Specific Chassis Or Ground Patents (Class 361/753)
  • Patent number: 10674639
    Abstract: An electronic control unit includes: a substrate a plurality of heat generating components that are provided on one surface of the substrate and generate heat during operation; a heat conducting component that is formed of a material having a heat conductivity equal to or higher than a predetermined value and is provided on the one surface of the substrate such that at least a part of the heat conducting component is located between the plurality of heat generating components; and a controller that is provided on the substrate and controls the operation of each of the plurality of heat generating components to control the object to be controlled.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: June 2, 2020
    Assignee: DENSO CORPORATION
    Inventors: Shinji Shibata, Takayuki Uchida, Tsuyoshi Tashima
  • Patent number: 10631447
    Abstract: An electromagnetic shielding structure uses at least one expansion card blank to cover an expansion card window. The expansion card blank includes a plate body, a fixing portion, an abutting portion, and an adjoining portion. The fixing portion and the abutting portion are connected to two opposite sides of the plate body respectively. The adjoining portion is connected to another side of the plate body. The expansion card blank is fixed to the expansion card window through the fixing portion and the abutting portion, so as to cover the expansion card window. In different practical instances, the adjoining portion touches a side fringe portion of the expansion card window, the plate body of another adjacent expansion card blank, or a fixing plate of an adjacent expansion card, so that the expansion card window can be covered completely for electromagnetic shielding.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: April 21, 2020
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventor: Yung-Teng Fu
  • Patent number: 10381761
    Abstract: A circuit card assembly includes a circuit card having front and back ends, substantially parallel longitudinal edges between the front and back ends, and a bus connector extending from one of the longitudinal edges. The circuit card assembly includes a bracket structure providing a mounting surface, the mounting surface comprising a bracket for engaging with a plurality of adjacent ones of a plurality of bracket slots with openings at a fixed pitch. The circuit card assembly includes a connector assembly at the surface of said circuit card at the first end, with at least a first input/output (I/O) connector, and a second I/O connector in a stacked arrangement with respect to the surface of said circuit card, where the first I/O connector and the second I/O connector extend through the bracket and are separated by the fixed pitch.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 13, 2019
    Assignee: QUANTA COMPUTER INC.
    Inventors: Maw-Zan Jau, Jen-Mao Chen, Chun Chang
  • Patent number: 10278316
    Abstract: A grounding structure for a vehicle provided with a floor portion formed of a resin material includes a sheet-shaped wiring sheet including a conductive material for electrical connection between an electric power supply and an electronic component and a sheet-shaped conductive portion electrically connected to a grounding potential. The conductive portion includes a part disposed to overlap a surface of the wiring sheet on an inner portion side of the vehicle.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: April 30, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Sho Endoh
  • Patent number: 10259409
    Abstract: A grounding structure for a vehicle provided with a floor portion formed of a resin material includes a sheet-shaped wiring sheet including a conductive material for electrical connection between an electric power supply and an electronic component and a sheet-shaped conductive portion electrically connected to a grounding potential. The conductive portion includes a part disposed to overlap a surface of the wiring sheet on an outer portion side of the vehicle.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: April 16, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Sho Endoh
  • Patent number: 10178804
    Abstract: A heat spreader includes a main body extending between a front and a rear configured to be mounted to a cage and heat transfer fingers cantilevered forward from the front of the main body. The heat transfer fingers each have a fixed end, a distal end, a top, a bottom and mating edges facing each other across gaps. The heat transfer fingers are configured to be received in corresponding channels between heat transfer fins of a pluggable module as the pluggable module is installed in the cage through the front end with the gaps receiving the heat transfer fins. The mating edges are configured to face and be thermally coupled to corresponding heat transfer fins. The heat transfer fingers transfer heat from the heat transfer fins rearward toward the distal ends and into the main body.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: January 8, 2019
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Alex Michael Sharf, Nathan Lincoln Tracy
  • Patent number: 10120146
    Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: November 6, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Tsujita, Naoki Shibata, Naoyuki Tanaka, Shotaro Masuda
  • Patent number: 10076719
    Abstract: An information handling system (IHS) includes a node having a node enclosure provisioned with at least one heat-generating component. A device that provides infrastructure support to the node contains an air mover is attached to the node enclosure. The air mover creates cooling air flow through the node to absorb and transfer thermal energy from the at least one heat-generating component. An air filter enclosure is attachable over an air intake of the device. The air filter enclosure has a top slot sized to receive a manually inserted air filter into an air filter receiving frame. Replacement of the air filter can be achieved without tools. The air filter filters the air prior to the air entering the node enclosure to remove impurities and possible particulates that can damage the internal components of the device.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: September 18, 2018
    Assignee: Dell Products, L.P.
    Inventors: Joanne C. Zhang, Thuy Thanh Vu, Mike Morihata
  • Patent number: 9929101
    Abstract: An electronic assembly includes (a) a base carrier structure having a cavity formed therein, (b) a cover carrier structure, and (c) an electronic component disposed within the cavity and connected electrically and/or thermally both with the cover carrier structure and with the base carrier structure. The base carrier structure is made at least partially from a printed circuit board. Preferably, also the cover carrier structure is made at least partially from a further printed circuit board. A method for manufacturing such an electronic assembly is also described.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: March 27, 2018
    Assignee: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Nick Renaud-Bezot
  • Patent number: 9886069
    Abstract: A system is provided herein. The system includes a support member and a latch mechanism. The support member includes a positioning member. The latch mechanism is connected to the support member. The latch mechanism includes a handle and a retention latch. The handle is formed to rotate about an axis. Rotation of the handle to shift engagement of the handle with the positioning member between an engaged position and an unengaged position. The retention latch to engage with a chassis and secure the support member therein. The retention latch connects to the handle. In the engaged position, the handle to connect to the positioning member and the retention latch to engage with the chassis. In the unengaged position, the handle and the positioning member to disconnect and the handle to displace the retention latch to release engagement of the retention latch with the chassis.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: February 6, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventor: Earl W Moore
  • Patent number: 9363919
    Abstract: A supporting frame includes a first engagement section, a supporting section and a second engagement section. The first engagement section is fixed on one side of the motherboard. The supporting section is connected between the first engagement section and the second engagement section and is adjacent to another side of the motherboard. The second engagement section is spaced apart from the first engagement section for fixing a fastening plate of the expansion card. In this way, the motherboard could be placed on a working surface horizontally or stands upright on the working surface with the support of the supporting frame.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: June 7, 2016
    Assignee: GIGA-BYTE TECHNOLOGY CO., LTD.
    Inventors: Chih hua Ke, Yung Shun Kao, Ya Han Chang
  • Patent number: 9056596
    Abstract: In an electronic control unit having a metallic control block in which a plurality of control equipments are installed, a metallic cover member fitted onto the metallic control block, and an electronic control mechanism retained between the control block and the cover member to drive the control equipments, the electronic control mechanism includes: a bus bar constituent made of a resin material and having a power electronic circuit to drive the control equipments; and a print board to control the drive of the control equipments via the bus bar constituent, the print board on which a plurality of electronic parts are mounted being fixed onto the bus bar constituent by means of a metallic fixture section and an electrically conducting section being disposed to electrically conduct the control block to the cover member to provide the same electric potential for both of the cover member and the control block.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: June 16, 2015
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Kazuaki Nagashima, Ryota Takagi, Susumu Kaneko
  • Publication number: 20150146392
    Abstract: A grounding part, an electronic device, an imaging device, and a method of producing a grounding part are provided. The grounding part includes a first connecting component made of an electrically conductive material and connected to a circuit board having an electronic component thereon, and a second connecting component made of an electrically conductive material and connected to the first connecting component and a grounding member. The first connecting component includes a substrate connecting part connected to the circuit board, and a second-connecting-component connecting part connected to the second connecting component, and the second connecting component includes a first-connecting-component connecting part connected to the first connecting component, and a grounding-part connecting part connected to the grounding member. The imaging device includes the circuit board and the grounding member.
    Type: Application
    Filed: November 12, 2014
    Publication date: May 28, 2015
    Applicant: RICOH COMPANY, LTD.
    Inventor: Naoyuki Yamashita
  • Patent number: 9042109
    Abstract: A mounting structure of a flexible printed circuit board and a sliding-type electronic device is provided by which a too large increase in thickness of devices can be avoided and a pair of housings can be slid relatively in a bending and slanting direction. In the mounting structure, an upper housing 12 and a lower housing 22 coupled in a freely slidable manner are electrically connected to each other by a flexible printed circuit board folded back to be routed between slide facing surfaces 12b and 22a of both the housings and the height of a side wall surface 12c and 22c of the upper housing and lower housing changes in a bending manner along the direction of freely sliding and, in the slide facing surfaces of the upper housing and lower housing, concave space portions 15 and 25 to accommodate the change in curvature and in position of a folding-back portion 31a caused by sliding motion between the upper housing and lower housing are disposed.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 26, 2015
    Assignee: NEC CORPORATION
    Inventors: Takahiro Sakai, Toshiki Yamanaka, Hiroshi Yamada
  • Patent number: 9042119
    Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The major components and subassemblies self-ground by establishing an interference fit with exposed, resilient, embossed portions of wire mesh.
    Type: Grant
    Filed: December 9, 2013
    Date of Patent: May 26, 2015
    Assignee: Delphi Technologies, Inc.
    Inventor: Edgar Glenn Hassler
  • Patent number: 9042105
    Abstract: An electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: May 26, 2015
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Michael B. Wittenberg, John Ardisana
  • Patent number: 9036360
    Abstract: A power casing apparatus of an image display module includes a display panel configured to have a Light-Emitting Diode module disposed in a front thereof; a bus bar unit installed in the rear of the display panel and configured to supply driving power to the LED module and to have a pair of electrode blades disposed on one side thereof; and a power casing unit disposed in the bus bar unit in such a way as to be attached to or detached from the bus bar unit and configured to supply the driving power to the bus bar unit and to have a pair of power supply connectors disposed at positions corresponding to the respective electrode blades on one side.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: May 19, 2015
    Assignee: EVERBRIGHTEN CO., LTD.
    Inventor: Yong Min Kim
  • Publication number: 20150131242
    Abstract: Embodiments of the inventive concept include a semiconductor device having a circuit board including a first outer layer, a contact region in the first outer layer, a second layer formed on an opposite side of the first outer layer, a via-hole, and a plurality of inner layers formed to be stacked between the first layer and the second layer. A case may accommodate the circuit board. The case may have a projection portion that is configured to come in contact with the circuit board in the contact region. The plurality of inner layers may include a ground layer. The first outer layer may be connected to the ground layer through a via-hole. The case may be connected to the ground layer through the first outer layer.
    Type: Application
    Filed: July 29, 2014
    Publication date: May 14, 2015
    Inventors: Jung-Hoon KIM, Jin-Hyuk LEE
  • Patent number: 9025338
    Abstract: A fixing fitting includes a solder connecting plate part soldered and fixed to a surface of the circuit board by using a cream solder and a parts fixing part which is fixed to a connector to be mounted on the circuit board. On a solder connected surface of a lower surface of the solder connecting plate part, V grooves are formed which suck up the cream solder applied on the surface of the circuit board in accordance with a capillary phenomenon. Further, a plurality of communicating holes which communicate with tapered parts of the V grooves and can suck up the cream solder by the capillary phenomenon are bored from an upper surface to the lower surface of the solder connecting plate part with prescribed spaces provided between them in the direction where the V grooves extend.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: May 5, 2015
    Assignee: Yazaki Corporation
    Inventor: Takashi Muro
  • Patent number: 9025344
    Abstract: An electronic relay includes: a housing having an interior space therein and a lateral side and a lower side of which are opened, a board installation part being formed along a periphery of the opened side of the housing; a printed circuit board a periphery of which is inserted into and installed in the board installation part of the housing, for shielding the opened side of the housing and performing a switching function; a lower cover for shielding a lower side of the housing, one side edge of the printed circuit board being fixed to the lower cover; and terminals ends of which are electrically connected to the printed circuit board and opposite ends of which pass through the lower cover to protrude to the outside.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: May 5, 2015
    Assignee: Korea Electric Terminal Co., Ltd.
    Inventors: Jong-Min Lee, Gil-Su Kim, Chul-Jin Jang
  • Publication number: 20150109747
    Abstract: An in-vehicle electronic device is provided which can ensure resistance to static electricity for the in-vehicle electronic device covered with a resin case, is more downsized smaller in the number of components, and inexpensive. An in-vehicle electronic device 43 includes: a resin housing (resin case) 5; a control board 7 that is covered with the housing, and accommodated within the housing a battery harness 27 that is a power wiring which supplies power to the control board; a signal harness 31 that is an input/output signal wiring that transmits an input/output signal to the control board; and a metal bracket 1 that fixes the resin housing to a vehicle main body. In the device, a distance between a projection 35 of the metal bracket 1 and the battery harness 27 is set to be shorter than a distance between the projection 25 of the metal bracket 1 and the signal harness 31 to form a discharge gap 33.
    Type: Application
    Filed: April 12, 2013
    Publication date: April 23, 2015
    Inventor: Masashi Saito
  • Patent number: 9013887
    Abstract: A display device includes a panel module, a frame, and a fixing device, wherein the panel module has a panel connecting part. The frame has a frame connecting part whose location corresponds to the location of the panel connecting part. The fixing device includes a joint unit and a fixing unit. The joint unit is used for accommodating the panel connecting part and the frame connecting part. The fixing unit is connected to the joint unit such that the frame can be fixed on the panel module.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: April 21, 2015
    Assignee: Wistron Corporation
    Inventors: Chih-Sheng Chou, Chia-Lun Yeh
  • Patent number: 9007779
    Abstract: According to one embodiment, an electronic apparatus includes a case, a printed circuit board contained in the case and having a through-hole, and a fixing member including a shaft portion inserted in the through-hole and a head portion located at one end of the shaft portion. The electronic apparatus also includes copper foil provided on the printed circuit board, and a cover film including an opening portion configured to expose part of the copper foil. The opening portion is located at a position which is to be covered with the head portion, and the cover film covers the copper foil at positions other than the position where the opening portion is located. The electronic apparatus further includes a conductive material provided on the copper foil inside the opening portion and configured to electrically connect the head portion and the copper foil to each other.
    Type: Grant
    Filed: January 25, 2012
    Date of Patent: April 14, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Nobuhiro Yamamoto, Takahisa Funayama
  • Publication number: 20150098201
    Abstract: An electronic apparatus which is capable of preventing a joint between a jack connector and a connector substrate from being broken due to prying after insertion of a plug without bringing about an increase in the size of the connector substrate. In a cantilever spring portion of a chassis, hooking portions that penetrate holes formed in the connector substrate and hook the connector substrate are provided on both sides in a width direction of the connector substrate which is vertical to a direction in which the plug is inserted. A screw, which fastens the connector substrate to the cantilever spring portion, is disposed in the same line as the plug insertion direction and on an opposite side of a plug insertion opening in the jack connector. When the connector substrate is not bent, a space is formed between the connector substrate and an end of the hooking portion.
    Type: Application
    Filed: September 30, 2014
    Publication date: April 9, 2015
    Inventor: Dai Naito
  • Patent number: 8988886
    Abstract: An electronic apparatus includes a cover panel and a case, and at least a board disposed therebetween. A plurality of components are disposed on a board and have heights different from one another. A gap reduction member is disposed so as to face the plurality of components. Steps are formed on the gap reduction member in accordance with the heights of the plurality of components which faces the plurality of components to reduce breakage of a cover panel of the electronic apparatus.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: March 24, 2015
    Assignee: KYOCERA Corporation
    Inventors: Katsumi Arao, Ryosuke Iwaya
  • Patent number: 8977798
    Abstract: The present invention provides an electronic system mounted on an aircraft which can effectively reduce electronic devices and wires by integration of control systems. Specifically, a fuselage (80) of an aircraft (100) is divided into a nose part (80a), a center part (80b), and an aft part (80c), and two IMAs (integrated modular avionics units) (50a to 50c) are provided in each of these parts. The IMA units (50a to 50c) are interconnected via an integrated data bus (53) to construct an integrated electronic system mounted on the aircraft. The system is suitably used for integrating utility systems except for avionics systems, among a plurality of control systems mounted on the aircraft, and is also applicable to integration of the avionics systems.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: March 10, 2015
    Assignee: Kawasaki Jukogyo Kabushiki Kaisha
    Inventors: Yoichi Mitani, Masahiro Tamaru, Reiichi Ikarashi, Taisei Isobe
  • Publication number: 20150062845
    Abstract: Electrical equipment 1 includes a chassis 2 that has a bottom portion 3 and side portions 4 and 5, a printed circuit board 10 that is stored in the chassis 2 such that one principal surface 10a faces an inner surface 3a of the portion 3, a sealing resin 20 that is filled in internal space S formed by the chassis 2 and the circuit board 10, embeds the circuit board 10, and a flow suppression portion 8 that decreases a drift velocity of the resin 20 pressed into the space S through the resin injection hole 11, and that is provided in at least part of region A from a position immediately below the hole 11 in the inner surface 3a to an inner surface 4a of a side portion 4 closest to the hole 11 out of the side portions 4 and 5.
    Type: Application
    Filed: August 30, 2013
    Publication date: March 5, 2015
    Inventor: Tomoya Akashi
  • Patent number: 8969730
    Abstract: Printed circuits may be electrically and mechanically connected to each other using connections such as solder connections. A first printed circuit such as a rigid printed circuit board may have solder pads and other metal traces. A second printed circuit such as a flexible printed circuit may have openings. Solder connections may be formed in the openings to attach metal traces in the flexible printed circuit to the solder pads on the rigid printed circuit board. A ring of adhesive may surround the solder connections. The flexible printed circuit may be attached to the rigid printed circuit board using the ring of adhesive. An insulating tape may cover the solder connections. A conductive shielding layer with a conductive layer and a layer of conductive adhesive may overlap the solder joints. The conductive adhesive may connect the shielding layer to the metal traces on the rigid printed circuit board.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: March 3, 2015
    Assignee: Apple Inc.
    Inventors: Anthony S. Montevirgen, Emery A. Sanford, Stephen Brian Lynch
  • Publication number: 20150043182
    Abstract: Disclosed is a portable downloader comprising a pen-shaped housing and a circuit board provided inside of the pen-shaped housing. Provided at one end of the circuit board is a micro-universal serial bus (MUSB) port. Connected to the circuit board are a ground wire and two data wires. Each data wire is connected to a probe at the other end. Provided at the end of the pen-shaped housing corresponding to the MUSB port is a socket. Provided at the other end are two position-fixing holes. The two probes penetrate the position-fixing holes. The MUSB port connects to a computer universal serial bus (USB) port through a USB-MUSB computer extension wire. The portable downloader uses USB power supply with no need for an external power supply, and supports hot plug. The downloader uses the two probes as the C2 port, and is convenient to transmit data to C2 slave devices. The downloader is of a pen-shaped packaging, and is therefore easy to carry.
    Type: Application
    Filed: July 16, 2012
    Publication date: February 12, 2015
    Inventors: Liuyu Zhang, Beili Song, Tao Yuan
  • Patent number: 8953331
    Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.
    Type: Grant
    Filed: August 1, 2012
    Date of Patent: February 10, 2015
    Assignee: Denso Corporation
    Inventors: Keiichi Sugimoto, Mitsuru Nakagawa
  • Patent number: 8952253
    Abstract: An enclosure includes a sidewall defining an opening through which a connector is to extend and a through hole, a resilient piece, and a sliding member slidably received in the through hole. The resilient piece includes a connecting piece slantingly extending from the sidewall between the opening and the through hole and a contacting piece connected to a distal end of the connecting piece. When the connector extends through the opening, The sliding member is slid toward the resilient piece to force the contacting piece to contact the connector.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: February 10, 2015
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Wei Huang, Lei Li
  • Publication number: 20150029687
    Abstract: A first substantially annular conductive material has a first central opening, the first central opening is sufficient to substantially surround a fastener and maintain an electrical connection between the printed circuit board and the chassis. A second substantially annular conductive material is concentric with the first conductive material and the second conductive material hays a second central opening which is sufficient to substantially surround the fastener and maintain the electric connection between the printed circuit board and the chassis. A substantially annular impedance material is between and adjacent to the first conductive material and the second conductive material, the impedance material is sufficient to attenuate the electromagnetic interference from the system.
    Type: Application
    Filed: July 23, 2013
    Publication date: January 29, 2015
    Applicant: International Business Machines Corporation
    Inventors: Edward C. Gillard, Don A. Gilliland
  • Publication number: 20150029688
    Abstract: Provided is a display device that is exceptionally easy to assemble. A display device includes an electroconductive housing. A case body accommodates the display device. A connecting member causes electrification between the housing of the display device and a grounding part of a circuit substrate. The connecting member has a base part that contacts the housing, and an elastic contact armature that contacts the grounding part of the circuit substrate when the circuit substrate is secured to the case body. A securing member secures the display device to the case body so that the base part is held between the housing and the case body. The case body has an elastic locking armature for securing the circuit substrate. The case body has a through-hole through which the elastic contact armature of the connecting member is inserted.
    Type: Application
    Filed: February 6, 2013
    Publication date: January 29, 2015
    Inventors: Yutaka Fujita, Yusuke Okaji
  • Publication number: 20150016076
    Abstract: An electrical junction box includes a case that includes a bottom plate portion and a case-side peripheral wall portion, the case having an opening that opens to a lateral side, and a cover that closes the opening of the case and includes a lid plate portion and a cover-side peripheral wall portion covering a perimeter of the case-side peripheral wall portion. A protruding length of a second upper plate portion of the cover-side peripheral wall portion that is located on the upper side in a state in which the electrical junction box is used is set at such a length that the second upper plate portion protrudes slightly outward beyond an outer surface of the bottom plate portion.
    Type: Application
    Filed: February 15, 2013
    Publication date: January 15, 2015
    Inventors: Tatsuya Shimizu, Takehiro Mizuno
  • Patent number: 8934261
    Abstract: High density electronic device assemblies and techniques for forming high density electronic device assemblies are disclosed. These assemblies and techniques can be used to form compact electronic devices. In one embodiment, substrate arrangements that include a multiple-part substrate can be used to form a high density electronic device assembly. In another embodiment, one or more clips can be used in a high density electronic device assembly to provide mechanical and electrical interconnection between electrical structures that are to be removably coupled together as parts of the high density electronic device assembly. In still another embodiment, a removable cap (and a method for forming the removable cap) can be used for an electronic device housing.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: January 13, 2015
    Assignee: Apple Inc.
    Inventors: Wey-Jiun Lin, Kevin Pan, Conrado Sacluti de la Cruz
  • Publication number: 20150009642
    Abstract: An electronic unit (1) having a circuit board, PCB, (2) arranged to be mounted in a main housing (6, 7 and having a first housing part (6) and a second housing part (7), where the first housing part (6) is at least partly electrically conducting. The PCB (2) having a first outer layer (3), a second outer layer (4), and a ground plane (5). The first outer layer (3) faces the first housing part (6) and the second outer layer (4) faces the second housing part (7) The ground plane (5) is in electrical contact with the first housing part (6) forming a first chamber (29), facing the first outer layer (3), and a second chamber (30), facing the second outer layer (4). The chambers (29, 30) are separated by the ground plane (5), providing electromagnetic shielding between the chambers (29, 30).
    Type: Application
    Filed: March 1, 2012
    Publication date: January 8, 2015
    Applicant: Autoliv Development AB
    Inventor: Laurent Caclard
  • Patent number: 8929084
    Abstract: A compact radio core engine (CE) module uniquely small in size and power consumption, in which only two circuit boards provide all the modem and transceiver functions needed for modern military radios. A modem circuit board has modem devices and a first connector mounted on the board, and a radio frequency (RF) circuit board has RF devices and a second connector mounted on the board. A module frame has an interior wall, and a side wall about the periphery of the interior wall. The modem and the RF circuit boards are positioned on opposite sides of the interior wall, and the connectors on the two boards mate with one another through an opening in the interior wall to exchange operating data and signals between the devices on the boards. The modem circuit board is seated entirely within a recess formed by the interior and the side walls of the frame.
    Type: Grant
    Filed: May 8, 2012
    Date of Patent: January 6, 2015
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Michael S. Vogas, Boris Radovcic, Todd R. DeLuck, George M. Horihan, Minh Le, Kenneth E. Kolodziej
  • Patent number: 8923003
    Abstract: An electronic device may contain components such as flexible printed circuits and rigid printed circuits. Electrical contact pads on a flexible printed circuit may be coupled electrical contact pads on a rigid printed circuit using a coupling member. The coupling member may be configured to electrically couple contact pads on a top surface of the flexible circuit to contact pads on a top surface of the rigid circuit. The coupling member may be configured to bear against a top surface of the flexible circuit so that pads on a bottom surface of the flexible circuit rest against pads on a top surface of the rigid circuit. The coupling member may bear against the top surface of the flexible circuit. The coupling member may include protrusions that extend into openings in the rigid printed circuit. The protrusions may be engaged with engagement members in the openings.
    Type: Grant
    Filed: February 6, 2012
    Date of Patent: December 30, 2014
    Assignee: Apple Inc.
    Inventors: Alexander D. Schlaupitz, Joshua G. Wurzel
  • Publication number: 20140376199
    Abstract: A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination.
    Type: Application
    Filed: September 9, 2014
    Publication date: December 25, 2014
    Inventors: Noboru KATO, Masahiro OZAWA, Satoshi ISHINO, Jun SASAKI
  • Patent number: 8902600
    Abstract: A thermally deformable assembly is formed in an integrated-circuit metallization level. The physical behavior of the metal forming the assembly brings the assembly into contact with a stop-forming body when subjected to a temperature change caused by a current flow. A natural rollback to the initial configuration in which the assembly is a certain distance away from the body is prevented. The state or configuration of the assembly is determined by a capacitive reader.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: December 2, 2014
    Assignee: STMicroelectronics (Rousset) SAS
    Inventors: Albert Martinez, Pascal Fornara
  • Publication number: 20140334119
    Abstract: An exemplary shielding assembly includes a printed circuit board (PCB) and a shielding case. The PCB includes a sensitive circuit and a grounding layer. A groove extends from a top surface of the PCB down into the inside of the PCB, and the groove is in communication with the grounding layer. The shielding case is inserted into the groove and covers the sensitive circuit, and the shielding case is electrically connected with the grounding layer.
    Type: Application
    Filed: July 22, 2013
    Publication date: November 13, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: YU-HUA HO
  • Patent number: 8885355
    Abstract: A structure such as a button may have a substrate. Components such as switches may be mounted on the substrate. The substrate may be a printed circuit board with solder pads. A snap member may be soldered to one of the solder pads. A metal clip may have a snap arm with an opening. The metal clip may be attached to the printed circuit board. When attached, the opening in the snap arm may mate with the snap member that is soldered to the solder pad on the printed circuit board. The printed circuit board may be attached to a button housing member. A button cover member may be attached to the clip. A ground connection may be formed between the metal clip and the snap member by providing the snap member with structures that bear against the metal clip and form an electrical connection.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: November 11, 2014
    Assignee: Apple Inc.
    Inventor: Craig Matthew Stanley
  • Publication number: 20140321082
    Abstract: A method for placing an electronic printed card in contact with contact elements in a housing receiving or surrounding card. The card is received in the housing and has a plurality of contact recesses. The contact elements have a first end on the outer side of the housing and a second end on the inner side of the housing, and each comprises, at the second end, a flexible extension capable of being positioned in a first rest position and a second contact position. In a first step the electronic printed card is positioned relative to the housing such that the two ends of the contact elements are located facing the contact recesses, the flexible extensions being positioned in their first position. Then the card is electrically contacted by the plurality of contact recesses and the flexible extensions of the second end of the contact elements, in their second position.
    Type: Application
    Filed: October 31, 2012
    Publication date: October 30, 2014
    Inventor: Benoit Box
  • Publication number: 20140321081
    Abstract: A circuit board mounting apparatus includes a circuit board, a chassis, two mounting members, and two fasteners. A front side of the circuit board defines two positioning holes. The chassis includes a side plate defining two through holes. Two opposite ends of each mounting member define a latching slot and a mounting hole. A resilient arm extends toward the latching slot from each mounting member. The front side of the circuit board is inserted into the latching slots of the mounting members, and the resilient arms are engaged in the corresponding positioning holes of the circuit board. The fasteners extend through the through holes of the side plate, to be fastened into the mounting holes of the mounting members, to perpendicularly mount the circuit board to the side plate.
    Type: Application
    Filed: June 4, 2013
    Publication date: October 30, 2014
    Inventor: ZHENG-HENG SUN
  • Patent number: 8867221
    Abstract: A lid opening and closing device includes a first supporting shaft, a guide surface, a second supporting shaft, an opening and closing key supported by the second supporting shaft, an arm member and a lever member, wherein when an insert is not present in a box, a lid is suspended from the first supporting shaft and covers the box and enters a closed state, and when the insert is inserted into the box through an opening, the insert causes the opening and closing key to swing in an insertion direction, an end of an arm member rises along the guide surface in synchronization with the swinging of the opening and closing key, the risen arm member lifts an end of the lever member, and the lid, to which the lever member is secured, swings around the first supporting shaft and enters an open state.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: October 21, 2014
    Assignee: Fujitsu Limited
    Inventor: Yuta Sasaki
  • Patent number: 8854832
    Abstract: Provided is a grounding structure of a high voltage secondary battery for a vehicle capable of securing stable ground potential of various electric devices included in the vehicle and reducing a risk factor that may be generated due to a potential difference by connecting a battery pack including a secondary battery and an inverter for the vehicle provided in the next generation vehicle such as a hybrid electric vehicle (HEV), an electric vehicle (EV), a plug-in hybrid electric vehicle (PHEV) to each other by a ground wire formed of an electric wire in order to allow a vehicle body and a battery pack to have equipotential.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: October 7, 2014
    Assignee: SK Innovation Co., Ltd.
    Inventor: Jongguk Yoon
  • Patent number: 8848382
    Abstract: The instant disclosure relates to a data access module, which includes a plurality of data access devices, a circuit board defining a plurality of holes, a base frame, a plurality of partition panels, a cover frame, and a plurality of locking pieces. The base frame includes a bottom plate and a pair of sidewalls. A plurality of fixing pieces and ridges are formed on the bottom plate. The partition panels are directed along the retrieving direction of the data access devices and fixed on the bottom plate. Each partition panel has a hooking portion for engaging the corresponding hole of the circuit board. The cover frame includes a top plate and a pair of side plates. The locking pieces are rotatably disposed on the cover frame. Each locking piece has a pressing portion selectively pressing against the circuit board. A chassis is also discussed.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: September 30, 2014
    Assignee: Wistron Corp.
    Inventors: Hai-Nan Qiu, Chia-Hsin Hsieh
  • Patent number: 8848396
    Abstract: An electronic device includes a metal shield, a housing, a circuit board, an engaging element, and a fixing element. The circuit board is located between the metal shield and the housing. The engaging element is disposed on the circuit board. The circuit board is fixed on the housing and connected to the metal shield via the engaging element.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: September 30, 2014
    Assignee: Wistron Corp.
    Inventor: Wei-Cheng Wang
  • Patent number: 8835773
    Abstract: A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: September 16, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Shigetsugu Muramatsu, Yasuhiko Kusama
  • Patent number: 8829362
    Abstract: An electronic device including a first ground conductor layer positioned at an underside of a first insulation layer; a second ground conductor layer positioned at an upper side of the first insulation layer; a second insulation layer positioned at an upper side of the second ground conductor layer; a first connection pattern formed on an inside wall of a first opening penetrating the first insulation layer and the second insulation layer and interconnecting the first ground conductor layer and the second ground conductor layer; a conductive member provided in the first opening and connected to the first ground conductor layer; and an electronic element mounted on the member and grounded to the member.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: September 9, 2014
    Assignee: Fujitsu Limited
    Inventor: Satoshi Masuda