Ic Card Or Card Member Patents (Class 361/737)
  • Patent number: 7679008
    Abstract: The present invention relates to a portable storage device with multiple data interfaces coupled to an electronic device for performing data access. The portable storage device has a casing, a circuit board, a first data interface and a second data interface. The casing contains a cavity, and a first opening and a second opening are located in both sides thereof. The circuit board is placed inside the cavity and contains a memory for performing data access. One terminals of the first data interface and the second data interface are electrically connected to both sides of the circuit board, respectively. The other terminals of the first data interface and the second data interface protrude out of the casing via the first opening and the second opening, respectively, to be coupled to an electronic device for performing data access.
    Type: Grant
    Filed: July 11, 2005
    Date of Patent: March 16, 2010
    Assignee: Compal Electronics, Inc.
    Inventor: Chuan-Yuan Lee
  • Publication number: 20100061070
    Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.
    Type: Application
    Filed: November 16, 2009
    Publication date: March 11, 2010
    Applicant: KINGSTON TECHNOLOGY CORPORATION
    Inventor: Wei Koh
  • Publication number: 20100046175
    Abstract: Various embodiments of the invention relate to electronics modules, enclosure assemblies housing at least one such electronics module, and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In one embodiment, an electronics module includes a first plate extending generally in a first plane, and a second plate spaced from the first plate and extending generally in a second plane. The electronics module further includes a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates. Each electronic board assembly may be positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.
    Type: Application
    Filed: June 18, 2008
    Publication date: February 25, 2010
    Applicant: Lockheed Martin Corporation
    Inventors: John W. Rapp, Nicholas J. Nagurny, Brent I. Gouldey, Mark Jones, Wendy S. Normark
  • Patent number: 7667976
    Abstract: A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.
    Type: Grant
    Filed: October 1, 2008
    Date of Patent: February 23, 2010
    Assignee: Denso Corporation
    Inventors: Keiichi Sugimoto, Mitsuru Nakagawa
  • Patent number: 7663888
    Abstract: A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: February 16, 2010
    Assignee: Alcatel Lucent
    Inventors: Simon Paul Creasy, Paul James Brown, Fabien Letourneau
  • Publication number: 20100033937
    Abstract: A memory card connector, which is mounted on a printed circuit board, includes a radio-communication module, and a card slot arranged with input/output terminals that are connected to the printed circuit board. In the memory card connector, input/output terminals of the radio-communication module are arranged to join the input/output terminals of the card slot, such that the radio-communication module enables the printed circuit board to access an external device via radio communication in a manner equivalent to a manner when the printed circuit board accesses a memory card attached to the card slot.
    Type: Application
    Filed: July 22, 2009
    Publication date: February 11, 2010
    Inventors: Koichi Kiryu, Hideo Miyazawa
  • Patent number: 7659606
    Abstract: Disclosed is a contacting unit, with plug-in card-shaped housing, having a base plate and a cover plate, between which a slit-like plug-in channel opening on one end of the housing is formed to receive a chip card, and which is provided on the other side with a connector strip, in which the plug-in channel is essentially open on both sides over its entire length in the plug-in direction of the chip card, and the base plate and the cover plate are firmly connected to each other only in the area connected to the plug-in channel in the plug-in direction, wherein at least one lateral guide device is arranged on one end on base plate and/or cover plate, which at least partially bounds the plug-in channel.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: February 9, 2010
    Assignee: STOCKO Contact GmbH & Co. KG
    Inventor: Dieter Klatt
  • Patent number: 7657687
    Abstract: A memory card controller is provided with a clock start/end control unit that suspends supply of a clock signal to the memory card when a data amount transferred from the memory card as a result of the transfer operation reaches a data amount specified by an nth command received from the host device. The memory card controller resumes supply of the clock signal to the memory card if a subsequent command received with supply of the clock signal to the SD card in a suspended state specifies an address consecutive to an end address of data transfer requested by the nth command as a start address.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: February 2, 2010
    Assignee: Panasonic Corporation
    Inventors: Takeshi Ootsuka, Seigo Fujiwara
  • Patent number: 7656676
    Abstract: A removable storage device includes a substrate whereon a plurality of components are arranged. Advantageously, the removable storage device comprises a casing of the package type suitable to completely cover these components and to form, together with the substrate, an external coating of the removable storage device. Moreover, a method is described for assembling at least one removable storage device thus realized.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: February 2, 2010
    Inventors: Marco Roveda, Davide Villa, Romina Zonca, Stefano Ghezzi, Stefano Saltutti, Luigi Costanzo
  • Patent number: 7656014
    Abstract: A process yield of a semiconductor device is enhanced. To that end, there is provided a semiconductor device comprising a substrate having a component mount face with semiconductor chips mounted thereon, the substrate being provided with a plurality of connection leads, and a cap made of resin, placed over the component mount face of the substrate so as to cover the same, the a cap having a first body part, and a second body part larger in thickness than the first body part. Because product information in the form of inscriptions is engraved on the top surface side of the second body part of the cap, the product information can be displayed without the use of an ink mark, it is possible to prevent occurrence of marking defects due to ink bleed, and so forth, thereby enhancing the process yield of a memory card (the semiconductor device).
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: February 2, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Yoshiyuki Tanigawa, Tamaki Wada
  • Patent number: 7652892
    Abstract: A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an electrical interface. The coating is disposed at least on the circuit board to generally encapsulate the circuit board. The housing is sized and configured to generally encompass the circuit board and the coating. The housing includes a housing opening being sized and configured with the electrical interface being at least partially exposed therethrough. The sealant is preferably disposed within the housing substantially intermediate the interior surface of the housing and the coating on the circuit board. Further, at least one of the coating and the sealant may be disposed substantially intermediate the electrical interface and the housing opening.
    Type: Grant
    Filed: March 3, 2006
    Date of Patent: January 26, 2010
    Assignee: Kingston Technology Corporation
    Inventors: George Shiu, Wei Koh
  • Patent number: 7649742
    Abstract: A flash-memory drive replaces a hard-disk drive using an integrated device electronics (IDE) interface. The flash drive has a printed-circuit board assembly (PCBA) with a circuit board with flash-memory chips and a controller chip. The controller chip includes an input/output interface circuit to an external computer over the IDE interface, and a processing unit to read blocks of data from the flash-memory chips. The PCBA is encased inside an upper case and a lower case, with an IDE connector that fits through and opening between the cases. The cases can be assembled with the PCBA by a snap-together, ultrasonic-press, screw-fastener, or thermal-bond adhesive method. Center lines formed on the inside of the cases fit between rows of flash-memory chips to improve case rigidity. The connector has two rows of pins that straddle the center line of the circuit board for a balanced design.
    Type: Grant
    Filed: October 11, 2006
    Date of Patent: January 19, 2010
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Abraham C. Ma, Charles C. Lee, Ming-Shiang Shen
  • Patent number: 7649743
    Abstract: An open-frame flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips, a controller chip, and a Serial AT-Attachment (SATA) connector soldered to it. The PCBA is only partially encased by left and right frames or by a U-shaped bracket frame. The frames have PCBA supports and guide posts that fit near edges of the PCBA. The frames do not cover the top and bottom of the PCBA, allowing chips on the PCBA to be ventilated by unblocked air flow. Screws that attach the PCBA to the frame have metal collars that ground the frame to the PCBA's ground plane. The screws form a current path to draw any electro-static-discharge (ESD) current off the frame and onto a PCBA ground. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the open frame.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: January 19, 2010
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Charles C. Lee, Frank Yu, Abraham C. Ma, Ming-Shiang Shen
  • Patent number: 7649741
    Abstract: A case structure for card-type electronic product includes an intermediate frame having insertion slots spaced thereon; a lower cover connected to a lower side of the intermediate frame by lower hooking members upward inserted into the insertion slots, and each of the lower hooking members including two spaced latch legs; and an upper cover connected to an upper side of the intermediate frame by upper hooking members downward inserted into the insertion slots corresponding to the lower hooking members, and each of the upper hooking members including two laterally outward extended latch hooks. When the upper and lower covers are assembled to the upper and lower sides of the intermediate frame, the latch hooks of the upper hooking members are abutted on lower edges of the latch legs of the lower hooking members to firmly hold the lower cover to the upper cover in three directions.
    Type: Grant
    Filed: July 10, 2008
    Date of Patent: January 19, 2010
    Assignee: Sunlit Precision Technology Co., Ltd.
    Inventor: Wen-Han Liu
  • Patent number: 7644867
    Abstract: A business-card sized storage device which is a thin metal housing built-in with a flash memory module.
    Type: Grant
    Filed: June 8, 2007
    Date of Patent: January 12, 2010
    Assignee: Power Quotient International Co., Ltd.
    Inventors: Wen-Lung Lin, Yi-Ling Liu, Chang-Cheng Tsai
  • Publication number: 20100002400
    Abstract: A daughter board of a computer system is connected to a front panel of a computer housing. The daughter board includes a main body mounted thereon a solid-state storage device for storing data and a control circuit for control data access to the solid state storage device, for example, by surface mount technology.
    Type: Application
    Filed: June 2, 2009
    Publication date: January 7, 2010
    Applicant: ASUSTeK COMPUTER INC.
    Inventor: Jui-Hua Lin
  • Patent number: 7644250
    Abstract: An orientation detector within a device package is used to establish the device orientation. A host controller coupled to the device supplies a control signal to at least one of the pins on the device during a setup phase. The pin that receives the control signal is used for active signaling during normal operations of the device. Based on the control signal, the orientation detector generates an orientation signal within the device. An analog or digital selector circuit connects the pins to correct internal circuit components according to the device orientation.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: January 5, 2010
    Assignee: Intel Corporation
    Inventors: David J. Zimmerman, Jun Shi, Aaron Martin
  • Publication number: 20090323294
    Abstract: A memory card includes a substrate, at least one semiconductor chip attached to the substrate, a writing permitting/prohibiting setting element attached to the substrate, and a molding member formed on the substrate to cover the semiconductor chip.
    Type: Application
    Filed: June 8, 2009
    Publication date: December 31, 2009
    Applicant: Samsung Electronics Co., Ltd
    Inventor: Seok-joon MOON
  • Publication number: 20090316368
    Abstract: A USB device including a bistable mechanism that serves to bias a plug connector into one of two stable states, where the first stable state is associated with a retracted position in which the plug connector is fully retracted inside a housing, and the second stable state is associated with a deployed position in which the plug connector extends through the front opening for coupling to a host system. Movement of the plug connector form the retracted to the deployed position is performed by manually applying a force to a handle portion that protrudes through a slot defined in the housing. The bistable mechanism resists the deploying force until an equilibrium point is reach, after which the bistable mechanism releases stored potential energy to complete the deploying process and to maintain the plug connector is the deployed position.
    Type: Application
    Filed: September 1, 2009
    Publication date: December 24, 2009
    Applicant: Super Talent Electronics, Inc.
    Inventors: Siew S. Hiew, Nan Nan, Abraham C. Ma
  • Patent number: 7633763
    Abstract: A memory card comprising a substrate having opposed top and bottom surfaces and a plurality of terminals disposed on the bottom surface thereof. Mounted to the top surface of the substrate is at least one component which is itself electrically connected to the terminals of the substrate. Formed on the bottom surface of the substrate is a first encapsulation part. Formed on the top surface of the substrate is a second encapsulation part which encapsulates the component mounted thereto.
    Type: Grant
    Filed: January 28, 2004
    Date of Patent: December 15, 2009
    Assignee: Amkor Technology, Inc.
    Inventors: Chul Woo Park, Suk Gu Ko, Sang Jae Jang, Sung Su Park, Choon Heung Lee
  • Patent number: 7630203
    Abstract: An IC card includes an opening formed in a bottom portion of a casing, a circuit board engaged into the casing, one or more batteries attached to the circuit board and received in the opening of the casing for reducing the thickness of the IC card, a processor and an antenna member are attached to the circuit board and electrically coupled together, and a cover member is attached to the casing and engaged onto the circuit board for shielding the circuit board and for retaining the circuit board in the casing, and the cover member includes a lid aligned with the batteries and openable to expose the batteries and to allow the batteries to be changed with a new one when the batteries have been consumed.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: December 8, 2009
    Assignee: Ardi Technology Corporation
    Inventors: Ie Sen Chen, Chih Nung Chen, Wei Chia Huang
  • Patent number: 7630204
    Abstract: A system including a portable object and a portable object holder is disclosed. Preferably, the portable object is an electronic device such as a flash memory drive such as a USB flash drive. According to some embodiments, when the portable object and the portable object holder are attached to each other, the combination is convenient for a user to carry in her pocket. While detached from each other, the portable object holder is retained in a state where the portable object holder is inconvenient for a user to carry in her pocket. Thus, the user may be less likely to forget the electronic device after use, and may be more likely to remember to replace the electronic device in or on the device holder. According to some embodiments, the portable object holder has a first state and a second state. Detachment of the portable object from the portable object holder is operative to cause the device holder to adopt the second state, where at least one dimension of the device holder is increased.
    Type: Grant
    Filed: March 27, 2006
    Date of Patent: December 8, 2009
    Assignee: SanDisk IL Ltd.
    Inventor: Itzhak Pomerantz
  • Publication number: 20090290274
    Abstract: According to the present invention, the setting height position of a first terminal is set to be lower than the setting height position of a second terminal on the terminal formation surface of a printed substrate, so that the protection of an internal circuit and the transmission of a high-speed signal can be both achieved.
    Type: Application
    Filed: May 19, 2009
    Publication date: November 26, 2009
    Inventors: Hiroshi SUENAGA, Yoshiyuki Saito, Osamu Shibata, Yukihiro Fukumoto
  • Publication number: 20090290313
    Abstract: A data card includes a casing provided with a circuit board therein. One end of the casing is provided with a plug electrically connected with the circuit board. The data card further includes a connecting part and a cap part. One end of the connecting part is connected with the casing, while the other end is connected with the cap part. The cap part can cover the plug. An antenna which is electrically connected with the circuit board is provided on the connecting part and/or the cap part. The invention mainly use in wireless data signal receiving or transmitting device.
    Type: Application
    Filed: May 21, 2009
    Publication date: November 26, 2009
    Applicant: Shenzhen Huawei Communication Technologies Co., Ltd.
    Inventor: Shuai ZHAO
  • Patent number: 7623354
    Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: November 24, 2009
    Assignee: Kingston Technology Corporation
    Inventor: Wei Koh
  • Patent number: 7614566
    Abstract: A smart card includes a first interface configured to perform a first type interfacing operation with a host using a plurality of contact pads defined by a contact type smart card protocol, a second interface configured to perform a second type interfacing operation with the host using a subset of the plurality of contact pads, and a controller configured to determine a priority between the first and second interfaces.
    Type: Grant
    Filed: January 30, 2007
    Date of Patent: November 10, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Hoon Shin, Seong-Hyun Kim
  • Patent number: 7616447
    Abstract: An IC memory card (11) has a mode change switch (18) for switching operation modes of a semiconductor component in the vicinity of an end side opposite the external connection terminals (17a to 17i). A controller LSI (24) detects the status of the mode change switch (18) and switches operation modes according to the detected status.
    Type: Grant
    Filed: June 17, 2005
    Date of Patent: November 10, 2009
    Assignee: Panasonic Corporation
    Inventors: Hiroyuki Yamada, Yoshiteru Mori, Kenji Nishimura, Yutaka Nakamura
  • Publication number: 20090273905
    Abstract: An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip.
    Type: Application
    Filed: July 10, 2009
    Publication date: November 5, 2009
    Inventors: Sang-Wook Park, Joong-Hyun Baek, Hyung-Gil Baek
  • Patent number: 7608787
    Abstract: A USB terminal having a conductor layer to be an input/output terminal of a USB connector is formed on a first principle surface of a circuit board. A memory element is mounted on a second principle surface at an opposite side of a terminal forming surface of the circuit board, and the memory element is sealed with a sealing resin. A semiconductor memory device as a USB memory main body is constituted by them. A USB memory is constituted by housing the USB memory main body inside of a USB connector case.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: October 27, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yasuo Takemoto, Naohisa Okumura, Taku Nishiyama, Takashi Okada
  • Patent number: 7606035
    Abstract: Provided are a heat sink and a memory module using the heat sink. In one embodiment, the heat sink includes a first and second guide pin respectively disposed in first and second heat spreaders placed around an object to be cooled. The first and second guide pins help prevent misalignment problems from occurring between the first and second heat spreaders, as well, as helping prevent the first and second heat spreaders from contacting each other when the first and second heat spreaders are pressed by pressure applied from the outside.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: October 20, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chang-Yong Park, Yong-Hyun Kim, Kwang-Ho Chun, Hyun-Jong Oh
  • Publication number: 20090251867
    Abstract: A standard compliant printed circuit base boards or modules for telecommunications, networking and computer equipment electrically and mechanically couples with reusable modular daughter cards to provide application-specific functionality within spatial limitations as required to comply with industry specifications. In particular, an Advanced Mezzanine Card (AMC) Specification compliant printed circuit board is configured for releseably coupling with one or more reusable daughter cards to provide reconfigurable, modularized and scalable electrical functionality in an AMC form factor.
    Type: Application
    Filed: October 9, 2008
    Publication date: October 8, 2009
    Inventors: Viswa N. Sharma, William Chu
  • Patent number: 7597268
    Abstract: A plurality of flash (solid state) media coupled to a single form factor connector to provide a module, i.e., referred to as a SmartStack module, that can be coupled directly to a device with a SmartStack module controller. The SmartStack module does not include a controller and is controlled from the host side. The form factor connector would typically be a CompactFlash (CF) form factor or some other form factor used in a variety of devices. The SmartStack memory module in a preferred embodiment includes a write protect switch that prevents certain portions of the memory within the SmartStack module from being written to. In addition, a portion of the flash memory will be allocated to the secure area for storing information to implement various forms of security. Another portion of the flash memory is allocated to store optional biometric information such as a user's fingerprint or retinal scan information, etc.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: October 6, 2009
    Assignee: MCM Portfolio LLC
    Inventors: Larry Lawson Jones, Sreenath Mambakkam, Arockiyaswamy Venkidu
  • Patent number: 7595996
    Abstract: An expanding card mechanism for protecting a circuit board is disclosed. The expanding card mechanism includes an upper case, a lower case, a plastic frame rack, a plastic baffle and an interface joint. The main feature is that two sides of the plastic frame rack form two positioning guiding tracks, respectively, for matching an inside concave slot guiding tracks of the two sides on the lower case and the plastic frame rack is slid well in the lower case until positioning convex blocks of the plastic frame are locked in positioning pinholes of the lower case. Furthermore, the two positioning convex blocks of the plastic baffle matching the two corresponding positioning guiding slots of the plastic frame rack are fixed well to form foolproof protection, and the circuit board and the interface joint are equipped with the lower case.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: September 29, 2009
    Assignee: Compupack Technology Co., Ltd.
    Inventor: Ben Chen
  • Patent number: 7589977
    Abstract: A housing combination includes a housing (51) and a shielding enclosure (55). The housing has a peripheral wall and a receiving hole (511). The peripheral wall surrounds the receiving hole configured for receiving a surface contact card. A guiding element (52) is positioned in at least one part of the peripheral wall of the receiving hole. The shielding enclosure is disposed at one side of the housing, one part of the shielding enclosure exposed from the receiving hole configured for supporting the surface contact card.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: September 15, 2009
    Assignee: Chi Mei Communication Systems, Inc.
    Inventor: Shih-Chieh Lin
  • Patent number: 7583505
    Abstract: A processor apparatus is disclosed. The apparatus includes a case with air passages, and a heat dissipation plate structure having a thermally conductive material within the case. It includes a processor having a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor. It also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: September 1, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Kenichi Wakabayashi, Chitoshi Takayama, Tadashi Shiozaki
  • Patent number: 7576990
    Abstract: A case-grounded flash-memory drive has a printed-circuit board assembly (PCBA) with flash-memory chips and a controller chip. The PCBA is encased inside an upper case and a lower case, with a Serial AT-Attachment (SATA) connector that fits through and opening between the cases. The cases can be assembled with the PCBA by a snap-together, ultrasonic-press, screw-fastener, or thermal-bond adhesive method. Dual-axis case-grounding pins draw any electro-static-discharges (ESD) current off the upper case along a primary axis and onto a PCBA ground through a secondary axis washer that is screwed into the PCBA. The primary axis body of the dual-axis case-grounding pins fits around a PCBA notch while the secondary axis passes through a metalized alignment hole for grounding. When the SATA connector is inserted into a host, the host ground sinks ESD currents collected by the dual-axis case-grounding pins.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: August 18, 2009
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim Chin-Nan Ni, Charles C. Lee, Abraham C. Ma, Ming-Shiang Shen
  • Patent number: 7559486
    Abstract: Apparatuses and methods for forming wireless RF labels are claimed. In one embodiment, a flexible layer may be made to receive an array of integrated circuit chips The integrated circuit chips may be powered by a signal from a transmitter which beams the information to the wireless RF labels. The method includes coupling a plurality of integrated circuit chips to a flexible web material and advancing the flexible web material through a web processing apparatus. A metallization material is patterned on the flexible web material. The flexible web material can be coupled to a second web material.
    Type: Grant
    Filed: December 18, 2006
    Date of Patent: July 14, 2009
    Assignee: Alien Technology Corporation
    Inventor: Jeffrey Jay Jacobsen
  • Patent number: 7559469
    Abstract: To achieve backward compatibility for smaller chip cards, in particular to legacy card readers/writers or legacy mobile terminals, according to the present invention a smaller chip card comprises a card body and a first contact area (14) with dimensions and locations of contacts according to predefined standard. An integrated circuit chip (36) is, firstly, physically and electrically connected to contacts of a second contact area (38), where the locations of contacts in the second contact area (38) are different from locations of contacts in the first contact area (14). According to the present invention, the integrated circuit chip (36) is also connected to contacts in the first contact area (14).
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: July 14, 2009
    Assignee: NTT DoCoMo, Inc.
    Inventors: Chie Noda, Atsushi Murase, Hidetoshi Ishikawa
  • Patent number: 7561432
    Abstract: A memory card reader apparatus includes an electric board having a connector into which a memory card is inserted, a board holder holding the electric board, a card connector cover having a card slot, and an exterior cover different from the card connector cover. The board holder is positioned relative to the exterior cover. The board holder and the card connector cover are positioned in at least two directions perpendicular to the direction in which the memory card is inserted and pulled out.
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: July 14, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masaaki Ishihara, Masahiro Kawanishi, Hiroshi Ogushi, Masato Koshimizu
  • Patent number: 7559804
    Abstract: A card connector assembled on a bracket, comprises an insulating housing, a plurality of contacts received in the insulating housing, the shell covering the insulating housing and a holding device. The insulating housing defines a card insertion/ejection direction. The holding device is disposed on the shell, one of the holding device and the bracket defining a receiving portion and the other of the holding device and the bracket having a mating portion to be received in the receiving portion.
    Type: Grant
    Filed: May 22, 2007
    Date of Patent: July 14, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventor: Yung-Chang Cheng
  • Patent number: 7558069
    Abstract: An extension structure for a plastic molding portable memory product includes an outer casing unit, an inner sliding unit, and a closing unit. The inner sliding unit is positioned inside the outer casing unit, and can be extended by sliding, whereas the closing unit is combined with the outer casing unit to ensure the inner sliding unit will not slip out. The outer casing unit is produced using one body formation method that is free from the traditional method of combining two pieces of structures through high frequency wave compression work sequence to effectively increase product yield, reduce cost and improve the cosmetics.
    Type: Grant
    Filed: January 2, 2008
    Date of Patent: July 7, 2009
    Assignee: Hahntek Technology Corp.
    Inventor: Chin-Hung Chung
  • Patent number: 7558070
    Abstract: An electronic information storage device includes a first casing provided with a first toothed portion; a pushing element; an outer gear coupled to the pushing element; and an electrical connecting portion having a circuit board mounting means and a circuit board, the circuit board mounting means being coupled to the circuit board, the circuit board mounting means being provided with a second toothed portion, wherein the outer gear is coupled to the first toothed portion and the second toothed portion respectively, so that the electrical connecting portion is driven with respect to the first casing when the pushing element pushes or pulls the outer gear. Via this arrangement, the moving distance of the electrical connecting portion can be further controlled, thereby improving the convenience of the storage device in use.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: July 7, 2009
    Assignee: A-Data Technology Co., Ltd.
    Inventor: Yu-Cheng Kang
  • Patent number: 7558110
    Abstract: In a SIM card having a flash memory chip, a memory controller chip, and contact/contactless card interfaces, the memory controller chip has a function of executing user authentication of a host equipment, executes processing of data transmitted through the contactless IC card interface (executing reading or writing of data to the flash memory chip) using power supplied from the host equipment to the contact IC card interface, and executes initialization of the flash memory chip between activation of the host equipment and completion of user authentication instructed by the host equipment.
    Type: Grant
    Filed: April 27, 2007
    Date of Patent: July 7, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Nagamasa Mizushima, Kunihiro Katayama, Masaharu Ukeda, Yoshinori Mochizuki
  • Patent number: 7554814
    Abstract: A back cover, a middle frame, and a front cap are utilized as a sandwich package for packaging a portable storage device. An electronic element passes through the hollow middle frame and the middle frame holds the electronic element. The back cover covers the back end of the middle frame and the front cap covers the front end of the middle frame for fully packaging the electronic element. A moveable outer frame on the middle frame allows for withstanding the back cover and eliminating the manufacturing dimensional error of the PCB of the electronic element between the PCB and the back cover. The front cap covers the front end of the middle frame instead of the USB connector and provides the USB connector of the portable device more durability.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: June 30, 2009
    Assignee: Transcend Information, Inc.
    Inventor: Chih-Sheng Chen
  • Patent number: 7554818
    Abstract: A telecommunications system is provided to allow for the securement of a module to a chassis in multiple positions. The multiple positions may include a storage position and/or an engaged position.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: June 30, 2009
    Assignee: Telect Inc.
    Inventor: Terry T. Thom
  • Patent number: 7554813
    Abstract: Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be rotated out of the way by hand when that set of contacts is being used.
    Type: Grant
    Filed: November 13, 2007
    Date of Patent: June 30, 2009
    Assignee: Sandisk Corporation
    Inventors: Robert C. Miller, Hem P. Takiar, Joel Jacobs, Robert Howard, Motohide Hatanaka, Robert F. Wallace, Edwin J. Cuellar, Eliyahou Harari, Matt Peterson
  • Patent number: 7551448
    Abstract: The invention is directed to a method and apparatus for electrically interconnecting multiple electronic components together by disposing the electronic components between two opposing plurality of protrusions that hold the electrical components together and establish an electrical connection therebetween. Each plurality of protrusions may be disposed in an offset arrangement with the opposing protrusions. The opposing protrusions cause the electronic components to bend and adopt a deflected geometry when they are positioned between the opposing sets of protrusions. This bending results in the electronic components being biased against each other so that electrical contacts on each electronic component may be held together and thereby form an electrical connection. As a result, the opposing sets of protrusions can be used to electrically interconnect a plurality of electrical components in the absence of clamping, adhesion, soldering, or pinching.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: June 23, 2009
    Assignee: Cryovac, Inc.
    Inventor: William P. Roberts
  • Patent number: 7547961
    Abstract: An IC card capable of reinforcing the prevention of the electrostatic damage without causing a rise in the cost of a semiconductor integrated circuit chip. The semiconductor integrated circuit chip (2) is mounted on a card substrate (1), and plural connection terminals (3) are exposed. The connection terminals are connected to predetermined external terminals (4) of the semiconductor integrated circuit chip, first overvoltage protection elements (7, 8, 9) connected to the external terminals are integrated in the semiconductor integrated circuit chip, and second overvoltage protection elements such as surface-mount type varistors (11) connected to the connection terminals are mounted on the card substrate. The varistors are variable resistor elements having a current tolerating ability greater than that of the first overvoltage protection elements.
    Type: Grant
    Filed: January 2, 2007
    Date of Patent: June 16, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Yosuke Yukawa, Takashi Totsuka
  • Patent number: 7546634
    Abstract: An encryption removable storage system that enables different types of storage devices to be conveniently added or removed from a cradle of a computer or equipment and with data encryption/decryption ability, which comprising: an enclosure portion that can slide in and out of said cradle portion, having a hollow space for containing said storage devices and providing connection of the electrical signals of said storage devices; and a bridge portion that can be positioned inside said enclosure portion with the ability of translating a first interface into a second interface and executing data encryption/decryption function, wherein, said first interface is different to said second interface either in signals type or physical connecting type.
    Type: Grant
    Filed: April 8, 2005
    Date of Patent: June 9, 2009
    Inventors: Victor Chuan-Chen Wu, Bill Kwong
  • Patent number: 7542301
    Abstract: An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: June 2, 2009
    Assignee: Alien Technology Corporation
    Inventors: Lily Liong, Kenneth D. Schatz, Gordon Craig, Mark A. Hadley, Eric Kanemoto