Ic Card Or Card Member Patents (Class 361/737)
  • Patent number: 7432816
    Abstract: A printed circuit board (PCB) includes an antenna for an RFID chip. An RFID chip for a tag is operable to be placed on the PCB such that the RFID chip is connected to the antenna and is operable to use the antenna to transmit data.
    Type: Grant
    Filed: October 13, 2005
    Date of Patent: October 7, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Joseph Ku, Geoff Lyon, Salil Pradhan
  • Publication number: 20080225497
    Abstract: A semiconductor integrated circuit includes a first clock pin controller that receives a mirror function signal and a test mode signal to generate a first input buffer control signal in response to the mirror function signal in a normal mode. A second clock pin controller receives the mirror function signal and the test mode signal to generate a second input buffer control signal, which is an inverted signal of the first input buffer control signal, in response to the mirror function signal in the normal mode. An input buffer unit generates output signals of first and second pins in response to the first input buffer control signal and the second input buffer control signal, respectively.
    Type: Application
    Filed: July 3, 2007
    Publication date: September 18, 2008
    Applicant: Hynix Semiconductor Inc.
    Inventors: Young Ju Kim, Kwan-Weon Kim
  • Publication number: 20080225498
    Abstract: An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.
    Type: Application
    Filed: May 23, 2008
    Publication date: September 18, 2008
    Inventors: JUNICHIRO OSAKO, Hirotaka Nishizawa, Kenji Osawa, Hideo Koike
  • Patent number: 7420803
    Abstract: A universal serial bus (USB) flash drive pen device for deploying and retracting a USB plug connector having a pusher assembly including a USB flash drive and a USB plug connector, in accordance with an embodiment of the present invention. The USB flash drive pen device further includes a housing assembly at least partially enclosing said pusher assembly for deploying said USB plug connector, said USB flash drive being coupled to said USB plug connector, said pusher assembly retracting said USB plug connector into said housing assembly, said USB flash drive pen device for deploying said USB plug connector to couple said USB flash drive to a USB port.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: September 2, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Paul Hsueh, Jin Kyu Kim, Nan Nan, David Nguyen, Ming-Shiang Shen
  • Patent number: 7420830
    Abstract: A memory card module includes a first circuit board, and a second circuit board. On one surface of the first circuit board, there are flash memories and a controller. The second circuit board is installed at one end of the first circuit board and is electrically connected with the first circuit board so as to form a transmitting interface port. On a first surface of the second circuit board, there are a plurality of interface connecting points. On a second surface of the second circuit board, part of the second surface is hollowed out. A space formed between the hollowed out area and the corresponding first circuit board increases the area for circuit layouts and the mounting components for the first circuit board. Therefore, quantity of accommodated memory components may be increased so as to increase the total storage capacity of the memory card under limitation of small dimensions.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: September 2, 2008
    Assignees: A-Data Technology Co., Ltd.
    Inventor: Ping-Yang Chuang
  • Publication number: 20080186685
    Abstract: The invention provides a semiconductor memory module. The semiconductor memory module includes a printed circuit board part having a first surface and a second surface facing the first surface, and a metal core having an insert part inserted inside the printed circuit board part and an extension part elongated from at least one side of the printed circuit board. The semiconductor memory module also includes memory parts mounted on the printed circuit board. The metal core has a folding structure having at least one bent portion to substantially cover the memory parts.
    Type: Application
    Filed: January 11, 2008
    Publication date: August 7, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Chan CHO, Hyun-Seok CHOI, Yong-Hyun KIM, Hyung-Mo HWANG, Kyu-Tae KIM
  • Patent number: 7407393
    Abstract: An embodiment of the present invention includes a super slim compact flash (CF) light Universal Serial Bus (USB) device having a top cover, a top cover slot formed within the top cover and forming a top cover slot cavity, a sliding plug connector positioned within the cavity and flexibly movable therein, a plastic frame disposed below and around the top cover, a retractable slim USB plug connector sub-assembly on top of which and connected thereto is placed the sliding plug connector, the sub-assembly including a retractable slim USB plug connector positioned within the device to be flexibly retracted from or pulled into the device by the sliding plug connector for causing connection to a mating USB plug connector.
    Type: Grant
    Filed: April 24, 2007
    Date of Patent: August 5, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Jim C. Ni, Ming-Shiang Shen
  • Patent number: 7405949
    Abstract: A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link.
    Type: Grant
    Filed: November 22, 2006
    Date of Patent: July 29, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Jun Lee, Joo-Sun Choi, Kyu-Hyoun Kim, Kwang-Soo Park
  • Patent number: 7395975
    Abstract: An SD memory card contains an RF circuit, a controller LSI and a flash memory. The RF circuit is connected to an antenna module attached to the SD memory card. The controller LSI executes radio interface control and interface control for the SD memory card. By running a protocol control program and an SD memory card interface control program stored in a ROM, using an MPU, the controller LSI executes upper-protocol control and SD memory card interface control (security data access control, flash memory access control).
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: July 8, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takafumi Ito
  • Patent number: 7397672
    Abstract: The present invention provides a flip chip mounting substrate which comprises an electronic circuit composed of a circuit line and plural mounting pads connected to both ends of the circuit line formed on one surface of a base sheet, wherein the plural mounting pads are faced each other and spaced a pad clearance gap apart, and one or more semiconductor mounting paste guide paths are formed in the mounting pads. The flip chip mounting substrate can reduce voids that might be produced in the semiconductor mounting paste, when flip-chip-mounting an IC chip on a flip chip mounting substrate.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: July 8, 2008
    Assignee: Lintec Corporation
    Inventors: Yasukazu Nakata, Katsuyoshi Matsuura, Taiga Matsushita
  • Publication number: 20080158835
    Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.
    Type: Application
    Filed: February 26, 2008
    Publication date: July 3, 2008
    Inventors: Takuya TAKAHASHI, Kazuhiro Yamamoto, Minoru Ohara
  • Patent number: 7394661
    Abstract: The present invention relates to a method and system for providing a flash memory assembly. The flash memory assembly includes a connector and a printed circuit board (PCB) coupled to the connector. The center of the PCB is positioned substantially at the center of the connector. An electronic component is coupled to one side of the PCB. In another aspect of the present invention, a second electronic component is coupled to a second side of the PCB. In another aspect of the present invention, the electronic components and the PCB are protected by covers joined using interference fitting or ultrasonic joining. In another aspect of the present invention, a cap protects the connector. The cap can be removably coupled to the connector.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: July 1, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventors: Kuang-Yu Wang, Charles C. Lee, Horng-Yee Chou
  • Publication number: 20080149740
    Abstract: A card device includes a card casing accommodating a circuit board. The card device is capable of being inserted into and pulled out from a card slot in an apparatus in which the card device is to be mounted. An anti-slipping member is anchored and exposed at a rear-end wall portion of a peripheral wall of the card casing for being held at least when the card device is inserted or pulled out. The rear-end wall portion is positioned at a rear end of the card device opposite to the end of the card device that is inserted into the card slot.
    Type: Application
    Filed: March 7, 2008
    Publication date: June 26, 2008
    Inventors: Hiroaki Fukuchi, Wataru Kakinoki
  • Patent number: 7390978
    Abstract: An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: June 24, 2008
    Assignee: Motorola, Inc.
    Inventors: Timothy B. Dean, Daniel T. Rooney, Jeffrey M. Petsinger
  • Patent number: 7387534
    Abstract: An electrical connector is disclosed comprising: an insulating main body provided with a first fixture block and a second fixture block on two ends of its side; and a metal housing disposed on the exterior of the insulating main body and provided with a first through hole and a second through hole corresponding to the first fixture block and the second fixture block to interfere one another, such that a clasping structure with at least two opposite clasping directions is formed.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: June 17, 2008
    Assignee: Lotes Co., Ltd.
    Inventor: Chien-Chih Ho
  • Patent number: 7385827
    Abstract: The invention relates to a contacting unit for a card-type carrier element in electronic component groups with a housing, the contact unit including a bonding pad on one end face, a slot-like slide-in port that joins on the end face opposite the bonding pad, into which the card-type carrier element, especially a chip card in accordance with ISO 7816, can be inserted, and a printed circuit board, arranged in the housing parallel to the slide-in port and electrically connected to the bonding pad, wherein said printed circuit board is equipped on one surface with contact elements for contacting the card-type carrier element, characterized in that said unit is designed in accordance with the PCMCIA Express Card Standard.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: June 10, 2008
    Assignee: STOCKO Contact GmbH & Co. KG
    Inventor: Dieter Klatt
  • Patent number: 7383992
    Abstract: The invention is directed to a device that functions as an adaptor for a micro-memory card. The device includes a port to receive the micro-memory card and an internal interface within the port allows for electrical connection between the device and the micro-memory card. The device also includes a card interface that conforms to a standard sized memory card. The device can be inserted into another device that accepts such standard sized memory card so that the other device can store data onto the micro-memory card connected to the port. In addition, the device also includes a host interface, such as an external shieldless USB tab protruding from an edge of the device, or a wireless USB interface to allow for wireless USB communication.
    Type: Grant
    Filed: October 10, 2006
    Date of Patent: June 10, 2008
    Assignee: Imation Corp.
    Inventor: Trung V. Le
  • Publication number: 20080130249
    Abstract: A complex memory chip includes a peripheral circuit block, a memory block for storing data, and a control block for controlling functions of the peripheral circuit block and the memory block. The peripheral circuit block, the memory block and the control block are formed as a single chip. Further, a memory card includes a printed circuit board, the complex memory chip formed on a first face of the printed circuit board, a wire for electrically connecting the complex memory chip to the printed circuit board, a contact pad formed on a second face of the printed circuit board opposite to the first face to be electrically connected to the complex memory chip, and a molding member for fixing the complex memory chip to the printed circuit board.
    Type: Application
    Filed: December 5, 2007
    Publication date: June 5, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Jin-Jun PARK
  • Patent number: 7382625
    Abstract: An express card adapted to receive and utilize a SIM card that can be electrically coupled with a computer is disclosed. The express card includes an extended portion with a printed circuit board (PCB) and a SIM card connector for coupling a SIM card with the PCB. An external antenna jack is electrically coupled with the PCB extended portion. An antenna/SIM card support structure is mounted on the PCB extended portion covering the SIM card connector. The antenna/SIM. card support structure forms a slot adapted to receive and seat a SIM card and form an electrical connection between the SIM card and the SIM card connector. A metallic flex antenna can be affixed to the antenna/SIM card support structure such that the antenna characteristics of an external antenna can be affected based on the metallization pattern and placement of the metallic flex antenna.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: June 3, 2008
    Assignee: Sony Ericsson Mobile Communications AB
    Inventors: Curtis W. Thornton, Brian Francis Mellage
  • Publication number: 20080123305
    Abstract: A dual-channel memory module for use in computing devices is disclosed. The memory module can include a substrate having a base portion, a first connector portion, and a second connector portion spaced apart and electrically insulated from the first connector portion. A first set of memory devices is disposed on the base portion and in electrical communication with the first connector portion, and a second set of memory devices is disposed on the base portion and in electrical communication with the second connector portion. The first and second sets of memory devices are independent of each other.
    Type: Application
    Filed: November 28, 2006
    Publication date: May 29, 2008
    Applicant: SMART Modular Technologies, Inc.
    Inventors: Hossein Amidi, Satyadev Kolli
  • Patent number: 7377815
    Abstract: A card connector device whose structure is simple and which can hold plural types of cards of different widths. A plate-spring-shaped card position control unit is formed on the top of a case by partially cutting off a part of the case. The tip of the card position control unit is folded and protrudes from the case by a prescribed distance toward the bottom of the case.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: May 27, 2008
    Assignee: Fujitsu Limited
    Inventor: Kazuaki Takao
  • Patent number: 7375975
    Abstract: In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a case which is cooperatively engaged to a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. In each embodiment of the present invention, the case is reinforced by a stiffener which effectively increases the mechanical strength of the fully fabricated memory card, thus providing the capability to withstand typical bending and twisting tests. The stiffener may be provided in any one of a plurality of different shapes or profiles, and may embedded within one or more of various locations within the case.
    Type: Grant
    Filed: October 31, 2005
    Date of Patent: May 20, 2008
    Assignee: Amkor Technology, Inc.
    Inventors: Sang Jae Jang, Chul Woo Park, Choon Heung Lee
  • Patent number: 7375972
    Abstract: An appearance protective case and an appearance protective case assembly are provided in which damage of a colored or marked pattern due to exposure is prevented, and in which the structure of a formed member having the colored or marked pattern printed thereon is made simple so that the formed member is easily incorporated into the appearance protective case. The appearance protective case includes a sheet-like formed member formed by draw-processing a sheet-like member treated with coloring or marking and a transparent or translucent cover case, and is assembled by fitting the sheet-like formed member into the cover case such that the sheet-like formed member extends in close contact with the inner surface of the cover case.
    Type: Grant
    Filed: August 18, 2003
    Date of Patent: May 20, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Wataru Kakinoki, Hiroaki Fukuchi, Katsuo Ito
  • Patent number: 7374104
    Abstract: In a memory card with a newly-added module for performing data communication, data communication is stably performed without receiving a noise effect. As an embodiment of the present invention, a memory card 100 has a thin-plate-shaped holding member 20, a memory section 24 provided as buried in the holding member 20, plural first connection pieces 2-10 connected to the memory section 24, a data communication section 26 provided as buried in the holding member 20, and two connection pieces 11, 12 connected to the data communication section 26. The two second connection pieces 11, 12 are disposed at the end of a row part R1 on which only the plural first connection pieces 2-10 are aligned. One first connection piece 10 positioned at the end of the row part R1 is a ground terminal. That is to say, in the plural first connection pieces 2-10, the first connection piece 10 adjacent to the second connection piece 11 is a ground terminal.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: May 20, 2008
    Assignees: Sony Corporation, Renesas Technology Corporation
    Inventors: Yoshitaka Aoki, Hideaki Bando, Keiichi Tsutsui, Hirotaka Nishizawa, Kenji Ohsawa, Takashi Totsuka
  • Patent number: 7367512
    Abstract: A chip card with a flexible card body and electrical components arranged in the card body with at least some of the electrical components being arranged in a casing. The card body has a recess matched in shape and size to the casing and the casing is affixed moveably in the recess of the card body. In this way, the conventionally existing incompatibility of rigid casing and flexible card body can be solved. As a result of the moveable suspension, the casing is decoupled from the bending and torsion forces acting on the card body.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: May 6, 2008
    Assignee: Novacard Informationssysteme GmbH
    Inventor: Guntram Laude
  • Publication number: 20080101042
    Abstract: An expansion card has a terminal block, a top metal sheet, bottom metal sheet and a plastic seat. Two step retainers are formed respectively on two short edges of the terminal block. Two pairs of hooks are formed on the two long edges adjacent respectively to front and rear ends of the bottom metal sheet. The hooks of one pair hook respectively on the step retainers. The two long edges of the top metal sheet both extend to form Two bent portions are formed respectively on the long edges of the bottom metal sheet. The plastic seat is engaged with the top and bottom metal sheet. Fabrication of the expansion card is easy and convenient.
    Type: Application
    Filed: October 31, 2006
    Publication date: May 1, 2008
    Inventor: Chi-Jung Huang
  • Patent number: 7365985
    Abstract: A memory module assembly includes two-plate heat sink attached to one or more of the integrated circuits (e.g., memory devices) of a memory module PCBA by adhesive. The adhesive is either heat-activated or heat-cured. The adhesive is applied to either the memory devices or the heat-sink plates, and then compressed between the heat-sink plates and memory module using a fixture. The fixture is then passed through an oven to activate/cure the adhesive. The two heat sink plates are connected together to form a rigid frame.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: April 29, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventor: Jim Ni
  • Publication number: 20080094808
    Abstract: In one implementation, flash memory chips are provided with an operating power supply voltage to substantially match a power supply voltage expected at an edge connector of a dual inline memory module. The one or more of the flash memory chips and a memory support application integrated circuit (ASIC) may be mounted together into a multi-chip package for integrated circuits. The one or more flash memory chips and the memory support ASIC may be electrically coupled together by routing one or more conductors between each in the multi-chip package. The multi-chip package may be mounted onto a printed circuit board (PCB) of a flash memory DIMM to reduce the number of packages mounted thereto and reduce the height of the flash memory DIMM. The number of printed circuit board layers may also be reduced, such as by integrating address functions into the memory support ASIC.
    Type: Application
    Filed: October 22, 2007
    Publication date: April 24, 2008
    Inventors: Ruban Kanapathippillai, Kenneth A. Okin
  • Patent number: 7359202
    Abstract: A printer apparatus is disclosed. The printer apparatus includes a heat dissipation plate structure including a thermally conductive material, and a processor comprising a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is coupled to the heat dissipation structure and is adapted to dissipate heat from the processor. An array of pins is substantially perpendicular to the major surface of the processor. The apparatus also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly. The apparatus also includes a memory for storing print image data, the memory being operatively coupled to the processor. It also includes a printing unit operatively coupled to the memory for printing on paper.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: April 15, 2008
    Assignee: Seiko Epson Corporation
    Inventors: Kenichi Wakabayashi, Chitoshi Takayama, Tadashi Shiozaki
  • Patent number: 7359208
    Abstract: A Universal-Serial-Bus (USB) device includes a PCBA mounted inside a molded plastic housing structure such that metal contacts are exposed on a plug portion of the housing structure, and includes a metal plug shell attached to the housing structure such that an upper wall of the metal plug shell is spaced from the metal contacts by a predetermined gap distance. A USB controller IC is mounted onto a relatively narrow portion of the PCBA under the metal contacts to reduce overall length of the USB device. The metal plug shell is molded or snap-coupled onto tabs formed on the plug portion of the housing structure. An optional locking collar secures a rear edge of the metal plug shell to the housing structure. An optional rear cover is attached over a rear opening of the housing structure and secures a rear edge of the PCBA.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: April 15, 2008
    Assignee: Super Talent Electronics, Inc.
    Inventor: Jim Ni
  • Patent number: 7355860
    Abstract: Enclosed re-programmable non-volatile memory cards include at least two sets of electrical contacts to which the internal memory is connected. The two sets of contacts have different patterns, preferably in accordance with two different contact standards such as a memory card standard and that of the Universal Serial Bus (USB). One memory card standard that can be followed is that of the Secure Digital (SD) card. The cards can thus be used with different hosts that are compatible with one set of contacts but not the other. A cover that is hinged to the card to normally cover one set of contacts can be rotated out of the way by hand when that set of contacts is being used.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: April 8, 2008
    Assignee: SanDisk Corporation
    Inventors: Robert C. Miller, Hem P. Takiar, Joel Jacobs, Robert Howard, Motohide Hatanaka, Robert F. Wallace, Edwin J. Cuellar, Eliyahou Harari
  • Patent number: 7351920
    Abstract: An IC card includes a semiconductor integrated circuit device package having one surface and another surface opposite to the one surface, card terminals on the one surface of the package, and a base card which includes a concave portion attached to the other surface of the package. The package includes a wiring board, a semiconductor integrated circuit chip on the wiring board, and an insulating resin coated over the semiconductor integrated circuit chip. The package is a rectangular parallelepiped package. The insulating resin is exposed to the other surface of the package. The insulating resin and the wiring board are exposed to four surfaces of the package except for the one surface and the other surface.
    Type: Grant
    Filed: May 22, 2003
    Date of Patent: April 1, 2008
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takuya Takahashi, Kazuhiro Yamamoto, Minoru Ohara
  • Patent number: 7352588
    Abstract: A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: April 1, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Tamaki Wada, Kenji Osawa, Junichiro Osako, Michiaki Sugiyama
  • Publication number: 20080074850
    Abstract: A mounting apparatus for fixing an expansion card to a motherboard, includes a connector socket for engaging with a first portion of the expansion card, and a clamp configured for engaging with a second portion of the expansion card. The connector socket is installed on the motherboard, and two latching portions are formed on two sides of the connector socket respectively. The clamp includes two elastic arms riding on the second portion of the expansion card and engaging with the corresponding latching portions of the connector socket.
    Type: Application
    Filed: June 11, 2007
    Publication date: March 27, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SZU-WEI KUO
  • Publication number: 20080068272
    Abstract: The present invention discloses: a connecting part of conductor pattern, which is connected to a conductor pattern formed on a surface of an insulating substrate and which has at least one dent on the surface, and a conductor patterns-connected structure obtained by electrically connecting the connecting parts of conductor patterns, mentioned above, to each other with a conductive material which fills the inside of the dent of each connecting part and further is adhered to each connecting part.
    Type: Application
    Filed: September 19, 2007
    Publication date: March 20, 2008
    Applicant: LINTEC CORPORATION
    Inventors: Taiga Matsushita, Katumi Katakura, Katsuyoshi Matsuura
  • Patent number: 7345883
    Abstract: A processing device is disclosed. It includes a heat dissipation plate structure with a thermally conductive material, and a processor with a major surface. The processor generates heat when energized, and the heat dissipation plate structure is adapted to dissipate heat from the processor. A heat dissipating material is in contact with the processor and the heat dissipation plate structure. Pins in an array of pins are substantially parallel to each other and are substantially perpendicular to the major surface of the processor. The pins may be received in a socket assembly that is on a circuit board.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: March 18, 2008
    Assignee: Seiko Epson Corporation
    Inventors: Kenichi Wakabayashi, Chitoshi Takayama, Tadashi Shiozaki
  • Patent number: 7337975
    Abstract: A multi-step method for producing contactless tickets or cards, the tickets or cards including a chip (24) which is connected to an antenna (10) on a paper carrier. The method includes: printing the antennae in series on the paper carrier strip using a silkscreen ink; fixing a chip to each ticket by connecting bond pads of the chip to the antennas' bond pads (14, 16); and covering the paper strip, including the silkscreen-printed antenna and the corresponding chip, with an adhesive paper strip. After each step, the paper carrier strip is wound up before the next step is begun. Each of the silkscreen-printed antennae is coated with a protective layer (12) to prevent silkscreen ink from being transferred to the back of the paper carrier strip during the successive winding-up following each step.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: March 4, 2008
    Assignee: Ask S.A.
    Inventor: Christophe Halope
  • Patent number: 7336498
    Abstract: The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: February 26, 2008
    Assignee: SanDisk Corporation
    Inventors: Hem P. Takiar, Robert Miller
  • Publication number: 20080030963
    Abstract: An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.
    Type: Application
    Filed: August 4, 2006
    Publication date: February 7, 2008
    Inventors: Warren Middlekauff, Robert C. Miller
  • Patent number: 7324347
    Abstract: A memory card includes: a main body of the memory card in which a notched section is formed; a semiconductor memory; and a write/nonwrite setting element for setting the write/nonwrite state of data in the semiconductor memory, the write/nonwrite setting element being slidably fitted in the notched section, wherein the main body of the memory card includes an upper main body and a lower main body; at least one of the upper main body and the lower main body has an elastic guide formed within the notched section; the write/nonwrite setting element slides along the elastic guide so as to set the write/nonwrite state of the data in the semiconductor memory; and the elastic guide has an engagement portion for engagedly stopping the write/nonwrite setting element so as to select the position of the write/nonwrite setting element with respect to the elastic guide.
    Type: Grant
    Filed: July 15, 2005
    Date of Patent: January 29, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiji Nakanishi, Takashi Torii, Noriaki Furuta, Takahiro Sakamoto, Masayoshi Yano
  • Publication number: 20080013290
    Abstract: A printed circuit board card comprising: a printed circuit board having a first thickness and having first and second edges for inserting into respective channels of card guides, the channels of the card guides for receiving printed circuit boards having a second thickness, the second thickness being greater than the first thickness; and, first and second thickness adaptors each having a third thickness applied at the first and second edges, respectively, a sum of the first and third thicknesses approximating the second thickness, to thereby align the printed circuit board in the channels of the card guides.
    Type: Application
    Filed: July 17, 2006
    Publication date: January 17, 2008
    Inventors: Simon Paul Creasy, Paul James Brown, Fabien Letourneau
  • Publication number: 20080007924
    Abstract: The present invention provides a card adaptor device, including a converter card that enables access to data stored therein, structure of which includes disposition of a memory module and a direct memory access controller therein, and functions in coordination with an adaptor device having a MS Pro Duo external form and converter chip to form a configuration conforming to MS Pro Duo electrical structures or functions in coordination with an adaptor device having a MMC/SD series external dimensions to form a configuration suitable as a MMC/SD series interface connector. Hence, a variety of adaptor devices having different interfaces and dimensions enable the card adaptor device to form different types of memory cards having a configuration conforming to MS Pro Duo and MMC/SD interface specifications.
    Type: Application
    Filed: July 6, 2006
    Publication date: January 10, 2008
    Inventor: Chien-Yuan Chen
  • Publication number: 20080002372
    Abstract: A card formed with a cavity located within the card. The cavity is used to hold one or more liquid chemicals. Additional hollow regions abut the visual and magnetic versions of the sensitive data and are normally separated from the chemicals. When the card is sharply folded, the chemicals are released from the cavity and flow in the hollow regions abutting the stored data. The chemicals render the data unreadable, such as by obscuring the visual display with an opaque film. Additionally, in at least some embodiments, the magnetic strip on the credit card is implemented in such a way that there are two separate portions, with the encoded data divided in such a way that both portions are required in order to be decoded.
    Type: Application
    Filed: June 28, 2006
    Publication date: January 3, 2008
    Applicant: Lenovo (Singapore) Pte. Ltd.
    Inventors: Scott Edwards Kelso, John Carl Mese, Nathan J. Peterson, Rod D. Waltermann, Arnold S. Weksler
  • Publication number: 20080002373
    Abstract: A printed circuit board comprises a high-speed DRAM and a memory controller mounted thereon. The high-speed DRAM is connected to the memory controller by memory bus wiring. The printed circuit board further comprises a power supply pattern connected to the memory bus wiring via a parallel terminal end resistor. A series circuit is formed by serially connecting, between the power supply pattern and a ground pattern, a capacitor and a resistor having a resistance value substantially equal to a characteristic impedance of the power supply pattern.
    Type: Application
    Filed: June 18, 2007
    Publication date: January 3, 2008
    Applicant: NEC CORPORATION
    Inventors: Nobuhiro ARAI, Akihiro Tanaka
  • Patent number: 7314388
    Abstract: An adapter to be attached to a memory card for changing an external shape such that it can be inserted into a memory card insertion section of specific type equipment is provided. The adapter includes: an adapter body for defining a space housing the memory card; a write protect mechanism including a write enable/disable setting member which is slidable with respect to the adapter body; and a terminal portion located in the adapter body, which is formed so as to be electrically connected to a terminal portion of the memory card when the memory card is housed in the adapter body, and in which the write protect mechanism sets whether to enable or disable writing of data into the memory card in accordance with the position of the write enable/disable setting member.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: January 1, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroyuki Yamada, Masayoshi Yano
  • Publication number: 20070285901
    Abstract: A card structure comprises a casing arranged to fit around an electrical connector. At least one foldable side tab is located on the casing such that when the at least one foldable side tab is folded it mechanically attaches the casing to the electrical connector. A method of assembling a card structure is also described comprising folding at least one foldable side tab located on a casing of the card structure around an electrical connector, such that the at least one foldable side tab mechanically attaches the casing to the electrical connector.
    Type: Application
    Filed: June 8, 2006
    Publication date: December 13, 2007
    Applicant: MOTOROLA, INC.
    Inventors: Boaz Siman-Tov, Micha Manassen, Eli Margalit
  • Publication number: 20070285902
    Abstract: A USB flash drive memory storage device includes a printed circuit board, a case, and a connector rigidly coupled to the case. In particular, the case defines a base end and a trailing end opposite the base end, and the connector extends a connector length from the base end of the case. The connector defines an opening through which data pads of the printed circuit assembly are accessible. The case and the connector combine to enclose the printed circuit board. In this regard, the case defines a case length extending between the base end and the trailing end that is not greater than the connector length.
    Type: Application
    Filed: June 7, 2006
    Publication date: December 13, 2007
    Inventor: Daniel G. Beneke
  • Patent number: 7306161
    Abstract: The present invention, roughly described, pertains to a small memory card that includes features which allow the memory card to be more easily handled by a user. In various embodiments, the memory card can include a chamfer and/or a raised portion that allows the memory card to be more easily grabbed by a human hand (or mechanical device) and also provides additional room to store passive devices such as capacitors and/or resistors. Because different electronic devices use different types of memory cards, an adaptor is provided that allows the memory cards disclosed herein to be used in ports or connectors on electronic devices that are meant for other types of memory cards.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: December 11, 2007
    Assignee: SanDisk Corporation
    Inventors: Hem P. Takiar, Michael W. Patterson
  • Patent number: 7306159
    Abstract: A protective case (10) for six different sized memory cards (20, 34, 50, 62, 75, 90) having distinct exterior dimensions of length, width and/or thickness includes a base (12) and a top (14) hinged to the base (12) for opening and closing. The base (12) includes securing means (18, 32, 48, 60) for securing a first small sized memory card (20) and first, second and third large sized memory cards (34, 50, 62). The top (14) includes a second small sized memory card securing means (74) for securing second and third small sized memory cards (75, 90). The securing means define rectangular alignments (26, 42, 56, 70, 80) approximating exterior length and width dimensions of the six cards (20, 34, 50, 62, 75, 90) and the rectangular alignments (26, 42, 56, 70, 80) overlie each other resulting in a very small case (10).
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: December 11, 2007
    Inventor: Donald R. Rochelo
  • Patent number: 7307848
    Abstract: A peripheral card includes a circuit board, various circuit elements on the circuit board, a set of user terminals, a set of test terminals, and an enclosure that covers a portion of the circuit board and the circuit elements. The enclosure does not cover the user terminals and test terminals. After the peripheral card is tested, the test terminals are covered with a conformal contact coating in order to prevent access to the test terminals.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: December 11, 2007
    Assignee: SanDisk Corporation
    Inventor: Hem P. Takiar