With Housing Patents (Class 361/730)
  • Patent number: 8004844
    Abstract: An enclosure device of a wireless communication apparatus, which has a tubular structure with increased heat dissipation not unknown heretofore. A section of the enclosure device has a polygonal or circular shape, such as a substantially cylindrical structure, and the enclosure, which has a plurality of radiation fins arranged on an outer surface of the enclosure in a vertical direction, is formed integrally with the radiation fins by using a compression method. Various communication devices of the wire communication apparatus are mounted on the interior of the enclosure. The structure is preferably formed by the radiation fins and exhibits an increased radiation effect than that of a structure where radiation fins are arranged side by side on a flat plane.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: August 23, 2011
    Assignee: KMW, Inc.
    Inventors: Duk-Yong Kim, Jung-Pil Lee, Kyoung-Seuk Kim, Chang-Woo Yoo, Sung-Ho Jang
  • Patent number: 8004858
    Abstract: An arrangement for installing a communication unit in an apparatus having a security housing, such as a mail processing apparatus, including a cavity bay located at a non-secure region of the apparatus that is accessible by a cover that is non-destructibly detachable from the security housing. The bay receives a pluggable communication unit that has a connection element connectible by a plug-in movement with a connection element of a motherboard located in the secure region of the apparatus: The cavity has at least one further connection element that is electrically conductively and mechanically connected with a metal chassis part of the apparatus in the security housing. This further connection element protrudes into the cavity and establishes contact with the communication unit for grounding thereof.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: August 23, 2011
    Assignee: Francotyp-Postalia GmbH
    Inventors: Joachim Jauert, Axel Ortmann, Tilmann Schilling, Torsten Schlaaff, Andreas Wagner, Dieter Wölm
  • Patent number: 8000104
    Abstract: An electronic device including a housing, a main circuit substrate disposed in one side of the housing; a connector unit which is disposed in an other side of the housing and is electrically connected to the main circuit substrate, and a discharging sheet disposed in the one side of the housing and is conductively connected to the connector unit to discharge static electricity generated in the connector unit is provided.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: August 16, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chul-kwi Kim, Koang-sik Lee, Dok-hwan Cha, Pil-sub Kim, Hyung-keun Song, Ba-da Kang
  • Patent number: 7995356
    Abstract: A power semiconductor module is disclosed including a housing for receiving at least one essentially board-type circuit carrier, the circuit carrier being provided with a metallization on at least one part of its surface and being populated with and electrically connected to at least one power semiconductor, rigid, integral and essentially straight load connection elements being applied on the metallized part of the metallized surface of the circuit carrier, which load connection elements are electrically and mechanically fixedly connected to the circuit carrier by one of their ends and project essentially perpendicularly into the housing interior, separate connection terminal elements for electrical conduct-making being placed onto the free end of the load connection elements.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: August 9, 2011
    Assignee: Siemens Aktiengesellschaft
    Inventors: Rainer Kreutzer, Karl-Heinz Schaller
  • Patent number: 7990725
    Abstract: A modular storage system is provided for storing a disk array consisting of multiple hard disks. Each hard disk is provided with a terminal set. The modular storage system includes a casing having a plurality of disk compartments for receiving the hard disks respectively, a front end defining a front opening and a rear end defining a rear opening; a rear cover for covering the rear opening of the casing; and a plurality of connectors mounted on the rear cover via a coupling mechanism so that each of the connectors is aligned with a respective one of the disk compartments. Once the hard disks are installed respectively in the disk compartments, the terminal set of each of the hard disks is coupled electrically to a respective one of the connectors on the rear cover.
    Type: Grant
    Filed: May 1, 2009
    Date of Patent: August 2, 2011
    Assignee: Micro-Star Int'l Co., Ltd.
    Inventors: Kai-Kuei Wu, Hsiao-Liang Chen
  • Patent number: 7986531
    Abstract: Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: July 26, 2011
    Assignee: Fairchild Korea Semiconductor, Ltd.
    Inventors: Keun-hyuk Lee, Seung-won Lim, Seung-han Paek, Sung-min Park
  • Patent number: 7970250
    Abstract: A latch and handle arrangement for a panel that provides a number of functions. The arrangement including a lever arm that functions as both a handle and a latch release in some panel and frame embodiments. The lever arm also functioning as a fastener cover in other panel and frame embodiments.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: June 28, 2011
    Assignee: ADC GmbH
    Inventor: Stephen James Morris
  • Publication number: 20110149525
    Abstract: A modular power amplifier system includes power amplifier modules removably mounted within a cabinet. Each of the power amplifier modules includes an embedded controller and a power amplifier. An RF distribution panel includes an input port for receiving an RF input signal, and a signal splitter for dividing the RF input signal for input to the plurality of power amplifier modules. Coaxial dividers are configured to divide the RF input signal substantially equally between the plurality of power amplifier modules. Passive waveguide combiners are configured to combine the amplified RF output signals from the plurality of power amplifier modules at an output port to provide an RF output signal. A designated master controller monitors operating parameters associated with each power amplifier module. The combined power rating of the power amplifier modules exceeds a rated power of the system by at least one power amplifier module.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: Paradise Datacom, LLC
    Inventor: Stephen D. TURNER
  • Publication number: 20110149527
    Abstract: The present invention provides for a multispur fieldbus barrier arrangement having a trunk connection (23) and in which each of a plurality of spurs (210) is connected to the trunk (23) by barrier devices (24), where each barrier device (24) comprises a removably mounted modular unit arranged for plug-in connection to the trunk (13) by means of a flameproof connection (29) and further wherein a redundant barrier device can likewise be included for activation responsive to failure of a barrier device.
    Type: Application
    Filed: September 2, 2009
    Publication date: June 23, 2011
    Applicant: Cooper Technologies Company
    Inventor: Frederic Esposito De La Torella
  • Publication number: 20110149526
    Abstract: A power amplifier chassis for an n+1 redundant power amplifier system. The power amplifier chassis includes an embedded controller and a power amplifier. The embedded controller operates the power amplifier chassis in a master controller mode or a slave controller mode. When operated in the master controller mode, the embedded controller monitors operating parameters associated with the power amplifier chassis, and can transfer control of the power amplifier system when the embedded controller senses that the monitored operating parameters indicate a failure or impending failure of the power amplifier chassis. When operated in the slave controller mode, the embedded controller receives control instructions from the master controller power amplifier module, and is enabled to reconfigure the power amplifier chassis from the slave controller mode to the master controller mode in response to a failure or imminent failure indication of a first power amplifier chassis operated in master controller mode.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: Paradise Datacom LLC
    Inventor: Stephen D. TURNER
  • Patent number: 7952655
    Abstract: A display device includes a display module, a rear cabinet and a front cabinet. The front cabinet has a front frame portion, a first rib and a second rib. The front frame portion defines a window. The first rib has a peak ridge. The first rib is integrally formed on the front frame portion, extends along the front frame portion to surround the window and protrudes rearward from the front frame portion so that the peak ridge contacts with a peripheral edge portion of the front face of the display module. The second rib has a flat top face. The second rib is integrally formed on the front frame portion, is located outward of the first rib with respect to the window with a spacing therebetween and protrudes rearward from the front frame portion. The second rib has shorter height than the first rib.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: May 31, 2011
    Assignee: Funai Electric Co., Ltd.
    Inventors: Nobuhiro Matsutani, Shinichi Kameoka
  • Patent number: 7952329
    Abstract: A system and methods for an avionics system are provided. The avionics system includes an enclosure, a recording device positioned within the enclosure, and an energy storage device positioned within the enclosure wherein the energy storage device electrically coupled to the recording device to supply electrical power to the recording device for a time period of greater than thirty seconds.
    Type: Grant
    Filed: October 29, 2008
    Date of Patent: May 31, 2011
    Assignee: General Electric Company
    Inventor: Joseph B. Steffler
  • Patent number: 7952478
    Abstract: An apparatus and method detect microchip tampering by including a capacitance circuit that comprises a protective cover. Dielectric material may be sandwiched between the cover and a backside metal layer, which may be proximate a protected surface of the microchip. Changes in the capacitance of the above circuit caused by alteration of the cover or other component of the capacitance circuit may be sensed and prompt defensive action.
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: May 31, 2011
    Assignee: International Business Machines Corporation
    Inventors: Gerald K Bartley, Darryl J Becker, Paul E Dahlen, Philip R Germann, Andrew B Maki, Mark O Maxson
  • Patent number: 7944704
    Abstract: The invention relates to a terminal module (1) with integrated functions, comprising a housing (2), at least one terminal strip (14-16) for connecting wire strands, and at least one circuit board (20) which is disposed in the housing (2) and on which functional elements are arranged that are electrically placed between contacts of the terminal strip or strips (14-16). Switching elements (21), by means of which conductor paths between the contacts can be modified, are positioned on the circuit board (20).
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: May 17, 2011
    Assignee: ADC GmbH
    Inventors: Harald Klein, Adrian Benedetto, Antony Nijhuis, Joachim Stark, Manfred Stöckel
  • Patent number: 7944701
    Abstract: A housing for a power semiconductor module in which load-connecting elements having contact devices are arranged. The contact devices are arranged in housing troughs on the exterior of the housing. The housing troughs are formed at an associated lateral wall of the housing. The housing is closed off by a cover. The housing is preferably formed as a unitary piece of material having a circumferential sealing frame and the cover includes an outer rim that extends over the circumferential sealing frame, to prevent the penetration of fluid or moisture into the power semiconductor module when the cover is closed. On its inner rim, each housing trough includes a sealing rib formed of a section of the sealing frame. The associated load-connecting element is crimped about the sealing rib, so that the contact device is disposed within the trough.
    Type: Grant
    Filed: February 13, 2008
    Date of Patent: May 17, 2011
    Assignee: Semikron Elektronik GmbH & Co., KG
    Inventors: Rainer Popp, Marco Lederer
  • Patent number: 7931114
    Abstract: An adapter or an appliance for use with an independently operable consumer electronic device having a user interface. The adapter comprises a holding device forming a device cavity capable of admitting the consumer electronic device in a predetermined orientation. An access opening into the device cavity exposes a portion of the consumer electronic device when the consumer electronic device is in the predetermined orientation. The portion of the consumer electronic device exposed includes at least a portion of the user interface.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: April 26, 2011
    Assignee: Whirlpool Corporation
    Inventors: Douglas D. LeClear, Ruben E. Rothermel, Andrew M. Tenbarge, James W. Kendall, Richard A. McCoy
  • Patent number: 7924571
    Abstract: A shield case shields an electric circuit on a circuit board by covering a front surface and a side peripheral surface of the circuit board. The shield case includes a frame section vertically arranged on a mother board and covering the side peripheral surface of the circuit board, and a lid section including a plate member provided at an upper end of the frame section and covering the front surface of the circuit board. The circuit board is arranged in the frame section at a position spaced apart from a front surface of the mother board, and has a circuit-side connector at a back surface of the circuit board. The circuit-side connector is connected with a mother-board-side connector provided at the mother board, so that an electric circuit of the circuit board is electrically connected with a conductive portion of the mother board.
    Type: Grant
    Filed: September 17, 2009
    Date of Patent: April 12, 2011
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Masanori Tsubono
  • Patent number: 7916489
    Abstract: According to an aspect of the present invention, a mounting structure includes a housing, an electronic component mounted at the housing, a pin-shaped terminal arranged upright at the housing, a circuit board having a mounting through-hole into which the in-shaped terminal is inserted, and a mounting support member positioned between the housing and the circuit board and fixed to the housing with the circuit board. In the mounting structure, the mounting support member includes a through-hole for positioning the pin-shaped terminal and an inclined guiding surface formed continuously with the through-hole for guiding a distal end of the pin-shaped terminal into the through-hole.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: March 29, 2011
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventor: Hisayoshi Okuya
  • Patent number: 7913914
    Abstract: A card connector for ejection and introduction of smart cards is disclosed for usage in a portable electronic device comprising a card reader with a resilient card connecting device for operative connection of the smart card to the card reader by introducing the smart card into the card reader or disconnection of the smart card from the card reader by withdrawing the smart card from the card reader by moving the smart card in a plane being substantially in parallel with the plane of the card reader, wherein the card connecting device is extending substantially along a plane being inclined in relation to the plane of the card reader at an angle ?, wherein the angle ? is not 90°.
    Type: Grant
    Filed: April 28, 2009
    Date of Patent: March 29, 2011
    Assignee: Sony Ericsson Mobile Communications AB
    Inventor: Andreas Nilsson
  • Patent number: 7911800
    Abstract: Electrical apparatus is provided including a housing for containing one or more electrical components therein. The housing has at least one connector means (29) for allowing the connection of at least one electrical cable thereto. Channel means (28) are provided adjacent the connector means for containing at least a part of the electrical cable adjacent a connection end thereof which is to be connected to the connector means on the housing in use.
    Type: Grant
    Filed: May 24, 2004
    Date of Patent: March 22, 2011
    Assignee: Pace, Pic
    Inventor: Mark Andrew Smith
  • Patent number: 7907420
    Abstract: A plurality of film substrates (2) having a bare chip (1) mounted on one side or both sides are joined into a laminated state by joint portions (3) and are attached to a motherboard (4) through junction by a joint portion (8) at a location off the mounting areas of the bare chips (1), thereby achieving a lower profile, higher lamination, and higher capacity.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: March 15, 2011
    Assignee: PANASONIC Corporation
    Inventors: Koichi Nagai, Minoru Yamamoto, Ken Takano, Tatsuo Sasaoka, Kazumichi Shimizu
  • Patent number: 7907422
    Abstract: The present invention provides a card case that can prevent skimming, when a noncontact IC card is sent to a card user from an issuer of it, or carried by the card user. Since metal films, which shield from an electromagnetic wave, are provided in a card main body, it makes prevention of skimming possible, when the noncontact IC card is sent to the card user from the card issuer. The card user peels off a peeling the section by taking off the seal of openings from an adhesive section, and then insert the card main body having the exposed the adhesive section into a card storing section formed in his wallet or commuter pass holder. As a result, skimming of the IC card can be prevented even when it is carried by the card user in his wallet or the commuter pass holder.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: March 15, 2011
    Inventor: Kenichi Tokuyama
  • Patent number: 7898819
    Abstract: A 1/16 DIN power controller configuration is provided that includes a housing, a circuit board carrier disposed within the housing and capable of engaging at least three circuit boards within the housing, a power supply circuit board disposed within the housing and engaged by the circuit board carrier, and a communications circuit board disposed adjacent the power supply circuit board within the housing and engaged by the circuit board carrier. The communications circuit board includes Ethernet/IP and/or Modbus TCP protocols, and in alternate forms includes RS-232 and RS-485 with Modbus RTU protocol, DeviceNet, Profibus DP, CanOpen, and/or EtherCat.
    Type: Grant
    Filed: April 6, 2007
    Date of Patent: March 1, 2011
    Assignee: Watlow Electric Manufacturing Company
    Inventors: Thomas Robert Pfingsten, Stanton Hopkins Breitlow, John Frederic Lemke, Keith Douglas Ness, Robert Allen Pape, Larry Emil Tiedemann, Theodore Thomas Von Arx, Dale Thomas Wolfe, Matthew Francis Yender
  • Patent number: 7894208
    Abstract: A server module includes a tray, a motherboard installed in the tray, and at least one storage device. The tray includes a port erected from a rear end of the tray, a roomage inwardly and concavely disposed on an edge of the motherboard and proximate to the port, and a socket disposed at an edge of the roomage and opposite to the port for connecting the insert roomage of the storage device, such that the storage device is disposed onto the roomage of the motherboard, and the motherboard can be used for expanding the storage device directly.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: February 22, 2011
    Assignee: Super Micro Computer Inc.
    Inventor: Te-Chang Lin
  • Patent number: 7889505
    Abstract: A camouflage retractable media system for efficiently providing media devices (e.g. speakers, etc.) that retract out-of-sight when not in use. The camouflage retractable media system generally includes a casing including a first end and a second end, wherein the first end includes a first opening and wherein the first opening extends through the first end. A chamber extends within the casing, wherein the chamber interconnects with the first opening. A drive unit extends within the chamber and a media device extends from the drive unit. A cap is positioned adjacent the first opening of the casing, wherein the cap includes a camouflage covering with respect to a surrounding environment. The drive unit selectively extends the media device outwardly from the first opening when in use and retracts the media device back within the chamber when not in use.
    Type: Grant
    Filed: October 24, 2007
    Date of Patent: February 15, 2011
    Inventor: Morris L. Beard
  • Patent number: 7880299
    Abstract: The present invention is intended to obtain a semiconductor device that is reduced in size, weight, and cost and improved in performance stability and productivity. The semiconductor device includes a semiconductor module in which a semiconductor element is sealed with a resin, a reinforcing beam fixed to an upper surface of the semiconductor module via a plate-like spring, and a frame part to which both ends of the reinforcing beam are fixed, the frame part being disposed in such a fashion as to enclose from four directions an outer periphery of the semiconductor module, plate-like spring, and the reinforcing beam.
    Type: Grant
    Filed: July 15, 2008
    Date of Patent: February 1, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Toru Kimura, Yuji Shirakata
  • Patent number: 7876568
    Abstract: The electronic device has: a housing having an opening; a lid attached to the housing to cover the opening; a first substrate fixed in the housing; and a second substrate that has a first electronic component mounted on a first surface thereof, a first component mounting part on the first surface on which a second electronic component is removably mounted, and a third electronic component mounted on a second surface thereof and is fixed in the housing with the first surface facing the opening and the first component mounting part exposed in the opening.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: January 25, 2011
    Assignee: Fujitsu Limited
    Inventors: Nagahisa Chikazawa, Katsumi Adachi
  • Patent number: 7872871
    Abstract: A low-profile Universal-Serial-Bus (USB) device includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a USB controller chip and a flash memory chip, or a single-chip (combined USB controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The low-profile USB device is optionally used as a modular insert that is mounted onto a metal case to provide a USB assembly having a plug shell similar to a standard USB male connector.
    Type: Grant
    Filed: July 5, 2007
    Date of Patent: January 18, 2011
    Assignee: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Jim C. Ni, Charles C. Lee, I-Kang Yu, Ming-Shiang Shen
  • Patent number: 7869224
    Abstract: A housing structure for pluggable transceiver module includes a case being internally provided with a plurality of vertical partitioning plates, and having first protrusions provided on an upper and a lower side of a free edge at an open end of the case, and second protrusions provided on two opposite sides of a free end of each of the partitioning plates at the open end of the case; a plurality of first elastic-leaf members being clamped to the free edge of the case and having retaining holes engaged with the first protrusions; and a plurality of second elastic-leaf members being clamped to the free ends of the partitioning plates and having retaining holes engaged with the second protrusions. Therefore, the first and second elastic-leaf members are easily and securely assembled to the case and the partitioning plates via the first and second protrusions, respectively, without the need of spot welding.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: January 11, 2011
    Assignee: All Best Precision Technology Co., Ltd.
    Inventor: Haven Yang
  • Publication number: 20100328901
    Abstract: A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.
    Type: Application
    Filed: June 24, 2010
    Publication date: December 30, 2010
    Applicant: DENSO CORPORATION
    Inventors: Hideki MINATO, Hideki Kabune, Atsushi Furumoto
  • Patent number: 7859849
    Abstract: In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system.
    Type: Grant
    Filed: May 14, 2009
    Date of Patent: December 28, 2010
    Assignee: Finisar Corporation
    Inventor: Donald A. Ice
  • Patent number: 7855893
    Abstract: In general, an improved handle assembly in accordance with the present invention is configured to be removably attached to a printed circuit board (PCB), such as a vehicle detector PCB. The handle assembly includes a faceplate, a handle extending outward from the front surface of the faceplate, and an enclosure extending from the back surface of the faceplate, wherein the enclosure has an open side configured to interface with the printed circuit board, and an external surface configured to accept printed indicia (e.g., operating instructions relating to functionality of the printed circuit board). In a preferred embodiment, the handle assembly is an integral, plastic (e.g., polycarbonate) structure, and is configured to cover one or more temperature-sensitive components attached to the board.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: December 21, 2010
    Assignee: Eberle Design, Inc.
    Inventor: Michael Pengelly
  • Patent number: 7855892
    Abstract: A protective jacket for covering an electrical device is provided. The protective jacket includes a first shell and a second shell. The first shell includes a front cover, a rear cover, and an elastic strip. The front and the rear covers are formed apart from each other and have an individual hollow for receiving the insertion of the device. The elastic strip is formed between these covers. A space is defined on the first shell by theses covers, and the elastic strip together. The second shell is configured to be disposed within the space of the first shell, and has a slot for receiving the insertion of the device. Therefore, the protective jacket conforms to the shape of the device and is capable of covering the device compactly for preventing damages due to collision and avoiding dust and mist pollution so as to increase the life of the device substantially.
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: December 21, 2010
    Assignee: Fruitshop International Corporation
    Inventor: Chin-Sheng Lin
  • Patent number: 7848112
    Abstract: On a case member of a semiconductor device, a screw block terminal or the like for connection to external equipment is attached. The screw block terminal or the like arranged on a region inside a base plate is attached to a terminal attachment member. Terminal attachment member has wall-like bodies, similar to wall-like bodies formed on a sidewall portion, formed along the direction of extension of terminal attachment member. On one end of terminal attachment member in the direction of extension, a side fitting portion is formed that corresponds to the wall-like body, and by fitting the side fitting portion to a space between sidewall portion and the wall-like body, terminal attachment member is fixed on case member. Thus, a semiconductor device is provided that allows high degree of freedom with simpler structure, as to the position of attaching a screw block terminal or a pin terminal to the case member.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: December 7, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventor: Manabu Matsumoto
  • Publication number: 20100302744
    Abstract: A method, apparatus, and system are described for a pre-wired and pre-engineered integrated platform for power supply and distribution that is pre-assembled, scalable, and modular. The skeletal framework of the integrated platform acts as an equipment support structure as well as a cable routing support system. A set of cables having wiring is routed along the skeletal framework of the integrated platform and goes to two or more cabinet enclosures mounted onto the skeletal framework. The skeletal framework acts as a National Electric Code approved raceway system to support and route the set of cables to the electrical equipment in the mounted cabinet enclosures. The integrated platform supports the weight of the one or more cabinet enclosures mounted onto the skeletal framework.
    Type: Application
    Filed: August 28, 2009
    Publication date: December 2, 2010
    Applicant: ROSENDIN ELECTRIC, INC.
    Inventors: Matthew John Englert, Jeffrey David Rose, John Manual Loera
  • Patent number: 7839646
    Abstract: A handheld computing device includes an electronic component assembly including at least one user interface component, and an enclosure formed from an extruded tube. The extruded tube defines an internal lumen between open ends, and has a substantially uniform cross section along a longitudinal axis thereof. The extruded tube includes a front face, a back face, side portions connecting the front face and the back face, at least one access opening provided on the front face, and a pair of guide rails formed in the lumen along the side portions in parallel with the longitudinal axis, the guide rails slidably guiding and receiving the electronic component assembly. The guide rails support the electronic component assembly and provide a reference surface for positioning the electronic component assembly relative to the front face such that the user interface is placed right behind the access opening to provide user access therethrough.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: November 23, 2010
    Assignee: Apple Inc.
    Inventors: Stephen Paul Zadesky, Stephen Brian Lynch
  • Publication number: 20100290604
    Abstract: A modular form factor power module system with monitoring and control functions is disclosed. The power module system is configured to power, monitor and/or control telecommunications equipment at the circuit level.
    Type: Application
    Filed: March 26, 2010
    Publication date: November 18, 2010
    Applicant: Telect, Inc.
    Inventors: Randolph Stanton Wright, Cindy Antoinette Dainio, Larry O'Neal Reeder, Phung M. Tran
  • Patent number: 7830668
    Abstract: A power supply unit for a mobile computerized device includes a housing having a handle, a battery positioned within the housing, and a detector configured to detect user interaction with the handle. The power supply unit may comprise a removable power supply unit for a mobile computerized device, having a detector generating a signal in response to detecting user interaction with the handle.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: November 9, 2010
    Assignee: Stinger Industries LLC
    Inventors: Gary Coonan, Jennifer L. Duckworth, Dean A. Werthman
  • Patent number: 7821791
    Abstract: A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: October 26, 2010
    Assignee: SEMIKRON Elektronik GmbH & Co. KG
    Inventors: Rainer Popp, Marco Lederer
  • Publication number: 20100265667
    Abstract: An electrical assembly comprises a housing, where the housing has an inner housing and a removable outer housing removably connected to the inner housing. A first connector portion is secured to the inner housing. The first connector portion comprises a dielectric body and connector terminals. A subscriber identification module is supported by the inner housing. The subscriber identification module has device terminals. A group of conductors or a conductor assembly supports an electrical connection of the connector terminals to the device terminals. A holder retains the subscriber identification module with respect to the inner housing.
    Type: Application
    Filed: August 14, 2009
    Publication date: October 21, 2010
    Inventors: Christopher M. Masucci, Kenneth C. Clark, David M. Thompson, Michael A. Hajicek, Todd A. Braun, Christopher J. Schmit
  • Patent number: 7817435
    Abstract: A wiring substrate has a front face and a rear face opposed the front face. An electric component is mounted on the front face and is electrically connected to the wiring substrate at the rear face. A protection cover is comprised of a resin material and includes an upper plate, a lower plate and a connecting plate. The upper plate covers the electric component from above. The lower plate covers an electrical connection between the wiring substrate and the electric component from below. The connecting plate integrally connects the upper plate and the lower plate.
    Type: Grant
    Filed: October 11, 2007
    Date of Patent: October 19, 2010
    Assignee: Funai Electric Co., Ltd.
    Inventor: Hiroaki Iwaasa
  • Patent number: 7800921
    Abstract: Power converter system topologies comprise a DC/DC converter. The DC/DC converter includes a transformer coupling a high side to a low side. The high side may include an inverter bridge in the form of an inverter module and an inductor. The low side may include a rectifier in the form of a rectifier module and a pair of inductors. The transformer may take the form of a planar transformer.
    Type: Grant
    Filed: January 8, 2008
    Date of Patent: September 21, 2010
    Assignee: Continental Automotive Systems US, Inc.
    Inventors: Lizhi Zhu, Fred Flett, John M. Van Dyke
  • Patent number: 7795549
    Abstract: A housing for a weighing indicator terminal, having a top cover and a base member attached to the top cover. The top cover and the base member have complimentary configurations whereby the top cover and the base member are attachable together in more than one configuration.
    Type: Grant
    Filed: March 31, 2007
    Date of Patent: September 14, 2010
    Assignee: Ohaus Corporation
    Inventors: Robert Hansen, Douglas Gardner, Zbigniew Pobocha
  • Publication number: 20100226100
    Abstract: Multimedia management devices comprise a plurality of multimedia management modules coupled together in an intermodular network. At least some of the multimedia management modules are adapted to distribute at least one of audio or video within an area. Each multimedia management module is configured to enable a distinct functionality to a multimedia management device. Each multimedia management module is sized and configured to be disposed at least partially within an electrical gang box.
    Type: Application
    Filed: March 5, 2010
    Publication date: September 9, 2010
    Applicant: YEN INTERNATIONAL, LLC
    Inventors: Thomas J. Johnson, Thomas Henry Perszyk
  • Patent number: 7782628
    Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.
    Type: Grant
    Filed: September 26, 2008
    Date of Patent: August 24, 2010
    Assignees: Sanyo Electric Co., Ltd., Sanyo Semiconductor Co., Ltd.
    Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
  • Patent number: 7781675
    Abstract: A network cabinet is provided comprising a door comprising first and second opposing lateral sides. A hinge lever is rotatably connected to the door and a retractable hinge pin is connected to the hinge lever and is positioned closer to the first lateral side of the door than the second lateral side. A lever stop is also connected to the door and is associated with the hinge lever. The lever stop prevents retraction of the hinge pin from an extended position with the second lateral side of the door in an open position.
    Type: Grant
    Filed: October 26, 2007
    Date of Patent: August 24, 2010
    Assignee: Panduit Corp.
    Inventors: Samuel J Adducci, Jonathan D Walker, Brendan F Doorhy
  • Patent number: 7768789
    Abstract: A case-grounded flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips and a controller chip. The PCBA is encased inside an upper case and a lower case, with a Serial AT-Attachment (SATA) connector that fits through an opening between the cases. The cases can be assembled with the PCBA by a screw-together or thermal-bond adhesive method. Triple-axis case-grounding tabs draw any electro-static-discharges (ESD) current off the upper case along a primary axis and onto a PCBA ground through a secondary axis that is screwed into the PCBA. An intermediary axis between the primary and secondary axes fits around a PCBA notch while the secondary axis passes through a metalized alignment hole on the PCBA for grounding. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the triple-axis case-grounding tabs.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: August 3, 2010
    Assignee: Super Tatent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Ken Qi-Jin Li, Abraham C. Ma, Ming-Shiang Shen
  • Patent number: 7764506
    Abstract: Systems and methods for providing a dynamically modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the dynamically modular unit, thereby enhancing the usefulness of the platform across all type of application.
    Type: Grant
    Filed: July 10, 2006
    Date of Patent: July 27, 2010
    Inventor: Jason A. Sullivan
  • Patent number: 7755906
    Abstract: An electronic apparatus comprising: a unit which is mountable and removable at an electronic apparatus main body; a locking component; a mounted component which is mounted at the unit; a stopper member which is mounted at the unit and impedes removal of the mounted component from the unit; a first engaged portion which is provided at one of the unit and the stopper member; and a first engaging portion which is provided at the other of the unit and the stopper member, the first engaging portion engaging with the first engaged portion when the stopper member is mounted at the unit and impeding removal of the stopper member from the unit, being operable for releasing the engagement with the first engaged portion, and being inoperable in a state in which the unit is mounted at the electronic apparatus main body, is provided.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: July 13, 2010
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Naruhiko Sato
  • Patent number: 7755905
    Abstract: The invention provides an electronic mobile communications/entertainment device capable of a plurality of modes of operation, comprising a basic module having circuitry common to the operation of the device in said plurality of modes of operation, and a plurality of supplementary modules, each supplementary module being provided in the form of a housing cover for the device and including controlling means configured to provide for a corresponding mode of operation when coupled to the basic module, the supplementary modules being interchangeably attachable/detachable to the basic module so as to provide respective modes of operation, and the device only being operational when one of said plurality of supplementary modules is attached to the device.
    Type: Grant
    Filed: July 22, 2008
    Date of Patent: July 13, 2010
    Assignee: Nokia Corporation
    Inventor: Axel Kohnke