Abstract: Capacitive proximity sensing is carried out by detecting a relative change in the capacitance of a “scoop” capacitor formed by a conductor and a surrounding ground plane. The conductor may be a plate provided in the form of an adhesive label printed with conductive ink. Charge is transferred between the “scoop” capacitor and a relatively large “bucket” capacitor, and a voltage of the bucket capacitor is applied to an input threshold switch. A state transition (e.g., from low to high, or high to low) of the input threshold switch is detected and a value (TouchVal) indicative of a number of cycles of charge transfer required to reach the state transition is determined. The presence or absence of an object or body portion in close proximity to or contact with a device can be determined by comparing TouchVal with a predetermined threshold value (TouchOff). TouchOff can be adjusted to take into account environmentally induced (non-touch related) changes in the capacitance of the scoop capacitor.

Abstract: An apparatus including a front panel (102) and a bezel (104) coupled to the front panel (102) and having a gasket (110), where the gasket (110) is affixed to the bezel (104) and electrically couples the bezel (104) to the front panel (102). Bezel (104) can be a mezzanine card bezel, a common mezzanine card bezel, and the like. A method of electrically coupling a front panel (102) to a bezel (104) includes providing a front panel (102) having an inner surface (112) defining a cut-out (114). Also, providing a bezel (104) having a perimeter (118), where the inner surface (112) of the cut-out (114) is designed to receive the bezel (104). Affixing a gasket (110) to the perimeter (118) of bezel (104) an the inner surface (112) receiving the bezel (104) where the gasket (110) is designed to be coupled to the inner surface (112), and electrically coupling the bezel (104) to the front panel (102) through the gasket (110).

Abstract: A tamper-proof enclosure for an electrical card, such as a high speed communications card, includes an enclosure in which the card is mounted. The enclosure has a wall with an opening, and a cup member is attached to the wall at the opening. A bus that is connected to the card extends through a passage in the cup member and through the opening in the wall. A security mesh is wrapped around the enclosure. The cup member is filled with liquid resin, which is also coated onto the security mesh. After the resin is cured, the resin in the cup member forms a plug that seals the security mesh from inner pressure when the enclosure is heated to an elevated temperature. The resin is preferably polyamide.

Abstract: A frame joining structure for electrical and electronic equipment housing cabinets, in which ends of frames are simplified in shape to dispense with complex cutting and which possesses excellent strength and waterproof property. Ends of outer side surfaces (4) of three mutually orthogonal frames (1a, 1b, 1c), which constitute a framework of a cabinet, are cut at two planes of ±45° relative to a plane defined by other two frames to be point-shaped. These ends are joined together directly or through a corner member (20) having the same configuration as that of the ends to constitute a firm corner portion.

Abstract: An expandable, modular electronic equipment enclosure (8) for telecommunications, signaling, or other electronic equipment, wherein the enclosure (8) includes male and female expansion interfaces (20,22) that allow for expanding the enclosure (8) by adding substantially similar modules (110,210) whenever increased capacity is needed. Broadly, each module (10) includes a housing body (12); a lid (14); a base (16); the male and female expansion interfaces (20,22); and a cap (24). A single cable interface and pressurization control componentry (18) serves all of the modules (10,110,210) of the enclosure (8). To expand the enclosure (8), the male or female expansion interface (120,122) of a subsequent module (110) is interfaced or mated with the corresponding exposed, unmated female or male expansion interface (20,22) of a preceding module (10). The cap (24) seals and protects the exposed, unmated expansion interface (120,122) of the last or end module (110) of the enclosure (8).

Abstract: A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.

Abstract: An interworking interface module for telecommunication switching systems has multiple interworking terminal I/O ports, tracking terminal I/O ports, and system terminal I/O ports, and an indicator lamp are mounted on the external panels of a mounting frame. Multiple connection modules are attached onto the inner surface of a mounting frame used for setting up interconnection between the above terminal I/O ports. Each connection module comprises a switching means, such that a terminal separated from the system connection is automatically switched to connect to a terminal resistor to damp any line oscillation due to open connection. Using the connection modules to interconnect the above terminals of the invention, the present invention is able to reduce the necessary interconnecting components and simplify the procedures for assembling a transit exchange platform, while the original service quality with respect to a line connection is maintained.

Abstract: An electronic equipment module includes a symmetrical casting with two chassis units. Each unit includes a mounting recess to receive a circuit assembly, separated by a cover applied to either unit, or both. The module is normally mounted to a unit rack, and typically has a removably attachable, re-orientable keyed surface which mates with another keyed surface on the rack. A mounting system includes a unit rack coupled to at least one electronic equipment module and a mounting frame. A method of mounting an electronic equipment module includes inserting the module into an open end of a unit rack, electrically coupling connectors attached to the module and the rack, securing the module to the rack, and attaching the rack to a mounting frame. The module can be secured to the rack by engaging a cam lever attached to the module.

Abstract: The invention provides a wire and component management system in an enclosure having a plurality of rack mounted drawers each having an integral component board. Each component board is configured to have a plurality of mounting openings strategically positioned to allow components to be mounted thereto in various orientations. The component mounting board and drawer are movable within the rack so that they can be easily serviced. The component mounting board and drawer are hingably mounted to the rack by a hinged wire manager. The hinged wire manager is formed of two arms joined by a hinge pin. Each of the arms has wire management features and the wire managed therein is routed around the hinge pin in a loop to allow movement of the component mounting board and drawer in and out of the rack while managing a bundle of wires connected to components on the board.

Abstract: A planar board for attachment to a chassis and the resulting attachment structure and method of forming the resulting structure is provided. The planar board has components on one face thereof oriented toward one face of the chassis. The chassis has at least one standoff extending from the one face thereof and the planar board has a structure cooperating with each standoff on the chassis mounting the planar board in a standoff relationship at an installed distance. At least one spacer member is mounted on the one face of the planar board and extends from that one face a distance equal to the installed distance to engage the one face of the chassis in the installed condition.

Abstract: An outer casing of an electric equipment including: a front panel; a base case having a bottom plate portion and a pair of side plate portions; a top case having a roof portion, a pair of side plate portions, a roof portion protruding piece, and a pair of side plate protruding pieces; and a fixing member. A longitudinal width of each of side plate protruding pieces is set smaller than a longitudinal width of the recess portion for a predetermined length. The outer casing further includes a pair of pedestals integrally formed at both end portions of a bottom face of the recess portion with height thereof being set substantially the same as the predetermined length.

Abstract: Methods and devices provide for remote management of a local computer utilizing a compact, portable interaction device for external connection to a local computer and a network. The interaction device includes a thermally conductive housing with circuit boards disposed within. At least one heat-generating component is disposed on an outer surface of each circuit board with at least one thermally conductive pad for each circuit boards abutting the at least one heat generating component and the inner surface of the housing. The device also includes ventilation means for allowing ambient air to flow through the interior of the housing.

Abstract: A Serial ATA mobile rack is constructed to include a housing having a back panel; an adapter fixedly provided in the back panel of the housing, the adapter comprising a connector formed of a signal segment and a power segment, a signal line disposed at a back side thereof and electrically connected to the signal segment for signal input/output, and a power cord disposed at the back side and electrically connected to the power segment, the power cord having an electric plug; and a circuit board mounted in the back panel of the housing, the circuit board comprising a power input socket adapted to receive external power supply, a power output socket adapted to receive the electric plug of the power cord for power output to the power segment of the adapter; the housing accommodating an inner case holding a data storage device, and a power switch connected between the power input socket and the power output socket for power on/off control.

Abstract: An electronic device includes a housing that is formed with a recess for receiving an electronic card, and a groove extending from the recess. A pivot pin is mounted in the groove. A cover is hooked on the pivot pin for covering the electronic card. The groove has a bight portion divided into first and second sections which are respectively spaced apart from the pivot pin by first and second gaps. A hook on the cover has a width smaller than that of the first gap and greater than that of the second gap.

Abstract: A computer module for use in a scalable computer system is provided. The computer module includes a chassis at least partially defining an interior and a processor board configured for insertion into a processor region of the interior of the chassis along an insertion axis. The processor board includes at least one connector for communicating signals to and from the processor board. The connector of the processor board is oriented along a connection axis that is substantially perpendicular to the insertion axis. The computer module also includes a memory board configured for insertion into a memory region of the interior of the chassis along the insertion axis. The memory board includes at least one connector for communicating signals to and from the memory board. The connector of the memory board is oriented along the connection axis.

Abstract: A two piece electronic component heat sink and device package comprising a first piece configured to retain electronic components, and a second piece having a hinge region configured to moveably connect the second piece to the first piece, and a snap lock region opposite the hinge region, the snap lock region configured to secure the second piece to the first piece. A two piece electronic component heat sink and device package for a circuit board comprising: a first piece having an index slot for retaining said circuit board, and a second piece having a hinge region configured to pivotably connect the second piece and the first piece, and a snap lock region configured to secure the second piece to the first piece.

Abstract: Methods, systems and devices are described relating to a chassis for front and back inserted modules. An apparatus includes a chassis including a first module bay and a second module bay, the first module bay and the second module bay together composing both a forward section and rearward section.

Abstract: The invention relates to a module for measuring purposes comprising an electrical or electronic circuit, which has at least one power supply connection and at least one data line connection for connecting, in the manner of a bus, to at least one other module of the same type that is also used for measuring purposes. According to the invention, the electronic circuit (80) is arranged inside a housing, the housing has a first contact surface (90) and a second contact surface (91), and the first contact surface (90) is joined to the second contact surface (91) of the other module (22, 32, 42) in a manner that permits it to be mechanically detached. The at least one power supply connection has a power supply contact (84a, 85a) in the first contact surface (90) and has a corresponding power supply contact (84b, 85b) in the second contact surface (91).

Abstract: 1. An electronics assembly comprises: (i) a frame (1); (ii) a plurality of power supply modules (2) for supplying power to electrical circuitry of the assembly, each of which has an input power connector and an output power connector (27); and (iii) a power inlet connection module (26) which is electrically connected to a plurality of the power supply modules; wherein the power inlet connection module (26) is separated from the power supply modules (2) by an internal wall (36) of the frame which has, on one side thereof, at least one location element (50) for locating the power inlet connection module relative to the wall and, on the other side thereof, at least one location element (54) for locating each power supply module that is connected to the power inlet connection module relative to the wall so that the power supply modules are aligned with the power inlet connection module by means of the internal wall.

Abstract: The invention is related to the computer science and may be used in the design of miniature high-performance computing systems. The purpose of the invention is to increase the IC stuffing density and to reduce the microelectronic module assembly effort. The multilayered hybrid electronic module contains a backplane with multilayer wiring with ICs and sockets installed. A socket body is a box of elastic dielectric material, whose vertical walls have vertical metallized contact slots connected to the contact pads on the outer bottom surface of the socket. IC packages to be installed in the sockets have a rigid peripheral frame with cylindrical leads on the perimeter. The leads are parallel to the base of the package and lie in the same plane. Dimensions and shape of the IC package correspond to those of the socket cavity. Dimensions and positions of the IC leads correspond to those of the contact slots.

Abstract: A pluggable optical transceiver having a pivotable actuator assembly for quickly and easily removing the transceiver from a receptacle cage assembly is provided. The actuator assembly includes a slide member, actuator means, and spring means. The rotation of the actuator causes the transceiver to become disengaged from the receptacle. In this manner, the transceiver is released and can be removed easily from the receptacle.

Abstract: A circuit board assembly has a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA integrated circuit package has a substrate having an array of solder columns extending from a bottom surface. An oversized lid is affixed to the substrate. Support shims are disposed between a portion of the lid that extends beyond an outer periphery of the substrate and a circuit board to which the CGA integrated circuit package is mounted. The support shims are affixed to the lid with adhesive after the CGA integrated circuit package is mounted on the circuit board. The adhesive accommodates any variations in height in the CGA integrated circuit package.

Abstract: In order to obtain a minimal leakage inductance in a semiconductor component, it is necessary to provide at least two adjacent switching elements whose load current connection elements which are adjacent on one housing side to have different polarities. A multiplicity of even-numbered switching elements are advantageously disposed next to one another on an alignment line. The leads between the load current connection elements and the load current connections of the switching elements that are disposed next to one another advantageously run approximately orthogonally with respect to the alignment line. The assigned load current connection elements then alternately have the first and the second supply potential and this minimizes the leakage inductance.

Abstract: A power lead and a ground lead are connected to corresponding pads of a die through an intra-package wiring substrate. A ground plane is formed in a mold under the intra-package wiring substrate extending along the bottom surface of the mold, and connected to the ground lead. A decoupling capacitor is connected to power wiring and the ground plane to prevent EMI caused by switching noise current generated by the power circuit of the die.

Abstract: The light emitting diode assembly for an illuminated sign discloses an enhanced waterproofs function and an enhanced durability. The light emitting diode assembly includes a case being open upwards, in which a connecting recess is formed on upper portions of both sides of the case. A printed circuit board is installed in the case and being mounted on upper sides of a plurality of light emitting diodes. The hollow cap is coupled in the connecting recess of the case, in which a plurality of wires passes through the cap. A synthetic resin material for covering the printed circuit board, the cap and the light emitting diode, the synthetic resin material being filled in the case. In this structure, the light emitting diode assembly can prevent the printed circuit board, transformer and the light emitting diode from being damaged by using an epoxy resin.

Abstract: A design for passively cooled telecommunication repeater housings for use in wire transmission in the local loop outside plant provides mounting slots for repeaters and voltage protector assemblies disposed and arranged such that a repeater and its voltage protector assembly can be removed independently of each other by pulling either one in the same direction.

Abstract: A technique for supplying power and data signals to panel-mounted components includes distribution of power and data conductors in a trunk wireway and further distribution to component locations via drop cable assemblies disposed in drop wireways. The drop cable assemblies and trunk cable assemblies may include identical cable. The cables have a plurality of parallel conductors in an insulated jacket. Connectors are mounted on the drop cable assemblies for receiving plug-in component cable assemblies routed to individual components mounted within component panels or bays. The components are thus electrically coupled in parallel with one another and may receive both power and data signals via the drop and trunk cable assemblies coupled to a network. Individual components may be independent installed and removed for servicing with interrupting service to upstream or downstream components in the system.

Abstract: A portable modular electronic system comprises a controller module, at least one memory module; and at least one application module that are mechanically connectable and disconnectable with respect to each other and include mating electrical connectors for communicating electrical signals between modules when the modules are mechanically connected.

Abstract: An electronic module having a chassis and a single backplane disposed within the chassis. A plurality of bridge circuit cards is disposed within the chassis and is electrically connected to the single backplane. Each of the plurality of bridge circuit cards is for converting between a local area network protocol and a wide area network protocol. A hub circuit card is disposed within the chassis and is electrically connected to the single backplane so that the hub circuit card is electrically connected to each of the plurality of bridge circuit cards. The single backplane is connectable to each of a plurality of remote units for respectively electrically connecting each of the plurality of remote units to each of the plurality of bridge circuit cards. The single backplane is connectable to a data network for electrically connecting the data network to the hub circuit card.

Abstract: In a docking station, a connecting port unit is mounted on a housing and is coupled to an external peripheral device. A connector is mounted on the housing and is coupled electrically to the connecting port unit. The connector is coupled electrically and directly with a portable electronic apparatus so as to provide a signal transmission path between the connecting port unit and the portable electronic apparatus when the portable electronic apparatus is mounted on the housing. The circuit unit is mounted in the housing, is coupled electrically to the connector, and receives and processes an external cable television signal so as to provide an output signal associated with the cable television signal to the portable electronic apparatus via the connector.

Abstract: A circuit module for a rack-mounted circuit has a motherboard detachably mounted in the module for removal and replacement while the module remains in the rack.

Abstract: Among plural types of signals sent/received between a computer (PC) and a extension unit (extension adapter), a predetermined signal group is converted to a serial data and delivered through a serial bus, and a specific signal directly affecting the operational-speed is directly delivered through a direct signal line so that the number of connection signals between the computer and the extension unit is reduced while keeping the operational-speed from lowering, a connector can be made smaller, and the device constitution of the entire system can be compact.

Abstract: The subrack has a slot for the terminal strip (4) embodied as a self-supporting, autonomous modular unit. By means of the mirror-image arrangement of the fixing points in the subrack, the terminal strip (4) can be selectively assembled in such a way that external lines coming from the front or back side of the subrack can be connected to connecting components (5) of the terminal strip (4).

Abstract: A pluggable optical transceiver having a pivotable actuator assembly for quickly and easily removing the transceiver from a receptacle cage is provided. The actuator assembly includes a pivotable lever arm and a slide member that can slide in a forward and rearward direction. Force is first applied to the actuator lever so that it pivots and rotates to a different position. Then, as force is applied to the pivoted actuator lever, the slide member slides rearwardly causing the transceiver to become disengaged from the receptacle. In this manner, the transceiver is released and can be removed easily from the receptacle.

Abstract: An electronic engine controller is provided in which a backup controller or independent protection module is located in a sealed housing 8 which itself is located within the main housing 4 of the controller. The backup controller is thermally insulated such that it has enhanced durability in the event of a fire or the like occurring in the vicinity of the controller.

Abstract: A mount structure for two members is applicable to a mount structure between a socket body as one member and an operation member as another member, which are relatively movable in their contacting or separating direction. A plate-shaped engaging piece extends from the operation member along the side surface of the socket body and is formed with an opening window, into which a projection formed to the side surface of the socket body is inserted. A coming-off prevention mechanism for preventing the engaging piece from coming off from the projection is provided between the side edge portion of the opening window peripheral edge and the side edge portion of the projection.

Abstract: A double-sided oscillator package having an open-top oscillator housing adapted to receive electronic components and a hermetically sealed resonator housing containing a piezoelectric element is described. The electronic components and piezoelectric element are electrically connected. The respective housing can be manufactured separately and the components thereof assembled thereafter to form the package.

Abstract: A method and system for packaging electronics with an electronic card rack of radial panels, an outer casing, a stabilizing ring, and a flex-circuit interconnect, whereby electronic cards inserted into the sectors formed by the radial panels do not carry the structural load. The card-mounted devices are optimally oriented for set back forces, and minimal potting and/or structural foam is required, if any. The present invention provides a lightweight, highly serviceable assembly that is relatively less expensive to produce, test and rework compared with potted assemblies.

Abstract: In part, and in addition to apparatus and methods presented, an expansion board to be connected/disconnected to/from its mother board easily is provided. A face of a CDC (Communication Daughter Card), which is an expansion board to be connected to the mother board of a computer system is covered by an insulating sheet. In the CDC, an edge of one end of this insulating sheet is extended so as to form a projection. A user can take this projection with fingers, thereby carrying and connecting/disconnecting the CDC to/from the mother board easily.

Abstract: An apparatus for hindering the collection of dust and particulate matter within unutilized housings or ports of hardware component chassis is provided. A port filler baffle for occupying a port within a chassis includes a panel assembly sized and dimensioned to fit within the port of the chassis. A bracket couples with the panel assembly. An aperture filler couples with the bracket. The aperture filler is disposed to hinder particulate intrusion into the unutilized port of the chassis. When the panel assembly is mounted in the chassis, the aperture filler presses against the unutilized port, substantially blocking access to the inside of the port, thus hindering particulate intrusion and keeping the port clean.

Abstract: The memory module includes a substantially rigid first circuit board having at least one memory chip disposed thereon. The memory module also includes a substantially rigid second circuit board having an array of electrical contact points disposed on a planar surface thereof. A flexible connector electrically couples the first circuit board to the second circuit board, such that the memory chip is electrically connected to the array of electrical contact points. Alternatively, the memory module that rigid/flex circuit board. The rigid/flex circuit board includes a substantially rigid first section having at least one memory chip disposed thereon, and a substantially rigid second section having an array of electrical contact points disposed on a planar surface thereof. The rigid/flex circuit board also includes a flexible third section in-between the first section to the second section.

Abstract: A module holder is provided which includes a first foot for supporting one side of a module, a second foot for supporting the other side of the module, and slots detachably assembled between the first foot the second foot provided as many as are necessary corresponding to the number of modules to be mounted therein. An engaging unit may be formed between the first foot and the slot, between the adjacent slots, and between the slot and the second foot, for fixing each component detachably. Since the slots are formed as single products and engaging portions are formed between the slots, so that the slots can be separated or engaged, the slots can be assembled as many as are necessary corresponding to the number of modules to be mounted and modules may be added, if necessary. Accordingly, the space of the module holder occupying equipment can be minimized, improving the space utilization of the equipment.

Abstract: An electromechanical device for mounting an electronic assembly on a mounting rack, in particular for mounting a display instrument recessed in a dashboard. There is at least one conductive Velcro-type connector between the electronic assembly (6) and the mounting rack (7), the conductive Velcro-type connector serving both for the mechanical fastening and the electrical contacting of the assembly (6) on the mounting rack (7).

Abstract: A circuit board programming/debugging arrangement and method includes a circuit board and frame assembly and a programming/debugging device. The assembly includes a printed circuit board, a first frame section coupled to the circuit board and at least one second frame section coupled to at least one of the circuit board and the first frame section. The second frame section is movable from an operational position to a non-interfering programming/debugging position wherein the second section would interfere with coupling of the programming/debugging device to the circuit board. The programming/debugging device is coupled to the circuit board while the at least one second frame section is in the programming/debugging position.

Abstract: A backplane is disclosed for attaching storage devices to the backplane that utilize removable media. The backplane is distributed and scalable. The backplane includes a generally horizontal portion for distributing electronic signals to the storage devices and a plurality of connectors coupled to said generally horizontal portion for receiving the storage devices. The storage devices are coupled to the backplane utilizing the generally horizontal portion. The storage devices are not coupled to the backplane utilizing a front or a back of any one of the storage devices such that the front and back of each storage device remain accessible when the storage devices are coupled to the backplane.

Abstract: A housing arrangement for a plurality of semiconductor chips (1) is disclosed, in which each of the chips is received in a respective frame or cassette (4), there being a first electrically conductive member (5), having portions (6) which are in electrical connection with one face of each of the chips and a second electrically conductive member (7), having portions (8) which are in electrical connection with an opposite face of each of the chips.

Abstract: A clamping assembly for use in conjunction with high voltage solid state devices. The clamping assembly includes a clamp frame having upper and lower clamping plates substantially composed of aluminum and joined together by four dielectric rods composed of glass laminate material. The clamping assembly further includes a compression assembly mounted in the upper clamping plate and including several spring washers disposed in a recess defined by the upper clamping plate. The position of a compression cap attached to the upper clamping plate by eight cap screws can by adjusted by way of the cap screws so as to compress, or deflect, the spring washers. The spring washers in turn exert a compressive force that is a function of the spring constant k of the spring washers as well as of the distance over which the spring washers are compressed by the compression cap. The compressive force thus generated is transmitted to a pivot ball seated in a recess collectively defined by the spring washers.

Abstract: A module and a corresponding connector that include multiple rows of contacts is described. In one embodiment, the module may include a channel formed in a bottom edge of the module. A plurality of contacts may be disposed on the inner surface of the channel and the outer surface of the module. A complementary connector is also described.

Abstract: The invention relates to a module unit for memory modules and to a method for producing the module unit. A module unit of this type has at least one main module and submodules. The modules are arranged in a star-shaped manner and are arranged radially with their inner contact strips in slots of a central plug connector. The module unit has a substantially cylindrical housing, from which an outer contact strip of the main module protrudes.

Abstract: A ruggedized electronics system is disclosed. The ruggedized electronics system includes at least one ruggedized electronics module. The electronics module has an electrical module coupling. The ruggedized electronics system also includes an open framed chassis provided with more than one electrical chassis coupling. At least one electrical chassis coupling is coupled to at least one electronic module. The electronics modules may be coupled to and decoupled from the chassis, so that the system may be selectively reconfigured.