Ic Card Or Card Member Patents (Class 361/737)
-
Patent number: 7537169Abstract: A flash memory mass storage drive stores user files in a convenient credit card sized drive. Embodiments function as both a credit card and a mass storage drive. Communication may be through a host interface connector such as a USB connector, a magnetic interface, a smart card interface, and/or a near field communication interface. In certain embodiments the drive comprises a portion that is sufficiently thin to be swiped through a standard credit card, ATM, or point of sale device. The USB connector of the drive can easily be plugged into even a crowded receptacle of a host computing device.Type: GrantFiled: December 10, 2007Date of Patent: May 26, 2009Assignee: SanDisk CorporationInventors: Carlos Gonzalez, Edwin J. Cuellar, Joel Jacobs, Robert C. Miller, Ronald LaPedis
-
Patent number: 7535718Abstract: The invention is directed to a memory card that includes two or more connectors that conform to different connector standards. In one embodiment, the first connector conforms to a device communication connector (DCC) standard to facilitate direct coupling of the memory card to a portable device such as a voice recorder, a digital video camcorder, a digital camera, a personal digital assistant (PDA), a cellular phone, a video game, a digital television, a photo printer, or the like. The second connector may comprise a host computer connector (HCC) for direct coupling to a computing device without an adapter or reader.Type: GrantFiled: August 20, 2003Date of Patent: May 19, 2009Assignee: Imation Corp.Inventor: Trung V. Le
-
Patent number: 7535719Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is retractably mounted into an external housing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The housing includes a retractable mechanism that facilitates selective exposure of metal contacts, either by sliding a front portion of the modular USB core component into and out of a front opening of the housing, or by providing a cover plate that slidably covers the front portion of the modular USB core component.Type: GrantFiled: October 17, 2007Date of Patent: May 19, 2009Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Jin Kyu Kim, Abraham C. Ma, Ming-Shiang Shen
-
Patent number: 7531757Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.Type: GrantFiled: February 26, 2008Date of Patent: May 12, 2009Assignee: Kabushiki Kaisha ToshibaInventors: Takuya Takahashi, Kazuhiro Yamamoto, Minoru Ohara
-
Patent number: 7529098Abstract: An electronic card includes a printed circuit board which has a nonvolatile semiconductor memory mounted on one surface thereof, a card case covering the one surface of the printed circuit board, signal pins provided in one side on the other surface of the printed circuit board, a circuit pattern provided on the one surface of the printed circuit board, a first ground pattern provided on the one surface of the printed circuit board, the first ground pattern being electrically connected to the signal pin which is supplied with a grounding potential in a case where the electronic card is equipped with a host apparatus and a first insulator film provided on the one surface of the printed circuit board, and the first insulator film having a first opening in which the first ground pattern is exposed.Type: GrantFiled: September 30, 2005Date of Patent: May 5, 2009Assignee: Kabushiki Kaisha ToshibaInventor: Hideo Aizawa
-
Patent number: 7525807Abstract: A semiconductor memory device according to the present invention comprises a housing including a card bus connector for connection to a host device and having a PC card shape having a thickness of 5.0 mm, four SD memory cards housed in the housing and a control circuit for controlling transmission/reception of a signal between the card bus connector and the respective SD memory cards. The semiconductor memory device is suitably used as a recording medium of a host device for which a higher data transfer rate and a larger memory capacity are demanded. Further, a semiconductor memory device, which is attachable and detachable relative to the host device and thereby portable, and relatively inexpensively obtainable, can be provided, and is directly insertable into a laptop personal computer to be used.Type: GrantFiled: December 11, 2003Date of Patent: April 28, 2009Assignee: Panasonic CorporationInventors: Haruo Ohta, Takeshi Ohtsuka
-
Patent number: 7522424Abstract: A multi-memory media adapter comprised of a first planar element having an upper surface and a lower surface, a second planar element having an upper surface and a lower surface, and formed from a single material. The two planar elements form at least one port, each port capable of receiving one or more types of a memory media card. The adapter has at least one set of contact pins protruding from the lower surface of the first planar element or the upper surface of the second planar element such that the at least one set of contact pins are disposed within the port. The at least one set of contact pins are capable of contacting the contacts of a memory media card inserted into the port. For one embodiment a controller chip is embedded within the single material forming the multi-memory media adapter.Type: GrantFiled: September 19, 2007Date of Patent: April 21, 2009Assignee: MCM Portfolio LLCInventors: Sreenath Mambakkan, Venkidu Arockiyaswamy, Larry Lawson Jones
-
Patent number: 7518879Abstract: A universal serial bus (USB) memory is disclosed. The USB memory includes a housing having a plurality of orientated indentations and a plurality of concave props, wherein the plurality of orientated indentation facilitates the USB memory to be connected while the USB memory is inserted into a female USB socket; a print circuit board assembly (PCBA) disposed in the housing, wherein the PCBA is fixed by means of pressing of the plurality of concave props; and a LED module having a LED indicator disposed in the housing and a LED module controller disposed on the PCBA, wherein a space is formed between the housing and the PCBA for disposing the LED module.Type: GrantFiled: March 21, 2006Date of Patent: April 14, 2009Assignee: Phison Electronics Corp.Inventors: Tom Chung, Dean Huang, Peter Huang
-
Patent number: 7518880Abstract: A shielding arrangement for an electronic component mounted on a circuit board includes a shield formed by a frame sidewall arranged to be oriented upstanding from the circuit board and surrounding the electronic component mounted on the circuit board. A first cover portion substantially closes the surrounding sidewall, enclosing the electronic component on the circuit board. A conductive layer, formed by vacuum deposition covers an inside surface of the surrounding sidewall and an inside surface of the first cover portion, continuously. As an alternative to the conductive layer, the frame can be composed of an electrically conductive plastic. The first cover portion can be a stamped metal plate integrated with the frame by overmolding.Type: GrantFiled: February 6, 2007Date of Patent: April 14, 2009Assignee: Bi-LinkInventor: Frank J. Ziberna
-
Publication number: 20090091894Abstract: Provided is a multichip module having a module substrate 2 on which an electronic component 3 is mounted, a conductor 8 electrically connected to a land 12 formed on the module substrate 2, a molding resin 6 covering the electronic component 3 and the conductor 8, and a conductive film 7 formed continuously on the molding resin 6 and the conductor 8 exposed from the molding resin 6.Type: ApplicationFiled: September 18, 2008Publication date: April 9, 2009Inventor: Shoji SAKURAI
-
Patent number: 7511233Abstract: The present invention is a flash memory drive including a printed circuit board, a male connector mounted to the printed circuit board, a female connector mounted to the printed circuit board, a flash memory chip mounted on the printed circuit board and electrically coupled to the male connector and the female connector and a download/copy logic chip for enabling data to be transferred to or from the flash memory chip. The female connector is configured to mate with another male connector for transferring data to or from the flash memory chip.Type: GrantFiled: January 3, 2005Date of Patent: March 31, 2009Inventor: Alan L. Pocrass
-
Publication number: 20090080164Abstract: A system in some embodiments includes a system having a memory module having a first board comprising a first plurality of memory receptacles configured to support a first plurality of in-line memory modules in an overlapping relationship with a second plurality of in-line memory modules disposed on a second board. Further, a method in some embodiments includes rotating first and second memory boards into a parallel configuration via a hinge coupling the first and second memory boards, and inserting the first and second memory boards into first and second board connectors simultaneously.Type: ApplicationFiled: September 21, 2007Publication date: March 26, 2009Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Brian T. Purcell, Melvin K. Benedict
-
Patent number: 7507041Abstract: Disclosed herein is an imaging device including a battery compartment having an opening for insertion and ejection of a battery, a battery release lever for allowing the insertion of the battery into the battery compartment through the opening and the ejection of the battery from the battery compartment through the opening, and a battery lid for openably closing the opening of the battery compartment. The battery release lever is located adjacent to the battery lid so as not to be substantially covered with the battery lid in its closed condition. Accordingly, the position of the battery release lever can be visually recognized even in the closed condition of the battery lid.Type: GrantFiled: December 13, 2005Date of Patent: March 24, 2009Assignee: Sony CorporationInventors: Toshiaki Ueda, Takayoshi Yamasaki, Tetsuya Okuchi, Kouta Nagano, Tomonori Watanabe, Shin Miyashita, Atsuko Koyama
-
Publication number: 20090073665Abstract: A memory card includes a first cover, a second cover, a set of leads and a memory component. The first cover has a set of openings; the second cover is combined with the first cover to define a holding space. The leads are arranged in the holding space, and their one end are emerged from the openings as an exterior terminal. The memory component arranged in the holding space includes a chip substrate and at least one function component electrically connected with the chip substrate, wherein the chip substrate has a set of conductive pads electrically connected to the other end of the leads. According to the above-mentioned structure, the memory card with smaller chip substrate is designed to reduce manufacture cost.Type: ApplicationFiled: October 22, 2007Publication date: March 19, 2009Inventor: En-Min Jow
-
Publication number: 20090073661Abstract: A circuit module includes a printed circuit board (PCB) having a first side, a second side, and a bottom perimeter edge. The PCB exhibits a first thickness along the bottom perimeter edge. The first side includes a recessed area and, in that recessed area, the PCB has a second thickness that is less than the first thickness. A plurality of integrated circuits (ICs) are fixed to the PCB in the recessed area. A plurality of module contacts are connected to the ICs and are disposed along at least one of the first and second sides and are configured to provide electrical connection between the circuit module and an edge connector.Type: ApplicationFiled: September 18, 2007Publication date: March 19, 2009Applicant: STAKTEK GROUP L.P.Inventors: Mark Wolfe, James Wilder, David L. Roper
-
Patent number: 7505279Abstract: A portable device that resists deformation caused by an external force while remaining water resistant. The portable device includes a case, which is made of a flexible material. A battery compartment is formed in the case. A separable portion is arranged in the part of the case corresponding to the battery compartment. Part of the case is bent to open the separable portion and expose the battery compartment from the case.Type: GrantFiled: January 28, 2004Date of Patent: March 17, 2009Assignee: Kabushiki Kaisha Tokai Rika Denki SeisakushoInventors: Kiyokazu Ohtaki, Seiji Ishigaki, Daisuke Kawamura, Masayuki Kawamura
-
Patent number: 7505277Abstract: A system comprises a chassis and a slot that is externally accessible on the chassis. The slot is configured to receive a first electronic device having a first electrical interface type. The slot is also configured to receive an adapter comprising a second electrical device having a second electrical interface type that is different than the first electrical interface type.Type: GrantFiled: January 31, 2007Date of Patent: March 17, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventors: Mark S. Tracy, Jeffrey A. Lev, Walter J. Rankins, Walter Fry
-
Patent number: 7498525Abstract: A card type peripheral apparatus is disclosed which can be removably inserted not only into a slot of an electronic apparatus of a small size but also into a slot of an external apparatus readily and with certainty. The apparatus includes a first case, an electronic part accommodated in the first case, and a connector provided at a first end in the lengthwise direction of the first case for electrically connecting an external apparatus to the electronic part. The attachment includes a second case. Mounting portions are provided at a second end in the lengthwise direction of the first case and a first end in the lengthwise direction of the second case such that the first and second cases are removably attached to each other at the mounting portions thereof while the lengthwise directions thereof are juxtaposed with each other.Type: GrantFiled: September 8, 2005Date of Patent: March 3, 2009Assignee: Sony CorporationInventors: Yoshitaka Aoka, Keiichi Tsutsui
-
Patent number: 7495926Abstract: An interface module in a nonplanar form. The interface module includes an electronic device card, such as a SIM or memory card, in a cross-sectional shape that may be, for example, substantially a circle or ellipse, substantially rectangular meeting certain dimensional requirements, or a shape other than a rectangle having at least three sides. Selected embodiments of the card may be a shape other than one having parallel major surfaces. An interface module assembly includes a card and a card reader. Electrical contacts are provided on both the card and the card reader. The contacts on the card may extend around the card to improve opportunity for continuous contact.Type: GrantFiled: October 5, 2004Date of Patent: February 24, 2009Assignee: Sony Ericsson Mobile Communications ABInventor: James C. Peele
-
Patent number: 7492604Abstract: An electronic apparatus, includes a plurality of electronic modules, each having a maximum thickness of no more than 90 microns, each comprising a substrate having a two sided edge connection pattern. The electronic modules are arranged adjacent to each other. Each pad of a first set of connection pads on a first electronic module is conductively connected to an opposing pad of a second set of connection pads of a second electronic module. The first set of connection pads is separated from the second set of connection pads by electrically conductive material that is less than 15 microns thick.Type: GrantFiled: April 21, 2006Date of Patent: February 17, 2009Assignee: Motorola, Inc.Inventors: Paul W. Brazis, Marc K. Chason, Daniel R. Gamota, Krishna Kalyanasundaram
-
Patent number: 7492260Abstract: An inductively powered transponder device has an unpackaged integrated circuit in which is integrated an antenna for receiving power and signal from radio frequency transmissions. A heatsink is thermally connected to the integrated circuit. The heatsink has means to prevent eddy currents. A first layer and a second layer of web material are attached together to encapsulate the integrated circuit and the heatsink.Type: GrantFiled: July 14, 2006Date of Patent: February 17, 2009Assignee: Hewlett-Packard Development Company, L.P.Inventor: John Waters
-
Publication number: 20090040734Abstract: The semiconductor memory module incorporating antenna includes a wiring board (11) having a connection terminal (17) connected with a control semiconductor element (16) and arranged at a position exposed to the surface of an outer case (15), and a terminal electrode (18) for antenna connection connected with the control semiconductor element (16) and arranged in the outer case (15); a semiconductor storage element (12) mounted on one side of the wiring board (11); and a loop-like antenna (13) and an antenna terminal electrode (20) formed on the other side of the wiring board (11) along the outer peripheral thereof, the wiring board (11) includes at least one magnetic body layer (14) and the terminal electrode (18) for antenna connection is connected with the antenna terminal electrode (20).Type: ApplicationFiled: March 28, 2007Publication date: February 12, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Shozo Ochi, Hidenobu Nishikawa, Hiroshi Sakurai
-
Patent number: 7489515Abstract: An expansion card has a terminal block, a top metal sheet, bottom metal sheet and a plastic seat. Two step retainers are formed respectively on two short edges of the terminal block. Two pairs of hooks are formed on the two long edges adjacent respectively to front and rear ends of the bottom metal sheet. The hooks of one pair hook respectively on the step retainers. The two long edges of the top metal sheet both extend to form Two bent portions are formed respectively on the long edges of the bottom metal sheet. The plastic seat is engaged with the top and bottom metal sheet. Fabrication of the expansion card is easy and convenient.Type: GrantFiled: October 31, 2006Date of Patent: February 10, 2009Assignee: Broadtek Technology Co., Ltd.Inventor: Chi-Jung Huang
-
Publication number: 20090034211Abstract: A computer card comprises a housing insertable into a slot of an electronic device and a power pin configured to provide power to the electronic device.Type: ApplicationFiled: July 30, 2007Publication date: February 5, 2009Inventors: Paul J. Doczy, Jonathan R. Harris, Steven S. Homer
-
Patent number: 7486522Abstract: An automated circuit board assembly system includes at least one movable circuit board receiver that is equipped with an empty circuit board or a hybrid circuit which is transported towards an uptake location at which components are assembled to the board, and an uptake mechanism positioned at the uptake location which detects the circuit board position in preparation for the assembly process. An alignment device positions the circuit board receiver in a predetermined directional position at the uptake location.Type: GrantFiled: January 28, 2003Date of Patent: February 3, 2009Assignee: Ericsson ABInventors: Ulf Muller, Willibald Konrath, Klaus Scholl, Dieter Kienzle, Lothar Ubele
-
Patent number: 7486524Abstract: A module housing for minimizing electromagnetic radiation leakage and a transceiver module built with this housing are presented. The housing includes a cover and a base disengagably coupled to each other, and a first and second layer of sidewalls located between the cover and the base. The two layers of sidewalls have different dimensions from each other so that a printed circuit board is enclosed in a space formed by the base, the cover, and either only the second layer of sidewall or both the first and second layer of sidewalls, depending on the thickness of the board. Another aspect of the invention is a pcb coupled to a connector and a housing for the pcb that includes an electromagnetic radiation shield between electronic components on the pcb and the connector. The shield reduces the amount of radiation reaching the connector. Also disclosed is a method of building this module.Type: GrantFiled: March 3, 2003Date of Patent: February 3, 2009Assignee: Finisar CorporationInventors: Donald A. Ice, Stephen T. Nelson
-
Patent number: 7483275Abstract: A method for the production of an encapsulated and at least partly organic electronic device wherein the device comprises a combination of three groups of different electronic units or components which may be separate discrete structures arranged to be produced independently from one another electrically conductively interconnected, the groups including inorganic units, passive units and active units or active components such as antennae, diodes (rectifier diodes and/or light-emitting diodes), some of which units may be organic, e.g., organic transistors, and so on, and forming a resulting optimized circuit. The components of the three groups of units forming the resulting circuit are combined on a one piece flexible substrate film which can also serve as an encapsulation layer for the device.Type: GrantFiled: September 6, 2002Date of Patent: January 27, 2009Assignee: PolyIC GmbH & Co. KGInventors: Wolfgang Clemens, Walter Fix, Jörg Zapf
-
Patent number: 7481659Abstract: The invention is directed to a memory card including a first connector that conforms to a first connection standard and a second connector that conforms to a second connection standard. The connectors are provided on a movable member disposed within a housing of the memory card. The movable member may be moved between a first position, in which the first connector is exposed, and a second position, in which the second connector is exposed.Type: GrantFiled: January 5, 2007Date of Patent: January 27, 2009Assignee: Imation Corp.Inventors: Gregory H. Johnson, Daniel C. Egan
-
Publication number: 20090021921Abstract: A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, multiple side edges, a chamfer extending between a pair of the side edges, a plurality of pads disposed on the lower circuit board surface, and a conductive pattern which is disposed on the upper circuit board surface and electrically connected to the pads. At least one electronic circuit device is attached to the upper circuit board surface and electrically connected to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board and the electronic circuit element such that a section of the upper circuit board surface extending along the entirety of the chamfer is not covered by the body.Type: ApplicationFiled: April 26, 2005Publication date: January 22, 2009Inventors: Sang Jae Jang, Chul Woo Park, Suk Ku Ko, Choon Heung Lee
-
Patent number: 7478473Abstract: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.Type: GrantFiled: September 28, 2006Date of Patent: January 20, 2009Assignee: Renesas Technology Corp.Inventors: Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi, Junichiro Osako, Tamaki Wada
-
Patent number: 7476802Abstract: A programmable logic controller or programmable automation controller assembly that can be used in harsh environments. A plurality of user-configurable housings are used to accommodate a customer's desired functionality design. A two-board design is featured to enable electronics in the controller assembly. The two-board design includes an active board that houses a majority of electrical components in the controller assembly, and a wiring hub that is used for wiring terminations. A mechanism is provided for a field-removable labeling system that withstands harsh environmental conditions.Type: GrantFiled: March 22, 2005Date of Patent: January 13, 2009Assignee: Fairmont Automation Inc.Inventors: Gary R. Cane, Brian M. Callahan, James R. Iocca, Steve D. DiBona, Andres Lebaudy
-
Patent number: 7477522Abstract: A high density high reliability memory module with a fault tolerant address and command bus. The memory module includes a rectangular printed circuit board having a first side and a second side, a length of between 149 and 153 millimeters and first and second ends having a width smaller than said length. The memory module also includes a first plurality of connector locations on the first side extending along a first edge of said board that extends the length of the board and a second plurality of connector locations on the second side extending on said first edge of said board. The memory module further includes one or more buffer devices in communication with the circuit board for accessing one or more of the four ranks of memory devices mounted on the first side and second side of the circuit board.Type: GrantFiled: October 23, 2006Date of Patent: January 13, 2009Assignee: International Business Machines CorporationInventor: Bruce G. Hazelzet
-
Publication number: 20090009976Abstract: Memory card includes a circuit board, a component mounted on a main face of the circuit board, casing covering at least the main face of the circuit board and the component, and bittering agent retained in a roughened area provided on casing or an exposed part of the circuit board.Type: ApplicationFiled: January 26, 2007Publication date: January 8, 2009Inventors: Hidenobu Nishikawa, Daido Komyoji, Hiroyuki Yamada, Yutaka Nakamura, Shuichi Takeda, Yasuharu Kikuchi
-
Publication number: 20090004920Abstract: An adapter system is disclosed including a pair of adapters operating in conjunction with each other to allow a variety of different, off-the-shelf memory cards to be used within the ExpressCard slot.Type: ApplicationFiled: June 29, 2007Publication date: January 1, 2009Inventors: Jonathan Hubert, Jason P. Hanlon, Matthijs Hutten
-
Publication number: 20080314994Abstract: There is provided an accessory device for a financial transaction token. The accessory has an onboard power storage device that enables a financial token or card that is in communication with the accessory to operate when the card or token is not in the proximity of a merchant terminal (e.g.; a POS terminal). In one implementation, the onboard power storage device includes a rechargeable battery or capacitor such as a thin-film capacitor that stores sufficient energy to power the accessory's onboard electronics and/or the electronics of a financial token in communication with the accessory. The accessory may be a subcomponent of another consumer device such as a computing device, communications device, an item of clothing, an item of jewelry, a cell phone, a PDA, an identification card, a money holder, a wallet, a purse, a briefcase, or a personal organizer.Type: ApplicationFiled: June 22, 2007Publication date: December 25, 2008Inventors: Patrick L. Faith, Ayman A. Hammad
-
Patent number: 7467464Abstract: A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.Type: GrantFiled: December 3, 2007Date of Patent: December 23, 2008Assignees: Renesas Technology Corp., Hitachi ULSI Systems, Co., Ltd.Inventors: Takahiro Osawa, Yoichi Kawata, Atsushi Fujishima, Tamaki Wada, Kenichi Imura
-
Patent number: 7466556Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component that is mounted into a swivel casing. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. The swivel casing includes a holder that is pivotably mounted into an external housing by way of a pivot pin. The pivot pin is either a separate structure that is inserted into holes formed in the holder and housing, or is integrally formed on the holder.Type: GrantFiled: October 17, 2007Date of Patent: December 16, 2008Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Jin Kyu Kim, Abraham C. Ma, Ming-Shiang Shen
-
Patent number: 7466555Abstract: A card connector assembly having a card misinsertion preventive structure has: a front cover placed in front of two card connectors double-decked up and down, each having an insertion opening; a shutter pivotally supported by the front cover; and a pivotal shaft. The shutter has two lengthwise parallel planes perpendicularly intersecting each other in L-shaped cross-section. In the absence of a card inserted in any of the card connectors, the shutter allows any one of the two insertion openings to be open to the front of the front cover to enable insertion of a card from outside into any one card connector. When a card is inserted in one card connector, the shutter covers the insertion opening of the other card connector to prevent insertion of a further card from outside into the other card connector. This prevents, in advance, a connection error, thereby preventing discomfort to the user.Type: GrantFiled: May 3, 2006Date of Patent: December 16, 2008Assignee: Funai Electric Co., Ltd.Inventor: Eiji Yamamoto
-
Patent number: 7466912Abstract: A storage compartment for loading and unloading batteries of varying sizes efficiently. The storage compartment is internally equipped with a position regulating plate part on a ceiling part, an ejection urging part, a thickness judging part, and a contact point part on an end surface at the back side. The position regulating plate part is equipped with rotatable position regulating plates urged to protrude vertically into the storage compartment. When a battery is inserted, the position regulating plates guide the battery and cause it to be pressed to a bottom surface part of the storage compartment. Any one of the position regulating plates that does not abut the battery opposes the battery in a perpendicular direction and prohibits movement of the battery in the thickness direction.Type: GrantFiled: March 15, 2004Date of Patent: December 16, 2008Assignee: Eastman Kodak CompanyInventors: Kazuo Ishikawa, Masao Kobayashi
-
Patent number: 7458519Abstract: A card tray to be mounted to a memory card can make the memory card mountable in a card slot for memory cards conforming to standards different from those to which the memory card conforms. The card tray has a main body and a recessed mount section. The recessed mount section is formed such that the holder of a second memory card can be mounted to one of the major surfaces of the main body. A memory-card-mounted body is produced when the second memory card is mounted to the recessed mount section. The card tray is configured such that, when the first memory card is placed on the memory-card-mounted body with the left and right edges thereof aligned with each other, the contact pieces of the first memory card and the contact pieces of the second memory card have longitudinally overlapping parts and transversally overlapping parts as viewed from above.Type: GrantFiled: July 17, 2006Date of Patent: December 2, 2008Assignee: Sony CorporationInventors: Yoshitaka Aoki, Keiichi Tsutsui, Hirotaka Nishizawa, Takashi Totsuka
-
Publication number: 20080278903Abstract: An embodiment of the present invention includes an electronic data flash memory card (memory card) comprising a top cover (TC), a printed circuit board assembly (PCBA) and a bottom cover (BC). The TC includes a plurality of ultrasonic bonders, a plurality of breakaway tabs (tabs) and a connection device. The PCBA includes at least one memory integrated circuit (IC) and at least one controller IC. The BC includes a plurality of tabs. The TC and BC are ultrasonically bonded together, at least partially encasing the PCBA. The controller IC enables the memory card to communicate with an external host device (host) through the connection device to retrieve data files (files) from and transfer files to the host, and to store files on and retrieve files from the memory IC. The tabs are removable by the user by exerting pressure. Removal of the tabs locks or unlocks the memory card.Type: ApplicationFiled: October 30, 2007Publication date: November 13, 2008Applicant: SUPER TALENT ELECTRONICS, INC.Inventors: Jim Chin-Nan Ni, Abraham Chih-Kang Ma, Charles Chung Lee, Ming-Shiang Shen
-
Patent number: 7447037Abstract: A low-profile Universal-Serial-Bus (USB) assembly includes a modular USB core component and an external case. The modular USB core component includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips (e.g., USB controller, flash memory) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The modular USB core component is then inserted or otherwise combined with an external plastic case to provide a USB assembly. An optional carrying case is disclosed.Type: GrantFiled: September 21, 2007Date of Patent: November 4, 2008Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Jim Chin-Nan Ni, Abraham C. Ma, Ming-Shiang Shen
-
Patent number: 7445156Abstract: A data management device and library are provided for organizing, holding, and providing electrical connectivity to multiple memory cards. The data management device can comprise a device body, a plurality of sockets to accommodate the data storage media, an electrical connector, and a power management circuit. Data can be retrieved from or transferred to the selected memory cards utilizing the device. The data management library can be utilized to interconnect multiple devices and can be daisy chained to other libraries.Type: GrantFiled: October 3, 2006Date of Patent: November 4, 2008Inventor: James A. McDonald
-
Publication number: 20080266816Abstract: A Solid State Drive (SSD) device includes a printed circuit board assembly (PCBA) defining rivet holes, and a support structure including parallel side frame rails defining rivet openings and support platforms for receiving and supporting the PCBA. Compression-mated rivet sets are used to connect the PCBA to the support structure, each rivet set including a female rivet portion and an associated male rivet portion. The PCBA is mounted onto the support structure such that the rivet holes are aligned with the rivet openings of the plurality of rivet openings, and then the rivet sets are mounted and secured using an automatic rivet tool such that each rivet set extends through an associated rivet hole/opening and fixedly engaged such that the PCBA and the support structure are held between end caps of the respective male and female rivet portions.Type: ApplicationFiled: July 11, 2008Publication date: October 30, 2008Applicant: Super Talent Electronics, Inc.Inventors: Jim Chin-Nan Ni, Siew S. Hiew, Abraham C. Ma
-
Publication number: 20080266778Abstract: In some embodiments a memory module circuit board includes a first surface adapted to couple a first plurality of memory devices, a plurality of signal lines, and a command and address bus coupled to the signal lines. The command and address bus is routed from the signal lines and adapted to couple to at least one of the first plurality of memory devices in a manner that does not require the command and address bus lines to turn more than approximately ninety degrees before coupling to the at least one of the first plurality of memory devices. Other embodiments are described and claimed.Type: ApplicationFiled: March 21, 2008Publication date: October 30, 2008Applicant: INTEL CORPORATIONInventors: John T. Sprietsma, Michael W. Leddige
-
Patent number: 7441701Abstract: A multiple card reading apparatus for reading at least two different types of information cards that may be used in a handheld point of sale device with printing capability. The multiple card reading apparatus has a housing containing at least two card reading devices and defining slots that receive the cards and position them for reading by the card reading devices. In one aspect, the slots overlap facilitating a compact arrangement of the card reading apparatus. Preferably, the common portions of the slots are an entrance portion so that only a single slot marks the outside of the housing. For instance, the slots may originate in the same position but diverge at different angles from each other. In this manner, different types of cards can be inserted through the same opening portion but at different angles to reach different card reading devices capable of reading its respective type of card.Type: GrantFiled: July 29, 2004Date of Patent: October 28, 2008Assignee: ZIH Corp.Inventors: David Beck, Gregory Klein
-
Patent number: 7443690Abstract: A memory device has a variable storage capacity depending on the object of use by a user, thereby improving convenience in use of the device. The memory device has a casing which may be loaded into host equipment. The casing has a plural number of loading sections in each of which a memory chip can be mounted. The casing carrying the memory chips has a terminal unit at the end insertable in the host equipment. Data readout from or writing into the memory chip is controlled by a semiconductor unit forming a control circuit disposed in the casing. The memory device may be of a recording capacity as desired by a user by changing the number of the memory chips mounted in the loading sections or by mounting memory chips of variable recording capacities in the loading sections.Type: GrantFiled: June 20, 2006Date of Patent: October 28, 2008Assignee: Sony CorporationInventors: Shigeo Matsumoto, Yasushi Fujita, Katsumi Endo
-
Patent number: 7440286Abstract: A dual-personality card reader system supports both USB and micro-SD devices using a card reader and an extended 9-pin USB socket. The card reader includes a PCBA having four standard USB metal contact pads and several extended purpose contact pads disposed on an upper side, components and IC chips covered by a molded case on a lower side, a molded lead-frame connector mounted on the PCBA and including five forward-facing extended purpose pins and eight rear-facing micro-SD connector pins that communicate with the PCBA through the extended purpose contact pads, and a housing including a slot for receiving a micro-SD card such that it communicates with the PCBA through the micro-SD connector pins. The extended 9-pin USB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and forward-facing extended purpose pins. The PCBA includes dual-personality electronics for SD/USB communications.Type: GrantFiled: October 29, 2007Date of Patent: October 21, 2008Assignee: Super Talent Electronics, Inc.Inventors: Siew S. Hiew, Nan Nan, Jim Chin-Nan Ni, Abraham C. Ma
-
Patent number: 7440285Abstract: Apparatus and methods for housing an electronic device are provided. In some implementations an apparatus is provided. The apparatus includes a base, an electronic device positioned on the base, and a lid positioned to cover the base and at least a portion of the electronic device. The lid and the base form a housing for the electronic device, the lid including a lid aperture, the lid aperture exposing at least a portion of the electronic device. The apparatus also includes a transparent portion positioned such that a first region of the transparent portion is positioned within the lid aperture and where at least a portion of the electronic device is covered by the transparent portion.Type: GrantFiled: December 29, 2006Date of Patent: October 21, 2008Assignee: Piranha Plastics, LLCInventor: Charles A. Centofante
-
Publication number: 20080247142Abstract: Electronic module (10), and an electric motor (12) containing one, and also a production method for one, having an electrically conductive first substrate (16) which has a basic body (54) and which has a second electrically conductive substrate (18) mounted on it, and having at least one power component which is arranged on a first substrate (16), and the second substrate (18) is fitted with further components (40) on a side (32) which is remote from the first substrate (16), where the second substrate (18) has a smaller base area (19) than the basic body (54) of the first substrate (16), and the power components (22) are mounted on the first substrate (16) outside the outer perimeter (70) of the second substrate (18)—next to the latter.Type: ApplicationFiled: November 9, 2006Publication date: October 9, 2008Inventors: Kuno Wolf, Thomas Koester, Stefan Hornung, Wolfgang Feiler