With Housing Or Chassis Patents (Class 361/752)
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Patent number: 10791633Abstract: A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 ?m to 630 ?m, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer.Type: GrantFiled: December 18, 2017Date of Patent: September 29, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Akira Ito, Eiichiro Saito, Naohito Fukuya
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Patent number: 10768948Abstract: An apparatus executes a boot operation, and determines a planar type associated with a motherboard. The apparatus queries an electronic database for the planar type associated with the motherboard, and identifies a branding identity that is electronically associated with the planar type.Type: GrantFiled: July 23, 2018Date of Patent: September 8, 2020Assignee: Dell Products, L.P.Inventors: Timothy M. Lambert, Eugene Cho, Pablo R. Arias
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Patent number: 10764998Abstract: An electronic circuit board includes electronic components to be mounted; a plurality of hard rigid board portions each of which has an insulating insulator and a conductive circuit pattern and electrically connects the mounted electronic component to the circuit pattern; and at least one soft flexible board portion which has an insulating insulator, has a conductive circuit pattern electrically connected to each of the circuit patterns of at least two rigid board portions among the plurality of rigid board portions, and is integrated with the rigid board portions which are electrically connected to the circuit pattern thereof. A plurality of contact relays as the electronic components is dispersedly arranged on the respective rigid board portions.Type: GrantFiled: September 18, 2018Date of Patent: September 1, 2020Assignee: YAZAKI CORPORATIONInventors: Masayuki Naohara, Tomohiro Sugiura, Yoshihiro Kawamura
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Patent number: 10753596Abstract: Methods for making encapsulated linear lighting are disclosed. In these methods, linear lighting is placed in a polymeric channel, and the channel is filled with a resin in order to encapsulate the linear lighting. In order to prevent leaks, the channel is dammed at both ends of the linear lighting with stoppers. The channel has interior engaging features, such as grooves or ridges, that engage with complementary features on the sidewalls of the stoppers to form a seal between the channel and the stoppers. The resin within the channel is caused or allowed to cure, and once cured, the stoppers are removed from the channel.Type: GrantFiled: February 21, 2020Date of Patent: August 25, 2020Assignee: Elemental LED, Inc.Inventors: Gilberto Lopez-Martinez, Daniel South
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Patent number: 10754811Abstract: A device may include a connector to connect the device to a chassis. The device may include chassis type circuitry to determine a type of the chassis. The device may further include mode configuration circuitry to configure the device to use a particular mode appropriate for the type of the chassis.Type: GrantFiled: May 23, 2019Date of Patent: August 25, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sompong Paul Olarig, Son T. Pham, Fred Worley
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Patent number: 10749136Abstract: A display device includes: a frame that includes a plurality of protrusions; a display panel disposed on the frame that includes a planar portion and a curved portion; a pressure sensing unit disposed between the frame and the display panel that overlaps the curved portion and that includes a plurality of first electrodes and a plurality of second electrodes disposed in a different layer; and a pressure sensing drive unit connected to the plurality of first electrodes and the plurality of second electrodes. Any one of the plurality of second electrodes at least partially overlaps any one of the plurality of first electrodes. At least one of the plurality of protrusions overlaps a region where one of the plurality of first electrodes and one of the plurality of second electrodes overlap each other.Type: GrantFiled: September 27, 2018Date of Patent: August 18, 2020Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Taehee Lee, Wonki Hong
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Patent number: 10742063Abstract: A charging pack for an electronic device which includes flexible members adapted to snugly attach the charging pack to an electronic device such as a cellular telephone. The flexible members may stretch to capture the corners of the cellular telephone. The flexible members may reside along a back surface of the charging pack in a stowed configuration. The flexible members may stretch over the corners of the charging pack main body to provide protection to the charging pack.Type: GrantFiled: November 1, 2018Date of Patent: August 11, 2020Assignee: Vitec Holdings Italia SRLInventor: Noah Balmer
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Patent number: 10734162Abstract: To provide a capacitor device capable of preventing thermal interference between a filter capacitor and a plurality of smoothing capacitors. A capacitor device provided in an energization circuit between a power source and a semiconductor module as a power supply device includes a filter capacitor for removing a noise included in a current supplied from a power input terminal, a plurality of smoothing capacitors for smoothing a voltage, and a capacitor case that houses the filter capacitor and the plurality of smoothing capacitors, and a first gap between the filter capacitor and a smoothing capacitor provided at a position closest to the filter capacitor among the plurality of smoothing capacitors is configured to be larger than a second gap between two smoothing capacitors adjacent to each other among the plurality of smoothing capacitors.Type: GrantFiled: July 15, 2019Date of Patent: August 4, 2020Assignee: DENSO CORPORATIONInventors: Tomohisa Sano, Kentaro Hirose, Yohei Imai, Seido Araki
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Patent number: 10687435Abstract: A configurable storage-system drawer may include (1) a chassis, (2) a slide assembly coupled to a side of the chassis that is configured to enable the chassis to be temporarily pulled out of a data-center rack, and (3) a passive drive-plane board housed within the chassis and configured to enable storage-system modules that differ between two or more storage-system configurations of the storage-system drawer to be interchanged. In some examples, the passive drive-plane board may include (1) storage-drive connectors that are each configured to detachably mate with a storage drive, (2) a storage-system-module connector configured to detachably mate with a storage-system module that includes one or more components necessary for one of the two or more storage-system configurations, and (3) electrical interconnects that electrically couple the storage-drive connectors to the storage-system-module connector.Type: GrantFiled: August 28, 2017Date of Patent: June 16, 2020Assignee: Facebook, Inc.Inventors: Jason David Adrian, Dominic Kai Yin Cheng, Austin Joel Cousineau
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Patent number: 10680210Abstract: A display apparatus may solve roughness and heat dissipation of a display panel. The display apparatus comprises a display panel which includes a first display portion and a second display portion bent from the first display portion, a support plate coupled to a rear surface of the first display portion, and a housing for receiving the support plate, the housing coupled with a rear surface of the second display portion.Type: GrantFiled: November 19, 2018Date of Patent: June 9, 2020Assignee: LG Display Co., Ltd.Inventor: Moonsun Lee
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Patent number: 10681439Abstract: An electronic device is provided. The electronic device includes a housing including a first plate and at least one first opening; and a speaker structure spaced apart from the first plate and disposed in the housing, wherein the speaker structure includes a first structure which faces in a first direction, opposes the first plate, and forms a space connecting to the at least one first opening along with the first plate; a second opening formed by penetrating through a part of the first structure; at least one component disposed in the speaker structure and emitting heat; a thermal conducting member including a first portion disposed in the speaker structure and being in contact with the at least one component, and a second portion disposed in the second opening; and at least one speaker disposed in a direction different from the first direction.Type: GrantFiled: August 8, 2019Date of Patent: June 9, 2020Assignee: Samsung Electronics Co., LtdInventors: Jinwoo Kim, Sujin Jung, Youngjin Cho, Sungjin Park, Hyunmin Oh, Iksu Jung
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Patent number: 10681826Abstract: Provided is a substrate unit that has a simple structure and is able to prevent water that has entered the inside from reaching a mounting surface of the substrate. The substrate unit includes: a substrate, a first casing member that supports the substrate, and a second casing member that is integrated into one piece with the first casing member and is provided on a mounting surface side of the substrate, wherein the second casing member is provided with a protruding portion that protrudes into a housing space that is defined by the first casing member and the second casing member and houses the substrate, and intersects a plane that extends along the mounting surface of the substrate.Type: GrantFiled: January 28, 2016Date of Patent: June 9, 2020Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.Inventors: Hideaki Tahara, Kazuyoshi Ohara, Munsoku O, Arinobu Nakamura
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Patent number: 10681824Abstract: A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.Type: GrantFiled: December 6, 2019Date of Patent: June 9, 2020Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Jian-Yi Hao, Yan-Lu Li, Xian-Qin Hu, Ming-Hua Du
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Patent number: 10674633Abstract: A plug assembly includes a lower cover, an upper cover mounted on the lower cover, and a circuit board. The upper cover is equipped with a heat-conducting element. The circuit board is mounted between the upper cover and the lower cover. The circuit board has two first contact portions contacting with the lower cover and the upper cover, and a plurality of second contact portions. The circuit board is equipped with a chip. The chip is mounted on and covers the plurality of the second contact portions. The chip contacts with the heat-conducting element. The circuit board opens at least one perforation. At least one of the lower cover and the upper cover protrudes towards the circuit board to form at least one fastening portion passing through the at least one perforation and contacting with the at least one of the upper cover and the lower cover.Type: GrantFiled: June 20, 2019Date of Patent: June 2, 2020Assignee: Nano Shield Technology Co., Ltd.Inventor: James Cheng Lee
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Patent number: 10670245Abstract: A light sensor assembly includes a sensor connector configured to be coupled to a receptacle connector mounted to a light fixture. The sensor connector includes a housing having a top and a bottom defining a mating interface configured to be mated to the receptacle connector. The housing has a sealed cavity including a first sensor component in the sealed cavity sensing an environmental characteristic exterior of the sensor connector. The sensor connector includes power contacts held by the housing and extending from the bottom for electrical connection with receptacle power contacts of the receptacle connector. The sensor connector includes a lid assembly at the top of the housing. The lid assembly has a lid defining an unsealed cavity allowing airflow through the unsealed cavity. The lid assembly has a second sensor component in the unsealed cavity sensing an environmental characteristic exterior of the sensor connector.Type: GrantFiled: December 18, 2017Date of Patent: June 2, 2020Assignee: TE CONNECTIVITY CORPORATIONInventors: Matthew Edward Mostoller, Justin Latorre, Christopher George Daily, Charles Raymond Gingrich, III
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Patent number: 10629354Abstract: An inductive component having a coil with a winding of a wire and a molded body adhering to the coil. The molded body has a surface for the arrangement of a heat sink. A method for producing such a component is also specified, in which, to produce the molded body, a mold is filled with a potting material and the mold is subsequently removed.Type: GrantFiled: May 17, 2017Date of Patent: April 21, 2020Assignee: TDK ELECTRONICS AGInventor: Martin Neudecker
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Patent number: 10627090Abstract: A light sensor assembly includes a sensor connector having a housing including a top and a bottom with power contact channels in the bottom of the housing. The sensor connector includes a circuit board supported by the housing at the top having a sensor component electrically connected to the circuit board sensing an environmental characteristic exterior of the sensor connector. The sensor connector includes power contacts received in corresponding contact channels and extending from the bottom for electrical connection with receptacle power contacts of the receptacle connector. The power contacts include a neutral power contact, a line power contact and a load power contact, where the line power contact and the load power contact are integral as a unitary contact body forming a monolithic line-load power contact.Type: GrantFiled: November 30, 2017Date of Patent: April 21, 2020Assignee: TE CONNECTIVITY CORPORATIONInventors: Matthew Edward Mostoller, Christopher George Daily
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Patent number: 10622593Abstract: A power module includes a packaging structure having a pair of side-by-side spaced apart busbars, each connected to a corresponding switch. The power module includes a conductive pad, between and electrically isolated from the busbars and the switches, and configured to, responsive to flow of current through the busbars generated by the switches and resulting in power loop magnetic flux between the busbars, generate magnetic flux that partially cancels the power loop magnetic flux.Type: GrantFiled: June 5, 2018Date of Patent: April 14, 2020Assignee: Ford Global Technologies, LLCInventors: Zhuxian Xu, Guangyin Lei, Nevin Altunyurt, Chingchi Chen
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Patent number: 10624243Abstract: An inverter for converting DC voltage into AC voltage, in particular a photovoltaic inverter for high power densities, in particular 250 W/dm3 to 500 W/dm3 power densities, has at least one DC input, an AC output, a heat sink, a printed circuit board, a DC disconnector, a DC-DC converter, an intermediate circuit, a DC-AC converter and a housing with a front cover and a basic shell. The electrical components of the DC-DC converter, intermediate circuit and DC-AC converter are combined into subassemblies. At least the DC disconnector and the subassemblies of the DC-DC converter, intermediate circuit and DC-AC converter are directly arranged on the circuit board in a U-shaped manner corresponding to the energy flow direction from DC input to AC output. The circuit board is arranged with the component side facing the base (65) of the basic housing shell and with the opposite side on the heat sink.Type: GrantFiled: September 13, 2016Date of Patent: April 14, 2020Assignee: Fronius International GmbHInventors: David Aitzetmueller, Franz Windischbauer, Bernhard Artelsmair, Guenter Achleitner, Ronald Leitgeb
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Patent number: 10615708Abstract: An inverter control device to drive a motor includes high-voltage circuitry that receives a power supply current and a power controller that supplies a driving current to a motor. The inverter control device further includes a first input terminal on a front surface portion of a casing of the high-voltage circuitry, a second input terminal on a power module in the power controller, and a first output terminal on a front surface portion of a casing of the power controller. Out of bus bars that electrically connect the first input terminal and the second input terminal to each other, a thickness of a bus bar on the first input terminal side is thicker than a bus bar on the second input terminal side.Type: GrantFiled: April 25, 2019Date of Patent: April 7, 2020Assignee: NIDEC ELESYS CORPORATIONInventors: Naoki Iwagami, Hitoshi Kuroyanagi
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Patent number: 10617019Abstract: A board holding apparatus holds an electric circuit board between a first case and a second case. The board holding apparatus includes locking parts that lock the first case and the second case together in a thickness direction of the electric circuit board such that the first case and the second case are not separated from each other and a bearing surface formed on the second case, the electric circuit board coming into contact with the bearing surface in the thickness direction. The board holding apparatus includes a spring that generates an elastic force, with the locking parts locking the first case and the second case together, the spring being formed on the first case and the elastic force pressing the bearing surface through the electric circuit board.Type: GrantFiled: June 20, 2017Date of Patent: April 7, 2020Assignee: AISIN AW CO., LTD.Inventors: Hiroyoshi Araki, Yuichi Takeuchi
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Patent number: 10613271Abstract: A backlight module and a display panel. The backlight module comprises a light guide plate, a heat dissipation plate and a light source. The display panel comprises a liquid crystal screen and a circuit board connected with the liquid crystal screen, the liquid crystal screen and the circuit board are arranged parallel to an arrangement direction of the heat dissipation plate main body and are respectively arranged at two sides of the heat dissipation plate. By means of the display device, the heat conducted to the back plate in the region of the heat dissipating plate corresponding to the circuit board can be reduced, and the temperature of the region where the circuit board locates can be reduced, thereby preventing aging of the electronic component and prolonging the lifetime of the circuit board.Type: GrantFiled: September 6, 2015Date of Patent: April 7, 2020Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yongda Ma, Yuxin Zhang, Xinyin Wu
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Patent number: 10602627Abstract: A key device comprises a housing in which a key hole is formed, a side key unit assembled at the key hole of the housing, and a gap of a predetermined thickness formed between a portion of the assembled side key unit located within the key hole and the key hole, wherein the gap is secured by processing any one or both of the side key unit located within the key hole or the housing in which the side key unit is assembled.Type: GrantFiled: February 10, 2017Date of Patent: March 24, 2020Assignee: Samsung Electronics Co., Ltd.Inventors: Sungho Lee, Hyosung Kang, Sangjin Kim, Sungsun Park, Dongchul Song
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Patent number: 10591959Abstract: A bendable displaying apparatus of the present disclosure includes two housings, a supporting device, and a bendable display. The supporting device is fastened to the two housings and is arranged between the two housings. The supporting device includes a retainer, two supporting units, a first supporting plate, and two second supporting plates. The bendable display is disposed on the two housings, the first supporting plate, and the two second supporting plates. When the two housings are moved to stack with each other, the two housings drive the two supporting units to move the two second supporting plates along a direction away from each other and drives the retainer to downwardly move the first supporting plate, so that the two second supporting plates and the first supporting plate jointly form a space that provides the bendable display to deform therein.Type: GrantFiled: March 18, 2019Date of Patent: March 17, 2020Assignee: FOSITEK CORPORATIONInventors: An-Szu Hsu, Way-Han Dai, Shao-Chun Chao, Chun-Han Lin
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Patent number: 10564749Abstract: A display screen assembly, an electronic device and an assembling method for the display screen assembly are provided. The display screen assembly includes a cover plate, a display screen, a bracket and a decoration enclosure. The cover plate includes a side edge. A top surface of the display screen is joined with a lower surface of the cover plate, a width of the display screen is larger than a width of the cover plate, and the side edge of the cover plate is indented inwards relative to the display screen. The bracket includes a top portion joined with a bottom surface of the display screen. The decoration enclosure includes a side surface joined with the side edge of the cover plate and is configured to shield a non-display area of the display screen.Type: GrantFiled: September 18, 2017Date of Patent: February 18, 2020Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventor: Jiao Cheng
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Patent number: 10567938Abstract: A ruggedized engine control module (ECU) system includes a plugin-pod, a connector configured to connect the plugin-pod to a connector of an ECU, and signal processing circuitry. The ruggedized ECU system further includes a ruggedized enclosure for the connector and the signal processing circuitry. The ruggedized enclosure is configured to mount the plugin-pod to the ECU. The connection circuit includes signal processing circuitry configured to receive signals from at least one of the connectors, process the signals, and output the processed signals. The ruggedized ECU is configured to dissipate heat from the signal processing circuitry.Type: GrantFiled: June 7, 2016Date of Patent: February 18, 2020Assignee: Cummins Inc.Inventors: Daniel R. Harshbarger, Nikhil Pandey, Joseph L. Gahimer
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Patent number: 10553546Abstract: Semiconductor packages and modules are provided. The semiconductor package includes a package substrate; a semiconductor chip disposed on the package substrate; a molding layer covering the semiconductor chip and a first region of the package substrate; and a functional layer covering the molding layer and extending onto a second region of the package substrate that surrounds the first region.Type: GrantFiled: July 17, 2018Date of Patent: February 4, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Joungphil Lee, Yeongseok Kim
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Patent number: 10545332Abstract: A display device including: a plastic window including a light transmittance film and a polymer layer, and a functional film including a touch screen panel film, a polarizing film, or a combination thereof. The light transmittance film, the polymer layer, and the functional film are sequentially stacked on each other, and the light transmittance film, the functional film, and the polymer layer are attached to each other by a plastic. A method of manufacturing the same is also provided.Type: GrantFiled: February 13, 2019Date of Patent: January 28, 2020Assignee: Samsung Display Co., Ltd.Inventors: Hwa Jin Oh, Hun Kyo Kim, Hyoung Suk Roh, Dong Jin Seo, Kwan Young Han
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Patent number: 10536770Abstract: A sound producing apparatus is provided. The sound producing apparatus comprises a driving circuit, comprising a pulse amplitude modulation (PAM) module, configured to generate an driving signal according to an audio input signal, wherein the driving signal comprises a pulse amplitude modulated signal generated according to the audio input signal, the pulse amplitude modulated signal comprises a plurality of pulses at a pulse rate, two consecutive pulses among the plurality of pulses are temporally spaced by a pulse cycle, the pulse rate is a reciprocal of the pulse cycle, and the pulse rate is larger than a maximum audible frequency; and a sound producing device, coupled to the driving circuit, configured to produce sound according to the driving signal.Type: GrantFiled: May 23, 2019Date of Patent: January 14, 2020Assignee: xMEMS Labs, Inc.Inventor: Jemm Yue Liang
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Patent number: 10524374Abstract: An electric device includes a substrate on which electronic components are mounted, and a metal plate to which the substrate is fixed. The metal plate includes first bosses provided at positions corresponding to four corners of the substrate, a second boss provided inside a rectangle that connects the four first bosses, and a slit that is provided adjacent to the second boss, and extends in non-parallel with any side of the rectangle. The substrate is fixed to each of the four first bosses with a first male screw, such that a rubber washer is sandwiched between the substrate and the first male screw. The substrate is fixed to the second boss with a second male screw, such that no rubber washer is sandwiched between the substrate and the second male screw.Type: GrantFiled: March 8, 2019Date of Patent: December 31, 2019Assignees: Toyota Jidosha Kabushiki Kaisha, Denso CorporationInventors: Shoji Tsutsui, Hiroki Umeda, Masatoshi Shinohara, Keisuke Hata, Daisuke Harada
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Patent number: 10505355Abstract: Provided is an electrical junction box with which it is possible to reliably prevent exposure to the outside of the entire L-shaped terminal that is fastened to a stud bolt conductively connected to a conductive member of a box body even when an upper cover is removed, while making it easier to fasten the L-shaped terminal to the stud bolt. A terminal cover is hingedly connected to a box body, is pivotable about hinge portions between an open state and a closed state, and includes a top cover that covers a bolt fastening portion, and a side cover that covers a wire connection portion. The side cover includes a front-surface cover wall that covers a wire connection portion from an outer circumference side of a first peripheral wall portion, and a side-surface cover wall that covers a front side surface of two side surfaces of the wire connection portion.Type: GrantFiled: May 31, 2017Date of Patent: December 10, 2019Assignee: SUMITOMO WIRING SYSTEMS, LTD.Inventor: Daisuke Matsuura
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Patent number: 10483738Abstract: An electrical connection box applied to a wire harness includes a substrate assembly and a housing the substrate assembly. The housing includes a first flexible rib that is extended along an extending direction Z, elastically deformable along a first support direction X, and supports the substrate assembly with respect to one side in the first support direction X, second flexible ribs that are extended along the extending direction Z, elastically deformable along the first support direction X, and supports the substrate assembly with respect to the other side in the first support direction X, and boss portions that are extended along the extending direction Z and position the substrate assembly with respect to the both sides in the first support direction X.Type: GrantFiled: June 19, 2018Date of Patent: November 19, 2019Assignees: YAZAKI CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Teppei Doi, Kimihiro Ishii, Tomohiko Saito, Takayoshi Furukawa, Tadashi Fujita, Yasuhiro Yamazaki, Takashi Maruyama, Atsushi Kawamura, Akihito Tsukamoto, Takumi Matsumoto
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Patent number: 10477675Abstract: Various embodiments of the disclosure relate to an electronic device including a capacitive structure.Type: GrantFiled: April 8, 2019Date of Patent: November 12, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Minsoo Kim, Hyuntae Jung, Jiwoo Lee
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Patent number: 10451645Abstract: A remote sensor module includes a housing comprising a first cavity and a second cavity. A pocket in the first cavity may be configured to hold a sensor package. A side of the pocket may be formed by a portion of a wall between the first and second cavities, and provides an alignment surface for the sensor package. A port communicates through the wall between the pocket and the second cavity. A plurality of terminals extend through the wall between the first cavity and the second cavity. Each of the terminals extends into the first cavity, is positioned such that the sensor package, when present, is between the ends of the terminals and a recessed surface of the pocket, and is configured to form an electrical and mechanical connection with the sensor package, which may hold the sensor package in contact with the alignment surface.Type: GrantFiled: March 12, 2018Date of Patent: October 22, 2019Assignee: VEONEER US INC.Inventor: Jacob Pusheck
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Patent number: 10455745Abstract: Disclosed is a power conversion device comprising: a case; a switching unit comprising a plurality of switches which are disposed on one side of the case; a transformer disposed on one side of the case; and a clip for fixing the plurality of switches. The clip comprises: a body part which is fixed to the case; and elastic parts which extend from the body part and are for pressing the plurality of switches to the case. The body part comprises a plurality of first through holes into which screws are coupled. And the first through holes are disposed between two adjacent elastic parts.Type: GrantFiled: January 6, 2017Date of Patent: October 22, 2019Assignee: LG INNOTEK CO., LTD.Inventor: Shin Young Jang
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Patent number: 10431697Abstract: A bidirectional Zener diode includes a substrate. A first conductivity type base region is formed in a surficial portion of the substrate. A second conductivity type first impurity region is formed in a surficial portion of the base region so as to form a pn junction with the base region. A second conductivity type second impurity region is formed in a surficial portion of the base region in a manner spaced apart from the first impurity region so as to form a pn junction with the base region. A first electrode is arranged at the surface of the substrate. A second electrode is arranged at the surface of the substrate. A dimension of the base region along the surface of the substrate between the first impurity region and the second impurity region is equal to or greater than 4.0 ?m and equal to or smaller than 12.5 ?m.Type: GrantFiled: September 22, 2016Date of Patent: October 1, 2019Assignee: ROHM CO., LTD.Inventor: Hiroki Yamamoto
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Patent number: 10432106Abstract: A power conversion device includes a printed wiring board on which an alternating-current power-supply input part, a converter circuit part to convert alternating-current power to direct-current power, an inverter circuit part to convert direct-current power converted by the converter circuit part to alternating-current power, an alternating-current power-supply output part to output alternating-current power converted by the inverter circuit part, and a conductive pattern to electrically connect the alternating-current power-supply input part, the converter circuit part, the inverter circuit part, and the alternating-current power-supply output part to one another are provided, and a busbar that has a plate-like shape with a plane direction thereof perpendicular to a plane direction of the printed wiring board, is arranged to overlap the conductive pattern in plan view, and includes two or more connecting portions that are in contact with the conductive pattern.Type: GrantFiled: January 21, 2016Date of Patent: October 1, 2019Assignee: Mitsubishi Electric CorporationInventor: Shinya Matsushita
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Patent number: 10423555Abstract: A data storage device includes a case and a connector housed within the case. The connector includes a first connection interface having a plurality of connection fingers and a second connection interface having a plurality of springs. The case is positionable within a data storage device port such that the data storage device is completely disposed within the data storage device port when used.Type: GrantFiled: June 26, 2017Date of Patent: September 24, 2019Inventor: Martin Kuster
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Patent number: 10376928Abstract: Disclosed is a cleaning blade, having an elastic body formed of a rubber base material molded product, and a surface treatment layer on at least an area of the elastic body to be brought into contact with a cleaning object. The surface treatment layer is formed by impregnating a surface portion of the elastic body with a surface treatment liquid containing an isocyanate compound and an organic solvent, and hardening the liquid. The surface treatment layer has an indentation elastic modulus of 21 MPa to 56 MPa. The elastic body has an indentation elastic modulus greater than 20 MPa and 35 MPa or less. The difference in indentation elastic modulus between the surface treatment layer and the elastic body is 1 MPa to 21 MPa.Type: GrantFiled: June 21, 2016Date of Patent: August 13, 2019Assignee: SYNZTEC CO., LTD.Inventors: Takeshi Osajima, Shuang Wang, Shuji Abe, Hiroyuki Sato
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Patent number: 10383245Abstract: A power supply chassis has at least one accommodating slot therein. Two side walls of the accommodating slot of the power supply chassis are provided with a first left guiding and fixing block and a first right guiding and fixing block. The guiding and fixing blocks have a first left guiding bevel and a first right guiding bevel facing a front side of the accommodating slot, a first left fixing plane and a first right fixing plane corresponding in position to the middle of the accommodating slot. When a power supply is placed into the accommodating slot, the first left guiding bevel and the first right guiding bevel guide the power supply to a middle position of the accommodating slot, and the power supply is clamped by the first left fixing plane and the first right fixing plane to enhance the stability of the power supply.Type: GrantFiled: August 3, 2018Date of Patent: August 13, 2019Assignee: CHYNG HONG ELECTRONIC CO., LTD.Inventor: Mu-Chun Lin
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Patent number: 10372659Abstract: A device may include a connector to connect the device to a chassis. The device may include chassis type circuitry to determine a type of the chassis. The device may further include mode configuration circuitry to configure the device to use a particular mode appropriate for the type of the chassis.Type: GrantFiled: January 20, 2017Date of Patent: August 6, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sompong Paul Olarig, Son T. Pham, Fred Worley
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Patent number: 10375461Abstract: Disclosed is a mounting assembly for use in a mobile terminal. The mobile terminal includes a main frame on which a motherboard is mounted. The mounting assembly includes a rack for mounting thereon at least one of a speaker or a vibrator, and the rack is detachably connectable to the main frame. By means of the mounting assembly, the speaker or the vibrator is not directly mounted on the motherboard of the mobile terminal.Type: GrantFiled: May 19, 2017Date of Patent: August 6, 2019Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yongda Ma, Jianbo Xian, Yong Qiao
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Patent number: 10347587Abstract: The disclosure provides an electronic device including an electronic assembly, a heat dissipating component, an electromagnetic shielding structure and an electromagnetic shielding shed. The electronic assembly includes a circuit board, a processor, a memory and a bus. The processor, the memory and the bus are stacked on the circuit board. The bus is located between and electrically connected to the processor and the memory. The heat dissipating component is staked on the processor. The electromagnetic shielding structure covers the memory. A side of the electromagnetic shielding shed is connected to the electromagnetic shielding structure, another side of the electromagnetic shielding shed is connected to the heat dissipating component, and the electromagnetic shielding shed covers at least part of the bus.Type: GrantFiled: June 14, 2018Date of Patent: July 9, 2019Assignee: WISTRON CORP.Inventor: Wen-Chao Chung
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Patent number: 10340217Abstract: A semiconductor device includes a semiconductor chip, an electrode electrically connected to the semiconductor chip, the electrode including a looped portion, a cylindrical electrode including a main portion having a screw thread formed therein and a narrow portion continuous with the main portion, the narrow portion having a smaller width than the main portion, the cylindrical electrode being electrically connected to the electrode by the narrow portion being inserted into the looped portion, and a case for the semiconductor chip and the electrode, the case contacting the main portion while causing the screw thread and a connecting portion between the looped portion and the cylindrical electrode to be exposed.Type: GrantFiled: October 30, 2017Date of Patent: July 2, 2019Assignee: Mitsubishi Electric CorporationInventors: Daisuke Oya, Satoshi Yokota
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Patent number: 10337700Abstract: A bolt locking structure for a waterproof LED lamp contains: a first casing and a second casing. The first casing includes multiple first protrusions and multiple first recesses which are arranged on each of four peripheral walls thereof respectively. The second casing includes multiple second protrusions and multiple second recesses which are arranged on each of four peripheral walls thereof respectively. The multiple first protrusions retain with the multiple second recesses, and the multiple first recesses retain with the multiple second protrusions. Multiple through holes are coaxial and form on each peripheral wall of each of the first casing and the second casing respectively, wherein each of the multiple through holes passes through each of the multiple first protrusions and the multiple second protrusions, such that each of multiple connection bolts inserts into the multiple through holes, thus locking the first casing and the second casing together.Type: GrantFiled: September 17, 2015Date of Patent: July 2, 2019Inventor: Feng Li
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Patent number: 10334744Abstract: An electronic subassembly for a personal care product with a housing defining a chamber having an open end. A first circuit board having a rigid end is positioned within the chamber and a flexible portion is positioned outside the chamber. A second circuit board is positioned within the chamber. The second circuit board has a connector dimensioned to receive the rigid end of the first circuit board.Type: GrantFiled: February 6, 2018Date of Patent: June 25, 2019Assignee: The Gillette Company LLCInventors: Juergen Behrendt, Norbert Broemse, Yvonne Scholl, Klaus Heubach, Fred Schnak
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Patent number: 10321601Abstract: An apparatus is disclosed for restricting air flow through an electronics enclosure. The apparatus may include a panel having at least one edge adapted to be secured to a surface of the electronics enclosure to thus place the panel in a path of a cooling air flow flowing through a cardcage portion of the enclosure. The panel may have a footprint that at least substantially fills an opening through which said cooling air flow flows through said cardcage portion of the enclosure. The panel may have a plurality of openings so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree, and thus reduces a volume of the air flow through the cardcage to a desired volume.Type: GrantFiled: October 16, 2009Date of Patent: June 11, 2019Assignee: Artesyn Embedded Computing, Inc.Inventors: Pasi Jukka Vaananen, Stephen A. Hauser
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Patent number: 10310556Abstract: An information handling system rotationally couples first and second housing portions to each other with a dual axis hinge having proximately located dual axis assemblies with aligned parallel axes. A tensile member routed through each dual axis assembly and coupled to opposing front and rear faces motivate synchronized motion of the parallel dual axis assemblies without a geared mechanism. Torque regions defined by each dual axis assembly coordinate housing portion resistance to rotation at predetermined portions of the relative rotational movement.Type: GrantFiled: September 21, 2017Date of Patent: June 4, 2019Assignee: Dell Products L.P.Inventor: Christopher T. Barnard
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Patent number: 10283898Abstract: An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.Type: GrantFiled: May 8, 2018Date of Patent: May 7, 2019Assignee: Apple Inc.Inventors: Ross C. Heyman, Alfredo Castillo, Arun R. Varma
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Patent number: 10274769Abstract: A display device can include a frame; a reflection sheet disposed on the frame; a housing coupled to at least one side of the frame; a substrate disposed on the housing; a light assembly mounted on the substrate; a light guide plate disposed on the reflection sheet and at a side of the light assembly; a guide panel coupled to another side of the frame; and a display panel disposed on the light guide plate, in which the display panel is disposed on the guide panel and overlaps with the housing.Type: GrantFiled: July 12, 2017Date of Patent: April 30, 2019Assignee: LG ELECTRONICS INC.Inventors: Hyongil Kil, Sangmin Baek