Abstract: An example embodiment includes a thermal management system for an active cable connector. The system includes a shell and a back plate. The shell defines a cavity and includes multiple heat-transfer areas on an internal shell surface. A first heat-transfer area is positioned with respect to a first heat-generating component to absorb a first portion of thermal energy generated by the first heat-generating component. The back plate is positioned with respect to the first heat-generating component to absorb a second portion of the thermal energy generated by the first heat-generating component. The back plate is further positioned proximate to a second heat-transfer area to transfer the second portion of the thermal energy to the shell.

Abstract: A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.

Abstract: A device for selectively clamping an electronic module to a heat sink comprising a frame and a camshaft rotatably attached to the frame. The camshaft comprises at least one cam lobe arranged thereon for selectively applying a clamping force on the electronic module in a direction generally normal to the heat sink.

Abstract: Provided is an apparatus, a system, and a method for operating the same. The apparatus, in one embodiment, includes a chassis having a front configured to accept one or more circuit boards, a back, and first and second sides. The apparatus, in this embodiment, further includes one or more slots located within the chassis, each slot configured to receive one of the circuit boards at an angle with respect to the first and second sides. The slots, in this embodiment, at least partially define a first plenum opening to the front and a second plenum opening to the back. The apparatus additionally includes a fan assembly coupled to one of the first plenum or the second plenum.

Abstract: Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal.

Abstract: An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate.

Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.

Abstract: Cooling apparatuses and coolant-cooled electronic assemblies are provided which include a thermal transfer structure configured to couple to one or more sides of an electronics card having one or more electronic components to be cooled. The thermal transfer structure includes a thermal spreader coupled to the one side of the electronics card, and the apparatus further includes a coolant-cooled structure disposed adjacent to the socket of the electronic system. The coolant-cooled structure includes: one or more low-profile cold rails sized and configured to thermally couple to the thermal spreader along a bottom edge of the thermal spreader with operative docking of the electronics card within the socket; and one or more coolant-carrying channels associated with the low-profile cold rail(s) for removing heat from the low-profile cold rail(s) to coolant flowing through the coolant-carrying channel(s).

Abstract: A circuit board assembly includes first and second circuit boards that each have a substrate and a conductive circuit layer positioned on the substrate. The first and second circuit boards are arranged such that the conductive circuit layers face each other across a gap. Thermal conductor pillars extend lengths across the gap between the conductive circuit layers of the first and second circuit boards. The thermal conductor pillars include opposite first and second ends that are engaged in thermal contact with the conductive circuit layers of the first and second circuit boards, respectively. The thermal conductor pillars provide thermal pathways for heat to travel between the first and second circuit boards.

Abstract: A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

Abstract: An IO system board included in an electronic device includes, in addition to a first section board that includes first ventilating holes and second section board that includes second ventilating holes, a third section board that includes third ventilating holes. Accordingly, a larger amount of cooling air is taken in via an air intake surface of a rack of the electronic device, flows into a casing of the IO system board, and then flows over a first sub circuit board, thus cooling a first heat-generating component.

Abstract: A chassis-based processing system includes a first set of processing blades mounted in parallel within a card cage and attached to a backplane within a chassis. An air intake plenum allows air to flow into the chassis, and over the first set of processing blades in an optimized manner. A separate processing blade is located in the air intake plenum, and is attached to the backplane. This processing blade may have less restrictive proximity requirements than the first set of processing blades. The processing blade in the plenum is positioned perpendicular to the first set of processing blades. As a result, airflow over the processing blade in the plenum has a different orientation than airflow over the first set of processing blades. An air deflector structure in the plenum deflects some of the air flowing into the plenum onto the processing blade located in the plenum, thereby providing improved cooling.

Abstract: A frame has frame blades arranged to be interleaved with memory modules or memory module sockets. The frame blades participate in cooling the memory modules when memory modules are installed.

Abstract: Systems, methods, and apparatus are provided for a mounting base for circuit board assemblies that provides both mounting of one or more circuit boards and a pathway including one or more fins to conduct heat away from the one or more circuit boards.

Abstract: A modular direct-current power conversion system is applied to receive a DC input voltage and output a DC output voltage. The modular direct-current power conversion system includes a main board and a plurality of DC power conversion modules. The main board includes a primary surface, a voltage input terminal, a voltage output terminal, a plurality of insertion regions, and a plurality of pin holders. When the DC power conversion module is inserted on the main board, the DC input voltage is inputted via the voltage input terminal to the DC power conversion module. The DC power conversion module converts the DC input voltage into a DC output voltage, and the DC output voltage is outputted via the voltage output terminal.

Abstract: A rack system may include a first plurality of line cards, where a particular one of the first plurality of line cards receives or sends packets via ports; a plurality of fabric cards, where a particular one of the plurality of fabric cards includes a switching fabric; a second plurality of line cards, where a particular one of the second plurality of line cards receives or sends packets via ports; a first backplane that connects the first plurality of line cards to the plurality of fabric cards; and a second backplane that connects the second plurality of line cards to the plurality of fabric cards.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: A power semiconductor system and method for producing a power semiconductor system. In one embodiment, the application relates to a power semiconductor system, comprising a line system for a fluid working medium; wall element having an outer side and an inner side; and a power semiconductor circuit arranged at the outer side of the wall element, wherein the inner side of the wall element forms a fluid-tight wall of the line system.

Abstract: The present invention discloses a compact server power supply having high power density has a casing, a main printed circuit board, a sub-printed circuit board, a power supplying circuit, a power output terminal set and a fan. The power supplying circuit has a primary side circuit unit, a transformer and a secondary side circuit unit. Electric elements of the primary and secondary side circuit units and the transformer are soldered on the main printed circuit board except parts of the electric elements of the secondary side circuit unit are soldered on the sub-printed circuit board. The sub-printed circuit board is vertically mounted and soldered on the main printed circuit board, so the length of the main printed circuit board is shortened to implement the server power supply having a compact size and high power density.

Abstract: A modular computer system includes a fan tray comprising a number of fans, a number of slots, and sets of temperature sensors. A shelf manager stores a table that records the relationship in distance between the slots and the fans, and the correlation relationship between the slots and the sets of temperature sensors. The shelf manager monitors the temperatures of different portions of each field replaceable unit according to signals from the temperature sensors. When there is one or more monitored temperatures exceeding a preset value, the shelf manager determines which of the slots corresponds to the one or more monitored temperatures, determines the number of sensors that have detected the high temperatures, and adjusts the speed of the one or more fans adjacent to each determined slot according to the determined number of sensors.

Abstract: A tube includes a tube body and a heat-dissipating member. A light-emitting module and a first electronic component connected electrically to the light-emitting module are disposed in the tube body. At least one opening is formed on the tube body in correspondence to the first electronic component. The heat-dissipating member is placed over the opening. The heat-dissipating member provides a first heat-dissipating path for the first electronic component.

Abstract: The universal control module is designed for controlling the operation of a plurality of motors and/or configured for a plurality of different motor applications. In an example, the control module is configurable within a housing of a power tool. The control module includes a top cover, a bottom cover and a printed circuit board (PCB) with control components thereon. The control module includes a spacer configured between the top and bottom covers and attached to the PCB for providing tolerances for the control components during a soldering process to fixedly attach the control components to the PCB.

Abstract: Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

Abstract: A display apparatus and a method of spreading heat in the display apparatus are provided. The display apparatus includes: a display panel which display an image on a front surface thereof; an intermediate panel disposed on a rear surface, opposite the front surface, of the display panel; and a heat spreader disposed on the rear surface of the intermediate panel and which spreads heat, the heat spreader extending in a longitudinal direction from a first position of the rear surface of the intermediate panel in which the heat is present to a second position of the rear surface of the intermediate panel.

Abstract: An automotive power converter may include a cold plate, a printed circuit board spaced away from the cold plate and including at least one heat generating electrical component attached thereto, and another printed circuit board disposed between the cold plate and the printed circuit board spaced away from the cold plate. The converter may further include at least one thermally conductive element configured to provide a thermally conductive path from the at least one heat generating electrical component to the cold plate. The at least one thermally conductive element may pass through the printed circuit boards.

Abstract: Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.

Abstract: The invention relates to the cooling of the item of electronic equipment comprising an electronic compartment formed from a housing and at least one electronic board assembled in the housing. The board is intended to be assembled in a removable manner in the housing by a movement of translation along a groove in order to reach an operating position, the assembly of the board (11) being carried out through an insertion face of the housing. According to the invention, the item of equipment comprises a heat sink of elongate shape disposed along the groove making it possible to collect the heat emitted by the components and means of extraction of the heat collected by the heat sink, the extraction means being located outside of the electronic compartment.

Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.

Abstract: An electronic device includes a circuit board with a number of expansion slots arranged on the circuit board for connecting a number of expansion cards, and a guiding member inserted in one idle expansion slot of the expansion slots for guiding airflow to the expansion cards at opposite sides of the idle expansion slot.

Abstract: A cold plate has blades arranged to be interleaved with memory modules or memory module sockets. A liquid cooling loop is thermally coupled to the blades of the cold plate.

Abstract: An apparatus is disclosed that may include one or more printed circuit boards (PCBs) and an electronics package may be disposed about the first surface of one or more of the PCBs. The PCBs may include a metal layer and a core, and, in some aspects, may include multiple cores interposed between multiple metal layers, and in some embodiments a backplane may be disposed along the core(s). A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The apparatus may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these.

Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.

Abstract: An apparatus includes a first electronic device mounted on a first substrate and a second electronic device mounted on a second substrate. The second substrate may be configured to be removably connected to the first electronic device. The second electronic device may be mounted on either planar surface of the second substrate.

Abstract: A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.

Abstract: The invention relates to a power semiconductor module including a module underside, a module housing, and at least two substrates spaced from each other. Each substrate has a topside facing an interior of the module housing and an underside facing away from the interior of the module housing. The underside of each substrate includes at least one portion simultaneously forming a portion of the module underside. At least one mounting means disposed between two adjacent substrates enables the power semiconductor module to be secured to a heatsink.

Abstract: An electronic device includes an enclosure. The enclosure includes a motherboard area and a power supply area adjacent to the motherboard area, which are both located at a first end of the enclosure, a hard disk drive area for mounting hard disk drives at a second end of the enclosure, and a fan area arranged between the motherboard area and the hard disk drive area.

Abstract: An apparatus, comprising a rack and a cooler. The apparatus also comprises a plurality of electronic circuit boards located in corresponding slots of the rack, each of the electronic circuit boards being held against a portion of the cooler by a corresponding force, some of the electronic circuit boards having a localized heat source thereon The apparatus also comprises a plurality of heat spreaders, each heat spreader configured to form a heat conducting path over and adjacent to one of the electronic circuit boards from one or more of the localized heat sources thereon to the portion of the cooler. The apparatus also comprises a plurality of compliant thermal interface pads, each of the pads being compressed between end of one of the heat spreaders and the portion of the cooler to form a heat conduction path therebetween.

Abstract: A mounting base for circuit board assemblies that provides both mounting of one or more circuit boards and a pathway including one or more fins to conduct heat away from the one or more circuit boards.

Abstract: A motherboard includes a circuit board, a memory slot, a memory, a heat-dissipating member, an electrically conductive latching element, and a grounding element. The grounding element includes two electrically conductive first securing members mounted on the circuit board. The first securing members are electrically connected to a ground layer of the circuit board. The latching element includes a latching portion abutting the heat-dissipating member and two hooking portions formed on two ends of the latching portion. The hooking portions respectively latch the first securing members.

Abstract: A power amplifier device for a magnetic resonance machine includes a housing, in which a first printed circuit board including at least one amplifier module having at least one power electronics component and at least one conductor pattern connected to the power electronics component is arranged. A second printed circuit board including at least one power electronics component and a conductor pattern is also arranged in the housing. The conductor pattern of the second printed circuit board is connected to at least one connection point of the first printed circuit board in order to supply voltage to the amplifier module. At least one cooling duct for cooling the power electronics components is arranged in the housing. At least two of the power electronics components are arranged such that the electronics components are thermally connected to a common cooling duct on opposite sides of the cooling duct.

Abstract: A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.

Abstract: A riser card for connecting at least one high-speed signal card to a mainboard is provided. The high-speed signal card includes a first connecting portion and a second connecting portion. The riser card includes a circuit board, a plurality of slots, a connection terminal, a power supply module, and a supporting board. The slots include a first slot and a second slot disposed spaced apart on a first surface of the circuit board and connected to the first connecting portion and the second connecting portion respectively of the high-speed signal card. The connection terminal connects to the mainboard. The power supply module is fixed to a second surface of the circuit board by using the supporting board and supplies power to the high-speed signal card via the circuit board, so that the high-speed signal card is able to exchange data with the mainboard via the riser card.

Abstract: One embodiment of the present invention provides an electronic control unit for electric power steering, including: a first board which is mounted with first surface-mount components; and only one second board which is mounted with second surface-mount components having larger allowable current capacities than the first surface-mount components, which have approximately the same components mounting area as the first board, and which is layered with the first board.

Abstract: An enclosure for outside plant equipment includes a base unit and first Printed Circuit Board (PCB) carried by the base unit and having a circuit side and opposing component side on which electronic components are mounted. A heat sink is connected to the first PCB at the circuit side and configured to dissipate heat from any electronic components mounted on the first PCB at the component side. A cover is attached to the base unit and has an inside surface covering the enclosure. A second PCB has a circuit side and opposing component side on which electronic components are mounted. The second PCB is supported by the inside surface of the cover. A heat sink is connected to the second circuit board at the circuit side and configured to dissipate heat from any electronic components mounted on the second PCB. A PCB finger connector interconnects the first and second PCB's at the component side.

Abstract: A folded system-in-package (SiP) assembly is provided for minimizing the footprint of two corresponding circuit board modules in a handheld electronic device. The assembly includes top and bottom circuit board modules that are electrically interconnected through a flex circuit. Either a plate or wrapped heat spreader may be thermally coupled to the top circuit board module to conduct heat from the heat-generating components mounted to the top circuit board module and to a case of the electronic device.

Abstract: In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Abstract: Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

Abstract: In one aspect, a system includes a first circuit board that includes integrated circuits, a first thermal spreader coupled to the integrated circuits of the first circuit board, a first compliant board coupled to the first circuit board, a second circuit board that includes integrated circuits and a second thermal spreader coupled to the integrated circuits of the second circuit board. The first circuit board and the first thermal spreader have a first thickness. The second daughter board and the second thermal spreader have a second thickness. The system further includes a second compliant board coupled to the second circuit board, a board assembly coupled to first and second compliant boards and a cold-plate assembly in contact with the first and second thermal spreaders. Either of the first or the second compliant boards is configured to expand or contract to account for the differences between the first and second thicknesses.

Abstract: A wireless network receiver includes a heat-dissipating unit, a wireless network receiving module, an electrical connecting unit, and a shell unit. The heat-dissipating unit has at least one main heat-dissipating body and a front heat-dissipating body extended forward from the main heat-dissipating body. The wireless network receiving module is disposed on the heat-dissipating unit, and the wireless network receiving module includes a first substrate unit and a second substrate unit electrically connected to the first substrate unit. The electrical connecting unit includes an electrical connecting casing contacting the front heat-dissipating body and enveloping the front heat-dissipating body and a front portion of the first substrate unit. The shell unit includes a shell module for selectively exposing or hiding the electrical connecting unit.