Amazon Technologies, Inc.Inventor: Isaac A. Salpeter
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Patent number: 8238094Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.Type: GrantFiled: March 28, 2011Date of Patent: August 7, 2012Assignee: Juniper Networks, Inc.Inventors: Gunes Aybay, David J. Lima, Olaf Moeller
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Publication number: 20120162922Abstract: In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.Type: ApplicationFiled: December 22, 2010Publication date: June 28, 2012Applicant: Raytheon CompanyInventors: Scott R. Cheyne, Jeffrey Paquette, Mark Ackerman
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Patent number: 8208252Abstract: A computer system has a chassis, a plurality of interconnected panels mounted on the chassis in a manner defining an interior space at least partially encompassed by the panels, a circuit assembly, an electrically-powered fan within the interior space, and an energy conversion device mounted within the interior space. One or more of the panels has an airflow opening therein. The circuit assembly is mounted on the chassis within the interior space and includes a heat generating system component. The heat generating system component includes a surface from which energy in the infrared (IR) electromagnetic spectrum is emitted during operation thereof. The energy conversion device is configured for converting the emitted infrared energy to electrical energy and is electrically connected to the electrically-powered fan for providing the electrical energy thereto.Type: GrantFiled: November 5, 2009Date of Patent: June 26, 2012Assignee: Alcatel-Lucent USA Inc.Inventor: Eric W. Tolliver
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Patent number: 8199510Abstract: A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.Type: GrantFiled: January 12, 2010Date of Patent: June 12, 2012Assignees: National Chip Implementation Center, National Applied Research LaboratoriesInventors: Chun-Ming Huang, Chien-Ming Wu, Chih-Chyau Yang, Shih-Lun Chen, Chin-Long Wey, Chi-Shi Chen, Chi-Sheng Lin
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Patent number: 8179674Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.Type: GrantFiled: May 28, 2010Date of Patent: May 15, 2012Assignee: International Business Machines CorporationInventors: John B. Carter, Wael R. El-Essawy, Elmootazbellah N. Elnozahy, Madhusudan K. Iyengar, Thomas W. Keller, Jr., Jian Li, Karthick Rajamani, Juan C. Rubio, William E. Speight, Lixin Zhang
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Publication number: 20120106089Abstract: A wireless network receiver includes a heat-dissipating unit, a wireless network receiving module, an electrical connecting unit, and a shell unit. The heat-dissipating unit has at least one main heat-dissipating body and a front heat-dissipating body extended forward from the main heat-dissipating body. The wireless network receiving module is disposed on the heat-dissipating unit, and the wireless network receiving module includes a first substrate unit and a second substrate unit electrically connected to the first substrate unit. The electrical connecting unit includes an electrical connecting casing contacting the front heat-dissipating body and enveloping the front heat-dissipating body and a front portion of the first substrate unit. The shell unit includes a shell module for selectively exposing or hiding the electrical connecting unit.Type: ApplicationFiled: November 2, 2010Publication date: May 3, 2012Applicant: BANDRICH, INC.Inventor: CHUN-YU HSU
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Patent number: 8169782Abstract: An electronic circuit device that suppresses deformation of an adhesive layer of a flexible printed circuit board during formation of a resin seal portion, and suppresses deterioration of the circuit board caused by deformation of the adhesive layer. The electronic circuit device includes a substrate mounted with an electronic component; a flexible printed circuit board electrically connectable to the substrate and an external device, and includes a wiring conductor and a pair of insulation films covering upper and lower surfaces of the wiring conductor; and a resin molding portion to seal the substrate and a portion of the circuit board. The wiring conductor of the circuit board is adhered through an adhesive layer to at least one of the pair of insulation films, and a dummy wiring material that does not function as wiring is disposed on an outer side of a border between the circuit board and an outer peripheral portion of the plastic molding portion, and disposed between the pair of insulation films.Type: GrantFiled: June 11, 2010Date of Patent: May 1, 2012Assignee: Aisin AW Co., Ltd.Inventors: Ryohei Takahashi, Naotaka Murakami, Keiichi Tominaga
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Patent number: 8164902Abstract: An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.Type: GrantFiled: August 19, 2009Date of Patent: April 24, 2012Assignees: Hitachi, Ltd., Hitachi Plant Technologies, Ltd.Inventors: Hitoshi Matsushima, Tadakatsu Nakajima, Takayuki Atarashi, Yoshihiro Kondo, Hiroyuki Toyoda, Tomoo Hayashi, Akio Idei, Shigeyasu Tsubaki, Takumi Sugiura, Yasuhiro Kashirajima
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Publication number: 20120087095Abstract: A power module according to the present invention includes: a semiconductor element for converting DC current to AC current by switching operation; an electrical wiring board to which the semiconductor element is electrically connected, with the semiconductor element being disposed upon one of its principal surfaces; an insulating resin layer provided on the other principal surface of the electrical wiring board; a first insulation layer that is disposed opposite from the electrical wiring board, separated by the insulating resin layer, and that is joined to the insulating resin layer; a second insulation layer that is disposed opposite from the insulating resin layer, separated by the first insulation layer, and that ensures electrical insulation of the semiconductor element; and a metallic heat dissipation member that is disposed opposite from the first insulation layer, separated by the second insulation layer, and that radiates heat generated by the semiconductor element via the electrical wiring board, tType: ApplicationFiled: April 16, 2010Publication date: April 12, 2012Applicant: Hitachi Automotive Systems, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Toshiya Satoh, Hideaki Ishikawa
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Publication number: 20120069527Abstract: A wiring structure including printed circuits each including: a base member including one end portion facing an actuator and the other end portion of the base member drawn from the one end portion along a face of the actuator and then turned, the other end portion extending in parallel with the one end portion; output terminals formed on the one end portion and configured to output signals to the actuator; a drive IC mounted on the base member and connected to the output terminals by wirings; and input terminal formed on the other end portion and connected to the drive IC by wirings to input signals to the drive IC, wherein the printed circuits are arranged in a predetermined direction along the face of the actuator, wherein the one end portions of the respective base members are arranged in the predetermined direction, and wherein the other end portions of the respective base members are arranged in the predetermined direction.Type: ApplicationFiled: March 28, 2011Publication date: March 22, 2012Applicant: BROTHER KOGYO KABUSHIKI KAISHAInventor: Toru YAMASHITA
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Publication number: 20120063098Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.Type: ApplicationFiled: September 13, 2010Publication date: March 15, 2012Applicant: Raytheon CompanyInventors: Jeffrey Paquette, Scott R. Cheyne, Joseph R. Ellsworth
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Patent number: 8130497Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.Type: GrantFiled: November 18, 2009Date of Patent: March 6, 2012Assignee: Hitachi, Ltd.Inventors: Yoshihiro Kondo, Tadakatsu Nakajima, Akio Idei, Shigeyasu Tsubaki, Hiroyuki Toyoda, Tomoo Hayashi
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Patent number: 8116078Abstract: A server auxiliary operating system is disclosed, which includes a case, a plurality of swappable GPUs and a printed circuit back plane. The case includes a bottom board and a first mounting bay located at the front portion of the case. The swappable GPUs are disposed in the first mounting bay. The printed circuit back plane is disposed on the bottom board and has a plurality of first interfaces and a plurality of second interfaces electrically corresponding to the first interfaces, wherein the swappable GPUs are respectively coupled to the first interfaces, and the servers are respectively electrically connected to the corresponding swappable GPUs through the second interfaces respectively connected to the servers so as to expand the server operation capability.Type: GrantFiled: May 4, 2010Date of Patent: February 14, 2012Assignee: Inventec CorporationInventors: Ji-Peng Xu, Tsai-Kuei Cheng, Shyn-Ren Chen, Banks Chen
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Patent number: 8116099Abstract: Provided is a circuit board device, wherein degrees of freedom are provided for a GND connecting position among plural printed boards, and noise shield and/or heat sink effects are provided. An electronic device provided with the circuit board device and a GND connecting method are also provided. Circuit board device (100) includes a pair of printed boards (110, 120), noise generating component (112) and/or heat generating component (122), and metal plate (140). Printed boards (110, 120) include mounting surfaces and GND connecting terminals (111, 121) arranged on the respective mounting surfaces, and the mounting surfaces are arranged to face each other. Noise generating component (112) and/or heat generating component (122) is mounted on the mounting surface of at least one of a pair of printed boards (110, 120).Type: GrantFiled: July 18, 2007Date of Patent: February 14, 2012Assignee: NEC CorporationInventor: Akihito Kubota
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Publication number: 20120033385Abstract: A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein.Type: ApplicationFiled: April 16, 2010Publication date: February 9, 2012Applicant: MOLEX INCORPORATEDInventor: Hideo Nagasawa
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Patent number: 8111516Abstract: A system for cooling processor assembly is disclosed which comprises a printed circuit board (PCB) with a plurality of heat emitting electronic components and a housing for each PCB with a heat collector. The heat collector is constructed in one-piece material covering the plurality of heat emitting electronic components through heat collecting areas with different heights adapted to the different heights of the electronic components as regard to the PCB surface wherein the heat collecting areas being in thermal contact with the electronic components.Type: GrantFiled: July 14, 2009Date of Patent: February 7, 2012Assignee: International Business Machines CorporationInventors: Gottfried A. Goldrian, Manfred Ries
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Patent number: 8107242Abstract: A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provided on the other surface. Insulating resin includes a covering part adhering and covering the second electronic components and the other surface, and side surface part extending from the periphery of the substrate to a side of the second electronic components along the direction. A lid covers the first electronic components from an opposite side of the substrate, and is fixed to the side surface part from the opposite side of the substrate.Type: GrantFiled: May 29, 2008Date of Patent: January 31, 2012Assignee: Daikin Industries, Ltd,Inventors: Akio Yoshimoto, Mitsuhiro Tanaka
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Patent number: 8094455Abstract: A high-density integrated circuit module structure comprises a substrate and a heat sink at least wherein the substrates form a reversely-staggered contacting stack structure by electrically contacting heat sinks and heat conductors on the heat sink have a non-flat structure at least to realize the present invention which extends the product's functions within an electronic product's restricted height and has a better vibration resistance capability, heat dissipation effect, and no steps involving junctions between solder balls and a carrier in an assembling procedure to simply an assembling procedure with improved functions, increased capacity, and reduced manufacturing costs.Type: GrantFiled: April 7, 2010Date of Patent: January 10, 2012Assignee: Walton Advanced Engineering Inc.Inventor: Yu Hong-Chi
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Patent number: 8081476Abstract: An electromagnetic shielding device with a heat dissipating function for shielding at least one electronic element on a circuit board is provided. The electromagnetic shielding device includes a frame, a cover, and a heat dissipating element. The frame is disposed on the circuit board and surrounds the electronic element, and the frame is one-piece and seamless. The cover has a top portion and a side portion bent from borders of the top portion. The heat dissipating element is disposed on the top portion. The top portion of the cover is connected to borders of the frame, and the side portion is tightly combined with the frame so that the cover, the frame and the circuit board form a shielding space to surround the electronic element.Type: GrantFiled: December 9, 2009Date of Patent: December 20, 2011Assignee: Unihan CorporationInventors: Wei-Chun Tsao, Chien-Ru Lin
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Patent number: 8081473Abstract: A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader.Type: GrantFiled: August 4, 2008Date of Patent: December 20, 2011Assignee: International Business Machines CorporationInventors: Thomas M. Cipolla, Evan George Colgan, Paul W. Coteus, Shawn Anthony Hall, Shurong Tian
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Patent number: 8077456Abstract: An apparatus has a plurality of printed board units each including a printed board, a frame to have the printed board arranged therein, a first rail to be arranged at a first lower end of an inner wall of the frame having the printed board located thereon in a lower opening of the frame, and a second rail to be arranged at a second lower end opposed to the first lower end in the opening; a housing including a rail holding unit to movably hold the first rail of a first printed board unit and the second rail of a second printed board unit adjacent to the first printed board unit among the plurality of printed board units; and a cooling fan to be arranged on an upper side or underside of the housing to send air into the frame.Type: GrantFiled: April 14, 2010Date of Patent: December 13, 2011Assignee: Fujitsu LimitedInventors: Masaki Yoshimaru, Naohiko Kajio, Takashi Imamoto
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Publication number: 20110292615Abstract: An automotive power converter may include a cold plate, a printed circuit board spaced away from the cold plate and including at least one heat generating electrical component attached thereto, and another printed circuit board disposed between the cold plate and the printed circuit board spaced away from the cold plate. The converter may further include at least one thermally conductive element configured to provide a thermally conductive path from the at least one heat generating electrical component to the cold plate. The at least one thermally conductive element may pass through the printed circuit boards.Type: ApplicationFiled: April 14, 2011Publication date: December 1, 2011Applicant: LEAR CORPORATIONInventors: Rutunj Rai, Nadir Sharaf
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Patent number: 8059404Abstract: Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway.Type: GrantFiled: October 9, 2008Date of Patent: November 15, 2011Assignee: GM Global Technology Operations LLCInventors: David H. Miller, Mark D. Korich, Gregory S. Smith
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Patent number: 8035974Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.Type: GrantFiled: September 14, 1998Date of Patent: October 11, 2011Assignee: Round Rock Research, LLCInventors: David J. Corisis, Walter L. Moden, Terry R. Lee
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Publication number: 20110235271Abstract: An arrangement of a mother circuit board and daughter circuit boards in a power instrument improves current and voltage capabilities. A mother board is mounted to a base panel of an enclosure, and a number of daughter boards are attached to and extend from the mother board. Each daughter board has substantially identical circuitry and produces substantially the same amount of current. The daughter boards together provide a total output current equal to a sum of each individually generated current. The amount of power generated by the instrument can be increased by attaching additional daughter boards to the mother board. The total current produced by the daughter boards is provided to and output from the mother board via a low inductance output path. The low inductance output path ensures that a sudden increase in current does not result in a large voltage spike that adversely affects instrument operation.Type: ApplicationFiled: March 25, 2010Publication date: September 29, 2011Applicant: IXYS CorporationInventor: James Budai
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Patent number: 8027162Abstract: Liquid-cooled electronics apparatuses and methods are provided. The cooled electronics apparatuses include a liquid-cooled cold rail and an electronics subassembly. The liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the thermally conductive structure. The electronics subassembly includes an electronics card(s) and one or more thermal transfer plates. The electronics card(s) includes electronic devices to be cooled, and the one or more thermal transfer plates are each rigidly affixed to one or more electronic devices of the electronics card(s). Each thermal transfer plate is thermally conductive and couples the electronics subassembly to the liquid-cooled cold rail to thermally interface the one or more electronic devices to the liquid-cooled cold rail to facilitate cooling of the electronic devices. In one embodiment, the electronics subassembly includes multiple interleaved electronics cards and thermal transfer plates.Type: GrantFiled: September 24, 2009Date of Patent: September 27, 2011Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Michael R. Rizzolo, Robert E. Simons
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Patent number: 8018717Abstract: A facility is disclosed for cooling a detection device. In at least one embodiment, the facility includes at least one first cooling unit, through which a thermal contact to the detection device is able to be established and through which heat arising during operation of the detection device is able to be removed; and at least one second cooling unit, which is arranged so that heat from the environment of the detection device can be discharged through it. In at least one embodiment, this has the advantage of largely shielding the first cooling unit from incident heat which allows the detection device to be efficiently cooled.Type: GrantFiled: April 30, 2009Date of Patent: September 13, 2011Assignee: Siemens AktiengesellschaftInventors: James Corbeil, Stefan Stocker
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Patent number: 8017872Abstract: A circuit board may include a pump and a channel. The channel may include a liquid metal and a coating. The liquid metal may be pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal may carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly. The pump may be driven by electric current that is utilized by one or more electronic components on the circuit board.Type: GrantFiled: September 24, 2008Date of Patent: September 13, 2011Assignee: Rockwell Collins, Inc.Inventors: David W. Cripe, Bryan S. McCoy, Nathan P. Lower, Ross K. Wilcoxon
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Patent number: 8009419Abstract: A portable, self-contained liquid submersion cooling system that is suitable for cooling a number of electronic devices, including cooling heat-generating components in computer systems and other systems that use electronic, heat-generating components. The electronic device includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid, and a pump for pumping the liquid into and out of the space, to and from a heat exchanger that is fixed to the housing outside the interior space. The heat exchanger includes a cooling liquid inlet, a cooling liquid outlet, and a flow path for cooling liquid therethrough from the cooling liquid inlet to the cooling liquid outlet. An air-moving device such as a fan can be used to blow air across the heat exchanger to increase heat transfer.Type: GrantFiled: October 12, 2010Date of Patent: August 30, 2011Assignee: Hardcore Computer, Inc.Inventors: Chad Daniel Attlesey, R. Daren Klum, Allen James Berning
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Patent number: 8004846Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.Type: GrantFiled: March 24, 2009Date of Patent: August 23, 2011Assignee: Fujitsu LimitedInventors: Akira Okada, Hirofumi Imabayashi, Hideaki Yajima, Katsumi Kanasaki, Takehide Miyazaki, Kazuya Nishida
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Publication number: 20110199735Abstract: There is provided a substrate connecting structure capable of preventing occurrence of a connection failure, which would otherwise be caused by a non-uniform temperature rise within a connecting areas of circuit boards during thermocompression bonding.Type: ApplicationFiled: February 22, 2010Publication date: August 18, 2011Applicant: PANASONIC CORPORATIONInventor: Masahito Kawabata
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Patent number: 8000103Abstract: Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.Type: GrantFiled: December 19, 2008Date of Patent: August 16, 2011Assignee: Clustered Systems CompanyInventors: Robert J. Lipp, Phillip P. Hughes
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Patent number: 7995345Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.Type: GrantFiled: September 3, 2010Date of Patent: August 9, 2011Assignee: Juniper Networks, Inc.Inventor: Tri Luong Nguyen
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Patent number: 7990722Abstract: A fastener comprises a fastener post, a clasping element and an elastic element. The fastener post comprises a head, a post body and a threaded portion. The post body has a first extension section connecting with the head, a second extension section connecting with the threaded portion and a recess section connected between the first and second extension sections. The clasping element comprises an annular clasping body, a first clasping portion axially extending from the clasping body and a second clasping portion extending outwardly and then downwardly from the clasping body. The clasping body encloses the post body, the first clasping portion engages with the recess section of the post body, and the second clasping portion engages with the heat sink. The elastic element is set around the post body and located between the head and the clasping body.Type: GrantFiled: October 19, 2009Date of Patent: August 2, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Lei Cao, Min Li
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Publication number: 20110176280Abstract: A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.Type: ApplicationFiled: January 12, 2011Publication date: July 21, 2011Applicant: Samsung Electronics Co., Ltd.Inventor: Seok-Chan Lee
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Publication number: 20110170017Abstract: A display device includes a display panel 11, a holding member 50, a circuit board 18 and a heat-transfer member 60. The display panel 11 is configured to display images. The holding member 50 holds the display panel 11. The circuit board 18 arranged so as to face the holding member 50 and connected to the display panel 11. The heat-transfer sheet 60 is arranged between the circuit board 18 and the holding member 50 so as to be in contact with the circuit board 18 and the holding member 50. The heat-transfer sheet 60 has a circuit board fixing portion 61, a holding member fixing portion 62 and flexible connection portions 63 that make connections between the fixing portions 61 and 62. The circuit board fixing portion 61 is attached to the circuit board 18 and separated from the holding member 50. The holding member fixing portion 62 is attached to the holding member 50 and separated from the circuit board 18. Therefore, a display quality is less likely to decrease.Type: ApplicationFiled: June 11, 2009Publication date: July 14, 2011Applicant: SHARP KABUSHIKI KAISHAInventor: Hokshing Liu
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Patent number: 7969733Abstract: A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.Type: GrantFiled: December 17, 2008Date of Patent: June 28, 2011Assignee: NVIDIA CorporationInventors: Samuel Abbay, Jeong Hun Kim, Don Le
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Patent number: 7961470Abstract: An RF power amplifier including a single piece heat sink and an RF power transistor die mounted directly onto the heat sink.Type: GrantFiled: July 19, 2006Date of Patent: June 14, 2011Assignee: Infineon Technologies AGInventors: Henrik Hoyer, Donald Fowlkes, Bradley Griswold
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Patent number: 7957141Abstract: A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.Type: GrantFiled: August 6, 2010Date of Patent: June 7, 2011Assignee: Asustek Computer Inc.Inventors: Chia-Hsing Chou, Chih-Wei Tsai, Chia-Hung Lu
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Patent number: 7957138Abstract: A gap filler member apparatus for blocking air flow through a gap existing between an edge of a first electronics board and a surface of a second electronics board that is disposed generally perpendicular to the first electronics board, where the first and second electronics boards are coupled by at least one pair of connectors and disposed within an electronics equipment enclosure, to block air flow through the gap. The apparatus has at least one rib extending therefrom, with the base portion being secureable to the surface of the second electronics board. A rib extends away from the base portion and has a height approximately equal to a height of the gap, and a length at least as long as a length of the gap so that the rib at least substantially blocks air flow through the gap.Type: GrantFiled: October 16, 2009Date of Patent: June 7, 2011Assignee: Emerson Network Power - Embedded Computing, Inc.Inventors: Pasi Jukka Vaananen, Stephen A. Hauser, David Paul Banasek
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Patent number: 7957133Abstract: An electronic system includes a chassis, an air flow distribution assembly having a first set of baffles disposed within an intake volume of the chassis and a second set of baffles disposed in proximity to an air outlet of the chassis. The first set of baffles is configured to turn the flow of an air stream approximately 90 degrees, relative to an inlet flow direction of the air stream, toward circuit boards disposed within the chassis. The second set of baffles is configured as a flow splitter that receives the air stream from the circuit boards and partitions the air stream into separate portions prior to the air stream exiting via the air outlet. The use of both the first and second set of baffles redirects and distributes the air stream, flowing into the air inlet, in a substantially even manner across the circuit board component mounting surfaces of the circuit boards disposed within the system.Type: GrantFiled: May 29, 2008Date of Patent: June 7, 2011Assignee: Cisco Technology, Inc.Inventors: Christopher E. Zieman, Todd Mason
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Publication number: 20110110047Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.Type: ApplicationFiled: November 4, 2010Publication date: May 12, 2011Applicant: Netlist, Inc.Inventors: Robert S. Pauley, Jayesh R. Bhakta, William M. Gervasi, Chi She Chen, Jose Delvalle
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Patent number: 7933120Abstract: According to the storage control device of the present invention, individual cooling passages are formed for each region in the enclosure and the respective cooling passages are formed bent so as to bypass the connection substrate. As a result, the interior of the enclosure is cooled efficiently. The interior of the enclosure is divided in the front-rear direction by the connection substrate. Logic substrates and battery devices are provided on the front side of the connection substrate and logic substrates and power supply devices are provided on the rear side of the connection substrate. The battery devices and power supply devices located on the left and right sides of the enclosure are each cooled by means of individual cooling passages. The logic substrates are cooled by means of different cooling passages.Type: GrantFiled: March 11, 2010Date of Patent: April 26, 2011Assignee: Hitachi, Ltd.Inventors: Shigeaki Tanaka, Yoshikatsu Kasahara
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Patent number: 7924565Abstract: A heat dissipation structure for communication chassis. The heat dissipation structure includes an enclosure. At least one first copper heat absorption component and at least one first heat pipe assembly are disposed in the enclosure. The first heat pipe assembly is connected with the first copper heat absorption component and a section not in contact with the first copper heat absorption component. The first heat pipe assembly serves to quickly transfer heat absorbed by the first copper heat absorption component to the section not in contact with the first copper heat absorption component to dissipate the heat.Type: GrantFiled: May 12, 2009Date of Patent: April 12, 2011Assignee: Asia Vital Components Co., Ltd.Inventors: Chiu-Mao Huang, Chang-Mou Huang