Ic Card Or Card Member Patents (Class 361/737)
  • Patent number: 7114047
    Abstract: A data storage medium has a first memory area that is read-only and stores first certification data that is unique to the data storage medium, a second memory area that stores data and second certification data supplied from the outside, an identity circuit for determining whether or not the first and second certification data are identical with each other, and a switch circuit for providing the data stored in the second memory area to the outside only when the identity circuit determines that the first and second certification data are identical with each other. If data is written into the data storage medium with illegal certification data, the data storage medium disables the reading of the written data from the data storage medium, thereby preventing the illegal copying of digital data.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: September 26, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hiroshi Iwasaki
  • Patent number: 7109427
    Abstract: A method for producing a finished multimedia card (MMC) in a single molding operation in a second stage manufacturing operation. The first stage involves obtaining an already molded top plate and an already assembled printed circuit board (PCB). The second stage involves placing the molded top plate and assembled printed circuit board together in a mold assembly and then placing the mold assembly in an injection molding machine. The printed circuit board is thus only exposed to a single molding operation in order to produce a finished multimedia card such as a memory card. The single molding operation produces an improved quality multimedia card.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: September 19, 2006
    Inventor: Chor-Ming Ng
  • Patent number: 7110262
    Abstract: A memory device has a variable storage capacity depending on the object of use by a user, thereby improving convenience in use of the device. The memory device has a casing which may be loaded into host equipment. The casing has a plural number of loading sections in each of which a memory chip can be mounted. The casing carrying the memory chips has a terminal unit at the end insertable in the host equipment. Data readout from or writing into the memory chip is controlled by a semiconductor unit forming a control circuit disposed in the casing. The memory device may be of a recording capacity as desired by a user by changing the number of the memory chips mounted in the loading sections or by mounting memory chips of variable recording capacities in the loading sections.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: September 19, 2006
    Assignee: Sony Corporation
    Inventors: Shigeo Matsumoto, Yasushi Fujita, Katsumi Endo
  • Patent number: 7104807
    Abstract: A plug for coupling with an industry-standard EXPRESSCARD™ receptacle is described. The plug includes a plurality of plug-side metal contacts disposed on a bottom substrate. The plurality of plug-side metal contacts is configured to electrically couple with receptacle-side metal contacts in the industry-standard EXPRESSCARD™ receptacle. When the plug is disconnected from the industry-standard EXPRESSCARD™ receptacle, the surfaces of the plurality plug-side metal contacts are exposed by not being covered by a top housing.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: September 12, 2006
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Ren-Kang Chiou, Edward W. Lee
  • Patent number: 7102891
    Abstract: A multi use circuit module has a front half module. The front half module is a functional circuit module having electrical contacts on a front portion there of for electrically coupling the multi use circuit module to a host device. A rear half module is removably coupled to the front half module. The rear half module increases functionality of the multi use circuit module by allowing functional and non functional components to be coupled to the front half module.
    Type: Grant
    Filed: July 23, 2003
    Date of Patent: September 5, 2006
    Assignee: Amkor Technology, Inc.
    Inventors: Jeffrey Alan Miks, John Armando Miranda
  • Patent number: 7102879
    Abstract: An industrial computer hinge assembly includes a bolt having a head and an extension, a first positioning ring with a first hook, a second positioning ring with a second hook, multiple leaf springs and an assembly device having an extension hole and a first fixing hole defined in a main board casing to correspond to the extension of the bolt and the first hook respectively and a hole and a second fixing hole defined in a screen casing to correspond to the extension and the second hook respectively. After the extension combines with the nut, engagement between the first positioning ring and the second positioning ring provides friction force to support the screen casing relative to the main board casing.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: September 5, 2006
    Inventor: Steven Lee
  • Patent number: 7102217
    Abstract: A board-on-chip (BOC) semiconductor package includes a multisegmented, longitudinally slotted interposer substrate through which an elongate row of die bond pads is accessed for electrical attachment, as by wire bonding, to conductive traces on the opposite side of the interposer substrate. One or more reinforcements in the form of crosspieces or bridges span and segment intermediate portions of the substrate slot to resist bending stresses acting in the slot region proximate the centerline of the interposer substrate tending to crack or delaminate a polymer wire bond mold cap filling and covering the slot and the wire bonds. Various interposer substrate configurations are also disclosed, as are methods of fabrication.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: September 5, 2006
    Assignee: Micron Technology, Inc.
    Inventor: Blaine J. Thurgood
  • Patent number: 7099648
    Abstract: An RFIC includes a baseband processing module, a digital to analog converter, an analog to digital converter, a radio module, and a border section. The border section is fabricated on the substrate, wherein the border section physically separates the radio module from the baseband processing module, the digital to analog converter, and the analog to digital converter, wherein the border section includes noise suppression circuitry operably coupled to convert outbound baseband signals into low noise outbound baseband signals and to convert low noise inbound baseband signals into inbound baseband signals.
    Type: Grant
    Filed: December 19, 2003
    Date of Patent: August 29, 2006
    Assignee: Broadcom Corporation
    Inventor: Shahla Khorram
  • Patent number: 7095618
    Abstract: A multi-memory media adapter comprised of a first planar element having an upper surface and a lower surface, a second planar element having an upper surface and a lower surface, and formed from a single material. The two planar elements form at least one port, each port capable of receiving one or more types of a memory media card. The adapter has at least one set of contact pins protruding from the lower surface of the first planar element or the upper surface of the second planar element such that the at least one set of contact pins are disposed within the port. The at least one set of contact pins are capable of contacting the contacts of a memory media card inserted into the port. For one embodiment a controller chip is embedded within the single material forming the multi-memory media adapter.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: August 22, 2006
    Assignee: OnSpec Electronic, Inc.
    Inventors: Sreenath Mambakkam, Arockiyaswamy Venkidu, Larry Lawson Jones
  • Patent number: 7092639
    Abstract: A transmitter comprises an oscillator, a phase lock loop, a serializer, and an electrical-to-optical converter. The oscillator is enclosed in a metal shield. The metal shield is soldered to a ground ring of the printed circuit board. In one embodiment, the oscillator is voltage-controlled oscillator.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: August 15, 2006
    Assignee: Intel Corporation
    Inventors: Craig Schultz, Joshua Oen
  • Patent number: 7092256
    Abstract: Methods and apparatus for interfacing a memory device with a host device are disclosed. According to one aspect of the present invention, an apparatus which enables a non-volatile memory device to communicate with a host device includes a body and an element. The body has a boundary, and the element is arranged to move at least partially within the body. The element includes an interface which may be coupled to the host device when the element is in a first position with respect to the body. The element is also arranged to receive the non-volatile memory device and to move the non-volatile memory device and the interface with respect to the body. In one embodiment, when the element is in the first position with respect to the body, the interface at least partially extends past the boundary associated with the body.
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: August 15, 2006
    Assignee: SanDisk Corporation
    Inventors: Jeffrey A. Salazar, Robert A. Howard, Jonathan R. Harris, Daren W. Hebold
  • Patent number: 7089661
    Abstract: A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC), CompactFlash™ (CF) card and PC card, by moulding over to encapsulate a populated printed circuit board (PCB) (10) to form the standard external dimensions and features of the memory card. The method comprises holding the populated PCB (10) in place in a cavity (44) of at least one mould piece; and moulding over both sides of the populated printed circuit board (10) to encapsulate said board. Various embodiments are disclosed, including means for holding the populated PCB (10) in the moulding cavity (44) for the encapsulation process, which includes transfer moulding and injection moulding processes, one or more moulding steps, and moulding over one part of one side of said board before the other side, and/or simultaneously moulding over both sides of said board.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: August 15, 2006
    Inventors: Piau Fong, Chee Kiang Yew, Colin Chun Sing Lum, Matthew Keng Siew Chua
  • Patent number: 7083107
    Abstract: A memory card that makes it possible to select the service provided by changing an adapter instead of having selection switches on the outer appearance of the card. The memory card is capable of executing one of a plurality of applications that correspond to individual services and comprises: an adapter that designates one of the services; a main card body to which the adapter is removably connected; an interface for an external device; a memory unit that stores information of the plurality of applications; a detection unit that detects whether or not an adapter is connected to the main card body; and a CPU or LSI that executes the selected application based on the detection signal to provide the service to the external device.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: August 1, 2006
    Assignee: Matsushita Electric industrial Co., Ltd.
    Inventors: Shizuka Sakamoto, Noriko Sugimoto, Masahiro Kawasaki, Eiji Ueda
  • Patent number: 7082037
    Abstract: A sheet metal cover (11) for a PC card, or electronic card, includes identical top and bottom sheet metal cover parts (13, 12) with opposite sides constructed to allow the cover parts to be joined together by merely pushing the sides of the top cover part forcefully down against the sides of the bottom cover part. One side (23) of each cover part is bent and cut to form a plurality of latching lugs (37), and the other side (24) of each cover part is bent and cut to form a plurality of slots leading to recesses that each receives a lug and then resists movement of the lug out of the recess. Each lug has outer and inner legs (38, 39) that are joined in a fold of less than 90°. The slots each receives a lug only when the inner and outer legs of the lug are deflected closer together.
    Type: Grant
    Filed: October 6, 2003
    Date of Patent: July 25, 2006
    Assignee: ITT Manufacturing Enterprises, Inc
    Inventor: Andreas Michael Schremmer
  • Patent number: 7082488
    Abstract: Embodiments of the present invention provide a system and method for detecting if a device is coupled to an inter-integrated circuit (I2C) router and/or for resetting the device. The I2C router comprises a first I2C bus port having a presence line and/or a reset line. The I2C router further comprises a control logic coupled to and/or distributed within the first I2C bus port. The control logic may determine if a device is coupled to the I2C router as a function of a state of the presence line. The control logic may also determine if a reset condition exists. If a reset condition exists, the control logic changes the state of the reset line, thereby causing the device to reset itself.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: July 25, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Thane M. Larson, Kirk Yates
  • Patent number: 7076858
    Abstract: A method of making a resonant frequency tag having a predetermined frequency comprises forming a first conductive pattern comprising an inductive element and a first land having a first end connected to an inductive element end, and a second end spaced a predetermined distance from the first end; separately forming a second conductive pattern comprising a second land having a predetermined width and a link element; placing the second conductive pattern proximate the first conductive pattern at a first location wherein the second land overlies a portion of the first land with a dielectric therebetween establishing capacitive element plates having a first capacitance along with the inductive element forming a resonant circuit; measuring the resonant circuit frequency and comparing the measured and predetermined frequencies moving the second land along of the first land length to match the resonant frequency; and securing the second conductive pattern to the first conductive pattern.
    Type: Grant
    Filed: October 19, 2004
    Date of Patent: July 18, 2006
    Assignee: Checkpoint Systems, Inc.
    Inventors: Eric Eckstein, Gary Mazoki, Peter Lendering, Luis Francisco Soler Bonnin, Takeshi Matsumoto, Lawrence Appalucci
  • Patent number: 7075793
    Abstract: An apparatus, such as a reader, adapter, or other device, is described that is capable of receiving at least four different types of memory cards using a single slot. The slot includes a central region having a width to receive a memory card of a first type, first outer regions that extend the width of the central region to a second width to receive a memory card selected from a second type of memory card or a third type of memory card, and second outer regions that extend the width of the central region to a third width to receive a memory card of a fourth type. A plurality of electrically conductive contact areas are disposed within the slot. The apparatus may receive, for example, any of a Smart Media flash memory card, Memory Stick flash memory card, Secure Digital flash memory card, or MultiMedia flash memory card.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: July 11, 2006
    Assignee: Imation Corp.
    Inventors: Trung V. Le, Robert W. Tapani
  • Patent number: 7075792
    Abstract: The present invention provides an assembly structure of electronic card comprising two cover bodies. Bent portions are formed at two ends of each of the cover bodies. A plurality of positioning pieces each having an interference piece on the outer surface thereof are extended from one of the bent portions. The other bent portion is bent inwards to form a bent piece with a slot formed at the front end of the bottom face thereof. A hook body is extended from behind the slot and the bottom face of the bent piece. A plurality of connection holes are formed at the boundary between the hook body and the bent piece. Insertion pieces are formed at two sides of the font end of the cover bodies. Two ends of a frame are extended to form clamping arms having positioning grooves for clamping a connector. The two cover bodies sheathe a circuit board up and down. The positioning pieces are retained in the slot and the connection holes to engage the two cover bodies.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: July 11, 2006
    Assignee: Longwell Company
    Inventors: Tien-Chih Tseng, Vincent Chen
  • Patent number: 7066394
    Abstract: A memory card is disclosed which has a card body (2) having a concavity (9) formed at the forward end thereof in the inserting direction and in which terminals (5) are disposed and projections (10) are formed between the terminals (5) to prevent the terminals (5) from being touched or accessed from outside. A receptacle for the memory card is also disclosed. The memory card has a simple structure designed to positively protect the terminals and easily let out dust or the like from inside, thereby permitting to assure a positive connection with the receptacle.
    Type: Grant
    Filed: August 25, 2004
    Date of Patent: June 27, 2006
    Assignee: Sony Corporation
    Inventors: Yoshio Kondo, Toshiharu Kobayashi, Takumi Okaue, Akira Sassa
  • Patent number: 7064423
    Abstract: Each of contact terminals, provided on a substrate of an IC module so as to be positioned on a back surface of a surface having an IC chip, which are terminals other than a GND terminal, has a curved convex face, and the GND terminal has a curved concave face as a counter face opposite to the curved convex face of the contact terminal so that there is a constant gap between the curved convex face and the curved concave face, and a gap between the GND and each of the contact terminals other than the GND terminal is narrower than a gap between all the contact terminals other than the GND terminal provided on the substrate so as to be positioned on the back surface of the surface having the IC chip. Thus, it is possible to provide an IC module and an IC card each of which enables the IC card's strength with respect to bending to be secured, and facilitates process thereof, and enables the IC chip to be protected from static electricity.
    Type: Grant
    Filed: June 9, 2004
    Date of Patent: June 20, 2006
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yoshitaka Okita, Masataka Nishikawa
  • Patent number: 7059871
    Abstract: A memory card casing is composed of a top cover having multiple through holes defined in a peripheral edge of the top cover, and a bottom cover, wherein the bottom cover has multiple longitudinal ridges formed on a peripheral edge of the bottom cover, a first rib formed on the bottom cover to connect to one end of each of the longitudinal ridges and a second rib formed on the bottom cover to connect to the other end of each of the longitudinal ridges so that after a printed circuit board is inserted into a receiving space between the bottom cover and the top cover, contacts on the printed circuit board are exposed via the through holes of the top cover and fully supported by the longitudinal ridges.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: June 13, 2006
    Assignee: Chip Hope Co., Ltd.
    Inventor: Kun-Hsien Hsiao
  • Patent number: 7061769
    Abstract: The present invention discloses an USB/OTG-interface storage card, wherein the USB/OTG interface unit is planarized such that the volume thereof can be reduced obviously and the USB/OTG-interface storage card can be more lightweight, slim. Further, the planarized interface unit enables the USB/OTG-interface storage card to be inserted completely inside a slot of an electronic device, and therefore, the user will no more scruple the bumps induced by the conventional USB/OTG-interface storage device's projecting from the electronic device.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: June 13, 2006
    Inventors: Jung-Che Chang, Yi-Chien Su
  • Patent number: 7055757
    Abstract: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: June 6, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Kouichi Kanemoto, Yousuke Yukawa
  • Patent number: 7053471
    Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
    Type: Grant
    Filed: October 10, 2002
    Date of Patent: May 30, 2006
    Assignees: Renesas Technologies Corp., Hitachi ULSI Systems Co., Ltd.
    Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
  • Patent number: 7049172
    Abstract: A packaging process of an electronic card is provided. Firstly, a first embedding operation is performed to embed a first metal cover into a first surface of a plastic frame. Then, a circuit board is placed on the plastic frame. Afterward, a second embedding operation is performed to embed a second metal cover into a second surface of the plastic frame. The circuit board is encapsulated into the plastic frame so as to form an electronic card package. The first metal cover, the plastic frame and the second metal cover are separately formed.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: May 23, 2006
    Assignee: 3 View Technology Co., Ltd.
    Inventors: Hank Wang, Sheng-Yuan Chen, Hung-Tse Wang
  • Patent number: 7048197
    Abstract: An IC card has a card substrate having semiconductor integrated circuit chips mounted thereon and a plurality of connector terminals formed thereon. The connector terminals are exposed from a casing. The connector terminals are laid out in plural sequences in staggered form between sequences adjacent to one another forward and backward as viewed in an IC card inserting direction. Owing to the adoption of the staggered layout, a structure or configuration wherein the amounts of protrusions of socket terminals of a card socket are changed and the socket terminals are laid out in tandem, can be adopted with relative ease. If a connector terminal arrangement of a downward or low-order IC card is adopted as a specific connector terminal sequence as it is, whereas a function dedicated for an upward or high-order IC card is assigned to another staggered connector terminal arrangement, then backward compatibility can also be implemented with ease.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: May 23, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Haruji Ishihara, Atsushi Shiraishi, Kouichi Kanemoto, Yousuke Yukawa
  • Patent number: 7046519
    Abstract: A small card adaptor into which a small card is inserted so as to be connected to a personal computer includes a small card identifying portion for identifying the kind of the inserted small card, and a controller for receiving an instruction issued by the personal computer based on the kind of the small card identified by the small card identifying portion and transferring the received instruction to the small card.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: May 16, 2006
    Assignee: Matsusita Electric Industrial Co., Ltd.
    Inventor: Masahiro Nakamura
  • Patent number: 7038916
    Abstract: The invention discloses an express card housing structure serving as a housing for accommodating light in weight, small in size and portable hardware devices, which are used as memories or execute various media. The express card housing includes a connector housing, terminals, a main frame, and upper and lower housings. The invention is characterized that, fastening openings at the lower housing are fastened with fastening sections at two inner sides of the main frame, and inverted U-shaped clasp sections bent downward at two lateral sides of the upper housing are positioned in clasp channels at two sides of the main frame for facilitating assembly of the invention. The terminals are devised as structures having a connect pin and can be installed with one-step installation process for elevating production efficiency and yield rate.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: May 2, 2006
    Inventor: George Chen
  • Patent number: 7035108
    Abstract: An information processing device is disclosed. The information processing device includes a heal dissipation plate structure including a thermally conductive material, and a processor including a major surface. A heat dissipating material is between and couples the processor and the heat dissipation plate structure. An array of pins is substantially perpendicular to the major surface of the processor. The device also includes a substrate including a plurality of holes, where the pins in the array of pins are configured to be inserted into the holes in the substrate.
    Type: Grant
    Filed: October 8, 2004
    Date of Patent: April 25, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Kenichi Wakabayashi, Chitoshi Takayama, Tadashi Shiozaki
  • Patent number: 7035110
    Abstract: A computer peripheral device including a USB plug connector in which a reinforced connecting ring is mounted over the front flange of a two-part housing, and includes an opening through which the USB plug connector protrudes. The connecting ring includes a collar that is sized to mount over the front flange using an interference fit. The connecting ring also includes a front plate that protects a front of the housing from damage during use. An optional rear connecting ring is used to further secure the housing together.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: April 25, 2006
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Jim Ni, Ren-Kang Chiou, Edward W. Lee
  • Patent number: 7030316
    Abstract: An apparatus and methods are provided for housing an electronic device. In one embodiment, an electronic device is positioned on a housing base and a housing lid is over-molded onto at least a portion of the base and the electronic device. An interface of the electronic device remains exposed for coupling to a second electronic device, and the housing base and housing lid form a housing partially encasing the electronic device. In another embodiment, an inset panel can be formed within the housing lid or base, for example, by positioning the panel and the electronic device within a housing base and over-molding a housing lid, while maintaining the inset panel substantially exposed. The inset panel can be formed from a material of a contrasting color to provide, for example, a label region on the housed electronic device.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: April 18, 2006
    Assignee: Piranha Plastics
    Inventor: Charles A. Centofante
  • Patent number: 7026720
    Abstract: The invention relates to an integrated circuit card element, comprising a support (1) on which an electrical circuit (2) is produced, an integrated circuit (5) being connected thereto and having an active flip-chip mounted surface (7), said integrated circuit (5) being fixed to the support by a sealing product (6) that is arranged between the active surface of the integrated circuit and the support. The inventive element comprises a reinforcement segment (8) which is fixed on an inactive surface (9) of the integrated circuit opposite the active surface (7).
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: April 11, 2006
    Assignee: Schlumberger Inc.
    Inventors: Sophie Girard, Stéphane Provost
  • Patent number: 7025623
    Abstract: An adapter for a memory card having a frame metal fitting to which an end portion of the card is inserted, whereby the card is detachably fitted, and a resin-molded body core assembled in the frame metal fitting by insertion, wherein an entire thickness of the adapter being approx. the same as that of the card, the frame metal fitting having a pair of holding portions in an approx. C shape in both end portions on the side of the card attached to hold both sides of the card, a hook portion between a pair of the holding portions being detachably engaged with the end portion of the card by spring force to prevent the card from coming off, a caulking projection fixing the core by caulking to the core, and an insulative coating film formed on the outer surface of the frame metal fitting.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: April 11, 2006
    Assignees: Sanwa Denki Kogyo Co., Ltd., Renesas Technology Corp.
    Inventors: Akira Katsumata, Hirotaka Nishizawa, Kenji Osawa
  • Patent number: 7026546
    Abstract: A printed circuit card kit (1) comprises a frame (2), an end cover (6), a rectangular lower cover (3), a rectangular upper cover (4), and a pair of side covers (5). The upper cover and the lower cover comprise respectively a pair of edges defining a number of openings (420,320). The frame has two side rails (22) defining a number of recesses (230). The side covers have a number of projections (50) respectively aligned with the openings and recesses. Assembling the end cover to an end of the frame, assembling the upper and lower covers to the frame and assembling the pair of side covers to the side rails of the frame. Therefore, the projections pass the openings and to be retained in the recesses.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: April 11, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ming Ge, Guohua Zhang, ZiQiang Zhu
  • Patent number: 7024566
    Abstract: An information terminal incorporating a function of a mobile phone is provided in which a subscriber ID card used in a GSM system or the like is prevented from being stolen. When a key is inserted in the key hole of a cylinder lock and turned by 90 degrees, the cam plate is turned to rotate a lever of the rotation arresting shaft through a coupling rod plate, and the arresting part is turned by 90 degrees in a lock part of a groove at the back side of a slide lock device. As a result, the slide lock device is prevented from sliding, and the arrested part is kept arrested by the arresting part. Therefore, a back lid cannot be opened, and the cam plate locks a power source lever, so that a power switch cannot be turned on.
    Type: Grant
    Filed: August 29, 2001
    Date of Patent: April 4, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshiyuki Shiwaku, Takeshi Mori
  • Patent number: 7019980
    Abstract: This invention provides a plastic frame to be a separated device so as to combine the lower metal cover, wherein the plastic frame has two extend shafts that are covered with two wrap-sides beside the lower metal cover. Furthermore, the packaged structure of the present invention can effectively apply the elastic-press method by at least one seam on the principal part of the plastic frame to fix two metal covers and the plastic frame. Moreover, the packaged structure of the present invention has a plurality of convexes in at least one seam on the principal part and the ends of two extend shafts of the plastic frame to press and combine two metal covers.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: March 28, 2006
    Inventor: Cai-Ting Gu
  • Patent number: 7019981
    Abstract: A chip card having a chip card body, a semiconductor chip and a carrier substrate, the carrier substrate being provided on both sides with surface contacts and with contact-hole lines electrically connecting the upper and lower surface contacts to one another. The contact-hole lines are arranged so close to the edge of the carrier substrate that their lower ends open out into a base of an outer cavity, where they are closed off, to thereby prevent moisture from penetrating into the inner cavity, in which the semiconductor chip is located, without it being necessary to produce a dedicated cover for the contact-hole lines.
    Type: Grant
    Filed: January 21, 2004
    Date of Patent: March 28, 2006
    Assignee: Infineon Technologies AG
    Inventors: Erik Heinemann, Frank Pueschner
  • Patent number: 7008240
    Abstract: A PC card assembly including a printed circuit board assembly (PCBA) and an associated two-piece housing made up of a frame-like body and a top cover. The PCBA includes a printed circuit board (PCB) and a connector that is attached to one end of the PCB. The frame-like body includes parallel side rails and an end rail formed with a step-like mounting structure that includes a peripheral shelf for supporting at least two edges of the PCB, and several alignment protrusions that extend from inside portions of the side rails onto the shelf that engage with alignment notches formed in the PCB during the assembly process. Depressions are formed in top and bottom walls for receiving ICs mounted on the PCB. The frame-like body defines an optional longitudinal slot for slidably receiving the PCB. A top cover is either ultrasonically welded or snap-coupled onto the frame-like body.
    Type: Grant
    Filed: April 16, 2004
    Date of Patent: March 7, 2006
    Assignee: Super Talent Electronics, Inc.
    Inventors: KuangYu Wang, Ren-Kang Chiou
  • Patent number: 7009846
    Abstract: A socket having thirteen contact springs arranged in a manner that supports existing MMC and SD form factors, and also supports a combination SD/MMC flash memory card. The combination memory card includes a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The contacts springs of the socket are arranged to make contact with the modified pad pattern, but to also be backward compatible with existing SD and MMC form factors. A system including the socket and combination SD/MMC flash memory card is also disclosed.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: March 7, 2006
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Jim Ni, I-Kang Yu
  • Patent number: 7009847
    Abstract: A connector concealment mechanism for computer peripheral device is proposed, which is designed for use in conjunction with a computer peripheral device equipped with an external connector for the connector to be concealable into the casing of the computer peripheral device when not in use, and be easily ejected out of the computer casing for use to connect the computer peripheral device to a computer unit. This feature allows the computer peripheral device to be more advantageous to use than the prior art due to the fact that it allows the user to conceal the connector into the casing of the computer peripheral device when not in use, without having using a separable cap which would easily get lost as in the case of the prior art, thus making the use of the computer peripheral device more convenient and trouble-free than prior art.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: March 7, 2006
    Assignee: Inventec Multimedia & Telecom Corporation
    Inventors: Kuo-Chang Wu, Yi-Min Tseng, Hsin-Chiang Ho, Ya-Chyi Chou, Kao-Yu Hsu
  • Patent number: 7000845
    Abstract: For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: February 21, 2006
    Assignee: Giesecke & Devrient GmbH
    Inventors: Ando Welling, Matthias Bergmann, Joachim Hoppe
  • Patent number: 7000124
    Abstract: A power management device of electronic card includes a functional module, an interface bus, a bus bridge unit, a power storage unit, an external power input unit and a power control unit. The power control unit controls the bus bridge unit, the external power input unit, and the power storage unit, so as to supply the interface power from the bus interface unit to the functional module and further charge the power storage unit, directly supply the interface power from the bus interface unit to the power storage unit for charging the same, supply the external power from the external power input unit to the functional module and further charge the power storage unit, or directly supply the external power from the external power input unit to the power storage unit for charging the same.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: February 14, 2006
    Assignees: C-One Technology Corporation, Pretec Electronics Corporation
    Inventors: Jui Chung Chen, Shih Chieh Cheng, Sidney Young
  • Patent number: 6992898
    Abstract: A smart-card module is described which has a substrate film of an anisotropically conductive material and at least one semiconductor chip. The semiconductor chip has connection points. On one surface of the semiconductor film, contact areas are applied directly. The substrate film is disposed between the semiconductor chip and the contact areas in such a way that it connects the connection points of the semiconductor chip to the contact areas in a manner of a direct contact.
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: January 31, 2006
    Assignee: Infineon Technologies AG
    Inventors: Erik Heinemann, Frank Püschner, Detlef Houdeau
  • Patent number: 6985361
    Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: January 10, 2006
    Assignee: Alien Technology Corporation
    Inventors: Thomas Lloyd Credelle, Glenn Gengel, Roger Green Stewart, William Hill Joseph
  • Patent number: 6976623
    Abstract: A memory card reading apparatus is described including a plurality of memory card interfaces, with at least of subset of the plurality memory card interfaces configured to interface with a memory card of a first type, the plurality of memory card interfaces accessible in parallel. In one embodiment, at least on of the memory card interfaces is configured to interface with a plurality of different memory card types. In another embodiment, a first subset of the plurality of memory card interfaces are configured to interface with a memory card of a first type and a second subset of the plurality of memory card interfaces are configured to interface with a memory card of a second type, wherein the first and second subset of memory card interfaces are accessible in parallel.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: December 20, 2005
    Assignee: OnSpec Electronic, Inc.
    Inventors: Sreenath Mambakkam, Arockiyaswamy Venkidu, Larry Lawson Jones
  • Patent number: 6976624
    Abstract: The 7-in-1 card reader has an electric connecting circuit in its cartridge coincident with an insertion slot of a PCMCIA interface; the cartridge is provided on the front side thereof with a first connecter for connecting an electric device having the PCMCIA interface, and on the rear end thereof with a first connecter module and a second connecter module for insertion of memory cards taken among those of seven specifications or those of CE, MD, MMC, MS, SD, SM and XD memory cards, and for proceeding to data reading, exchanging and transferring with the memory card through the electric connecting circuit, so that the electric device with the PCMCIA interface can read and write on the memory cards of the seven specifications.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: December 20, 2005
    Assignee: WEM Technology Inc.
    Inventor: Wen-Hsiang Hsiao
  • Patent number: 6971918
    Abstract: A card connector comprises an insulation member, a back row of spaced first contact terminals, a front row of spaced first contact terminals, a row of spaced second contact terminals and a shielding cover. The insulation member has a first receiving space for receiving a first electronic card and a second receiving space for receiving a second electronic card. Contacting portions of the back row and the front row of the first contact terminals extend into the first receiving space and are aligned and flush with each other. Contacting portions of the second contact terminals extend into the second receiving space. Soldering portions of the first and the second contact terminals all extend outwardly from the rear of the card connector. Therefore, the first and the second contact terminals can be easily soldered on a printed circuit board and entirely contact with contact pads of the electronic cards.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: December 6, 2005
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chia Sheng Su, Ming Chun Lai
  • Patent number: 6970360
    Abstract: A tamper-proof enclosure for an electrical card, such as a high speed communications card, includes an enclosure in which the card is mounted. The enclosure has a wall with an opening, and a cup member is attached to the wall at the opening. A bus that is connected to the card extends through a passage in the cup member and through the opening in the wall. A security mesh is wrapped around the enclosure. The cup member is filled with liquid resin, which is also coated onto the security mesh. After the resin is cured, the resin in the cup member forms a plug that seals the security mesh from inner pressure when the enclosure is heated to an elevated temperature. The resin is preferably polyamide.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: November 29, 2005
    Assignee: International Business Machines Corporation
    Inventor: Arvind Kumar Sinha
  • Patent number: 6970359
    Abstract: An apparatus and method of removably interconnecting a reduced-sized memory card with an extension member. A locking mechanism may be formed in a peripheral end portion of the reduced-sized memory card that may include an entry surface and a ledge. The extension member may include a biasing portion that slidably engages the entry surface and removably interconnects with the ledge. With this arrangement, the extension member may easily be secured and removed from the reduced-sized memory card, allowing easy interchangeability between a standard-sized socket of one electronic device and a reduced-sized socket of another electronic device.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: November 29, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Derek J. Gochnour, Walter L. Moden, Michael W. Morrison
  • Patent number: RE38997
    Abstract: In a small and thin memory module for sharing data among electronic devices such as information processing apparatuses, a write prohibit state can be visually recognized. A conductive seal is attached to a predetermined position on a support member, thereby setting the memory module in the write prohibit state. The conductive seal visually indicates the write prohibit state. When the memory module is mounted in a connector section of a card-shaped holder, connector pins are electrically connected to each other via the conductive seal. That, a write prohibit mechanism is realized at low cost.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: February 28, 2006
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Hiroshi Iwasaki